CN108448274A - A kind of earphone socket, phone jack component and electronic equipment - Google Patents

Abstract

A kind of earphone socket of present invention offer, phone jack component and electronic equipment, the earphone socket include：Socket main body, socket main body include the first face and the second face being disposed opposite to each other, and between the first face and the second face and two opposite lateral walls；Terminal, terminal are set on lateral wall, and terminal includes the interconnecting piece and leg protruded from lateral wall, and leg is extended to form from the one end of interconnecting piece far from lateral wall towards the second face side；And the fixing bracket being fixedly connected with socket main body, and fixing bracket includes at least one set of support portion；Support portion includes the first joint face that can be abutted with circuit board, and interconnecting piece includes the second joint face that can be abutted with circuit board, and the height in first the second face of joint face distance is less than the height in second the second face of joint face distance.Earphone socket provided by the invention can effectively promote the versatility of earphone socket.

Description

A kind of earphone jack, earphone jack assembly and electronic equipment

technical field

The invention relates to the technical field of communication, in particular to an earphone jack, an earphone jack assembly and electronic equipment.

Background technique

Headphone jacks are widely used in electronic equipment such as mobile phones and computers. During the assembly process of electronic equipment, earphone jacks are generally mounted on circuit boards and electrically connected to the circuit boards through terminals. Wherein, the manner in which the earphone jack is fixed on the circuit board is divided into a board type and a sunken board type according to the relative position of the earphone jack and the circuit board. However, with the development of thinner and lighter electronic devices such as mobile phones, the on-board headphone jacks that occupy a large thickness and space are gradually being eliminated, while the sinking plate headphone jacks that occupy a small thickness and space are gradually accepted by the market.

At present, in the application of the sunken plate type earphone jack, the requirements for the height of the earphone jack relative to the circuit board are also different for different types of electronic equipment due to the different overall structures, and the relative height of the earphone jack and the circuit board is generally determined by the terminal soldering of the earphone jack. Depending on the position of the feet. Therefore, for electronic devices with different requirements for the relative heights of the earphone jack and the circuit board, the relative height of the earphone jack and the circuit board is generally adjusted by adjusting the height of the terminal soldering pins on the earphone jack. In this way, the earphone socket needs to be redesigned and molded, which will increase labor costs and mold costs.

It can be seen that the existing sunken plate type earphone socket has the problem of poor versatility.

Contents of the invention

Embodiments of the present invention provide an earphone jack, an earphone jack assembly, and an electronic device to solve the problem of poor versatility of the existing sinker-type earphone jack.

In a first aspect, an embodiment of the present invention provides an earphone jack, including:

a socket main body, the socket main body includes a first surface and a second surface disposed opposite to each other, and two opposite outer sidewalls located between the first surface and the second surface;

A terminal, the terminal is arranged on the outer wall, and the terminal includes a connecting portion protruding from the outer wall and a welding foot, and the welding foot is directed from an end of the connecting portion away from the outer wall The side where the second surface is located is extended;

and a fixed bracket fixedly connected to the socket main body, and the fixed bracket includes at least one set of support parts;

The support portion includes a first connection surface capable of abutting against the circuit board, the connection portion includes a second connection surface capable of abutting against the circuit board, and the distance between the first connection surface and the second surface is The height is smaller than the height of the second connection surface from the second surface.

In a second aspect, an embodiment of the present invention provides an earphone jack assembly, including a circuit board and the aforementioned earphone jack, wherein;

The circuit board includes a third surface and a fourth surface arranged opposite to each other, an accommodating groove is provided on the circuit board, and a conductive part is also provided on the circuit board;

The earphone jack is partly accommodated in the accommodating groove, the welding leg of the terminal is electrically connected to the conducting part, and the second connecting surface of the connecting part of the terminal is connected to the third surface of the circuit board. contact, and the positions on the circuit board corresponding to the supporting parts are hollowed out.

In a third aspect, an embodiment of the present invention provides an earphone jack assembly, including a circuit board and the aforementioned earphone jack, wherein;

The circuit board includes a third surface and a fourth surface arranged opposite to each other, an accommodating groove is provided on the circuit board, and a conductive part is also provided on the circuit board;

The earphone socket is partly accommodated in the accommodating groove, the welding leg of the terminal is electrically connected to the conducting part, and the first connecting surface of the supporting part abuts against the third surface of the circuit board , the second connection surface of the connection part of the terminal is suspended.

In a fourth aspect, an embodiment of the present invention provides an electronic device, including the above earphone socket assembly.

In this way, in the embodiment of the present invention, the earphone socket can be used as the supporting part for the connection between the earphone socket and the circuit board through the supporting part or the connecting part of the terminal, so that the earphone socket can provide support positions with different height requirements; thus without changing the earphone socket Under the premise of the main structure, it can meet the assembly between the headphone socket and the circuit board with different height requirements under different models, improve the versatility of the headphone socket, avoid repeated design and mold opening of the headphone socket, and reduce manufacturing costs .

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments of the present invention. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained based on these drawings without any creative effort.

FIG. 1 is one of the structural schematic diagrams of an earphone socket assembly provided by an embodiment of the present invention;

Fig. 2 is the second structural schematic diagram of the earphone socket assembly provided by the embodiment of the present invention;

Fig. 3 is one of the side views of the earphone jack assembly in Fig. 2;

Fig. 4 is the third structural schematic diagram of the earphone socket assembly provided by the embodiment of the present invention;

Fig. 5 is the second side view of the earphone jack assembly in Fig. 4;

Fig. 6 is the fourth structural schematic diagram of the earphone socket assembly provided by the embodiment of the present invention;

Fig. 7 is the third side view of the earphone jack assembly in Fig. 6 .

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

As shown in Figures 1 to 7, an embodiment of the present invention provides an earphone jack 100, including:

The socket main body 110, the socket main body 110 includes a first surface 111 and a second surface 112 disposed opposite to each other, and two opposite outer sidewalls located between the first surface 111 and the second surface 112;

Terminal 120, the terminal 120 is arranged on the outer wall, and the terminal 120 includes a connecting portion 121 protruding from the outer wall and a welding foot 122, and the welding foot 122 is away from the connecting portion 121 One end of the outer wall extends toward the side where the second surface 112 is located;

and a fixed bracket 130 fixedly connected to the socket main body 110, and the fixed bracket 130 includes at least one set of support parts 131;

The support portion 131 includes a first connection surface capable of abutting against the circuit board 200 , the connection portion 121 includes a second connection surface capable of abutting against the circuit board 200 , and the distance between the first connection surface and the The height of the second surface 112 is smaller than the height of the second connection surface from the second surface 112 .

The earphone socket assembly 100 provided by the embodiment of the present invention can be applied to a sunken plate type earphone socket, and can be used as the earphone socket 100 and The supporting part connected to the circuit board 200, since the height of the first connection surface of the support part 131 from the second surface 112 is smaller than the height of the second connection surface of the connection part 121 from the second surface 112, that is, the support part 131 and the connection part 121 provide The support heights are different, so that the earphone socket 100 can be compatible with at least two sinker heights. And contact the circuit board 200 through the support part 131 on the fixed bracket 130 fixedly connected with the socket main body 110, or contact the circuit board 200 through the connecting part 121 of the terminal 120, so that the earphone socket 100 can be compatible with different sinker heights assembly between circuit boards 200 as required. Therefore, under the premise of not changing the main structure of the earphone jack 100, the assembly between the earphone jack 100 and the circuit board 200 with different plate height requirements under different models can be satisfied, the versatility of the earphone jack 100 can be improved, and the need for earphone jack 100 can be avoided. Repeated design and mold opening to reduce manufacturing costs.

Wherein, the fixed bracket 130 includes a bracket body 132 and the at least one set of support parts 131 extending from the ends on both sides of the bracket body 132, and the bracket body 132 and the first socket body 110 The faces 111 are in abutment.

Optionally, the bracket body 132 is also provided with a bayonet 1321, the socket body 110 is provided with a buckle portion 113 matching the bayonet 1321, and the fixed bracket 130 and the socket body 110 pass through the bayonet 1321 is clamped and fixed with the buckle part 113 .

In this embodiment, the connection between the bayonet 1321 and the buckle part 113 can not only ensure the stability of the connection between the fixed bracket 130 and the socket main body 110, but also facilitate the removal of the fixed bracket 130 from the socket main body 110. .

It should be noted that the fixing bracket 130 in this embodiment can be a metal bracket or a hard plastic bracket, as long as the stability of the connection between the earphone socket 100 and the circuit board 200 can be ensured. Moreover, the supporting parts 131 provided on both sides of the bracket body 132 can be formed by bending and extending from the ends on both sides of the bracket body 132 , and the supporting parts 131 formed by bending and extending are located on two sides of the socket body 110 . Both sides of the outer wall.

Optionally, the fixed bracket 130 includes two sets of support parts 131, and the two sets of support parts 131 include a first support part 1311 and a second support part 1312;

There is a difference in height between the first connection surface of the first support portion 1311 and the second surface 112 and the height of the first connection surface of the second support portion 1312 from the second surface 112 .

In this embodiment, by setting the first support part 1311 , the second support part 1312 and the connecting part 121 with height differences, the earphone jack 100 can be compatible with three sinker height requirements, so as to improve the versatility of the earphone jack 100 .

Preferably, in this embodiment, the height of the first connection surface of the first support part 1311 from the second surface 112 is smaller than the distance from the first connection surface of the second support part 1312 to the second surface 112 the height of.

It should be noted that the support portion 131 provided on the fixing bracket 130 can also be one or more groups, but considering the size of the earphone socket 100 and the stability of the connection between the earphone socket 100 and the circuit board 200, the The supporting parts 131 on the fixing bracket 130 are generally preferably two groups.

Wherein, the number of the first supporting part 1311 can be one, two, three or more, but considering the size of the socket main body 110 and the stability of the connection between the earphone socket 100 and the circuit board 200, the first supporting part 1311 The number of the first supporting part 1311 is generally preferably two, distributed on the two outer walls, and arranged symmetrically; the number of the first support part 1311 can be one, two, three or more, but considering the size of the socket main body 110 and the earphone For the stability of the connection between the socket 100 and the circuit board 200, the number of the first supporting parts 1311 is generally preferably two, which are distributed on the two outer side walls and arranged symmetrically.

It should be further explained that the earphone socket 100 provided by the embodiment of the present invention is used as a sunken plate earphone socket, and can choose to use the support part 131 or the connecting part 121 as the connection with the circuit board according to the different height requirements of the sunken plate of different circuit boards. 200 connected supporting parts; wherein, since the supporting heights of each group of supporting parts 131 and connecting parts 121 are different, when it is necessary to use the connecting part 121 or a group of supporting parts 131 with a higher supporting part as the earphone socket 100 and the circuit board 200, the lower supporting portion 131 can be avoided by setting a hollow structure on the circuit board 200 .

Specifically, as shown in FIGS. 2 and 3 , an embodiment of the present invention provides an earphone jack assembly, including a circuit board 200 and the aforementioned earphone jack 100 ;

The circuit board 200 includes a third surface 210 and a fourth surface 220 disposed opposite to each other. The circuit board 200 is provided with an accommodating groove 230 , and the circuit board 200 is also provided with a connecting portion 240 ;

The earphone jack 100 is partly accommodated in the accommodating groove 230, the welding leg 122 of the terminal 120 is electrically connected to the conducting portion 240, and the second connecting surface of the connecting portion 121 of the terminal 120 is connected to the connecting portion 240. The third surface 210 of the circuit board 200 is abutted against, and the position of the circuit board 200 corresponding to the support portion 131 is hollowed out, and a hollowed out area 250 is formed on the circuit board 200 .

In this embodiment, the earphone jack assembly is a sinker-type earphone jack assembly, and the accommodating groove 230 is an open slot provided on the circuit board 200 for accommodating the earphone jack 100, and serves as an earphone jack through the connecting portion 121 of the terminal 120. The supporting part of 100 realizes the connection between the earphone socket 100 and the circuit board 200 .

Wherein, since the height of the first connection surface of the support portion 131 from the second surface 112 is smaller than the height of the second connection surface of the connection portion 121 from the second surface 112, the connection portion 121 of the terminal 120 is used as the support portion of the earphone jack 100 , it is necessary to hollow out the area of the circuit board 200 corresponding to the support portion 131 on the earphone socket 100 to form the hollowed out area 250 . Specifically, the hollow area 250 may be formed on the circuit board 200 by cutting or stamping, so as to make the supporting portion 131 suspended.

As shown in FIGS. 4 to 7 , an embodiment of the present invention provides another earphone socket assembly, including a circuit board 200 and the above-mentioned earphone socket 100 ;

The circuit board 200 includes a third surface 210 and a fourth surface 220 disposed opposite to each other. The circuit board 200 is provided with an accommodating groove 230 , and the circuit board 200 is also provided with a connecting portion 240 ;

The earphone socket 100 is partly accommodated in the accommodating groove 230, the solder pin 122 of the terminal 120 is electrically connected to the conducting part 240, and the first connecting surface of the supporting part 131 is connected to the circuit board. The third surface 210 of the terminal 120 abuts against, and the second connection surface of the connecting portion 121 of the terminal 120 is suspended.

In this embodiment, the earphone socket assembly is a sunken plate type earphone socket assembly, and the accommodating groove 230 is an open groove provided on the circuit board 200 for accommodating the earphone socket 100, and serves as a support for the earphone socket 100 through the supporting part 131 The part realizes the connection between the earphone jack 100 and the circuit board 200 .

Optionally, the fixed bracket 130 includes two sets of support parts 131, the two sets of support parts 131 include a first support part 1311 and a second support part 1312, and the distance between the first connection surface of the first support part 1311 is The height of the second surface 112 is smaller than the height of the first connecting surface of the second supporting portion 1312 from the second surface 112;

As shown in FIGS. 4 and 5 , when the first connection surface of the first support portion 1311 abuts against the third surface 210 of the circuit board 200 , the first connection surface of the second support portion 1312 is suspended;

As shown in FIGS. 6 and 7 , when the first connection surface of the second support portion 1312 abuts against the third surface 210 of the circuit board 200 , the circuit board 200 corresponds to the first support portion 1311 The position of the hollow is set to form a hollow area 250 . Specifically, the hollow area 250 may be formed on the circuit board 200 through cutting or stamping processes, so that the first supporting portion 1311 is suspended.

In this embodiment, by providing two sets of support parts 131 with different heights, the earphone jack 100 can be compatible with two height requirements, so as to improve the versatility of the earphone jack 100 .

It should be noted that the support portion 131 provided on the fixing bracket 130 can also be one or more groups, but considering the size of the earphone socket 100 and the stability of the connection between the earphone socket 100 and the circuit board 200, the The supporting parts 131 on the fixing bracket 130 are generally preferably two groups.

An embodiment of the present invention also relates to an electronic device, including the above earphone socket assembly.

Among them, the electronic device can be a mobile phone, a tablet computer, a personal digital assistant (Personal Digital Assistant, PDA), an e-book reader, an MP3 (Moving Picture Experts Group Audio Layer III) player, an MP4 (dynamic Moving Picture Experts Compresses Standard Audio Layer 4, MovingPicture Experts Group Audio Layer IV) Players, Laptops, Car PCs, Desktops, Set-Top Boxes, Smart TVs, Wearables, and more.

It should be noted that the implementation of the above-mentioned embodiment of the earphone socket assembly is also applicable to the embodiment of the electronic device, and can achieve the same technical effect, and will not be repeated here.

The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims (10)

1. a kind of earphone socket, which is characterized in that including：

Socket main body, the socket main body include the first face and the second face being disposed opposite to each other, and are located at first face and institute It states between the second face and two opposite lateral walls；

Terminal, the terminal are set on the lateral wall, and the terminal include protrude from interconnecting piece on the lateral wall and Leg, the leg are extended to form from the one end of the interconnecting piece far from the lateral wall towards second face side；

And the fixing bracket being fixedly connected with the socket main body, and the fixing bracket includes at least one set of support portion；

The support portion includes the first joint face that can be abutted with circuit board, and the interconnecting piece includes can be with the circuit board The second joint face abutted, and height of first joint face apart from second face is less than second joint face apart from institute State the height in the second face.

2. earphone socket according to claim 1, which is characterized in that the fixing bracket include rack body and from described in At least one set of support portion that the end of rack body both sides extends to form, and the rack body and the socket main body First face abuts.

3. earphone socket according to claim 2, which is characterized in that the rack body is additionally provided with bayonet, the socket Main body is equipped with passes through the bayonet and the card with the matched clamping part of the bayonet, the fixing bracket and the socket main body Buckle connects and fixes together.

4. earphone socket according to claim 1, which is characterized in that the fixing bracket includes two groups of support portions, described Two groups of support portions include the first support portion and the second support portion；

Height of first joint face of first support portion apart from second face is connect with the first of second support portion There are differences in height for height of the identity distance from second face.

5. earphone socket according to claim 4, which is characterized in that the quantity of first support portion is two, and point It Wei Yu not be on described two lateral walls；The quantity of second support portion is also two, is also located at described two lateral walls On.

6. earphone socket according to claim 4, which is characterized in that the distance of the first joint face of first support portion The height in second face is less than height of the first joint face of second support portion apart from second face.

7. a kind of phone jack component, which is characterized in that including circuit board and such as ear according to any one of claims 1 to 6 Machine transplanting of rice seat, wherein

The circuit board includes the third face being disposed opposite to each other and fourth face, and the circuit board is equipped with a storage tank, the circuit Junction is additionally provided on plate；

The earphone socket part is placed in the storage tank, and the leg of the terminal is electrically connected with the junction, described Second joint face of the interconnecting piece of terminal is abutted with the third face of the circuit board, and the support portion is corresponded on the circuit board The setting of position hollow out.

8. a kind of phone jack component, which is characterized in that including circuit board and such as ear according to any one of claims 1 to 6 Machine transplanting of rice seat, wherein

The circuit board includes the third face being disposed opposite to each other and fourth face, and the circuit board is equipped with a storage tank, the circuit Junction is additionally provided on plate；

The earphone socket part is placed in the storage tank, and the leg of the terminal is electrically connected with the junction, described First joint face of support portion is abutted with the third face of the circuit board, and the second joint face of the interconnecting piece of the terminal is hanging.

9. phone jack component according to claim 8, which is characterized in that the fixing bracket includes two groups of support portions, Two groups of support portions include the first support portion and the second support portion, and described in the first joint face distance of first support portion The height in the second face is less than height of the first joint face of second support portion apart from second face；

When first joint face of first support portion is abutted with the third face of the circuit board, the first of second support portion Joint face is hanging；

Described in being corresponded to when first joint face of second support portion is abutted with the third face of the circuit board, on the circuit board The position hollow out setting of first support portion.

10. a kind of electronic equipment, which is characterized in that include the phone jack component as described in any one of claim 7 to 9.