CN107599553A - A kind of preparation method of glue-free copper coated plate - Google Patents
A kind of preparation method of glue-free copper coated plate Download PDFInfo
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- CN107599553A CN107599553A CN201610553939.XA CN201610553939A CN107599553A CN 107599553 A CN107599553 A CN 107599553A CN 201610553939 A CN201610553939 A CN 201610553939A CN 107599553 A CN107599553 A CN 107599553A
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Abstract
The invention discloses a kind of preparation method of glue-free copper coated plate, including configuration raw material, heated lamination and semi-finished product heat treatment step.The preparation method step of glue-free copper coated plate of the present invention is simple, it is compound using Kapton and copper coin hot pressing, and glue-free copper coated plate semi-finished product obtained by hot pressing are heat-treated, promote the molecular chain rupture in Kapton to reset to form 3-D solid structure, optimize the dimensional stability of polyimide film layer.
Description
Technical field
The present invention relates to polyimide thermoplastic's property technical field of film preparation, and in particular to a kind of preparation of glue-free copper coated plate
Method.
Background technology
Glue-free copper coated plate refers to the single or double in the flexible insulating material such as polyester film or Kapton, passes through
Certain PROCESS FOR TREATMENT, bonded together formed copper-clad plate with copper foil.Glue-free copper coated plate be widely used in aerospace equipment,
Navigation equipment, aircraft instrument, military guidance system and mobile phone, digital camera, DV, vehicle satellite direction positioning dress
Put, in the electronic product such as LCD TV, notebook computer.Due to the fast development of electronic technology so that the production of glue-free copper coated plate
Steady growth is measured, production scale constantly expands, the particularly high performance glue-free copper coated plate using Kapton as base material, its
Demand and growth trend are more prominent.
The A of CN 104228211 disclose one kind to be included without glue polyimide copper clad lamination preparation method, its step：Containing
Chopped fiber or fiber powder are mixed in the DMF solution of the polyamic acid of percentage by weight 12%~23%, and is uniformly mixed；Will be mixed
Compound is evenly applied on copper foil and heated, 150~250 degrees Celsius of heating-up temperature, removes the solvent in DMF solution；After
It is continuous to be heated to 300~450 degrees Celsius, make polyamic acid imidization, form polyimides and be firmly affixed on copper foil, be thus made
Without glue polyimide copper clad lamination.Above-mentioned preparation method is by the way of gluing, complex process, and polyamides is sub- obtained by above-mentioned technique
The poor dimensional stability of amine film, so as to influence the dimensional stability of glue-free copper coated plate.
The content of the invention
It is an object of the invention to overcome defect present in prior art, there is provided a kind of preparation side of glue-free copper coated plate
Method, gained glue-free copper coated plate have good dimensional stability.
To realize above-mentioned technique effect, the technical scheme is that：A kind of preparation method of glue-free copper coated plate, its feature
It is, comprises the following steps：
S1：Size identical copper foil is configured, the Kapton of formed objects is folded among copper foil, polyimides
The mat surface of film and copper foil fits；
S2：Stepped construction obtained by S1 is placed in heated lamination in 290~320 DEG C of mould, lamination pressure is 23~
27Mpa, lamination times are 50~100min, and discharging obtains glue-free copper coated plate semi-finished product；
S3：Glue-free copper coated plate semi-finished product obtained by S2 are placed in Muffle furnace, are heated to 390~420 DEG C, inert gas shielding
50~80min of lower processing, obtains glue-free copper coated plate finished product.
Preferable technical scheme is that inert gas is nitrogen or argon gas in the S3.
Preferable technical scheme is that the thickness of the Kapton is 8~15 μm.
Preferable technical scheme is that the two-sided of Kapton passes through sided corona treatment in the S1.
Preferable technical scheme is to contain nano level heat filling, Kapton in S1 in Kapton
The percentage by weight of middle heat filling is 3~15%.
Preferable technical scheme is that heat filling includes component A and component B, and component A is selected from rare earth oxide and rare earth
At least one of oxysulfide, component B are selected from least one of aluminum oxide, aluminium nitride, boron nitride, carborundum, heat conduction
Component B percentage by weight is 90~95% in filler.
Preferable technical scheme is that component A rare earth element is lanthanum or cerium.
The advantages of the present invention are：
The preparation method step of glue-free copper coated plate of the present invention is simple, compound using Kapton and copper coin hot pressing, and
And glue-free copper coated plate semi-finished product obtained by hot pressing are heat-treated, promote the molecular chain rupture in Kapton to reset to be formed
3-D solid structure, optimize the dimensional stability of polyimide film layer.
Embodiment
With reference to embodiment, the embodiment of the present invention is further described.Following examples are only used for more
Add and clearly demonstrate technical scheme, and can not be limited the scope of the invention with this.
Embodiment 1
The preparation method of glue-free copper coated plate comprises the following steps in embodiment 1：
S1：Size identical copper foil is configured, the Kapton of formed objects is folded among copper foil, polyimides
The mat surface of film and copper foil fits；
S2：Stepped construction obtained by S1 is placed in heated lamination in 290 DEG C of mould, lamination pressure 27Mpa, lamination times
For 50min, discharging obtains glue-free copper coated plate semi-finished product；
S3：Glue-free copper coated plate semi-finished product obtained by S2 are placed in Muffle furnace, 420 DEG C is heated to, locates under inert gas shielding
50min is managed, obtains glue-free copper coated plate finished product.
Inert gas is nitrogen in S3.
The thickness of Kapton is 15 μm.
Contain nano level heat filling in S1 in Kapton, the weight hundred of heat filling in Kapton
Divide than being 3%.
Heat filling is aluminum oxide.
Embodiment 2
The difference of embodiment 2 and embodiment 1 is,
Stepped construction obtained by S1 is placed in heated lamination in 320 DEG C of mould in S2, lamination pressure 23Mpa, during lamination
Between be 100min, discharging obtain glue-free copper coated plate semi-finished product；
S3：Glue-free copper coated plate semi-finished product obtained by S2 are placed in Muffle furnace, 390 DEG C is heated to, locates under inert gas shielding
80min is managed, obtains glue-free copper coated plate finished product.
Inert gas is argon gas in S3.
The thickness of Kapton is 8 μm.
The two-sided of Kapton passes through sided corona treatment in S1.
Contain nano level heat filling in S1 in Kapton, the weight hundred of heat filling in Kapton
Divide than being 15%.
Heat filling includes component A and component B, and component A is rare earth oxide, and component B is aluminium nitride, group in heat filling
The percentage by weight for dividing B is 90%.
Component A rare earth element is lanthanum.
Embodiment 3
The difference of embodiment 3 and embodiment 1 is,
Stepped construction obtained by S1 is placed in heated lamination in 305 DEG C of mould in S2, lamination pressure 25Mpa, during lamination
Between be 75min, discharging obtain glue-free copper coated plate semi-finished product；
S3：Glue-free copper coated plate semi-finished product obtained by S2 are placed in Muffle furnace, 405 DEG C is heated to, locates under inert gas shielding
65min is managed, obtains glue-free copper coated plate finished product.
Inert gas is nitrogen in S3.
The thickness of Kapton is 11 μm.
The two-sided of Kapton passes through sided corona treatment in S1.
Contain nano level heat filling in S1 in Kapton, the weight hundred of heat filling in Kapton
Divide than being 9%.
Heat filling includes component A and component B, and component A is rare-earth oxide sulfate, component B be aluminium nitride and carborundum with
Weight mixes than 1: 1, and component B percentage by weight is 995% in heat filling.
Component A rare earth element is cerium.
Comparative example：Comparative example uses the production technology in specification background technology, the solid content of polyimide solution, coating
Amount is identical with the solid content in the Kapton of embodiment 1.
Dimensional stability test is carried out to copper-clad plate obtained by embodiment：
Result of the test：Embodiment 1-3 copper-clad plate toughness and excellent size stability, meet glue-free copper coated plate toughness size
Stability criterion, comparative example dimensional stability is poor, in addition, the copper-clad plate heat transfer efficiency in embodiment 2 and embodiment 3 is higher than real
Apply example 1 and comparative example.
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, some improvements and modifications can also be made, these improvements and modifications
Also it should be regarded as protection scope of the present invention.
Claims (7)
1. a kind of preparation method of glue-free copper coated plate, it is characterised in that comprise the following steps：
S1：Size identical copper foil is configured, the Kapton of formed objects is folded among copper foil, Kapton
Fitted with the mat surface of copper foil；
S2：Stepped construction obtained by S1 is placed in heated lamination in 290~320 DEG C of mould, lamination pressure is 23~27Mpa, layer
The pressure time is 50~100min, and discharging obtains glue-free copper coated plate semi-finished product；
S3：Glue-free copper coated plate semi-finished product obtained by S2 are placed in Muffle furnace, 390~420 DEG C is heated to, locates under inert gas shielding
50~80min is managed, obtains glue-free copper coated plate finished product.
2. the preparation method of glue-free copper coated plate according to claim 1, it is characterised in that inert gas is nitrogen in the S3
Gas or argon gas.
3. the preparation method of glue-free copper coated plate according to claim 1, it is characterised in that the thickness of the Kapton
Spend for 8~15 μm.
4. the preparation method of glue-free copper coated plate according to claim 1, it is characterised in that Kapton in the S1
Two-sided pass through sided corona treatment.
5. the preparation method of glue-free copper coated plate according to claim 1, it is characterised in that contain in S1 in Kapton
There is a nano level heat filling, the percentage by weight of heat filling is 3~15% in Kapton.
6. the preparation method of glue-free copper coated plate according to claim 5, it is characterised in that heat filling include component A and
Component B, component A are selected from least one of rare earth oxide and rare-earth oxide sulfate, and component B is selected from aluminum oxide, nitridation
At least one of aluminium, boron nitride, carborundum, component B percentage by weight is 90~95% in heat filling.
7. the preparation method of glue-free copper coated plate according to claim 6, it is characterised in that component A rare earth element is lanthanum
Or cerium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610553939.XA CN107599553A (en) | 2016-07-11 | 2016-07-11 | A kind of preparation method of glue-free copper coated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610553939.XA CN107599553A (en) | 2016-07-11 | 2016-07-11 | A kind of preparation method of glue-free copper coated plate |
Publications (1)
| Publication Number | Publication Date |
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| CN107599553A true CN107599553A (en) | 2018-01-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610553939.XA Pending CN107599553A (en) | 2016-07-11 | 2016-07-11 | A kind of preparation method of glue-free copper coated plate |
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| Country | Link |
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| CN (1) | CN107599553A (en) |
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2016
- 2016-07-11 CN CN201610553939.XA patent/CN107599553A/en active Pending
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| PB01 | Publication | ||
| PB01 | Publication | ||
| DD01 | Delivery of document by public notice | ||
| DD01 | Delivery of document by public notice |
Addressee: Jiangyin's application interface Co. Ltd. Document name: Notification of before Expiration of Request of Examination as to Substance |
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180119 |