CN107580444A - A kind of pcb board with dual density QSFP interfaces - Google Patents
A kind of pcb board with dual density QSFP interfaces Download PDFInfo
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- CN107580444A CN107580444A CN201710644759.7A CN201710644759A CN107580444A CN 107580444 A CN107580444 A CN 107580444A CN 201710644759 A CN201710644759 A CN 201710644759A CN 107580444 A CN107580444 A CN 107580444A
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- pcb board
- fixed block
- switch
- interfaces
- qsfp
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Abstract
The present invention provides a kind of pcb board with dual density QSFP interfaces,Including pcb board body,First QSFP interfaces,2nd QSFP interfaces,First fixed block,Second fixed block,Electric expansion bar,Connecting rod and semiconductor chilling plate,First QSFP interfaces are arranged on pcb board body upper surface,2nd QSFP interfaces are arranged on pcb board body upper surface,First fixed block is arranged on rear side of pcb board body upper surface,Second fixed block is arranged on pcb board body right side,Electric expansion bar is arranged on inside the first fixed block,Connecting rod is fixed on electric expansion bar lower surface,The design solves the problems, such as that original pcb board does not have automatic cleaning function,Semiconductor chilling plate is arranged on left side in the second fixed block,The design solves the problems, such as that original pcb board does not have quick heat radiating function,The present invention is rational in infrastructure,It is easy to combination to install,It is applied widely,Reliability is high.
Description
Technical field
The present invention is a kind of pcb board with dual density QSFP interfaces, belongs to technical field of PCB board.
Background technology
Pcb board is also known as printed circuit board (PCB), is the supplier of electronic component electrical connection.Its development is existing more than 100 years
History；It is mainly designed to layout design；Major advantage using circuit board is to greatly reduce the difference of wiring and assembling
Mistake, improve the gentle productive labor rate of Automated water.Pcb board according to the wiring board number of plies can be divided into single sided board, dual platen, four layers
Plate, six laminates and other multilayer circuit boards.
Mostly it is an only QSFP interface during existing pcb board use, transmission channel is few, causes transmission rate
Low, existing pcb board does not have automatic cleaning function, and staff needs manually to clean it, wasted time and energy, existing pcb board
There is no quick heat radiating function, be badly in need of a kind of pcb board with dual density QSFP interfaces now to solve above-mentioned produced problem.
The content of the invention
In view of the deficienciess of the prior art, it is an object of the present invention to provide a kind of pcb board with dual density QSFP interfaces,
To solve the problems mentioned in the above background technology, the present invention is rational in infrastructure, is easy to combination to install, applied widely, reliability
It is high.
To achieve these goals, the present invention is to realize by the following technical solutions：One kind has dual density QSFP
The pcb board of interface, including apparatus main body, automated cleaning mechanism and Quick heat radiation mechanism, described device main body include pcb board sheet
Body, SMA interfaces, the first QSFP interfaces, the 2nd QSFP interfaces, the first fixed block, signal wire and the second fixed block, described first
QSFP interfaces are arranged on pcb board body upper surface, and the 2nd QSFP interfaces are arranged on pcb board body upper surface, and described first
QSFP interfaces are arranged on the left of the 2nd QSFP interfaces, and first fixed block is arranged on rear side of pcb board body upper surface, and described the
Two fixed blocks are arranged on pcb board body right side, and the SMA interfaces are evenly distributed on pcb board body upper surface, the signal wire
Installed in SMA interfaces upper surface, the automated cleaning mechanism include electric expansion bar, connecting rod, Clean Brush for cleaning, stretch out switch with
And switch of retracting, the electric expansion bar are arranged on inside the first fixed block, the connecting rod is fixed on electric expansion bar lower end
Face, the Clean Brush for cleaning are arranged on connecting rod lower surface, and the switch that stretches out is arranged on the first fixed block left side, the retraction
Switch is arranged on the first fixed block left side, and the stretching switch is arranged on retraction switch rear side, the Quick heat radiation mechanism bag
Cell piece, rotating switch, radiator fan, refrigeration switch and semiconductor chilling plate are included, the cell piece is arranged on second and fixed
Rear side in block, the rotating switch are arranged on the second fixed block right side, and the radiator fan is arranged on right in the second fixed block
Side, the semiconductor chilling plate are arranged on left side in the second fixed block, and the refrigeration switch is arranged on the second fixed block front end face.
Further, the SMA interfaces are provided with 32 groups, and 32 groups of SMA interface specifications are identical.
Further, the pcb board body lower surface is equipped with beam.
Further, the electric expansion bar is connected with stretching out switch and retraction switch respectively by wire.
Further, the refrigeration switch is connected by wire with cell piece, and the refrigeration switch passes through wire and half
Conductor cooling piece is connected, and the rotating switch is connected by wire with cell piece, and the rotating switch is by wire with dissipating
Hot-air fan is connected.
Further, the first QSFP interfaces and the 2nd QSFP interface specifications are identical.
Beneficial effects of the present invention：A kind of pcb board with dual density QSFP interfaces of the present invention, because the present invention with the addition of
Electric expansion bar, connecting rod, Clean Brush for cleaning, stretching switch and switch of retracting, the design facilitate staff enterprising to pcb board
Row cleaning, solves the problems, such as that original pcb board does not have automatic cleaning function, improves the ease of use of the present invention.
The present invention with the addition of cell piece, rotating switch, radiator fan, refrigeration switch and semiconductor chilling plate, the design
It is convenient that pcb board is radiated, solve the problems, such as that original pcb board does not have quick heat radiating function, improve the function of the present invention
Property.
Because SMA interfaces are provided with 32 groups, the design facilitates staff to connect signal wire, because of pcb board body lower surface
Beam is equipped with, this design reduces the vibrating effect of the present invention, because of the first QSFP interfaces and the 2nd QSFP interface specification phases
Together, design increase transmission channel, the transmission rate of the present invention is improved, the present invention is rational in infrastructure, is easy to combination to install, and is applicable
Scope is wide, and reliability is high.
Brief description of the drawings
The detailed description made by reading with reference to the following drawings to non-limiting example, further feature of the invention,
Objects and advantages will become more apparent upon：
Fig. 1 is a kind of structural representation of the pcb board with dual density QSFP interfaces of the present invention；
Fig. 2 is the structural representation of automated cleaning mechanism in a kind of pcb board with dual density QSFP interfaces of the present invention；
Fig. 3 is the structural representation of Quick heat radiation mechanism in a kind of pcb board with dual density QSFP interfaces of the present invention；
In figure：1-PCB plates body, 2-SMA interfaces, the QSFP interfaces of 3- the first, the QSFP interfaces of 4- the 2nd, the fixed blocks of 5- first, 6-
Automated cleaning mechanism, 7- signal wires, 8- Quick heat radiation mechanisms, the fixed blocks of 9- second, 61- electric expansion bars, 62- connecting rods, 63-
Clean Brush for cleaning, 64- stretch out switch, 65- retractions switch, 81- cell pieces, 82- rotating switches, 83- radiator fans, 84- refrigeration and opened
Close, 85- semiconductor chilling plates.
Embodiment
To be easy to understand the technical means, the inventive features, the objects and the advantages of the present invention, with reference to
Embodiment, the present invention is expanded on further.
Fig. 1-Fig. 3 is referred to, the present invention provides a kind of technical scheme：A kind of pcb board with dual density QSFP interfaces, bag
Include apparatus main body, automated cleaning mechanism 6 and Quick heat radiation mechanism 8, apparatus main body includes pcb board body 1, SMA interfaces 2, the
One QSFP interfaces 3, the 2nd QSFP interfaces 4, the first fixed block 5, the fixed block 9 of signal wire 7 and second, the first QSFP interfaces 3 are pacified
Mounted in the upper surface of pcb board body 1, the 2nd QSFP interfaces 4 are arranged on the upper surface of pcb board body 1, and the first QSFP interfaces 3 are arranged on
The left side of 2nd QSFP interfaces 4, the first fixed block 5 are arranged on rear side of the upper surface of pcb board body 1, and the second fixed block 9 is arranged on PCB
The right side of plate body 1, SMA interfaces 2 are evenly distributed on the upper surface of pcb board body 1, and signal wire 7 is arranged on the upper surface of SMA interfaces 2.
Automated cleaning mechanism 6 includes electric expansion bar 61, connecting rod 62, Clean Brush for cleaning 63, stretching switch 64 and retracted
Switch 65, electric expansion bar 61 are arranged on inside the first fixed block 5, and connecting rod 62 is fixed on the lower surface of electric expansion bar 61, clearly
Clean hairbrush 63 is arranged on the lower surface of connecting rod 62, stretches out switch 64 and is arranged on the left side of the first fixed block 5, the installation of switch 65 of retracting
In the left side of the first fixed block 5, stretch out switch 64 and be arranged on the rear side of retraction switch 65, the design facilitates staff to pcb board
On cleaned, solve the problems, such as that original pcb board does not have automatic cleaning function.
Quick heat radiation mechanism 8 includes cell piece 81, rotating switch 82, radiator fan 83, refrigeration switch 84 and semiconductor
Cooling piece 85, cell piece 81 are arranged on rear side in the second fixed block 9, and rotating switch 82 is arranged on the right side of the second fixed block 9, dissipates
Hot-air fan 83 is arranged on right side in the second fixed block 9, and semiconductor chilling plate 85 is arranged on left side in the second fixed block 9, and refrigeration is opened
Close 84 and be arranged on the front end face of the second fixed block 9, the design is convenient to radiate to pcb board, and it is not quick to solve original pcb board
The problem of heat sinking function.
SMA interfaces 2 are provided with 32 groups, and 32 groups of specifications of SMA interfaces 2 are identical, the assembling of the lower surface of pcb board body 1
There is beam, electric expansion bar 61 is connected with stretching out switch 64 and retraction switch 65 respectively by wire, refrigeration switch 84
It is connected by wire with cell piece 81, refrigeration switch 84 is connected by wire with semiconductor chilling plate 85, rotating switch 82
It is connected by wire with cell piece 81, rotating switch 82 is connected by wire with radiator fan 83, the He of the first QSFP interfaces 3
The specification of 2nd QSFP interfaces 4 is identical.
Embodiment：Staff presses refrigeration switch 84, switching refrigeration switch 84 when using pcb board body 1
For on-state, electric energy is sent in semiconductor chilling plate 85 by cell piece 81, and semiconductor chilling plate 85 is started working, and work people
Member presses rotating switch 82, and switching rotating switch 82 is on-state, and electric energy is sent to radiator fan 83 by cell piece 81, radiating
Fan 83 starts to rotate, and radiator fan 83 rotates blows to semiconductor chilling plate 85 by wind energy, so as to which radiator fan 83 blows cold wind
Radiated on to pcb board body 1, add the ease of use of the present invention.
Staff presses stretching switch 64, and electric expansion bar 61 is started working, and electric expansion bar 61 drives connecting rod 62
Move forward, connecting rod 62 drives Clean Brush for cleaning 63 to move forward, otherwise staff presses retraction switch 65, the band of connecting rod 62
Dynamic Clean Brush for cleaning 63 is moved rearwards, and pcb board body 1 and SMA interfaces 2 are cleaned by the way that Clean Brush for cleaning 63 is movable, carried
The high cleanliness factor of the present invention.
The general principle and principal character and advantages of the present invention of the present invention has been shown and described above, for this area skill
For art personnel, it is clear that the invention is not restricted to the details of above-mentioned one exemplary embodiment, and without departing substantially from the present invention spirit or
In the case of essential characteristic, the present invention can be realized in other specific forms.Which point therefore, no matter from the point of view of, all should incite somebody to action
Embodiment regards exemplary as, and be it is nonrestrictive, the scope of the present invention by appended claims rather than on state
Bright restriction, it is intended that all changes fallen in the implication and scope of the equivalency of claim are included in the present invention
It is interior.Any reference in claim should not be considered as to the involved claim of limitation.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that those skilled in the art should for clarity
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It is appreciated that other embodiment.
Claims (6)
1. a kind of pcb board with dual density QSFP interfaces, including apparatus main body, automated cleaning mechanism and quick heat radiating machine
Structure, it is characterised in that：Described device main body includes pcb board body, SMA interfaces, the first QSFP interfaces, the 2nd QSFP interfaces, the
One fixed block, signal wire and the second fixed block, the first QSFP interfaces are arranged on pcb board body upper surface, and described second
QSFP interfaces are arranged on pcb board body upper surface, and the first QSFP interfaces are arranged on the left of the 2nd QSFP interfaces, and described first
Fixed block is arranged on rear side of pcb board body upper surface, and second fixed block is arranged on pcb board body right side, and the SMA connects
Mouth is evenly distributed on pcb board body upper surface, and the signal wire is arranged on SMA interfaces upper surface；
The automated cleaning mechanism includes electric expansion bar, connecting rod, Clean Brush for cleaning, stretching switch and switch of retracting, described
Electric expansion bar is arranged on inside the first fixed block, and the connecting rod is fixed on electric expansion bar lower surface, the Clean Brush for cleaning
Installed in connecting rod lower surface, the switch that stretches out is arranged on the first fixed block left side, and the switch of retracting is arranged on first
Fixed block left side, the stretching switch are arranged on retraction switch rear side；
The Quick heat radiation mechanism includes cell piece, rotating switch, radiator fan, refrigeration switch and semiconductor chilling plate, institute
State cell piece rear side, rotating switch in the second fixed block and be arranged on the second fixed block right side, the radiation air
Fan is arranged on right side in the second fixed block, and the semiconductor chilling plate is arranged on left side in the second fixed block, the refrigeration switch
Installed in the second fixed block front end face.
A kind of 2. pcb board with dual density QSFP interfaces according to claim 1, it is characterised in that：The SMA interfaces
Provided with 32 groups, and 32 groups of SMA interface specifications are identical.
A kind of 3. pcb board with dual density QSFP interfaces according to claim 1, it is characterised in that：The pcb board sheet
Body lower surface is equipped with beam.
A kind of 4. pcb board with dual density QSFP interfaces according to claim 1, it is characterised in that：It is described electronic to stretch
Contracting bar is connected with stretching out switch and retraction switch respectively by wire.
A kind of 5. pcb board with dual density QSFP interfaces according to claim 1, it is characterised in that：The refrigeration is opened
Pass is connected by wire with cell piece, and the refrigeration switch is connected by wire with semiconductor chilling plate, and the rotation is opened
Pass is connected by wire with cell piece, and the rotating switch is connected by wire with radiator fan.
A kind of 6. pcb board with dual density QSFP interfaces according to claim 1, it is characterised in that：Described first
QSFP interfaces and the 2nd QSFP interface specifications are identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710644759.7A CN107580444A (en) | 2017-08-01 | 2017-08-01 | A kind of pcb board with dual density QSFP interfaces |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710644759.7A CN107580444A (en) | 2017-08-01 | 2017-08-01 | A kind of pcb board with dual density QSFP interfaces |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107580444A true CN107580444A (en) | 2018-01-12 |
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ID=61034339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710644759.7A Pending CN107580444A (en) | 2017-08-01 | 2017-08-01 | A kind of pcb board with dual density QSFP interfaces |
Country Status (1)
| Country | Link |
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| CN (1) | CN107580444A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114158180A (en) * | 2021-10-08 | 2022-03-08 | 中国安全生产科学研究院 | Driver with heat dissipation function and infrared detector applying same |
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2017
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9671580B1 (en) * | 2015-07-01 | 2017-06-06 | Inphi Corporation | Photonic transceiving device package structure |
| TW201707400A (en) * | 2015-08-05 | 2017-02-16 | 傳承光電股份有限公司 | Optical transceiver |
| CN106470074A (en) * | 2015-08-14 | 2017-03-01 | 传承光电股份有限公司 | Light R-T unit |
| CN205828597U (en) * | 2016-07-10 | 2016-12-21 | 安徽机电职业技术学院 | A kind of new-energy automobile refrigerating device of accumulator |
| CN205984405U (en) * | 2016-08-26 | 2017-02-22 | 杭州乐荣电线电器有限公司 | Special cable of high density high -speed signal receiving and dispatching transport connection subassembly |
| CN106838850A (en) * | 2017-02-27 | 2017-06-13 | 中山市璞玉灯饰有限公司 | Intelligent underwater lamp |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114158180A (en) * | 2021-10-08 | 2022-03-08 | 中国安全生产科学研究院 | Driver with heat dissipation function and infrared detector applying same |
| CN114158180B (en) * | 2021-10-08 | 2023-09-05 | 中国安全生产科学研究院 | Driver with heat dissipation function and infrared detector applying driver |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180112 |
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| RJ01 | Rejection of invention patent application after publication |