CN107591495A - Added metal plate and display device - Google Patents
Added metal plate and display device Download PDFInfo
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- CN107591495A CN107591495A CN201710711312.7A CN201710711312A CN107591495A CN 107591495 A CN107591495 A CN 107591495A CN 201710711312 A CN201710711312 A CN 201710711312A CN 107591495 A CN107591495 A CN 107591495A
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Abstract
The embodiment of the invention discloses a kind of display device and added metal plate, the added metal plate is used for glassivation powder, and added metal plate is additionally operable to receive the energy of laser, melten glass powder, and added metal plate includes at least double layer of metal lamination；Every layer of metal laminated metal wire or net surface structure for snakelike cabling at least in double layer of metal lamination, adjacent two layers are metal laminated at least in double layer of metal lamination is separated by inter-level dielectric；The joining position that adjacent two layers are metal laminated on inter-level dielectric sets medium holes, and adjacent two layers are metal laminated to be electrically connected via medium holes.Implement the embodiment of the present invention, it is possible to reduce the charge accumulated on added metal plate, so as to which minimizing electrostatic discharges.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of added metal plate and display device.
Background technology
At present, AMOLED (Active-matrix organic light emitting diode) display device extensively should
For in various product.When carrying out the encapsulation of AMOLED display panels, clinkering (frit) technique can be used, is needing to be encapsulated in
Added metal plate can be set between two substrates together, for the energy of reflection laser, frit material secondaries are melted and consolidate
Change.To increase the adhesive force to frit materials, perforate can be set on added metal plate.
However, in AMOLED display panels, the added metal plate for adhering to frit materials is the gold of the large area of monolithic
Belong to plate, because area is huge, easily cause charge accumulated, produce Electro-static Driven Comb (Electro-Static Discharge,
ESD), so as to the electronic device on damaged substrate.
The content of the invention
Based on this, to solve the huge caused charge accumulated of added metal plate suqare in the prior art, spy proposes one kind
Added metal plate, it is possible to reduce the charge accumulated on added metal plate, so as to which minimizing electrostatic discharges.
A kind of added metal plate, the added metal plate are used for glassivation powder, and the added metal plate is additionally operable to receive
The energy of laser, melts the glass dust, and the added metal plate includes at least double layer of metal lamination；At least double layer of metal
Every layer of metal laminated metal wire or net surface structure for snakelike cabling in lamination, phase at least double layer of metal lamination
Adjacent double layer of metal lamination is separated by inter-level dielectric；The metal laminated joining position of the adjacent two layers on the inter-level dielectric
Medium holes are installed, the adjacent two layers are metal laminated to be electrically connected via the medium holes.
In addition, to solve the huge caused charge accumulated of added metal plate suqare in the prior art, spy proposes a kind of aobvious
Showing device, the display device include above-mentioned added metal plate, it is possible to reduce the charge accumulated on added metal plate, so as to reduce
Electro-static Driven Comb.
Implement the embodiment of the present invention, will have the advantages that：
It is multiple layer metal lamination to set added metal plate, and it is snakelike cabling metal wire or wire side that every layer metal laminated
Structure, then every layer of metal laminated area reduce compared to bulk metal, due to every layer it is metal laminated with it is adjacent metal laminated
Between separated by inter-level dielectric, it is metal laminated to have certain electric capacity between inter-level dielectric so that the electricity assembled on single-layer metal
Lotus is reduced compared to bulk metal, is discharged so as to minimizing electrostatic, improves the security of electronic device.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Wherein：
Fig. 1 is a kind of structural representation of added metal plate provided in an embodiment of the present invention；
Fig. 2 is a kind of vertical section structural representation of added metal plate provided in an embodiment of the present invention；
Fig. 3 is the structural representation of another added metal plate provided in an embodiment of the present invention；
Fig. 4 is the vertical section structural representation of another added metal plate provided in an embodiment of the present invention；
Fig. 5 is the vertical section structural representation of another added metal plate provided in an embodiment of the present invention；
Fig. 6 is the structural representation of another added metal plate provided in an embodiment of the present invention；
Fig. 7 is the structural representation of another added metal plate provided in an embodiment of the present invention；
Fig. 8 is also a kind of structural representation of added metal plate provided in an embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Added metal plate is used for glassivation powder (frit seal), and frit seal are coated on the position of metallic plate perforate,
And by the energy of metallic plate reflection laser, make frit seal second meltings and solidify.To absorb the energy of enough laser,
The size of added metal plate need to be more than predetermined threshold value.But the metallic plate of large area easily causes charge accumulated, produce
ESD, so as to the electronic device on damaged substrate.
To solve the huge caused charge accumulated of added metal plate suqare in the prior art, spy proposes a kind of added metal
Plate 10, it is possible to reduce the charge accumulated on added metal plate, so as to which minimizing electrostatic discharges.
Specifically, also referring to Fig. 1 and Fig. 2, Fig. 1 is a kind of knot of added metal plate 10 provided in an embodiment of the present invention
Structure schematic diagram.Fig. 2 is a kind of vertical section structural representation of added metal plate provided in an embodiment of the present invention.The added metal plate
10 are used for glassivation powder, and the added metal plate 10 is additionally operable to receive the energy of laser, melts the glass dust, such as Fig. 1 and
Shown in Fig. 2, the added metal plate 10 includes first metal laminated 101 and second metal laminated 102, and this first metal laminated 101
Separated with second metal laminated 102 by inter-level dielectric (Inter Layer Dielectric, ILD) 103, and inter-level dielectric
Inter-level dielectric hole is set in the first metal laminated 101 and second metal laminated 102 place intersected in the stacking direction on 103
(ILD hole) 1031, first metal laminated 101 and second metal laminated 102 can pass through the electricity of ILD hole 1031 of setting
Connection.
Wherein, first metal laminated 101 and second metal laminated 102 can be snakelike cabling metal wire.
In the added metal plate described by Fig. 1, it is multiple layer metal lamination to set added metal plate, and every layer metal laminated
For snakelike cabling metal wire or net surface structure, then the metallic area in every layer of metal laminated unit area is compared to bulk gold
Category reduces, due to every layer it is metal laminated and adjacent it is metal laminated between separated by inter-level dielectric, metal laminated and inter-level dielectric
Between have certain electric capacity so that the electric charge assembled on single-layer metal compared to bulk metal reduce, so as to minimizing electrostatic
Release, improve the security of electronic device.
In the embodiment of the present invention, first metal laminated 101 and second metal laminated 102 can be that film is brilliant in pixel cell
In the gate metal of body pipe, the pixel cell in the source/drain metal of thin film transistor (TFT) and the anode metal of luminescent device
One kind.First metal laminated 101 and second metal laminated 102 can be the metal of different metal material.Wherein, pixel cell
The gate metal of middle thin film transistor (TFT) for example can be Gate1 metal, or Gate2 metal, and film is brilliant in pixel cell
The source/drain metal of body pipe is S/D metal, and the anode metal of luminescent device is Anode metal.Choose in these
Metal as metal laminated 101 and 102, these metals can directly led out carrying out the making of added metal plate, make
Simplification of flowsheet in technique, it is cost-effective.In addition, first metal laminated 101 and second metal laminated 102 can choose
Two kinds of different metals in Gate1 metal, Gate2 metal, S/D metal and Anode metal.First is metal laminated
One in 101 and second metal laminated 102 can choose S/D metal, and another can choose Gate1 metal, Gate2
One kind in metal.In the present embodiment, first metal laminated 101 and second metal laminated 102 can also be other arbitrary gold
Category, the present embodiment are not construed as limiting.
In the embodiment of the present invention, as depicted in figs. 1 and 2, first metal laminated 101 and second metal laminated 102 can be
The metal wire of snakelike cabling, the metal laminated snakelike direction of routing of adjacent two layers can be in default angle, as depicted in figs. 1 and 2,
The angle can be 90 degree or other angles.It first metal laminated 101 is in y directions cabling and in the x-direction that can be
The metal wire of the snakelike cabling of inflection, second metal laminated 102 is in x directions cabling and to the snakelike cabling of y directions inflection
Metal wire, i.e., first metal laminated 101 and second metal laminated 102 direction of routing are vertical.
Referring to Fig. 3, as shown in figure 3, Fig. 3 is the structural representation of another added metal plate provided in an embodiment of the present invention
Figure, as shown in figure 3, in the embodiment of the present invention, the direction of the metal laminated snakelike cabling of adjacent two layers can be in any angle,
Can also direction of routing it is identical, the embodiment of the present invention is not construed as limiting.
Referring to Fig. 4, Fig. 4 is the vertical section structural representation of another added metal plate 10 provided in an embodiment of the present invention
Figure.The added metal plate 10 can be comprising more than two layers it is metal laminated, as shown in figure 4, the added metal plate 10 can include
First metal laminated 101, second metal laminated 102 and the 3rd metal laminated 104, wherein two layers of arbitrary neighborhood it is metal laminated it
Between separated by ILD 103, i.e., separated between first metal laminated 101 and second metal laminated 102 by ILD 103, second
Separated between metal laminated 102 and the 3rd metal laminated 104 by ILD 103, and on ILD 103 metal laminated in stacking side
Intersecting place sets ILD hole 1031, such as ILD between first metal laminated 101 and second metal laminated 102 upwards
103 positions intersected on ILD 103 set ILD hole 1031, such as second metal laminated 102 and the 3rd metal laminated 104
Between the positions intersected on ILD 103 of ILD 103 ILD hole 1031 are set.In the embodiment of the present invention, ILD hole
1031 quantity is not construed as limiting.
Wherein, it is reduction technological process, first metal laminated 101, second metal laminated 102 and the 3rd metal laminated 104
Three kinds of metals different in Gate1 metal, Gate2 metal, S/D metal and Anode metal can be chosen.The present invention
In embodiment, metal laminated first metal laminated 101, second metal laminated 102 and the 3rd can also be other arbitrary metals,
The embodiment of the present invention is not construed as limiting.
Wherein, first metal laminated 101, second metal laminated 102 and the 3rd metal laminated 104 can be snakelike cabling
Metal wire, the structure of every layer of snakelike cabling can be found in Fig. 1.First metal laminated 101, second metal laminated 102 and the 3rd metal
The direction of 104 snakelike cabling of lamination can be different.The double layer of metal lamination direction of routing phase of layer of metal lamination can also be separated by
Together, for example, it may be first metal laminated 101 is in y directions cabling and the metal wire of the snakelike cabling of inflection in the x-direction
Two metal laminated 102 be the metal wire of the snakelike cabling in x directions cabling and to the inflection of y directions, i.e., the first metal laminated 101 He
Second metal laminated 102 direction of routing is vertical.3rd metal laminated 104 can be and the first metal laminated 101 direction of routing
The metal wire of the snakelike cabling of identical, i.e., in y directions cabling and the metal wire of the snakelike cabling of inflection in the x-direction.It is of the invention real
Apply in example, the direction of the metal laminated snakelike cabling of adjacent two layers can be in any angle, and the embodiment of the present invention is not construed as limiting.
In the embodiment of the present invention, every layer of metal laminated area can be related to the metal laminated number of plies, for example, can
To be that metal laminated quantity is more, the metal laminated area of each layer can be with smaller, then the cabling spacing of snakelike cabling is bigger
Or the spacing of adjacent metal block can be bigger in the metal block array of network structure.
In the embodiment of the present invention, because the metal that can be used for doing added metal plate in existing metal is Gate1
Metal, Gate2 metal, S/D metal and Anode metal, and in added metal plate every layer it is metal laminated can equal not phases
Together, then the number of plies that can be most setting added metal plates 10 is four layers, and four layers are respectively Gate1 metal, Gate2
Metal, S/D metal and Anode metal, the order of unlimited deposit category laminated material.Every layer can be snakelike cabling gold
Belong to line or metal block array.
Referring to Fig. 5, Fig. 5 is the vertical section structural representation of another added metal plate 10 provided in an embodiment of the present invention
Figure.As shown in figure 5, added metal plate 10 includes the first metal laminated 101, second metal laminated 102, the 3rd metal laminated 104
With the 4th metal laminated 105, wherein two layers of arbitrary neighborhood it is metal laminated between separated by ILD 103, i.e., the first metal is folded
Layer 101 and second metal laminated 102 between separated by ILD 103, second metal laminated 102 and the 3rd metal laminated 104 it
Between separated by ILD 103, separated between the 3rd metal laminated 104 and the 4th metal laminated 105 by ILD 103, and ILD
ILD hole 1031, such as first metal laminated 101 are set in the adjacent metal laminated position intersected on ILD 103 on 103
And the position that the ILD 103 between second metal laminated 102 intersects on ILD 103 sets ILD hole 1031, the second metal
The position that ILD 103 between lamination 102 and the 3rd metal laminated 104 intersects on ILD 103 sets ILD hole 1031,
3rd metal laminated 104 and the 4th metal laminated 105 sets ILD hole 1031 in the position that both intersect on ILD 103.
In the embodiment of the present invention, ILD hole 1031 quantity is not construed as limiting.Wherein, every layer of metal laminated structure may refer to Fig. 4
The vertical section structural representation of described added metal plate 10, is repeated no more here.
Wherein, every layer of metal laminated material can also choose any metal material, and the embodiment of the present invention is not construed as limiting.
Referring to Fig. 6, Fig. 6 is the structural representation of another added metal plate 10 provided in an embodiment of the present invention.This is molten
Connect it is metal laminated in metallic plate 10 can also be made up of the metal level of network structure, i.e. metal block array, as shown in fig. 6, should
Added metal plate 10 is made up of first metal laminated 101 and second metal laminated 102, and second metal laminated 102 is metal derby battle array
Row.It is similar with the added metal plate 10 described by Fig. 1, pass through ILD between first metal laminated 101 and second metal laminated 102
103 separate, and first metal laminated 101 and second metal laminated 102 intersecting position sets ILD hole on ILD 103
1031, first metal laminated 101 and second metal laminated 102 electrically connects via ILD hole 1031.On ILD 103, ILD
Hole 1031 quantity does not limit.
Wherein, first metal laminated 101 and second metal laminated 102 Gate1 metal, Gate2 metal can be chosen,
Different metal in S/D metal and Anode metal, second it is metal laminated 102 composition metal block array in metal derby
Two of which or two or more metals can also be chosen, for example, first metal laminated 101 can choose S/D metal, second
Metal derby in metal laminated 102 can choose the alternate metal derby of Gate1 metal and Gate2 metal compositions, that is, appoint
The metal material that the adjacent metal derby of one metal derby uses is different from any metal derby.First metal laminated 101 and second gold medal
Category lamination 102 can also choose arbitrary metal, for example, Gate1 metal, Gate2 metal, S/D metal and Anode
Metal beyond metal, the embodiment of the present invention are not construed as limiting.
Alternatively, it is also possible to be snakelike cabling the first metal layer 101 in a z-direction, folded in the second metal of net surface structure
Below layer 102, and the direction of snakelike cabling can also be the metal of the snakelike cabling in x directions cabling and to the inflection of y directions
Line.First metal laminated 101 can also be above-mentioned metal net surface structure, and in the embodiment of the present invention, the direction of snakelike cabling can
Can be any direction according to demand to be not construed as limiting, for example, it is also possible to which the direction for being snakelike cabling is and x directions and y directions
It is in a certain angle.
Wherein, the cabling spacing of 101 snakelike cabling of the first metal layer can be identical or different, second
The spacing of metal derby in the x-direction be able to can also be differed with identical in metal laminated 102 metal block array, metal block array
The spacing of middle metal derby in the y-direction be able to can also be differed, the embodiment of the present invention is not construed as limiting with identical.
Wherein, the number of plies of the added metal plate 10 can be more than two layers, and overlapped way refers to Fig. 4 or Fig. 5, adjacent
The structure of double layer of metal lamination can be different, for example, in the z-direction, first it is metal laminated can be metal block array,
Two it is metal laminated can be from the first metal laminated different structure, can be snakelike cabling.3rd metal laminated can be
Can be metal derby array structure from the second metal laminated different structure.In addition, the structure between adjacent metal lamination
Can be identical, for example, it is metal derby array structure that adjacent two layers are metal laminated, the embodiment of the present invention is not construed as limiting.
Referring to Fig. 7, Fig. 7 is the structural representation of another added metal plate 10 provided in an embodiment of the present invention.In Fig. 6
On the basis of the structure of shown added metal plate 10, as shown in fig. 7, the first metal layer 101 can be snakelike cabling, this is snakelike
Cabling can be the snakelike cabling mode outwards radiated successively by center.Can also be other snakelike cabling mode, or snake
Other kinds of structure beyond shape cabling, the embodiment of the present invention are not construed as limiting, and need to ensure unit area on single-layer metal lamination
On metallic area be less than metallic area on bulk metal plate in unit area, then the electric charge of metal laminated upper accumulation is less than big
The quantity of electric charge accumulated on block metallic plate, the quantity of electric charge reduces on single-layer metal plate, is scattered at least two equivalent to by substantial amounts of electric charge
Layer it is metal laminated on, so as to reduce ESD risks.
Referring to Fig. 8, Fig. 8 is also a kind of structural representation of added metal plate 10 provided in an embodiment of the present invention.In Fig. 7
On the basis of described added metal plate 10, the shape of metal derby is in this hair in second metal laminated 102 metal block array
It is not construed as limiting in bright embodiment.As shown in figure 8, second metal laminated 102 can be designed as according to demand it is circular or ellipse
Circle, rhombus, rectangle etc., the embodiment of the present invention is not construed as limiting.
In the embodiment of the present invention, metal laminated structure can also be other structures, such as single-layer metal lamination can be
Structure that network, more metal lines rearrange etc., the embodiment of the present invention is not construed as limiting.
In addition, the embodiment of the present invention also provides a kind of display device, the display device includes any one of Fig. 1 to Fig. 8 institute
The weld plate of description.
Above disclosure is only preferred embodiment of present invention, can not limit the right model of the present invention with this certainly
Enclose, therefore the equivalent variations made according to the claims in the present invention, still belong to the scope that the present invention is covered.
Claims (10)
1. a kind of added metal plate, the added metal plate is used for glassivation powder, and the added metal plate, which is additionally operable to receive, to swash
The energy of light, melt the glass dust, it is characterised in that the added metal plate includes at least double layer of metal lamination；It is described extremely
Every layer of metal laminated metal wire or net surface structure for snakelike cabling in few double layer of metal lamination, at least two layers of gold medal
Adjacent two layers are metal laminated in category lamination is separated by inter-level dielectric；The adjacent two layers are metal laminated on the inter-level dielectric
Joining position set medium holes, the adjacent two layers it is metal laminated via the medium holes electrically connect.
2. added metal plate according to claim 1, it is characterised in that the metal wire of the snakelike cabling is along default side
To snakelike cabling, or from center to the snakelike cabling of external radiation, the net surface structure is metal block array.
3. added metal plate according to claim 1, it is characterised in that when described in adjacent two layers it is metal laminated for it is snakelike walk
During line metal wire, metal laminated snakelike direction of routing described in the adjacent two layers is in default angle.
4. added metal plate according to claim 3, it is characterised in that metal laminated snakelike described in the adjacent two layers
Direction of routing is vertical.
5. added metal plate according to claim 2, it is characterised in that the metal block array is by least two metal groups
Into.
6. added metal plate according to claim 1, it is characterised in that every layer of metal at least double layer of metal lamination
Lamination is the source/drain metal of thin film transistor (TFT) in the gate metal of thin film transistor (TFT), the pixel cell in pixel cell
With one kind in the anode metal of luminescent device.
7. added metal plate according to claim 6, it is characterised in that any two layers at least double layer of metal lamination
The metal laminated metal material it is different.
8. added metal plate according to claim 1, it is characterised in that every layer of metal at least double layer of metal lamination
The area of lamination is related to the number of plies of at least double layer of metal lamination.
9. the added metal plate according to any one of claim 1 to 8, it is characterised in that between the cabling of the snakelike cabling
Away from equal, the spacing described in the metal block array between metal derby is equal.
10. a kind of display device, it is characterised in that the display device includes the welding as described in any one of claim 1 to 9
Metallic plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710711312.7A CN107591495B (en) | 2017-08-18 | 2017-08-18 | Added metal plate and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710711312.7A CN107591495B (en) | 2017-08-18 | 2017-08-18 | Added metal plate and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107591495A true CN107591495A (en) | 2018-01-16 |
| CN107591495B CN107591495B (en) | 2019-06-25 |
Family
ID=61042241
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710711312.7A Active CN107591495B (en) | 2017-08-18 | 2017-08-18 | Added metal plate and display device |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102893700A (en) * | 2010-10-01 | 2013-01-23 | 日本电气硝子株式会社 | Electric device package |
| CN104332484A (en) * | 2013-07-22 | 2015-02-04 | 三星显示有限公司 | ORGANIC LIGHT EMITTING DISPLAY DEVICE and method for manufacture same |
| CN105679771A (en) * | 2016-01-29 | 2016-06-15 | 厦门天马微电子有限公司 | Array substrate and manufacturing method thereof and display panel comprising array substrate |
| CN106876606A (en) * | 2017-03-16 | 2017-06-20 | 京东方科技集团股份有限公司 | Display panel and display device |
-
2017
- 2017-08-18 CN CN201710711312.7A patent/CN107591495B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102893700A (en) * | 2010-10-01 | 2013-01-23 | 日本电气硝子株式会社 | Electric device package |
| CN104332484A (en) * | 2013-07-22 | 2015-02-04 | 三星显示有限公司 | ORGANIC LIGHT EMITTING DISPLAY DEVICE and method for manufacture same |
| CN105679771A (en) * | 2016-01-29 | 2016-06-15 | 厦门天马微电子有限公司 | Array substrate and manufacturing method thereof and display panel comprising array substrate |
| CN106876606A (en) * | 2017-03-16 | 2017-06-20 | 京东方科技集团股份有限公司 | Display panel and display device |
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| Publication number | Publication date |
|---|---|
| CN107591495B (en) | 2019-06-25 |
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