CN107598381A - The method and device of knife mark on a kind of removing aluminium alloy work piece - Google Patents
The method and device of knife mark on a kind of removing aluminium alloy work piece Download PDFInfo
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- CN107598381A CN107598381A CN201710751096.9A CN201710751096A CN107598381A CN 107598381 A CN107598381 A CN 107598381A CN 201710751096 A CN201710751096 A CN 201710751096A CN 107598381 A CN107598381 A CN 107598381A
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- laser
- knife mark
- work piece
- mark
- aluminium alloy
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Abstract
The present invention proposes a kind of method and device for removing knife mark on aluminium alloy work piece, including：Localization process, capture the place for having knife mark in Al alloy parts surface, groove and hole；After the completion of positioning, laser light extraction is controlled, removes the knife mark in the surfaces of Al alloy parts, groove and hole.Efficiency high, effect is good, and cost is low.
Description
Technical field
The present invention relates to technical field of laser processing, more particularly to it is a kind of using laser on aluminium alloy work piece surface, recessed
The method that the working position such as groove or hole removes knife mark.
Background technology
When the surface of existing turnning and milling aluminium alloy work piece, groove or hole, inevitably knife mark not of uniform size
Phenomenon.Normally, the knife mark in these surfaces, groove, hole is handled, it is necessary to using techniques such as sandblastings.Blasting craft is used to remove
Knife mark, to the strict management and control of blasting craft palpus, less efficient, otherwise sandblasting is excessive, and stress easily occurs, and causes aluminium alloy to add
The bending of workpiece, size change (especially thin plate).Also, the knife mark in some grooves or hole, sandblasting are difficult spray
Arrive, or, spray is uneven, causes the effect of knife mark poor.In addition, the tiny particles content used needed for blasting craft, easily
The health of operating personnel is caused damage, these tiny particles contents also easily cause pollution, increased substantial amounts of raw as consumptive material
Produce cost.
The content of the invention
The technical problem to be solved in the present invention is, for the drawbacks described above of prior art, proposes a kind of removing aluminium alloy
The method of knife mark on workpiece, efficiency high, effect is good, and cost is low.
The technical solution adopted for the present invention to solve the technical problems is：Knife mark on a kind of removing aluminium alloy work piece is provided
Device, including：
Electrical control division, for giving laser provided energy power supply, and control the way of output of laser beam；
Laser, for providing light source for laser processing of materials surface；
Beam expanding lens, the light for laser to be sent expand, and improve the transmission characteristic of laser；
Galvanometer system, the specified location for laser to be given according to control software carry out telltale mark；
CCD alignment systems, there is the place of knife mark in surface, groove and the hole for capturing aluminium alloy work piece；
Optical focus camera lens, for making laser beam focusing；And
Workbench, for carrying Al alloy parts.
Wherein, the laser selects infrared optical fiber laser.
Wherein, a length of 1055nm-1075nm of the impulse wave of the laser, the pulsewidth of the laser is 4-200ns.
Wherein, the mean power of the laser is 20W.
Wherein, the galvanometer system includes X galvanometers and Y galvanometers, and each galvanometer is combined by scan module and optical mirror slip.
Wherein, the CCD alignment systems include camera and light source.
Wherein, the focal dimension for the laser that the optical focus camera lens provides is within 0.03mm.
The technical solution adopted for the present invention to solve the technical problems is still：A kind of removing aluminium alloy work piece upper slitter is provided
The method of line, including：Localization process, capture the place for having knife mark in Al alloy parts surface, groove and hole；Go at knife mark
Reason, after the completion of positioning, laser light extraction is controlled, removes the knife mark in the surfaces of Al alloy parts, groove and hole.
Wherein, before described localization process, in addition to：Cleaning treatment, the Al alloy parts for needing laser labelling
Surface clean is clean.
Wherein, it is described go knife mark to handle after, in addition to：Cleaning is handled, by Al alloy parts wiped clean.
The beneficial effects of the present invention are capture Al alloy parts surface, groove and Kong Liyou by localization process
The place of knife mark, then by going knife mark to handle, after the completion of positioning, control laser light extraction, remove Al alloy parts surface,
Groove and the knife mark in hole, efficiency high, effect is good, and cost is low.
Brief description of the drawings
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing：
Fig. 1 is the schematic diagram for removing the device that knife mark is processed on aluminium alloy work piece of the present invention.
Fig. 2 is the flow chart for removing the method that knife mark is processed on aluminium alloy work piece of the present invention.
The method that Fig. 3 is the present invention compares figure to the effect of aluminium alloy work piece before and after the processing.
Wherein, description of reference numerals is as follows：1st, electrical control division 2, laser 3, beam expanding lens 4, galvanometer system 5, CCD
Alignment system 6, optical focus mirror 7, workbench.
Embodiment
In conjunction with accompanying drawing, presently preferred embodiments of the present invention is elaborated.
Referring to Fig. 1, Fig. 1 is the schematic diagram for removing the device that knife mark is processed on aluminium alloy work piece of the present invention.The present invention
A kind of device for removing knife mark on aluminium alloy work piece is proposed, including：Electrical control division 1, laser 2, beam expanding lens 3, galvanometer system
4, CCD of system alignment systems 5, optical focus camera lens 6 and workbench 7.
Electrical control division 1 is used to give laser provided energy power supply, and controls the way of output of laser beam.
Laser 2 is used to provide light source for laser processing of materials surface.In the present embodiment, laser 2 selects infrared light
Fibre laser, its impulse wave a length of 1055nm-1075nm, pulsewidth 4-200ns, mean power 20W.In other embodiments
In, according to the needs of practical application, the laser 2 can select other laser types, the pulse wavelength of the laser 2,
The index parameter such as pulsewidth and mean power can also be selected separately.
The light that beam expanding lens 3 is used to send in laser 2 expands, and the transmission characteristic of laser is improved, preferably to converge laser
Gather material surface.
Galvanometer system 4 includes X galvanometers and Y galvanometers, is combined by scan module and optical mirror slip, for utilizing scanning electricity
Machine drives optical mirror slip to carry out gauche form motion, and the specified location that laser gives according to control software is carried out into telltale mark.
CCD alignment systems 5 include camera and light source, and its software section (i.e. CCD softwares) and mark software (belong to electric-controlled
The software section in portion 1 processed) connected by virtual serial port.Mark software sends a signal to CCD softwares, after CCD softwares are connected to signal,
Captured by polishing camera, being capable of precise positioning.After positioning OK, then mark software light extraction is delivered a signal to, so as to realize
Accurate mark.
Optical focus mirror 6 is used to make laser beam focusing (the laser facula characteristic one i.e. in a certain flat focus to point
Cause).Workbench 7 is used to carry Al alloy parts (not shown), that is, provides when Al alloy parts carry out Laser Processing mark
Place place.
Referring to Fig. 2, Fig. 2 is the flow chart for removing the method for knife mark on aluminium alloy work piece of the present invention.The present invention proposes
A kind of method that knife mark is processed on removing aluminium alloy work piece, is comprised the following steps that：
S201, cleaning treatment.It is needing the Al alloy parts surface clean of laser labelling clean, especially needs to beat
Target position.Specifically include：Degrease simultaneously wiped clean, dries up and checks the cleanliness factor on surface.
S203, localization process.It is to use CCD positioning functions, has knife in crawl Al alloy parts surface, groove and hole
The place of line.
S205, knife mark is gone to handle.Be after the completion of positioning, control laser light extraction, remove Al alloy parts surface,
Groove and the knife mark in hole.In the present embodiment, it is to click on corresponding operation interface by operating personnel, to control laser to go out
Light；In other embodiments, it can be software automatically controls laser light extraction.
S207, cleaning processing.It is after laser goes knife mark to terminate, by Al alloy parts wiped clean.
Referring to Fig. 3, the method that Fig. 3 is the present invention compares figure to the effect of aluminium alloy work piece before and after the processing.It can be seen that use
It can be seen that clearly knife mark on the aluminium alloy work piece 301 of this method before processing；Aluminium alloy after being handled using this method is added
Knife mark has been can't see on workpiece 303.
The beneficial effects of the present invention are compared with existing sandblasting glossing, method of the invention is untouchable
Processing, due to Laser Focusing size it is small (such as：Within 0.03mm), processing is fine, and heat-affected zone is small, and stress is small,
Deformation is less likely to occur, the surface size of aluminium alloy work piece will not be changed, goes knife mark speed fast, efficiency high；Further, it is possible to go
Except some sandblastings are sprayed less than or spray uneven groove, aperture, effect is good.In addition, processing cost is relatively low, may band to human body
The harm come is smaller.
It should be appreciated that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations, to ability
For field technique personnel, the technical scheme described in above-described embodiment can be modified, or it is special to which part technology
Sign carries out equivalent substitution；And these are changed and are replaced, it should all belong to the protection domain of appended claims of the present invention.
Claims (10)
- A kind of 1. device for removing knife mark on aluminium alloy work piece, it is characterised in that including：Electrical control division, for giving laser provided energy power supply, and control the way of output of laser beam；Laser, for providing light source for laser processing of materials surface；Beam expanding lens, the light for laser to be sent expand, and improve the transmission characteristic of laser；Galvanometer system, the specified location for laser to be given according to control software carry out telltale mark；CCD alignment systems, there is the place of knife mark in surface, groove and the hole for capturing aluminium alloy work piece；Optical focus camera lens, for making laser beam focusing；Workbench, for carrying Al alloy parts.
- 2. device according to claim 1, it is characterised in that：The laser selects infrared optical fiber laser.
- 3. device according to claim 2, it is characterised in that：The a length of 1055nm-1075nm of impulse wave of the laser, should The pulsewidth of laser is 4-200ns.
- 4. device according to claim 2, it is characterised in that：The mean power of the laser is 20W.
- 5. device according to claim 1, it is characterised in that：The galvanometer system includes X galvanometers and Y galvanometers, each galvanometer Combined by scan module and optical mirror slip.
- 6. device according to claim 1, it is characterised in that：The CCD alignment systems include camera and light source.
- 7. according to the device described in any one of claim 1 to 6, it is characterised in that：The optical focus camera lens provides the poly- of laser Burnt size is within 0.03mm.
- 8. a kind of remove the method that knife mark is processed on aluminium alloy work piece, it is characterised in that including：Localization process, crawl aluminium close There is the place of knife mark in golden workpiece surface, groove and hole；Go knife mark to handle, after the completion of positioning, control laser light extraction, go Fall the knife mark in the surfaces of Al alloy parts, groove and hole.
- 9. according to the method for claim 8, it is characterised in that：Before described localization process, in addition to：At cleaning Reason, needing, the Al alloy parts surface clean of laser labelling is clean.
- 10. according to the method for claim 8, it is characterised in that：It is described go knife mark to handle after, in addition to：Cleaning Processing, by Al alloy parts wiped clean.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710751096.9A CN107598381A (en) | 2017-08-28 | 2017-08-28 | The method and device of knife mark on a kind of removing aluminium alloy work piece |
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| CN201710751096.9A CN107598381A (en) | 2017-08-28 | 2017-08-28 | The method and device of knife mark on a kind of removing aluminium alloy work piece |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108994446A (en) * | 2018-08-30 | 2018-12-14 | 合肥联宝信息技术有限公司 | It is a kind of for removing the device and method of material surface hickie |
| CN111151884A (en) * | 2018-11-06 | 2020-05-15 | 大族激光科技产业集团股份有限公司 | Method and equipment for removing plastic overflow edge by using laser |
| CN113414889A (en) * | 2021-06-29 | 2021-09-21 | 华中科技大学 | Method and device for compounding laser-assisted diamond cutting and laser polishing in situ |
| CN113500711A (en) * | 2021-06-29 | 2021-10-15 | 华中科技大学 | High-precision composite energy field auxiliary cutting and finishing equipment and method |
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| CN113414889A (en) * | 2021-06-29 | 2021-09-21 | 华中科技大学 | Method and device for compounding laser-assisted diamond cutting and laser polishing in situ |
| CN113500711A (en) * | 2021-06-29 | 2021-10-15 | 华中科技大学 | High-precision composite energy field auxiliary cutting and finishing equipment and method |
| CN113500711B (en) * | 2021-06-29 | 2022-09-13 | 华中科技大学 | High-precision composite energy field auxiliary cutting and finishing equipment and method |
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Application publication date: 20180119 |