CN107613052B - Mobile terminal and its circuit board assembly, shielding case - Google Patents
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Abstract
本发明公开了一种屏蔽罩,该屏蔽罩包括顶壁、第一侧壁以及第二侧壁,第一侧壁和第二侧壁均与顶壁弯折连接,第一侧壁和第二侧壁相对设置,第一侧壁和第二侧壁中至少一者的远离顶壁的一端沿第一方向的尺寸小于顶壁沿第一方向的尺寸,第一方向为平行于顶壁且平行于第一侧壁和第二侧壁的方向。本发明还公开了一种电路板组件和一种移动终端。通过上述方式,本发明能够在满足屏蔽罩的屏蔽和保护功能要求的情况下,便于屏蔽罩内的被屏蔽物与周围电路之间的走线设计。
The present invention discloses a shielding cover, which includes a top wall, a first side wall and a second side wall, wherein the first side wall and the second side wall are both bent and connected to the top wall, the first side wall and the second side wall are arranged opposite to each other, and the dimension of an end of at least one of the first side wall and the second side wall away from the top wall along a first direction is smaller than the dimension of the top wall along the first direction, and the first direction is a direction parallel to the top wall and parallel to the first side wall and the second side wall. The present invention also discloses a circuit board assembly and a mobile terminal. Through the above manner, the present invention can facilitate the routing design between the shielded object in the shielding cover and the surrounding circuits while meeting the shielding and protection function requirements of the shielding cover.
Description
技术领域technical field
本发明涉及电子设备领域,特别是涉及一种移动终端及其电路板组件、屏蔽罩。The invention relates to the field of electronic equipment, in particular to a mobile terminal, a circuit board assembly and a shielding cover thereof.
背景技术Background technique
为了提高电子设备尤其是智能手机等移动终端的相关性能(例如无线灵敏度),通常需要使用屏蔽罩罩设在电路板的电子元件上对重要的敏感信号或者强干扰源进行屏蔽。In order to improve the relevant performance (such as wireless sensitivity) of electronic equipment, especially mobile terminals such as smart phones, it is usually necessary to use a shielding cover on the electronic components of the circuit board to shield important sensitive signals or strong interference sources.
随着移动终端的功能多元化、性能的提升,屏蔽罩的应用场合越来越多,电路板上的数量和种类也逐渐变多,由于屏蔽罩的设置必须满足保护电子元件的作用或者屏蔽外界干扰的功能,导致电子元件与周围电路的走线空间受到限制。With the diversification of functions and the improvement of performance of mobile terminals, there are more and more applications of shielding covers, and the number and types of circuit boards are also gradually increasing. Since the settings of the shielding cover must meet the function of protecting electronic components or shielding the outside world Interfering functions, resulting in limited routing space between electronic components and surrounding circuits.
发明内容SUMMARY OF THE INVENTION
本发明实施例提供一种移动终端及其电路板组件、屏蔽罩,能够在满足屏蔽罩的屏蔽和保护功能要求的情况下,便于屏蔽罩内的被屏蔽物与周围电路之间的走线设计。Embodiments of the present invention provide a mobile terminal, a circuit board assembly thereof, and a shielding cover, which can facilitate the design of the wiring between the shielded object in the shielding cover and the surrounding circuits under the condition that the requirements of the shielding and protection functions of the shielding cover are met. .
本发明实施例采用的一个技术方案是:提供一种屏蔽罩,该屏蔽罩包括顶壁、第一侧壁以及第二侧壁,第一侧壁和第二侧壁均与顶壁弯折连接,第一侧壁和第二侧壁相对设置,第一侧壁和第二侧壁中至少一者的远离顶壁的一端沿第一方向的尺寸小于顶壁沿第一方向的尺寸,第一方向为平行于顶壁且平行于第一侧壁和第二侧壁的方向。A technical solution adopted in the embodiment of the present invention is to provide a shielding cover, the shielding cover includes a top wall, a first side wall and a second side wall, and both the first side wall and the second side wall are connected to the top wall by bending , the first side wall and the second side wall are arranged oppositely, and the size of the end of at least one of the first side wall and the second side wall away from the top wall along the first direction is smaller than the size of the top wall along the first direction, the first The direction is a direction parallel to the top wall and parallel to the first and second side walls.
本发明实施例采用的另一个技术方案是:提供一种电路板组件,电路板组件包括电路板、设置在电路板上的被屏蔽物、设置在电路板上且罩设于被屏蔽物的屏蔽罩,屏蔽罩为上述的屏蔽罩。Another technical solution adopted in the embodiments of the present invention is to provide a circuit board assembly, the circuit board assembly includes a circuit board, a shielding object disposed on the circuit board, and a shielding object disposed on the circuit board and covering the shielding object cover, the shielding cover is the above-mentioned shielding cover.
本发明实施例采用的又一个技术方案是:提供一种移动终端,该移动终端包括终端主体和电路板组件,电路板组件为上述的电路板组件。Another technical solution adopted by the embodiments of the present invention is to provide a mobile terminal, where the mobile terminal includes a terminal body and a circuit board assembly, and the circuit board assembly is the above-mentioned circuit board assembly.
本发明实施例的有益效果是:本发明实施例通过设置屏蔽罩包括顶壁、第一侧壁以及第二侧壁,第一侧壁和第二侧壁均与顶壁弯折连接,第一侧壁和第二侧壁相对设置,第一侧壁和第二侧壁中至少一者的远离顶壁的一端沿第一方向的尺寸小于顶壁沿第一方向的尺寸,第一方向为平行于顶壁且平行于第一侧壁和第二侧壁的方向,能够在满足屏蔽罩的屏蔽和保护功能要求的情况下,便于屏蔽罩内的被屏蔽物与周围电路之间的走线设计。The beneficial effects of the embodiments of the present invention are: in the embodiments of the present invention, by setting the shielding cover to include a top wall, a first side wall, and a second side wall, the first side wall and the second side wall are both connected to the top wall by bending, and the first side wall and the second side wall are connected by bending. The side wall and the second side wall are arranged opposite to each other, and the dimension of the end of at least one of the first side wall and the second side wall away from the top wall along the first direction is smaller than the dimension of the top wall along the first direction, and the first direction is parallel The direction of the top wall and parallel to the first side wall and the second side wall can facilitate the design of the wiring between the shielded object in the shield and the surrounding circuits under the condition that the shielding and protection function requirements of the shield are met. .
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative efforts.
图1是本发明实施例的电路板组件的立体结构示意图;FIG. 1 is a schematic three-dimensional structure diagram of a circuit board assembly according to an embodiment of the present invention;
图2是本发明实施例的电路板组件的第一侧壁从图1中的侧面观看时的第一种结构示意图;FIG. 2 is a first structural schematic diagram of the first side wall of the circuit board assembly according to the embodiment of the present invention when viewed from the side in FIG. 1;
图3是本发明实施例的电路板组件的第二侧壁从图1中的侧面观看时的结构示意图;3 is a schematic structural diagram of the second side wall of the circuit board assembly according to the embodiment of the present invention when viewed from the side in FIG. 1;
图4是第一侧壁的第二种结构示意图;Fig. 4 is the second structure schematic diagram of the first side wall;
图5是第一侧壁的第三种结构示意图;Fig. 5 is the third structure schematic diagram of the first side wall;
图6是第一侧壁的第四种结构示意图;Fig. 6 is the fourth kind of structure schematic diagram of the first side wall;
图7是第一侧壁的第五种结构示意图;Fig. 7 is the fifth structure schematic diagram of the first side wall;
图8是本发明实施例移动终端的示意图。FIG. 8 is a schematic diagram of a mobile terminal according to an embodiment of the present invention.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述。可以理解的是,此处所描述的具体实施例仅用于解释本发明,而非对本发明的限定。另外还需要说明的是,为了便于描述,附图中仅示出了与本发明相关的部分而非全部结构。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, the drawings only show some but not all structures related to the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
本发明中的术语“第一”、“第二”等是用于区别不同对象,而不是用于描述特定顺序。此外,术语“包括”和“具有”以及它们任何变形,意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元,而是可选地还包括没有列出的步骤或单元,或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或单元。The terms "first", "second" and the like in the present invention are used to distinguish different objects, rather than to describe a specific order. Furthermore, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally also includes For other steps or units inherent to these processes, methods, products or devices.
在本文中提及“实施例”意味着,结合实施例描述的特定特征、结构或特性可以包含在本发明的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例,也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是,本文所描述的实施例可以与其它实施例相结合。Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor a separate or alternative embodiment that is mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.
请参阅图1,图1是本发明实施例的电路板组件的立体结构示意图。在本实施例中,电路板组件包括电路板100、设置在电路板100上的被屏蔽物200、设置在电路板100上且罩设于被屏蔽物200的屏蔽罩300。Please refer to FIG. 1 , which is a schematic three-dimensional structural diagram of a circuit board assembly according to an embodiment of the present invention. In this embodiment, the circuit board assembly includes a
可选地,被屏蔽物200可以为设置在电路板100上的金属走线或者电子元件,电子元件可以通过贴片的方式或者焊接的方式设置在电路板100的表面。在其他实施例中,电子元件也可以以其他的方式设置在电路板100的表面。Optionally, the
可选地,屏蔽罩300可以通过焊接的方式设置在电路板100上。应理解,屏蔽罩300与电路板100的连接方式不限于焊接,也可以使胶水粘接、卡扣连接或者其他的固定连接方式,本发明实施例对此不做限定。Optionally, the
屏蔽罩300可以包括顶壁10、第一侧壁11以及第二侧壁12。The
第一侧壁11和第二侧壁12均与顶壁10弯折连接,第一侧壁11和第二侧壁12相对设置。Both the
具体而言,第一侧壁11与顶壁10在顶壁10的第一边缘13(例如图中所示的左边缘)处弯折连接。可选地,第一侧壁11可与顶壁10垂直弯折连接,即第一侧壁11可垂直于顶壁10。在其他的实施例中,第一侧壁11也可以与顶壁10呈其他角度弯折连接,本发明实施例对此不做限定。Specifically, the
第二侧壁12与顶壁10在顶壁10的第二边缘14(例如图中所示的右边缘)弯折连接。第二边缘14是顶壁10的与第一边缘13相对的边缘。可选地,第二侧壁12可与顶壁10垂直弯折连接,即第二侧壁12可垂直于顶壁10。在其他实施例中,第二侧壁12也可以与顶壁10呈其他角度弯折连接,本发明实施例对此不做限定。The
为了便于说明,定义第一方向a为平行于顶壁10且平行于第一侧壁11和第二侧壁12的方向。例如,第一方向a为图中所示的屏蔽罩300的长度方向。For the convenience of description, the first direction a is defined as a direction parallel to the
第一侧壁11和第二侧壁12中至少一者的远离顶壁10的一端(例如图中所示的下端)沿第一方向a的尺寸小于顶壁10沿第一方向a的尺寸。The dimension of at least one end of the
电路板组件进一步包括设置在电路板100上的第一连接层15和第二连接层16,第一连接层15用于与第一侧壁11连接,第二连接层16用于与第二侧壁12连接,第一连接层15和第二连接层16中至少一者沿第一方向a的尺寸小于顶壁10沿第一方向a的尺寸。The circuit board assembly further includes a
可选地,第一连接层15沿第一方向a的尺寸可以等于第一侧壁11沿第一方向a的尺寸,第二连接层16沿第一方向b的尺寸可以等于第二侧壁12沿第一方向a的尺寸。Optionally, the dimension of the
例如,在屏蔽罩300与电路板100采用焊接的方式连接时,第一连接层15可以是设置在电路板100上的第一焊盘,第二连接层16可以是设置在电路板100的上的第二焊盘。屏蔽罩300通过第一侧壁11的远离顶壁10的一端与第一连接层15连接,屏蔽罩300还通过第二侧壁11的远离顶壁10的一端与第二连接层16连接。For example, when the
可选地,第一侧壁11和第二侧壁12的远离顶壁10的一端沿第一方向a的尺寸均小于顶壁10沿第一方向a的尺寸。与之相对应的,第一焊盘沿第一方向a的尺寸可以设置为小于顶壁10沿第一方向a的尺寸,第二焊盘沿第一方向a的尺寸可以设置为小于顶壁10沿第一方向a的尺寸。Optionally, the size of one end of the
在其他实施例中,可以是第一侧壁和第二侧壁其中一者的远离顶壁的一端沿第一方向的尺寸小于顶壁沿第一方向的尺寸,另一者的远离顶壁的一端沿第一方向的尺寸等于顶壁沿所述第一方向的尺寸In other embodiments, the dimension of one end of the first side wall and the second side wall away from the top wall along the first direction is smaller than the dimension of the top wall along the first direction, and the dimension of the other end away from the top wall The dimension of one end along the first direction is equal to the dimension of the top wall along the first direction
通过上述方式,将第一侧壁11和第二侧壁12的下端沿第一方向a的尺寸均设置为小于顶壁10沿第一方向a的尺寸,可以使得第一焊盘和第二焊盘沿第一方向a的尺寸均小于顶壁10沿第一方向a的尺寸,一方面,可以使得顶壁10在电路板100的投影完全覆盖被屏蔽物200,保证屏蔽罩300的对被屏蔽物200的保护功能和屏蔽功能,另一方面,由于第一焊盘和第二焊盘尺寸小于顶壁尺寸使得,第一焊盘和第二焊盘可以让出空间方便被屏蔽物200与周围电路之间的走线布局。In the above manner, the size of the lower ends of the
请结合图1参阅图2,图2是本发明实施例的电路板组件的第一侧壁从图1中的侧面观看时的第一种结构示意图。Please refer to FIG. 2 in conjunction with FIG. 1 . FIG. 2 is a first structural schematic diagram of the first side wall of the circuit board assembly according to the embodiment of the present invention when viewed from the side in FIG. 1 .
如图2所示,可选地,第一侧壁11包括第一侧壁部111和第二侧壁部112。As shown in FIG. 2 , optionally, the
第一侧壁部111与顶壁10弯折连接,第二侧壁部112与第一侧壁部111远离顶壁10的一端(例如图中所示的下端)连接。The first
第一侧壁部111沿第一方向a的尺寸等于顶壁10沿第一方向a的尺寸,第二侧壁部112沿第一方向a的尺寸小于顶壁10沿第一方向a的尺寸。The size of the first
第一侧壁部111和第二侧壁部112均呈矩形设置以使第一侧壁11具有矩形缺口113。The first
请结合图1参阅图3,图3是本发明实施例的电路板组件的第二侧壁从图1中的侧面观看时的结构示意图。Please refer to FIG. 3 in conjunction with FIG. 1 . FIG. 3 is a schematic structural diagram of the second side wall of the circuit board assembly according to the embodiment of the present invention when viewed from the side in FIG. 1 .
如图3所示,第二侧壁12包括第三侧壁部121和第四侧壁部122。As shown in FIG. 3 , the
第三侧壁部121与顶壁10弯折连接,第四侧壁部122与第三侧壁部121远离顶壁10的一端连接。The third
第三侧壁部121沿第一方向a的尺寸等于顶壁10沿第一方向a的尺寸,第四侧壁部122沿第一方向a的尺寸小于顶壁10沿第一方向a的尺寸。The size of the third
第三侧壁部121和第四侧壁部122均呈矩形设置以使第二侧壁具有矩形缺口123。Both the third
请参阅图4,图4是第一侧壁的第二种结构示意图。Please refer to FIG. 4 , which is a schematic diagram of a second structure of the first side wall.
如图4所示,在第一侧壁21的第二种结构中,第一侧壁部211可以呈矩形设置,第二侧壁部212呈直角梯形设置,以使第一侧壁21具有缺角,具体而言,该缺角为直角三角形的缺口213。As shown in FIG. 4 , in the second structure of the
通过上述方式,可以简化第一侧壁21的制造工艺,只需要切一个缺角即可。In the above manner, the manufacturing process of the
类似地,第三侧壁部也可以呈矩形设置,第四侧壁部也可以呈直角梯形设置,以使第二侧壁具有缺角。其结构与图4所示的第一侧壁类似,此处不再赘述。Similarly, the third side wall portion can also be arranged in a rectangular shape, and the fourth side wall portion can also be arranged in a right-angled trapezoid shape, so that the second side wall portion has a missing corner. Its structure is similar to that of the first side wall shown in FIG. 4 , and details are not repeated here.
请参阅图5,图5是第一侧壁的第三种结构示意图。Please refer to FIG. 5 , which is a schematic diagram of a third structure of the first side wall.
如图5所示,第一侧壁31为矩形,该矩形的第一侧壁31沿第一方向a的尺寸小于顶壁10沿第一方向a的尺寸。As shown in FIG. 5 , the
应理解,第二侧壁也可以做类似的变形设计,此处不再赘述。It should be understood that the second side wall can also be designed with similar deformation, which will not be repeated here.
请参阅图6,图6是第一侧壁的第四种结构示意图。Please refer to FIG. 6 , which is a schematic diagram of a fourth structure of the first side wall.
如图6所示,第一侧壁41为直角梯形,第一侧壁41的下底b与顶壁10连接,且该下底b的长度等于顶壁10沿第一方向a的尺寸,第一侧壁41的上底c与第一连接层连接。下底b长度大于上底c的长度。As shown in FIG. 6 , the
第二侧壁也可以做与第一侧壁类似的变形设计,此处不再赘述。The second side wall can also have a similar deformation design as the first side wall, which will not be repeated here.
请参阅图7,图7是第一侧壁的第五种结构示意图。Please refer to FIG. 7 , which is a schematic diagram of a fifth structure of the first side wall.
如图7所示,第一侧壁51包括矩形的第一侧壁部511和矩形的第二侧壁部512。第二侧壁部511沿第一方向a的尺寸小于第一侧壁部512沿第一方向a的尺寸。第二侧壁部512与第一侧壁部511的下端的中间段连接,以使第一侧壁51在图7中所示的沿第一方向a的相对两侧(例如图中所示的左右两侧)分别具有第一矩形缺口513和第二矩形缺口514。As shown in FIG. 7 , the
通过上述方式,可以使得第一焊盘的沿第一方向两侧均可以设计走线,走线更加均匀,使得走线不至于在一侧密集分布。In the above manner, traces can be designed on both sides of the first pad along the first direction, and the traces are more uniform, so that the traces are not densely distributed on one side.
第二侧壁也可以做与第一侧壁类似的变形设计,此处不再赘述。The second side wall can also have a similar deformation design as the first side wall, which will not be repeated here.
应理解,可以将第一侧壁和第二侧壁中的一者设置为上述实施例中的一种结构,将另一者设置为上述实施例中的另一种结构。It should be understood that one of the first side wall and the second side wall can be configured as one structure in the above-mentioned embodiment, and the other can be configured as another structure in the above-mentioned embodiment.
在本实施例中,屏蔽罩300仅包括相对设置的两个侧壁(第一侧壁11和第二侧壁12)。在其他实施例中,顶壁10的另外的两侧也可以设置侧壁。In this embodiment, the shielding
例如,屏蔽罩可以进一步包括与顶壁10弯折连接的第三侧壁(图未示)和第四侧壁(图未示),第三侧壁和第四侧壁相对设置,第三侧壁和第四侧壁中至少一者的远离顶壁的一端沿第一方向的尺寸小于顶壁沿第一方向的尺寸。For example, the shielding case may further include a third side wall (not shown) and a fourth side wall (not shown) connected to the
第三侧壁和第四侧壁的结构与第一侧壁和第二侧壁的情况类似。此处不再赘述。The structures of the third and fourth side walls are similar to those of the first and second side walls. It will not be repeated here.
上文中提及的弯折连接可以是90度垂直弯折连接,也可以是呈其他角度的弯折连接。The bending connection mentioned above may be a 90-degree vertical bending connection, or a bending connection at other angles.
请参阅图8,图8是本发明实施例移动终端的示意图。在本实施例中,移动终端包括终端主体81和电路板组件82,电路板组件82为上述的任意一实施例所描述的电路板组件。Please refer to FIG. 8 , which is a schematic diagram of a mobile terminal according to an embodiment of the present invention. In this embodiment, the mobile terminal includes a
移动终端可以是智能手机、平板电脑、可穿戴式智能设备等。The mobile terminal may be a smart phone, a tablet computer, a wearable smart device, and the like.
本发明实施例通过设置屏蔽罩包括顶壁、第一侧壁以及第二侧壁,第一侧壁和第二侧壁均与顶壁弯折连接,第一侧壁和第二侧壁相对设置,第一侧壁和第二侧壁中至少一者的远离顶壁的一端沿第一方向的尺寸小于顶壁沿第一方向的尺寸,第一方向为平行于顶壁且平行于第一侧壁和第二侧壁的方向,能够在满足屏蔽罩的屏蔽和保护功能要求的情况下,便于屏蔽罩内的被屏蔽物与周围电路之间的走线设计。In the embodiment of the present invention, the shielding cover includes a top wall, a first side wall and a second side wall, the first side wall and the second side wall are both connected to the top wall by bending, and the first side wall and the second side wall are oppositely arranged , the size of one end of at least one of the first side wall and the second side wall away from the top wall along the first direction is smaller than the size of the top wall along the first direction, and the first direction is parallel to the top wall and parallel to the first side The direction of the wall and the second side wall can facilitate the design of the wiring between the shielded object in the shield and the surrounding circuits under the condition that the requirements of the shielding and protection functions of the shielding cover are met.
以上所述仅为本发明的实施方式,并非因此限制本发明的专利范围,凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本发明的专利保护范围内。The above description is only an embodiment of the present invention, and is not intended to limit the scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied to other related technologies Fields are similarly included in the scope of patent protection of the present invention.
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JP2008078321A (en) * | 2006-09-20 | 2008-04-03 | Sony Ericsson Mobilecommunications Japan Inc | Communication terminal and transmitter shielding structure |
CN201119257Y (en) * | 2007-11-20 | 2008-09-17 | 青岛海信电器股份有限公司 | Shielding cover for printed circuit board |
CN203193699U (en) * | 2013-04-26 | 2013-09-11 | 东莞华贝电子科技有限公司 | Shield cover, display screen, and mobile terminal |
CN203423896U (en) * | 2013-07-02 | 2014-02-05 | 中兴通讯股份有限公司 | Shielding device |
CN105592678A (en) * | 2016-02-25 | 2016-05-18 | 广东欧珀移动通信有限公司 | Rigid-flex board wiring structure and mobile terminal |
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2017
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2008078321A (en) * | 2006-09-20 | 2008-04-03 | Sony Ericsson Mobilecommunications Japan Inc | Communication terminal and transmitter shielding structure |
CN201119257Y (en) * | 2007-11-20 | 2008-09-17 | 青岛海信电器股份有限公司 | Shielding cover for printed circuit board |
CN203193699U (en) * | 2013-04-26 | 2013-09-11 | 东莞华贝电子科技有限公司 | Shield cover, display screen, and mobile terminal |
CN203423896U (en) * | 2013-07-02 | 2014-02-05 | 中兴通讯股份有限公司 | Shielding device |
CN105592678A (en) * | 2016-02-25 | 2016-05-18 | 广东欧珀移动通信有限公司 | Rigid-flex board wiring structure and mobile terminal |
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