CN107599588A - A kind of preparation method of polyimides flexibility coat copper plate - Google Patents
A kind of preparation method of polyimides flexibility coat copper plate Download PDFInfo
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- CN107599588A CN107599588A CN201610554228.4A CN201610554228A CN107599588A CN 107599588 A CN107599588 A CN 107599588A CN 201610554228 A CN201610554228 A CN 201610554228A CN 107599588 A CN107599588 A CN 107599588A
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- polyimides
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- flexibility coat
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Abstract
The invention discloses a kind of preparation method of polyimides flexibility coat copper plate, including configuration polyimides glue, heated lamination and semi-finished product heat treatment step.The preparation method step of polyimides flexibility coat copper plate of the present invention is simple, it is compound using Kapton and companion's hot pressing, and glue-free copper coated plate semi-finished product obtained by hot pressing are heat-treated, promote the molecular chain rupture in Kapton to reset to form 3-D solid structure, optimize the dimensional stability of polyimide film layer.
Description
Technical field
The present invention relates to polyimide thermoplastic's property technical field of film preparation, and in particular to a kind of polyimides flexible copper-clad
The preparation method of plate.
Background technology
Glue-free copper coated plate refers to the single or double in the flexible insulating material such as polyester film or Kapton, passes through
Certain PROCESS FOR TREATMENT, bonded together formed copper-clad plate with copper foil.Glue-free copper coated plate be widely used in aerospace equipment,
Navigation equipment, aircraft instrument, military guidance system and mobile phone, digital camera, DV, vehicle satellite direction positioning dress
Put, in the electronic product such as LCD TV, notebook computer.Due to the fast development of electronic technology so that the production of glue-free copper coated plate
Steady growth is measured, production scale constantly expands, the particularly high performance glue-free copper coated plate using Kapton as base material, its
Demand and growth trend are more prominent.
CN 104228211A disclose one kind to be included without glue polyimide copper clad lamination preparation method, its step：Containing weight
Measure and chopped fiber or fiber powder are mixed in the DMF solution of the polyamic acid of percentage 12%~23%, and be uniformly mixed；Will mixing
Thing is evenly applied on copper foil and heated, 150~250 degrees Celsius of heating-up temperature, removes the solvent in DMF solution；Continue
300~450 degrees Celsius are heated to, makes polyamic acid imidization, polyimides is formed and is firmly affixed on copper foil, nothing is thus made
Glue polyimide copper clad lamination.Above-mentioned preparation method is by the way of gluing, complex process, and polyimides obtained by above-mentioned technique
The poor dimensional stability of film, so as to influence the dimensional stability of glue-free copper coated plate.
The content of the invention
It is an object of the invention to overcome defect present in prior art, there is provided a kind of polyimides flexibility coat copper plate
Preparation method, gained glue-free copper coated plate have good dimensional stability.
To realize above-mentioned technique effect, the technical scheme is that：A kind of preparation side of polyimides flexibility coat copper plate
Method, it is characterised in that comprise the following steps：
S1：Polyimides, heat filling are added in dimethylformamide, and are uniformly mixed to obtain polyimides glue
Liquid, the percentage by weight of polyimides is 12~20% in polyimides glue, the weight percent of filler in polyimides glue
Than for 5~10%,；
S2：Polyimides glue obtained by S1 is coated to the mat surface of a piece of copper foil, be heated to 150~250 DEG C go out it is molten
Agent, another size identical copper foil is covered on polyimides glue, is heated to 290~320 DEG C of laminations, lamination pressure is
23~27Mpa, lamination times are 50~100min；
S3：Glue-free copper coated plate semi-finished product obtained by S2 are placed in Muffle furnace, are heated to 390~420 DEG C, inert gas shielding
50~80min of lower processing, obtains glue-free copper coated plate finished product.
Preferable technical scheme is that the thickness of the Kapton is 8~15 μm.
Preferable technical scheme is that mixture is cast into copper foil surface using the tape casting in S2 steps.
Preferable technical scheme is, heat filling include component A and component B, component A in rare-earth sulfide extremely
Few one kind, component B are the component B weight in heat filling selected from least one of aluminum oxide, aluminium nitride, boron nitride, carborundum
It is 90~95% to measure percentage；Component A rare earth element is lanthanum or cerium.
The advantages of the present invention are：
The preparation method step of polyimides flexibility coat copper plate of the present invention is simple, using Kapton and copper coin hot pressing
It is compound, and glue-free copper coated plate semi-finished product obtained by hot pressing are heat-treated, promote the molecular chain rupture in Kapton
Rearrangement forms 3-D solid structure, optimizes the dimensional stability of polyimide film layer.
Embodiment
With reference to embodiment, the embodiment of the present invention is further described.Following examples are only used for more
Add and clearly demonstrate technical scheme, and can not be limited the scope of the invention with this.
Embodiment 1
The preparation method of polyimides flexibility coat copper plate comprises the following steps in embodiment 1：
S1：Polyimides, heat filling are added in dimethylformamide, and are uniformly mixed to obtain polyimides glue
Liquid, the percentage by weight of polyimides is 12% in polyimides glue, and the percentage by weight of filler is in polyimides glue
10%,；
S2：Polyimides glue obtained by S1 is coated to the mat surface of a piece of copper foil, is heated to 150 DEG C of solvents of going out, will
Another size identical copper foil is covered on polyimides glue, is heated to 320 DEG C of laminations, lamination pressure 23Mpa, lamination
Time is 100min；
S3：Glue-free copper coated plate semi-finished product obtained by S2 are placed in Muffle furnace, 390 DEG C is heated to, locates under inert gas shielding
80min is managed, obtains glue-free copper coated plate finished product.
The thickness of the Kapton is 8 μm.
Mixture is cast to by copper foil surface using the tape casting in S2 steps.
Heat filling is aluminum oxide.
Embodiment 2
The difference of embodiment 2 and embodiment 1 is,
The preparation method of polyimides flexibility coat copper plate comprises the following steps：
S1：Polyimides, heat filling are added in dimethylformamide, and are uniformly mixed to obtain polyimides glue
Liquid, the percentage by weight of polyimides is 12% in polyimides glue, and the percentage by weight of filler is in polyimides glue
10%,；
S2：Polyimides glue obtained by S1 is coated to the mat surface of a piece of copper foil, is heated to 150 DEG C of solvents of going out, will
Another size identical copper foil is covered on polyimides glue, is heated to 320 DEG C of laminations, lamination pressure 23Mpa, lamination
Time is 100min；
S3：Glue-free copper coated plate semi-finished product obtained by S2 are placed in Muffle furnace, 390 DEG C is heated to, locates under inert gas shielding
80min is managed, obtains glue-free copper coated plate finished product.
The thickness of the Kapton is 8 μm.
Mixture is cast to by copper foil surface using the tape casting in S2 steps.
Heat filling includes component A and component B, and component A is cerium sulphide, and component B is aluminium nitride and carborundum with weight ratio 1
: 1 mixes, and component B percentage by weight is 90% in heat filling.
Embodiment 3
The difference of embodiment 3 and embodiment 1 is,
The preparation method of polyimides flexibility coat copper plate comprises the following steps：
S1：Polyimides, heat filling are added in dimethylformamide, and are uniformly mixed to obtain polyimides glue
Liquid, the percentage by weight of polyimides is 16% in polyimides glue, and the percentage by weight of filler is in polyimides glue
7%,；
S2：Polyimides glue obtained by S1 is coated to the mat surface of a piece of copper foil, is heated to 200 DEG C of solvents of going out, will
Another size identical copper foil is covered on polyimides glue, is heated to 305 DEG C of laminations, lamination pressure 25Mpa, lamination
Time is 75min；
S3：Glue-free copper coated plate semi-finished product obtained by S2 are placed in Muffle furnace, 405 DEG C is heated to, locates under inert gas shielding
65min is managed, obtains glue-free copper coated plate finished product.
The thickness of the Kapton is 11 μm.
Mixture is cast to by copper foil surface using the tape casting in S2 steps.
Heat filling includes component A and component B, and component A is rare earth lanthanum sulfide, and component B is carborundum, group in heat filling
The percentage by weight for dividing B is 95%.
Comparative example：Comparative example uses the production technology in specification background technology, the solid content of polyimide solution, coating
Amount is identical with the solid content in the Kapton of embodiment 1.
Dimensional stability test is carried out to copper-clad plate obtained by embodiment：
Result of the test：Embodiment 1-3 copper-clad plate toughness and excellent size stability, meet glue-free copper coated plate toughness size
Stability criterion, comparative example dimensional stability is poor, in addition, the copper-clad plate heat transfer efficiency in embodiment 2 and embodiment 3 is higher than real
Apply example 1 and comparative example.
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, some improvements and modifications can also be made, these improvements and modifications
Also it should be regarded as protection scope of the present invention.
Claims (4)
1. a kind of preparation method of polyimides flexibility coat copper plate, it is characterised in that comprise the following steps：
S1：Polyimides, heat filling are added in dimethylformamide, and are uniformly mixed to obtain polyimides glue,
The percentage by weight of polyimides is 12~20% in polyimides glue, and the percentage by weight of filler is in polyimides glue
5~10%,；
S2：Polyimides glue obtained by S1 is coated to the mat surface of a piece of copper foil, is heated to 150~250 DEG C of solvents of going out, will
Another size identical copper foil is covered on polyimides glue, be heated to 290~320 DEG C lamination, lamination pressure be 23~
27Mpa, lamination times are 50~100min；
S3：Glue-free copper coated plate semi-finished product obtained by S2 are placed in Muffle furnace, 390~420 DEG C is heated to, locates under inert gas shielding
50~80min is managed, obtains glue-free copper coated plate finished product.
2. the preparation method of polyimides flexibility coat copper plate according to claim 1, it is characterised in that the polyimides
The thickness of film is 8~15 μm.
3. the preparation method of polyimides flexibility coat copper plate according to claim 1, it is characterised in that used in S2 steps
Mixture is cast to copper foil surface by the tape casting.
4. the preparation method of polyimides flexibility coat copper plate according to claim 1, it is characterised in that heat filling includes
Component A and component B, component A are selected from least one of rare-earth sulfide, and component B is selected from aluminum oxide, aluminium nitride, nitridation
At least one of boron, carborundum, component B percentage by weight is 90~95% in heat filling；Component A rare earth element is
Lanthanum or cerium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610554228.4A CN107599588A (en) | 2016-07-11 | 2016-07-11 | A kind of preparation method of polyimides flexibility coat copper plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610554228.4A CN107599588A (en) | 2016-07-11 | 2016-07-11 | A kind of preparation method of polyimides flexibility coat copper plate |
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| CN107599588A true CN107599588A (en) | 2018-01-19 |
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| CN201610554228.4A Pending CN107599588A (en) | 2016-07-11 | 2016-07-11 | A kind of preparation method of polyimides flexibility coat copper plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111300922A (en) * | 2019-04-30 | 2020-06-19 | 南京中鸿润宁新材料科技有限公司 | Polyimide flexible copper-clad plate |
| CN111300950A (en) * | 2019-04-29 | 2020-06-19 | 南京中鸿润宁新材料科技有限公司 | Preparation method of high-performance polyimide flexible copper clad laminate |
-
2016
- 2016-07-11 CN CN201610554228.4A patent/CN107599588A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111300950A (en) * | 2019-04-29 | 2020-06-19 | 南京中鸿润宁新材料科技有限公司 | Preparation method of high-performance polyimide flexible copper clad laminate |
| CN111300950B (en) * | 2019-04-29 | 2021-11-19 | 南京中鸿润宁新材料科技有限公司 | Preparation method of high-performance polyimide flexible copper clad laminate |
| CN111300922A (en) * | 2019-04-30 | 2020-06-19 | 南京中鸿润宁新材料科技有限公司 | Polyimide flexible copper-clad plate |
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Addressee: Jiangyin's application interface Co. Ltd. Document name: Notification of before Expiration of Request of Examination as to Substance |
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Application publication date: 20180119 |