CN107603125A - A kind of phenolic resin foam composite board - Google Patents

A kind of phenolic resin foam composite board Download PDF

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Publication number
CN107603125A
CN107603125A CN201610553041.2A CN201610553041A CN107603125A CN 107603125 A CN107603125 A CN 107603125A CN 201610553041 A CN201610553041 A CN 201610553041A CN 107603125 A CN107603125 A CN 107603125A
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CN
China
Prior art keywords
powder
parts
phenolic resin
composite board
rubber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610553041.2A
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Chinese (zh)
Inventor
黄平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangyin's Application Interface Co Ltd
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Jiangyin's Application Interface Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to CN201610553041.2A priority Critical patent/CN107603125A/en
Publication of CN107603125A publication Critical patent/CN107603125A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a kind of phenolic resin foam composite board, its raw material composition fraction by weight includes 50~86 parts of phenolic resin, 0.5~2.5 part of emulsifying agent, 4~8 parts of foaming agent, 3~20 parts of 2~6 parts of curing accelerator and mixed filler, the composition of mixed filler includes 30~40 parts of wood powder or bamboo powder, 40~60 parts of inorganic powder, 10~23 parts of natural resin or Petropols, 5~10 parts of rubber powder, 0.5~3 part of coupling agent, wherein the material of rubber powder is EP rubbers, nitrile rubber, organic silicon rubber, at least one of polysulfide rubber, natural resin is at least one of rosin resin and kopol.Phenolic resin foam composite board component of the present invention is simple, mixed by using wood powder or bamboo powder, inorganic powder, resin and rubber powder as mixed filler, the toughness and rigidity of phenolic resin foamed board can be balanced, influence of the retrieval sheet material internal stress to processing, makes sheet material more smooth.

Description

A kind of phenolic resin foam composite board
Technical field
The present invention relates to foaming plate technical field, and in particular to a kind of phenolic resin foam composite board.
Background technology
Traditional insulation material such as polystyrene foam, polyurethane foam organic material still exists in fire protecting performance Some shortcomings, and some inorganic heat insulation materials such as rock wool etc. is unfavorable for the physical and mental health of workmen, has used on the market New type fireproof board prepared by waterglass and expanded perlite, but mechanical property is poor and water resistance is bad.It is this kind of multiple to improve Plate property is closed, improved technical scheme has prepares anti-fire screen using expanded perlite addition high temperature resistant powder and polyvinyl acetate Hot composite board, compression strength and fire resistance improve to some extent.Technical scheme also is good by phenolic resin Mechanical property and high temperature resistant ablation property, a kind of mixing of lightweight has been prepared using polystyrene foam particles and phenolic resin and protected Adiabator, but its anti-flammability needs further to improve.The sheet material that phenolic resin is made possesses good fire prevention, lightweight and guarantor The performance of temperature, but the flatness of phenolic foam board, heat resistance and mechanical property are poor, it is necessary to for drawbacks described above, to existing The component for having the Foaming of phenolic resin plate in technology is improved.
The content of the invention
It is an object of the invention to overcome defect present in prior art, there is provided a kind of phenolic resin foam composite board, Comprehensively utilize wood powder or bamboo powder, rubber powder and resin combination into additive package, improve the mechanical performance of sheet material.
To realize above-mentioned technique effect, the technical scheme is that:A kind of phenolic resin foam composite board, its feature exist Include 50~86 parts of phenolic resin, 0.5~2.5 part of emulsifying agent, 4~8 parts of foaming agent, solid in, its raw material composition fraction by weight Change 3~20 parts of 2~6 parts of accelerator and mixed filler, the composition of mixed filler includes 30~40 parts of wood powder or bamboo powder, inorganic 10~23 parts of 40~60 parts of powder, natural resin or Petropols, 5~10 parts of rubber powder, 0.5~3 part of coupling agent, wherein rubber powder Material is EP rubbers, nitrile rubber, organic silicon rubber, at least one of polysulfide rubber, natural resin be rosin resin and At least one of kopol.
Preferable technical scheme is that wood powder is selected from least one of leaf wood powder, broad-leaved wood powder, weedtree powder.
Preferable technical scheme is, inorganic powder be selected from natural sodium bentonite, precipitated calcium carbonate, precipitated calcium carbonate, At least one of hydrotalcite powder, diatomite, attapulgite.
Preferable technical scheme is that inorganic powder is that precipitated calcium carbonate and diatomite combine, diatom in inorganic powder The weight score ratio of soil is 35~55%.
Preferable technical scheme is that the particle diameter of wood powder or bamboo powder is 70~120 mesh;The particle diameter of inorganic powder is 150~200 Mesh.
Preferable technical scheme is that coupling agent is answered by amino-alkyl silicane and monoalkoxy Pyrophosphate Type Yitanate Coupling Agent With into the percentage by weight of monoalkoxy Pyrophosphate Type Yitanate Coupling Agent is 20~55% in coupling agent.
The advantages of the present invention are:
Phenolic resin foam composite board component of the present invention is simple, by using wood powder or bamboo powder, inorganic powder, resin and glue Powder is mixed as mixed filler, can balance the toughness and rigidity of phenolic resin foamed board, and retrieval sheet material internal stress pair adds The influence of work, make sheet material more smooth.
Embodiment
With reference to embodiment, the embodiment of the present invention is further described.Following examples are only used for more Add and clearly demonstrate technical scheme, and can not be limited the scope of the invention with this.
Embodiment 1
The phenolic resin foam composite board of embodiment 1, its raw material composition fraction by weight include 50 parts of phenolic resin, emulsification 3 parts of 2.5 parts of agent, 4 parts of foaming agent, 6 parts of curing accelerator and mixed filler, the composition of mixed filler include 40 parts of bamboo powder, 40 parts of inorganic powder, 23 parts of natural resin, 5 parts of rubber powder, 3 parts of coupling agent, the wherein material of rubber powder are EP rubbers, natural resin For rosin resin.
Inorganic powder is natural sodium bentonite.
The particle diameter of bamboo powder is 70 mesh;The particle diameter of inorganic powder is 200 mesh.
Coupling agent is formed by amino-alkyl silicane and monoalkoxy Pyrophosphate Type Yitanate Coupling Agent compounding, single in coupling agent The percentage by weight of alkoxy Pyrophosphate Type Yitanate Coupling Agent is 20%.
Embodiment 2
The difference of embodiment 2 and embodiment 1 is that phenolic resin foam composite board, its raw material forms fraction bag by weight Include 20 parts of 86 parts of phenolic resin, 0.5 part of emulsifying agent, 8 parts of foaming agent, 2 parts of curing accelerator and mixed filler, mixed filler Composition include 30 parts of bamboo powder, 60 parts of inorganic powder, 10 parts of Petropols, 10 parts of rubber powder, 0.5 part of coupling agent, wherein rubber powder Material is organic silicon rubber, and natural resin is kopol.
Inorganic powder is that precipitated calcium carbonate and diatomite combine, and diatomaceous weight score ratio is in inorganic powder 35%.
The particle diameter of bamboo powder is 120 mesh;The particle diameter of inorganic powder is 150 mesh.
Coupling agent is formed by amino-alkyl silicane and monoalkoxy Pyrophosphate Type Yitanate Coupling Agent compounding, single in coupling agent The percentage by weight of alkoxy Pyrophosphate Type Yitanate Coupling Agent is 55%.
Embodiment 3
The difference of embodiment 3 and embodiment 1 is that phenolic resin foam composite board, its raw material forms fraction bag by weight Include 14 parts of 65 parts of phenolic resin, 1.5 parts of emulsifying agent, 6 parts of foaming agent, 4 parts of curing accelerator and mixed filler, mixed filler Composition include 35 parts of wood powder, 50 parts of inorganic powder, 15 parts of natural resin, 7 parts of rubber powder, 1.5 parts of coupling agent, the wherein material of rubber powder Matter is polysulfide rubber, and natural resin is that rosin resin and kopol etc. mix again.
Wood powder is weedtree powder.
Inorganic powder is that precipitated calcium carbonate and diatomite combine, and diatomaceous weight score ratio is in inorganic powder 55%.
The particle diameter of wood powder is 90 mesh;The particle diameter of inorganic powder is 175 mesh.
Coupling agent is formed by amino-alkyl silicane and monoalkoxy Pyrophosphate Type Yitanate Coupling Agent compounding, single in coupling agent The percentage by weight of alkoxy Pyrophosphate Type Yitanate Coupling Agent is 37%.
Comparative example:Conventional wood powder is added in comparative example and substitutes mixed filler.
Composite board carries out testing flatness obtained by embodiment 1-3.
Test result:Embodiment 1-3 samples flatness is better than comparative example sample, at the same heat resistance and mechanical property also have it is small Width improves.
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art For member, without departing from the technical principles of the invention, some improvements and modifications can also be made, these improvements and modifications Also it should be regarded as protection scope of the present invention.

Claims (6)

  1. A kind of 1. phenolic resin foam composite board, it is characterised in that its raw material composition by weight fraction include phenolic resin 50~ 3~20 parts of 86 parts, 0.5~2.5 part of emulsifying agent, 4~8 parts of foaming agent, 2~6 parts of curing accelerator and mixed filler, mixing is filled out Fill the composition of agent include wood powder or 10~23 parts of 30~40 parts of bamboo powder, 40~60 parts of inorganic powder, natural resin or Petropols, 5~10 parts of rubber powder, 0.5~3 part of coupling agent, the wherein material of rubber powder are EP rubbers, nitrile rubber, organic silicon rubber, polysulfide At least one of rubber, natural resin are at least one of rosin resin and kopol.
  2. 2. phenolic resin foam composite board according to claim 1, it is characterised in that wood powder is selected from leaf wood powder, broad-leaved At least one of wood powder, weedtree powder.
  3. 3. phenolic resin foam composite board according to claim 1, it is characterised in that inorganic powder is selected from natural sodium base At least one of bentonite, precipitated calcium carbonate, precipitated calcium carbonate, hydrotalcite powder, diatomite, attapulgite.
  4. 4. phenolic resin foam composite board according to claim 3, it is characterised in that inorganic powder be precipitated calcium carbonate and Diatomite combines, and diatomaceous weight score ratio is 35~55% in inorganic powder.
  5. 5. phenolic resin foam composite board according to claim 4, it is characterised in that wood powder or the particle diameter of bamboo powder be 70~ 120 mesh;The particle diameter of inorganic powder is 150~200 mesh.
  6. 6. phenolic resin foam composite board according to claim 6, it is characterised in that coupling agent is by amino-alkyl silicane and list Alkoxy Pyrophosphate Type Yitanate Coupling Agent compounding forms, monoalkoxy Pyrophosphate Type Yitanate Coupling Agent in coupling agent Percentage by weight is 20~55%.
CN201610553041.2A 2016-07-11 2016-07-11 A kind of phenolic resin foam composite board Pending CN107603125A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610553041.2A CN107603125A (en) 2016-07-11 2016-07-11 A kind of phenolic resin foam composite board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610553041.2A CN107603125A (en) 2016-07-11 2016-07-11 A kind of phenolic resin foam composite board

Publications (1)

Publication Number Publication Date
CN107603125A true CN107603125A (en) 2018-01-19

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610553041.2A Pending CN107603125A (en) 2016-07-11 2016-07-11 A kind of phenolic resin foam composite board

Country Status (1)

Country Link
CN (1) CN107603125A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110903596A (en) * 2019-11-26 2020-03-24 固诺(天津)实业有限公司 Waterproof sound absorption type foam filling agent suitable for wall

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110903596A (en) * 2019-11-26 2020-03-24 固诺(天津)实业有限公司 Waterproof sound absorption type foam filling agent suitable for wall

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Addressee: Jiangyin's application interface Co. Ltd.

Document name: Notification of before Expiration of Request of Examination as to Substance

WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20180119