CN108994446B - Device and method for removing white spots on surface of material - Google Patents
Device and method for removing white spots on surface of material Download PDFInfo
- Publication number
- CN108994446B CN108994446B CN201811001305.9A CN201811001305A CN108994446B CN 108994446 B CN108994446 B CN 108994446B CN 201811001305 A CN201811001305 A CN 201811001305A CN 108994446 B CN108994446 B CN 108994446B
- Authority
- CN
- China
- Prior art keywords
- laser
- white spots
- galvanometer
- residual stress
- white
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
Abstract
The invention provides a device for removing white spots caused by thermal residual stress on the surface of a material, which comprises a laser; the X galvanometer is used for reversing laser from the laser; the Y galvanometer is used for reversing the laser passing through the X galvanometer; and the focusing mirror is used for adjusting the light intensity of the laser passing through the Y-shaped vibrating mirror and guiding the laser with the adjusted light intensity to the surface of the material so as to remove white spots on the surface of the material. The laser emitted by the device provided by the invention can melt the white spots on the surface of the material, and the material around the white spots can be blurred by matching with a focusing lens in the device, so that the material is recovered from a crystalline state to an amorphous state, the purpose of removing the white spots is achieved, and other residual stress is not caused.
Description
Technical Field
The present invention relates to an apparatus, and more particularly, to an apparatus and method for removing white spots caused by thermal residual stress on a material surface.
Background
At present, the material generates thermal residual stress during the manufacturing process or post-processing process of the material, or heating/cooling for a long time, and for plastic or polymer materials, the thermal residual stress often causes some components or smaller additives to be induced to crystallize or atomized to precipitate, thereby generating white spots on the surface of the material. In general, a method for removing white spots in industry is to wipe off white spots with a solvent (e.g., alcohol) to make the wiped appearance consistent with the surrounding color, and then put the white spots into an oven to be baked to remove the solvent. However, the removal of the white spots by the above-mentioned method causes the generation of chemical residual stress induced again by the use of a solvent.
Disclosure of Invention
The invention provides a device and a method for removing white spots caused by thermal residual stress on the surface of a material. The laser emitted by the device provided by the invention can melt the white spots on the surface of the material, and the material around the white spots can be blurred by matching with a focusing lens in the device, so that the material is recovered from a crystalline state to an amorphous state, the purpose of removing the white spots is achieved, and other residual stress is not caused.
In order to solve the above technical problem, an embodiment of the present invention provides the following technical solutions:
the invention provides, in a first aspect, an apparatus for removing white spots caused by thermal residual stress on a material surface, comprising,
a laser;
the X galvanometer is used for reversing laser from the laser;
the Y galvanometer is used for reversing the laser passing through the X galvanometer;
and the focusing mirror is used for adjusting the light intensity of the laser passing through the Y-shaped vibrating mirror and guiding the laser with the adjusted light intensity to the surface of the material so as to remove white spots on the surface of the material.
Preferably, the device further comprises a beam expander, the laser emitted by the laser passes through the beam expander and then strikes the X galvanometer, and the beam expander is used for adjusting the diameter of the laser emitted by the laser.
The second aspect of the present invention provides a method for removing the white spots caused by the thermal residual stress on the surface of the material, which uses the laser emitted from the above-mentioned apparatus to remove the white spots.
Preferably, the device is used for removing the white spots, and specifically comprises the following steps of calculating the product of adjustable variables v, w and d in the white spot removing process of the device by using a formula (I), and then adjusting the adjustable variables by the device to remove the white spots;
wherein rho is the density of the material, eta is the efficiency of removing the white spots, v is the moving speed of the laser on the surface of the material, w is the depth of the laser entering the material, d is the irradiation diameter of the laser on the surface of the material, CtIs the specific heat capacity of the material,. DELTA.T is the softening temperature range of the material, LfIs the latent heat of fusion of the material, m is the mass fraction of vaporization of the material, Lv is the latent heat of pyrolysis vaporization of the material, PiIs the output power of the device, riFor the reflectivity of the laser light at the surface of the material。
Preferably, the output power PiIn the range of 105~106W/cm2。
Preferably, the laser is in contact with the material for a time of no more than 0.05 seconds.
Preferably, the contact time of the laser with the material is no greater than 0.01 seconds.
Preferably, the material is a polymer material or a polymer composite material.
Based on the disclosure of the above embodiments, it can be known that the embodiments of the present invention have the following beneficial effects:
the laser emitted by the device provided by the invention can melt the white spots on the surface of the material, and the material around the white spots can be blurred by matching with the focusing lens in the device, so that the material is recovered from a crystalline state to an amorphous state, the purpose of removing the white spots is achieved, and other residual stress is not caused.
Drawings
FIG. 1 is a schematic structural diagram of an apparatus for removing white spots caused by thermal residual stress on a material surface according to an embodiment of the present invention;
the laser comprises a laser 1, a beam expander 2, a vibrating mirror 3-X, a vibrating mirror 4-Y and a focusing mirror 5.
Detailed Description
The following detailed description of specific embodiments of the present invention is provided in connection with the accompanying drawings, which are not intended to limit the invention.
It will be understood that various modifications may be made to the embodiments disclosed herein. Accordingly, the foregoing description should not be construed as limiting, but merely as exemplifications of embodiments. Other modifications will occur to those skilled in the art within the scope and spirit of the disclosure.
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the disclosure and, together with a general description of the disclosure given above, and the detailed description of the embodiments given below, serve to explain the principles of the disclosure.
These and other characteristics of the invention will become apparent from the following description of a preferred form of embodiment, given as a non-limiting example, with reference to the accompanying drawings.
It should also be understood that, although the invention has been described with reference to some specific examples, a person of skill in the art shall certainly be able to achieve many other equivalent forms of the invention, having the characteristics as set forth in the claims and hence all coming within the field of protection defined thereby.
The above and other aspects, features and advantages of the present disclosure will become more apparent in view of the following detailed description when taken in conjunction with the accompanying drawings.
Specific embodiments of the present disclosure are described hereinafter with reference to the accompanying drawings; however, it is to be understood that the disclosed embodiments are merely examples of the disclosure that may be embodied in various forms. Well-known and/or repeated functions and structures have not been described in detail so as not to obscure the present disclosure with unnecessary or unnecessary detail. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present disclosure in virtually any appropriately detailed structure.
The specification may use the phrases "in one embodiment," "in another embodiment," "in yet another embodiment," or "in other embodiments," which may each refer to one or more of the same or different embodiments in accordance with the disclosure.
The embodiments of the present invention will be described in detail below with reference to the accompanying drawings,
as shown in fig. 1, a first embodiment of the present invention provides an apparatus for removing white spots caused by thermal residual stress on a material surface, comprising,
a laser;
the X galvanometer is used for reversing laser from the laser;
the Y galvanometer is used for reversing the laser passing through the X galvanometer;
and the focusing mirror is used for adjusting the light intensity of the laser passing through the Y-shaped vibrating mirror and guiding the laser with the adjusted light intensity to the surface of the material so as to remove white spots on the surface of the material.
Specifically, laser emitted by the laser passes through a focusing mirror after being reversed twice by an X-vibrating mirror and a Y-vibrating mirror, and is shot on the surface of a material after passing through the focusing mirror to remove white spots. The focusing mirror can adjust the light intensity of the laser beam passing through by adjusting the diameter of the laser beam passing through, for example, the focusing mirror can increase the diameter of the laser beam passing through, so that the material surface can be melted, the material around the white spot can be blurred, the material is recovered from a crystalline state to an amorphous state, the purpose of removing the white spot is achieved, and other residual stress cannot be generated.
In one embodiment of the invention, the X-galvanometer, the Y-galvanometer and the focusing mirror can be moved synchronously, so that the laser can move on the surface of the material. The moving speed of the laser on the surface of the material is controlled by controlling the moving speeds of the X galvanometer, the Y galvanometer and the focusing mirror.
With continued reference to fig. 1, in another embodiment of the present invention, the apparatus further includes a beam expander, the laser emitted by the laser passes through the beam expander and then strikes the X-ray galvanometer, and the beam expander is used to adjust the diameter of the laser emitted by the laser. In one embodiment, after the laser emitted by the laser passes through the beam expander, the diameter of the laser may be increased or decreased.
The second embodiment of the present invention provides a method for removing the white spots caused by the thermal residual stress on the surface of the material, which uses the laser emitted from the above-mentioned device to remove the white spots. The laser emitted by the device is applied to the position of the white spot on the surface of the material, so that the white spot on the surface of the material can be melted, the material around the white spot can be blurred, the material is recovered from a crystalline state to an amorphous state, the purpose of removing the white spot is achieved, and other residual stress cannot be caused.
In one embodiment of the present invention, the material is a polymer material or a polymer composite material.
In one embodiment, the removing of the white spots by the device specifically comprises calculating the product of adjustable variables v, w and d in the white spot removing process by the device by using formula (I), and then adjusting the adjustable variables by the device to remove the white spots;
wherein rho is the density of the material, eta is the efficiency of removing the white spots, v is the moving speed of the laser on the surface of the material, w is the depth of the laser entering the material, d is the irradiation diameter of the laser on the surface of the material, CtIs the specific heat capacity of the material,. DELTA.T is the softening temperature range of the material, LfIs the latent heat of fusion of the material, m is the mass fraction of vaporization of the material, Lv is the latent heat of pyrolysis vaporization of the material, PiIs the output power of the device, riIs the reflectivity of the laser light on the surface of the material.
In particular, the output power P of the deviceiCan be obtained through the factory parameters of a specific device; the reflectivity r of the laser on the surface of the materialiCan be obtained by measurement; the efficiency eta for removing the white spots can be artificially set; density of material rho, specific heat capacity of material CtThe softening temperature range (i.e. the melting point) Δ T of the material, the latent heat of fusion L of the materialfAnd the latent heat of pyrolysis volatilization Lv of the material, can be found by data known in the art, and the mass fraction m of vaporization of the material is typically 0.
In other embodiments, the output power PiIn the range of 105~106W/cm2. The above output power PiIn the range of 105~106W/cm2The laser emitted by the device can melt the surface of the material.
In one embodiment of the invention, the contact time of the laser with the material is no greater than 0.05 seconds. Preferably, the contact time of the laser with the material is no greater than 0.01 seconds. By controlling the contact time of the laser and the material, white spots on the surface of the material can be effectively removed.
The above embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and the scope of the present invention is defined by the claims. Various modifications and equivalents may be made by those skilled in the art within the spirit and scope of the present invention, and such modifications and equivalents should also be considered as falling within the scope of the present invention.
Claims (6)
1. A method for removing the white spot caused by the thermal residual stress on the surface of a material, which removes the white spot by using the laser emitted by a device for removing the white spot caused by the thermal residual stress on the surface of the material;
removing white spots by using the device, specifically comprising the steps of calculating the product of adjustable variables v, w and d in the white spot removing process by using a formula (I), and then adjusting the adjustable variables by using the device to remove the white spots;
wherein rho is the density of the material, eta is the efficiency of removing the white spots, v is the moving speed of the laser on the surface of the material, w is the depth of the laser entering the material, d is the irradiation diameter of the laser on the surface of the material, CtIs the specific heat capacity of the material,. DELTA.T is the softening temperature range of the material, LfIs the latent heat of fusion of the material, m is the mass fraction of vaporization of the material, Lv is the latent heat of pyrolysis vaporization of the material, PiIs the output power of the device, riIs the reflectivity of the laser on the surface of the material;
wherein the contact time of the laser with the material is no more than 0.05 seconds.
2. The method according to claim 1, wherein the means for removing white spots caused by thermal residual stress on the surface of the material comprises,
a laser;
the X galvanometer is used for reversing laser from the laser;
the Y galvanometer is used for reversing the laser passing through the X galvanometer;
and the focusing mirror is used for adjusting the light intensity of the laser passing through the Y-shaped vibrating mirror and guiding the laser with the adjusted light intensity to the surface of the material so as to remove white spots on the surface of the material.
3. The method of claim 2, wherein the device further comprises a beam expander, the laser emitted by the laser passes through the beam expander and then strikes the X-ray galvanometer, and the beam expander is used for adjusting the diameter of the laser emitted by the laser.
4. The method of claim 1, the output power PiIn the range of 105~106W/cm2。
5. The method of claim 1, the laser being in contact with the material for a time of no greater than 0.01 seconds.
6. The method of any one of claims 1-5, wherein the material is a polymeric material or a polymeric composite.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811001305.9A CN108994446B (en) | 2018-08-30 | 2018-08-30 | Device and method for removing white spots on surface of material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811001305.9A CN108994446B (en) | 2018-08-30 | 2018-08-30 | Device and method for removing white spots on surface of material |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108994446A CN108994446A (en) | 2018-12-14 |
CN108994446B true CN108994446B (en) | 2021-03-05 |
Family
ID=64594105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811001305.9A Active CN108994446B (en) | 2018-08-30 | 2018-08-30 | Device and method for removing white spots on surface of material |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108994446B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103379980A (en) * | 2011-02-25 | 2013-10-30 | 法国圣戈班玻璃厂 | Heat treatment of a laser coating |
CN105880828A (en) * | 2015-06-09 | 2016-08-24 | 广州创乐激光设备有限公司 | Laser marking system for delaying galvanometer operation and laser marking method |
CN106583929A (en) * | 2015-10-16 | 2017-04-26 | 武汉华工激光工程有限责任公司 | Laser mark removal system and mark removal method thereof |
CN107598381A (en) * | 2017-08-28 | 2018-01-19 | 大族激光科技产业集团股份有限公司 | The method and device of knife mark on a kind of removing aluminium alloy work piece |
CN207026754U (en) * | 2017-06-22 | 2018-02-23 | 武汉华工激光工程有限责任公司 | The auxiliary wiping device and equipment of a kind of laser ablation stress trace |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MX2012009047A (en) * | 2010-02-04 | 2012-11-12 | Echelon Laser Systems Lp | Laser etching system and method. |
-
2018
- 2018-08-30 CN CN201811001305.9A patent/CN108994446B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103379980A (en) * | 2011-02-25 | 2013-10-30 | 法国圣戈班玻璃厂 | Heat treatment of a laser coating |
CN105880828A (en) * | 2015-06-09 | 2016-08-24 | 广州创乐激光设备有限公司 | Laser marking system for delaying galvanometer operation and laser marking method |
CN106583929A (en) * | 2015-10-16 | 2017-04-26 | 武汉华工激光工程有限责任公司 | Laser mark removal system and mark removal method thereof |
CN207026754U (en) * | 2017-06-22 | 2018-02-23 | 武汉华工激光工程有限责任公司 | The auxiliary wiping device and equipment of a kind of laser ablation stress trace |
CN107598381A (en) * | 2017-08-28 | 2018-01-19 | 大族激光科技产业集团股份有限公司 | The method and device of knife mark on a kind of removing aluminium alloy work piece |
Also Published As
Publication number | Publication date |
---|---|
CN108994446A (en) | 2018-12-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105719958B (en) | Laser annealing system and method with ultra-short dwell time | |
CA2604641A1 (en) | Method for finely polishing/structuring thermosensitive dielectric materials by a laser beam | |
US11904410B2 (en) | Laser surface preparation of coated substrate | |
US5257706A (en) | Method of cleaning laser ablation debris | |
JPH07136782A (en) | Method and device for forming image on inside of transparent material using pulse laser beam | |
CN107717216B (en) | Femtosecond laser micromachining method and device | |
US20050236380A1 (en) | Ultrashort pulse laser processing method | |
CN104752267B (en) | A kind of laser anneal device and method | |
EP3759529A1 (en) | Using lasers to reduce reflection of transparent solids, coatings and devices employing transparent solids | |
CN107116308B (en) | Waveguide micro/nano processing system and processing method | |
US20170313617A1 (en) | Method and apparatus for laser-cutting of transparent materials | |
TWI384551B (en) | Method for patterning crystalline indium tim oxide | |
CN108994446B (en) | Device and method for removing white spots on surface of material | |
CN116810157A (en) | Laser texturing method and laser texturing equipment | |
TWI633589B (en) | Laser annealing device and method thereof | |
CN111112843A (en) | Laser marking device and laser marking method thereof | |
RU2661165C1 (en) | Method and device for forming microchannels on substrates from optical glass, optical crystals and semiconductor materials by femtosecond impulses of laser radiation | |
US8658260B2 (en) | Laser-induced backside annealing using fluid absorber | |
RU174220U1 (en) | LASER-RADIATED FERROELECTRIC ANNEALING DEVICE WITH SPATIAL RESOLUTION EXCEEDING THE DIFFRACTION LIMIT | |
RU2175648C2 (en) | Process of artistic and graphical finishing of surface of glass articles | |
CN110202265A (en) | A kind of processing method of diamond high-precision microchanneled surface | |
CN116511719B (en) | Method and system for preparing micro-nano structure by laser-electron beam and micro-nano structure | |
JP2015142937A (en) | Laser marking device of plastic product, and method therein | |
CN112705862B (en) | Blackening treatment method and system for transparent PC (polycarbonate) piece based on ultrafast laser | |
Abe et al. | In-process debris removal in femtosecond laser processing |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |