CN107579429A - Semiconductor laser and its temprature control method - Google Patents
Semiconductor laser and its temprature control method Download PDFInfo
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- CN107579429A CN107579429A CN201610517379.2A CN201610517379A CN107579429A CN 107579429 A CN107579429 A CN 107579429A CN 201610517379 A CN201610517379 A CN 201610517379A CN 107579429 A CN107579429 A CN 107579429A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
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Abstract
This application discloses a kind of semiconductor laser and its temprature control method, first gather the temperature and humidity in the temperature and humidity or accommodating cavity body of semiconductor laser external environment condition, then a work shell temperature that condensation vapor phenomenon can be prevented is determined according to the temperature and humidity collected, and then temperature controlling point is adjusted according to the work shell temperature of the determination, and according to the functional relation of input current and the work gentle optical output power of laser of shell, on the premise of ensureing that optical output power of laser is substantially constant, input current corresponding to calculating work at present shell temperature, is adjusted.The temprature control method adjusts the work shell temperature and supply current of laser, prevents from turn ensure that stable Output optical power while condensation vapor in real time by the change of humiture in monitors environment/cavity.
Description
Technical field
The application is related to semiconductor laser, more particularly, to temprature control method in semiconductor laser.
Background technology
LASER Light Source has the advantages that wide brightness height, colour gamut, good reliability, energy-conserving and environment-protective, in all kinds of projection arrangements
To more and more extensive application.The semiconductor laser that LASER Light Source generally uses, its electric light transformation efficiency and reliability with
The work shell temperature of laser is closely bound up.Such as during a kind of 25 DEG C of red laser diode shell temperature, 3A input currents, laser energy
Export 2.5W feux rouges；Same to export 2.5W feux rouges during 35 DEG C of shell temperature, input current needs to reach 3.75A, i.e. input power at least
Need increase by 25%.Therefore it is defeated in order to obtain preferable electrical efficiency and stable luminous power for such semiconductor laser
Go out, common practice is using the work shell temperature of cooling body (TEC) control laser at present, is supplied using constant-current source to laser
Constant circuit, so as to obtain stable Output optical power.
The logic of this control mode is simple, and the work shell temperature of laser is constant, long lifespan.But problems with hardly possible be present
To solve：First, the work shell temperature of laser is lower than environment temperature, when ambient humidity is larger, the steam in air can be cold in TEC
Equitemperature is held to be condensed less than the surface of environment temperature, it is possible to cause light power to decline, short circuit, optical element are impaired etc., and product loses
Effect, have a strong impact on the reliability of projection arrangement；Second, with the rise of environment temperature, the TEC hot and cold side temperature difference increases, TEC's
Refrigerating efficiency COP rapid decreases, the efficiency of projection arrangement is caused to decline.
The content of the invention
The application provides a kind of semiconductor laser and its temprature control method.
The temprature control method that the application provides, the semiconductor laser, which has, houses cavity, in the accommodating cavity body
Equipped with laser and the cooling body for being cooled down to laser；
The temprature control method includes the first temp-controled mode, and first temp-controled mode includes step：
External data gathers：Gather the temperature and humidity of semiconductor laser external environment condition；
Calculate dew-point temperature：Ambient dew point temperature is calculated according to the temperature and humidity of collection；
Temperature setting：The work shell temperature of laser is determined according to ambient dew point temperature, the work shell temperature is greater than or equal to
Ambient dew point temperature；And the temperature controlling point of cooling body is arranged to equal with work shell temperature；
Determine input current：According to the functional relation of input current and the work gentle optical output power of laser of shell, ensure
Optical output power of laser is substantially constant, calculates input current corresponding to work at present shell temperature；
Adjust input current：According to electric current corresponding to the input current value calculated to laser input.
As the further improvement of the temprature control method, in temperature setting step, by the temperature controlling point of cooling body
Compared with the work shell temperature that this step determines, such as temperature controlling point=work shell temperature, then into next step；Such as temperature controlling point ≠ work
Make shell temperature, then the value of temperature controlling point is arranged to the value of work shell temperature, and enter next step.
As the further improvement of the temprature control method, after the completion of input current step is adjusted, during the setting of interval
Between, return to external data acquisition step.
As the further improvement of the temprature control method, the temprature control method also includes second temperature control mould
Formula, switching is can be chosen between first temp-controled mode and second temperature control model；The second temperature control
Pattern includes step：
Cavity inner temperature gathers：Gather the temperature in the space in accommodating cavity body around laser；
Temperature setting：Determine the work shell temperature of laser according to the cavity inner temperature of collection, the work shell temperature be equal to or
The cavity inner temperature is equal to higher than the cavity inner temperature, and by cooling body temperature controlling point；
Determine input current：According to the functional relation of input current and the work gentle optical output power of laser of shell, ensure
Optical output power of laser is substantially constant, calculates input current corresponding to work at present shell temperature；
Humidity collection in cavity：Gather the humidity in the space in accommodating cavity body around laser；
Temperature adjusts：Work shell temperature is determined according to humidity in the cavity of collection, and after adjusting temperature controlling point, returns and determines input
Current step.
As the further improvement of the temprature control method, in temperature adjustment, the threshold of humidity in cavity is preset
It is worth the upper limit and bottom threshold, when humidity ＜ bottom thresholds in cavity, then new temperature controlling point=current step-length of temperature controlling point-the first is set,
New work shell temperature=new temperature controlling point, and input current step is returned, input current is calculated according to new work shell temperature；Work as cavity
Interior humidity ＞ upper thresholds, then set new temperature controlling point=current temperature controlling point+the first step-length, new work shell temperature=new temperature controlling point,
And input current step is returned, input current is calculated according to new work shell temperature；When humidity ＜ threshold values in bottom threshold ＜ cavitys
The upper limit, then return to input current step；Wherein, the first step-length represents the step-length of temperature adjustment.
As the further improvement of the temprature control method, the value of the first step-length reduces with the rise of humidity.
As the further improvement of the temprature control method, when the temperature in accommodating cavity body and/or humidity are compared and partly led
The temperature and/or humidity of body laser external environment condition are high, and the difference being higher by is equal to or more than setting difference, then by the first temperature
Control mode switch is to second temperature control model.
Another temprature control method that the application provides, the semiconductor laser has accommodating cavity, described accommodating
Cavity is built with laser and the cooling body for being cooled down to laser；
The temprature control method includes step：
Cavity inner temperature gathers：Gather the temperature in the space in accommodating cavity body around laser；
Temperature setting：Determine the work shell temperature of laser according to the cavity inner temperature of collection, the work shell temperature be equal to or
Cavity inner temperature is equal to higher than cavity inner temperature, and by the temperature controlling point of cooling body；
Determine input current：According to the functional relation of input current and the work gentle optical output power of laser of shell, ensure
Optical output power of laser is substantially constant, calculates input current corresponding to work at present shell temperature；
Humidity collection in cavity：Gather the humidity in the space in accommodating cavity body around laser；
Temperature adjusts：Work shell temperature is determined according to the humidity of collection, and after adjusting temperature controlling point, returns and determines input current step
Suddenly.
As the further improvement of another temprature control method, in temperature adjustment, humidity in cavity is preset
Upper threshold and bottom threshold, when humidity ＜ bottom thresholds in cavity, then new temperature controlling point=current temperature controlling point-first step is set
Long, new work shell temperature=new temperature controlling point, and input current step is returned, input current is calculated according to new work shell temperature；When
Humidity ＞ upper thresholds in cavity, then new temperature controlling point=current step-length of temperature controlling point+the first, new work shell temperature=new temperature control are set
Point, and input current step is returned, input current is calculated according to new work shell temperature；When humidity ＜ thresholds in bottom threshold ＜ cavitys
It is worth the upper limit, then returns to input current step；Wherein, the first step-length represents the step-length of temperature adjustment.
As the further improvement of another temprature control method, the value of first step-length subtracts with the rise of humidity
It is small.
The semiconductor laser that the application provides, including：
Housing, the housing enclose to form accommodating cavity；
Laser, the laser are arranged in accommodating cavity body；
Cooling body, the cooling body carry out cooling temperature control to laser；
Parameter detecting mechanism, the parameter detecting mechanism includes temperature sensor and humidity sensor, in the housing
The parameter detecting mechanism is provided with outside and/or accommodating cavity body；
And control circuit, the laser, cooling body and parameter detecting mechanism are connected with control circuit respectively, described
The temperature and humidity signal that control circuit gathers according to parameter detecting mechanism, it is determined that the work shell of laser condensation vapor can be prevented
Temperature, and according to the functional relation of input current, the gentle optical output power of laser of shell that works, ensure that optical output power of laser is big
Cause under stabilization, calculate input current corresponding to work at present shell temperature, and laser is adjusted with this input current.
As the further restriction of the semiconductor laser, the parameter detecting mechanism for being arranged on hull outside is the first ginseng
Number testing agency, the temperature and humidity that the control circuit gathers according to the first parameter detecting mechanism determine ambient dew point temperature,
And the temperature controlling point of the gentle cooling body of work shell of laser is arranged to equal and is greater than or equal to ambient dew point temperature.
As the further restriction of the semiconductor laser, the parameter detecting mechanism being arranged in accommodating cavity body is second
Parameter detecting mechanism, initialization shell temperature of the control circuit using the temperature that the second parameter detecting mechanism gathers as laser
With the temperature controlling point of cooling body, and according to the second parameter detecting mechanism gather humidity adjust the gentle temperature controlling point of work shell.
As the further restriction of the semiconductor laser, preset in cavity under the upper threshold and threshold value of humidity
Limit, when humidity ＜ bottom thresholds, then new temperature controlling point=current step-length of temperature controlling point-the first, new work shell temperature=new temperature control are set
Point, and redefine input current；When humidity ＞ upper thresholds in cavity, then new temperature controlling point=current temperature controlling point+the first is set
Step-length, new work shell temperature=new temperature controlling point, and redefine input current；When bottom threshold ＜ humidity ＜ upper thresholds, then
Keep present input current；Wherein, the first step-length represents the step-length of temperature adjustment.
The beneficial effect of the application is：
In semiconductor laser and its temprature control method that the application provides, semiconductor laser external environment condition is first gathered
Temperature and humidity or accommodating cavity body in temperature and humidity, then determine that one can prevent according to the temperature and humidity collected
The only work shell temperature of condensation vapor phenomenon, so according to the work shell temperature of the determination adjust temperature controlling point, and according to input current with
The functional relation of the work gentle optical output power of laser of shell, on the premise of ensureing that optical output power of laser is substantially constant,
Input current corresponding to calculating work at present shell temperature, is adjusted.The temprature control method passes through warm in monitors environment/cavity
The change of humidity, the work shell temperature and supply current of laser are adjusted in real time, prevent from turn ensure that stabilization while condensation vapor
Output optical power.
Brief description of the drawings
Fig. 1 is that semiconductor laser structure shows in the temprature control method of the application semiconductor laser the first embodiment
It is intended to；
Fig. 2 is the first embodiment FB(flow block) of the temprature control method of the application semiconductor laser；
A kind of performance diagrams of the Fig. 3 between red laser input current and power output；
A kind of performance diagrams of the Fig. 4 between red laser input current and voltage；
Fig. 5 shows for semiconductor laser structure in second of embodiment of temprature control method of the application semiconductor laser
It is intended to；
Fig. 6 is second of embodiment FB(flow block) of temprature control method of the application semiconductor laser.
Embodiment
The present invention is described in further detail below by embodiment combination accompanying drawing.The application can be with a variety of
Different forms is realized, however it is not limited to embodiment described by the present embodiment.The purpose of detailed description below is provided
It is easy for becoming apparent from present disclosure thorough explanation, the words of the wherein indicating position such as upper and lower, left and right is only pin
To shown structure in respective figure for position.
However, those skilled in the art may be aware that one or more detail description can be by
Omit, or other methods, component or material can also be used.In some instances, some embodiments are not described
Or it is not described later in detail.
In addition, technical characteristic described herein, technical scheme can also be closed arbitrarily in one or more embodiments
Suitable mode combines.For those skilled in the art, should be readily appreciated that with provided herein is embodiment relevant method
Step or operation order can also change.Therefore, any order in drawings and examples is merely illustrative purposes, not secretly
Show requirement in a certain order, require unless expressly stated according to a certain order.
It is herein part institute serialization number itself, such as " first ", " second " etc., is only used for distinguishing described object,
Without any order or art-recognized meanings.And " connection ", " connection " described in the application, unless otherwise instructed, include directly and
It is indirectly connected with (connection).
Embodiment one：
The temprature control method for the semiconductor laser that the present embodiment one provides is based on a kind of semiconductor laser.This is partly led
Body laser has accommodating cavity, laser is housed and for the cooling body to laser temperature control in accommodating cavity body.
Specifically, Fig. 1 is refer to, Fig. 1 show a kind of specific example of above-mentioned semiconductor laser, is not this reality
Apply the unique selection of temprature control method shown in example.
Wherein, red laser 303 is arranged on bottom plate 304, and bottom plate 304 passes through soaking plate 305, cooling body (TEC) 306
It is connected with heat sink 307.Bottom plate 304 is fixed on heat sink 307 by way of elastic connection and (not provided in fixed form figure), respectively
It is brought into close contact between contact surface by way of the silicone grease of high thermal conductivity or other low thermal resistances.
In other embodiments, cooling body is not limited to Peltier element (TEC) 306, it is also possible to which other are controllable
Magnetism servo-electric motor water-cooling, heat exchanger and the combination of fans of temperature, refrigerant etc..
Label 308 show the temperature measuring point of the temperature sensing devices such as thermistor, thermocouple, monitors the shell temperature of red laser 303.
Laser can reach very high temperature-controlled precision using TEC closed control circuit, ensure laser shell temperature by constant current source power supply
Stabilization.On the premise of supply current and shell temperature all keep stable, the stable luminous power of laser output.
Module shell 301, cover plate of outer casing 302, heat sink 307 collectively constitute housing with luminous lens 310, enclose an envelope
The accommodating cavity 311 closed, meets dust-proof needs.But common sealing structure can not completely cut off steam, therefore in cavity
Humidity can raise with the rise of ambient humidity.
The present embodiment one adds parameter detecting mechanism, and the parameter detecting mechanism includes temperature sensor and humidity sensor
Device, the temperature sensor and humidity sensor can independently be set, it is also possible to be become one.
Laser, cooling body and parameter detecting mechanism are connected with control circuit respectively, and the control circuit is according to parameter
The temperature and humidity signal of testing agency's collection, it is determined that the work shell temperature of laser condensation vapor can be prevented, and according to input electricity
The functional relation of stream, the work gentle optical output power of laser of shell, under ensureing that optical output power of laser is substantially constant, calculate
Input current corresponding to work at present shell temperature, and laser is adjusted with this input current.
It refer to Fig. 1, temperature sensor and humidity sensor are integrated into a Temperature Humidity Sensor 312 in the present embodiment.
The Temperature Humidity Sensor 312 is defined as the first parameter detecting mechanism, and it is arranged on the outside of accommodating cavity 311, outer to gather
The temperature and humidity of portion's environment.So as to realize the rise with environment temperature, the synchronous work shell temperature for improving laser.
This temprature control method includes：
External data gathers：Gather the temperature Ta and humidity Ha of semiconductor laser external environment condition.
Calculate dew-point temperature：Ambient dew point temperature Tra is calculated according to the temperature Ta of collection and humidity Ha.
Specifically calculating process is to pass through Tra and Ta, Ha functional relation Tra=f1(Ta, Ha), tries to achieve Current Temperatures
Ambient dew point temperature Tra corresponding to Ta and humidity Ha, functional relation Tra=f1(Ta, Ha) belongs to known, here
Just no longer superfluous words.
Temperature setting：Work shell the temperature T_set, the work shell temperature T_ of laser are determined according to ambient dew point temperature Tra
Set is greater than or equal to ambient dew point temperature Tra；And the temperature controlling point T_cold of cooling body is arranged to and the shell temperature T_set that works
It is equal.
Work shell temperature T_set is greater than or equal to ambient dew point temperature Tra, and semiconductor laser can be prevented in external environment condition
In condensation vapor phenomenon caused by temperature difference problem.
Determine input current：According to input current I_in with work shell temperature T_set's and optical output power of laser P_out
Functional relation, ensure that optical output power of laser P_out is substantially constant, calculate and inputted corresponding to work at present shell temperature T_set
Electric current I_in.
Output optical power P_out mentioned here is substantially constant to refer to that Output optical power P_out is maintained at certain value model
In enclosing, this span can be manually set according to the actual requirements.
Different lasers has a respective characteristic curve, input current I_in and work shell temperature T_ in various lasers
Set and optical output power of laser P_out functional relation I_in=f2(P_out, T_set) is otherwise varied, the functional relation
I_in=f2(P_out, T_set) can by the test data of its characteristic curve or laser by interpolation, curve matching or
Other method can obtain, and this is already belonging to known prior art.
For example, refer to Fig. 3 and 4, Fig. 3 and 4 is a kind of performance diagram of red laser, wherein, Tc=25 DEG C in Fig. 4
Curve with Tc=35 DEG C essentially coincides, therefore only depicts a curve, i.e., supply voltage is only related to electric current, with shell temperature nothing
Close.From figure 3, it can be seen that within the scope of 25 DEG C of -35 DEG C of shell temperature, the characteristic curve of below 2W Output optical power has well linearly
Degree.By taking 1.8W Output optical power as an example, in the case of 25 DEG C of shell temperature, the heat consumption 3.625W of single laser；The feelings of 35 DEG C of shell temperature
Under condition, the heat consumption 4.653W of single laser.
Adjust input current：According to electric current corresponding to the input current I_in values calculated to laser input.
Specifically, Fig. 2 is refer to, a kind of FB(flow block) based on the temprature control method is as follows：
Step S10：The temperature and humidity of external environment condition of the collection beyond accommodating cavity.
Step S12：The work shell temperature T_set of laser is calculated according to the step S10 temperature and humidities gathered；
Step S14：The input current I_in of laser is calculated according to work shell temperature T_set, and according to the value calculated
To electric current corresponding to laser input；
Step S16：After the completion of input current step is adjusted, setting time is spaced, returns to external data acquisition step.Between
Can flexibly it be set according to the actual requirements every the time.
Further, please continue to refer to Fig. 2, in addition to temperature setting step S15：
In temperature setting step, by the temperature controlling point T_cold of cooling body and the work shell temperature T_set of this step determination
Be compared, as temperature controlling point T_cold=work shell temperature T_set, then into next step；Such as temperature controlling point T_cold ≠ work shell
Warm T_set, then temperature controlling point T_cold value is arranged to work shell temperature T_set value, and enters next step.
Further, in temperature setting step, as temperature-controlled precision be +/- N DEG C, then the shell temperature that works T_set is defined as T_
Set=Tra+N DEG C, N is arithmetic number.
The work shell temperature and supply current of change, in real time regulation laser that the present embodiment passes through monitors environment humiture,
Laser works shell temperature can be not only reduced as far as possible, while is also prevented from condensation vapor and is ensured stable Output optical power.
For example, for the module using 15 red lasers as shown in Figure 3.The laser shell temperature 25 of prior art
DEG C thermostatic control scheme, TEC refrigerating capacity 54W, 20 DEG C of its cold junction temperature, hot junction to 0.16 DEG C/W of environment thermal resistance.Environment temperature 25
DEG C when, by calculate understand TEC power 32.6W, 40 DEG C of hot-side temperature, 20 DEG C of the TEC hot and cold sides temperature difference, refrigerating efficiency COP reaches
1.66.But when environment temperature rises to 35 DEG C, calculate and understand now TEC power 93.9W, 60 DEG C of hot-side temperature, TEC is cold and hot
40 DEG C of the temperature difference is held, refrigerating efficiency COP drops to 0.57.
And temprature control method shown in the present embodiment is used, when 35 DEG C of environment temperatures, laser shell temperature is also controlled 35
DEG C, then now TEC refrigerating capacitys 69.8W, TEC power 73.7W, 60 DEG C of hot-side temperature are understood by calculating, and cold junction temperature is 30 DEG C,
30 DEG C of the TEC hot and cold sides temperature difference, refrigerating efficiency COP are 0.94, remain at higher level.
Embodiment two：
Fig. 5 is refer to, the temprature control method for the semiconductor laser that the present embodiment two provides is swashed based on a kind of semiconductor
Light device.The semiconductor laser has accommodating cavity 311, houses cavity 311 built with laser 303 and for laser control
The cooling body 306 of temperature.
Specifically, Fig. 5 show a kind of specific example of above-mentioned semiconductor laser, and it is with respect to exemplified by embodiment one
The difference of structure is, Temperature Humidity Sensor 313 is defined as into the second parameter detecting mechanism, and it is arranged in accommodating cavity 311,
And around laser 303, to gather the temperature T_air in the space in accommodating cavity 311 around laser 303.
So as to realize with the rise of temperature in accommodating cavity 311, the synchronous work shell temperature for improving laser 303.
The temprature control method includes step：
Cavity inner temperature gathers：The temperature T_air in the space in the accommodating cavity 311 of collection around laser 303.
Temperature setting：The work shell temperature T_set of laser 303 is determined according to temperature T_air in the cavity 311 of collection, should
Work shell temperature T_set is equal to or higher than T_air, and the temperature controlling point T_cold of cooling body 306 is equal into T_air.
Work shell temperature T_set can prevent each part in the environment of cavity 311 greater than or equal to temperature T_air in cavity 311
The interior condensation vapor phenomenon caused by temperature difference problem.
Determine input current：Ensure that laser 303 Output optical power P_out is substantially constant, according to input current I_in with
The work shell temperature T_set and Output optical power P_out of laser 303 functional relation, it is corresponding to calculate work at present shell temperature T_set
Input current I_in.
As described in embodiment one, different lasers 303 has respective characteristic curve, is inputted in various lasers 303
Electric current I_in and work shell temperature T_set and optical output power of laser P_out functional relation I_in=f2(P_out,T_set)
It is otherwise varied, functional relation I_in=f2(P_out, T_set) can by the test data of characteristic curve or laser
It can obtain by interpolation, curve matching or other method, this is already belonging to known prior art, here just no longer superfluous words.
Humidity collection in cavity 311：The humidity H_ in the space in the accommodating cavity 311 of collection around laser 303
air。
Temperature adjusts：Work shell temperature T_set is determined according to the humidity H_air of collection, and after adjusting temperature controlling point T_cold, returned
Return and determine input current step.
When temperature adjusts, the upper threshold and bottom threshold of humidity in cavity 311 can be preset, by the humidity of collection
H_air adjusts or kept current temperature controlling point T_cold and work according to comparative result compared with upper threshold and bottom threshold
Shell temperature T_set size.
To divide into a length of T_step of the first step, specifically, Fig. 6 is refer to, this temprature control method includes：
Step S20：The temperature T_air in the space in the accommodating cavity 311 of collection around laser 303；
Step S22：According to the temperature controlling point T_ of the control program of the step S20 temperature T_air setting cooling bodies gathered
Cold, the temperature controlling point T_cold value are equal to T_air value；
Step S24：Calculate the input current I_in of laser 303 according to temperature controlling point T_cold, and according to calculating
It is worth to laser 303 and inputs corresponding electric current；
Step S26：The humidity H_air in the space in the accommodating cavity 311 of collection around laser 303, according to collection
Humidity H_air adjustment temperature controlling point T_cold size, and return to step S24.
In step S26, the upper threshold and bottom threshold of humidity in cavity 311 are preset, by the humidity H_ of collection
Air adjusts or kept current temperature controlling point T_cold numerical value according to comparative result compared with upper threshold and bottom threshold.
Can work as humidity H_air ＜ bottom thresholds, then the current temperature controlling point T_cold-T_ of new temperature controlling point T_cold=are set
Step, the new work shell temperature new temperature controlling point T_cold of T_set=, and input current step is returned, according to new work shell temperature T_set
Calculate input current I_in；When humidity H_air ＞ upper thresholds, then the current temperature controlling point T_ of new temperature controlling point T_cold=are set
Cold+T_step, the new work shell temperature new temperature controlling point T_cold of T_set=, and input current step is returned, according to new work shell
Warm T_set calculates input current I_in；When bottom threshold ＜ humidity H_air ＜ upper thresholds, then input current step is returned；
Wherein, T_step represents the step-length of temperature adjustment.
Wherein, T_step value has two ways：1st, definite value is taken, step-length is small, such as all compares between 1 DEG C to 2 DEG C
Properly；2：Changed according to humidity in cavity 311, humidity hour, step-length can take larger, and when humidity is high, step-length gets the small value, i.e.,
Step-length T_step value reduces with the rise of humidity.
Threshold value bound value typically within the humidity range of product requirement normal operation.The for example humidity of product requirement
Scope is 5%-95%, then threshold value bound can use any value in the range of this；When threshold value bound value is close, for example
70%-73%, moreover it is possible to realize approximate constant humidity control.
The present embodiment two specifically, in module after electricity, the initial temperature controlling point using temperature in cavity 311 as TEC,
It is exactly the work shell temperature of laser 303.Then TEC temperature controlling points are adjusted according to humidity in cavity 311:Humidity is less than bottom threshold
The work shell temperature of laser 303 then can be further reduced, will not also cause condensation vapor；Need to improve if humidity is higher than upper threshold
The work shell temperature of laser 303, to prevent condensation vapor.If humidity is between threshold value bound, the work shell of laser 303
Temperature does not adjust.The input current of laser 303 is adjusted to ensure that stable Output optical power according to its work shell temperature.
The present embodiment adjusts work shell temperature and the confession of laser 303 in real time by monitoring the change of humiture in cavity 311
Electric current, the work shell temperature of laser 303 can be not only reduced as far as possible, while be also prevented from condensation vapor and ensure stable output
Luminous power.
Embodiment three
The present embodiment three provides the temprature control method of another semiconductor laser, and the temprature control method employs reality
Apply the combination of example one and embodiment two.
The temprature control method includes the first temp-controled mode and second temperature control model, the first temp-controled mode
Switching is can be chosen between second temperature control model.
Wherein, the first temp-controled mode is temprature control method shown in embodiment one, and second temperature control model is then
Using the temprature control method shown in embodiment two.First temp-controled mode is mainly used in the humiture to application environment
To determine the work shell temperature of laser, the change of ambient temperature and humidity is slower in general, and this method can normal use.
But when in some cases, for example equipment does humiture loop test, ambient temperature and humidity change is very fast.Ambient humidity reduces
When, the humidity in accommodating cavity body is still higher, and now ambient dew point Tra is controlled sharp less than dew point Trc in cavity according to Tra
Light device shell temperature, can cause dew condensation phenomenon.
Therefore, when the temperature in accommodating cavity body and/or humidity are compared to the temperature of semiconductor laser external environment condition and/or wet
Degree is high, and the difference being higher by is equal to or more than setting difference (setting difference can be manually set according to the actual requirements and flexibly), this
When ambient dew point Tra less than dew point Trc in cavity, then second temperature control model is switched to by the first temp-controled mode.Instead
It, then by second temperature control mode switch to the first temp-controled mode.
Second temperature control model adjusts the work of laser in real time using humidity Hac in cavity inner temperature Tac and cavity
Shell temperature and supply current, laser works shell temperature can be not only reduced as far as possible, while be also prevented from condensation vapor in cavity and protect
Demonstrate,prove stable Output optical power.
Example IV
The present embodiment four provides a kind of semiconductor laser, and it includes housing, laser, cooling body, parameter detecting machine
Structure and control circuit.
The housing encloses to form accommodating cavity, and it is probably a part for independently playing housing effect, it is also possible to by
Multiple component combinations are formed, as shown in embodiment one.
The laser is arranged in accommodating cavity body, and cooling body carries out cooling temperature control to laser.Parameter detecting mechanism bag
Temperature sensor and humidity sensor are included, parameter detecting mechanism is provided with the outside of housing and/or accommodating cavity body, to detect
Temperature and humidity in hull outside and/or accommodating cavity body.
Laser, cooling body and parameter detecting mechanism are connected with control circuit respectively, and control circuit is according to parameter detecting
The temperature and humidity signal of mechanism collection, it is determined that the work shell temperature of laser condensation vapor can be prevented, and according to input current, work
Make the functional relation of the gentle optical output power of laser of shell, under ensureing that optical output power of laser is substantially constant, calculate current
Input current corresponding to the shell temperature that works, and laser is adjusted with this input current.
Further, the parameter detecting mechanism for being arranged on hull outside is the first parameter detecting mechanism, control circuit according to
The temperature and humidity of first parameter detecting mechanism collection determines ambient dew point temperature, and by the gentle cooler of work shell of laser
The temperature controlling point of structure is arranged to equal and is greater than or equal to ambient dew point temperature.Specific control process refers to the institute of embodiment one
State.
Further, the parameter detecting mechanism being arranged in accommodating cavity body is the second parameter detecting mechanism, and control circuit will
Temperature controlling point of the temperature as the gentle cooling body of initialization shell of laser of second parameter detecting mechanism collection, and according to the
The humidity adjustment gentle temperature controlling point of work shell of two parameter detecting mechanisms collection.Specific control process refers to the institute of embodiment two
State.
Wherein it is possible to preset the upper threshold and bottom threshold of humidity in cavity, when humidity ＜ bottom thresholds, then set
New temperature controlling point=current temperature controlling point-T_step, new work shell temperature=new temperature controlling point are put, and redefines input current；When wet
＞ upper thresholds are spent, then new temperature controlling point=current temperature controlling point+T_step is set, new work shell temperature=new temperature controlling point, and again
Determine input current；When bottom threshold ＜ humidity ＜ upper thresholds, then present input current is kept；Wherein, T_step represents temperature
Spend the step-length of regulation.Specific control process is referred to described in embodiment two.
Above content is to combine specific embodiment further description made for the present invention, it is impossible to assert this hair
Bright specific implementation is confined to these explanations.For general technical staff of the technical field of the invention, do not taking off
On the premise of from present inventive concept, some simple deduction or replace can also be made.
Claims (14)
- A kind of 1. temprature control method of semiconductor laser, it is characterised in that the semiconductor laser has accommodating cavity, Laser and the cooling body for being cooled down to laser are housed in the accommodating cavity body；The temprature control method includes the first temp-controled mode, and first temp-controled mode includes step：External data gathers：Gather the temperature and humidity of semiconductor laser external environment condition；Calculate dew-point temperature：Ambient dew point temperature is calculated according to the temperature and humidity of collection；Temperature setting：The work shell temperature of laser is determined according to ambient dew point temperature, the work shell temperature is greater than or equal to environment Dew-point temperature；And the temperature controlling point of cooling body is arranged to equal with work shell temperature；Determine input current：According to the functional relation of input current and the work gentle optical output power of laser of shell, ensure laser Device Output optical power is substantially constant, calculates input current corresponding to work at present shell temperature；Adjust input current：According to electric current corresponding to the input current value calculated to laser input.
- 2. temprature control method as claimed in claim 1, it is characterised in that in temperature setting step, by cooling body Temperature controlling point is compared with the work shell temperature that this step determines, such as temperature controlling point=work shell temperature, then into next step；Such as temperature control The value of temperature controlling point, then be arranged to the value of work shell temperature by point ≠ work shell temperature, and enters next step.
- 3. temprature control method as claimed in claim 1, it is characterised in that after the completion of input current step is adjusted, interval Setting time, return to external data acquisition step.
- 4. the temprature control method as described in claim any one of 1-3, it is characterised in that the temprature control method also includes Second temperature control model, switching is can be chosen between first temp-controled mode and second temperature control model；Institute Stating second temperature control model includes step：Cavity inner temperature gathers：Gather the temperature in the space in accommodating cavity body around laser；Temperature setting：The work shell temperature of laser is determined according to the cavity inner temperature of collection, the work shell temperature is equal to or higher than The cavity inner temperature, and cooling body temperature controlling point is equal to the cavity inner temperature；Determine input current：According to the functional relation of input current and the work gentle optical output power of laser of shell, ensure laser Device Output optical power is substantially constant, calculates input current corresponding to work at present shell temperature；Humidity collection in cavity：Gather the humidity in the space in accommodating cavity body around laser；Temperature adjusts：Work shell temperature is determined according to humidity in the cavity of collection, and after adjusting temperature controlling point, returns and determines input current Step.
- 5. temprature control method as claimed in claim 4, it is characterised in that in temperature adjustment, preset wet in cavity The upper threshold and bottom threshold of degree, when humidity ＜ bottom thresholds in cavity, then new temperature controlling point=current temperature controlling point-the first is set Step-length, new work shell temperature=new temperature controlling point, and input current step is returned, input current is calculated according to new work shell temperature； When humidity ＞ upper thresholds in cavity, then new temperature controlling point=current step-length of temperature controlling point+the first, new work shell temperature=new control are set Warm spot, and input current step is returned, input current is calculated according to new work shell temperature；As humidity ＜ in bottom threshold ＜ cavitys Upper threshold, then return to input current step；Wherein, the first step-length represents the step-length of temperature adjustment.
- 6. temprature control method as claimed in claim 5, it is characterised in that the value of first step-length is with the rise of humidity And reduce.
- 7. temprature control method as claimed in claim 4, it is characterised in that when the temperature in accommodating cavity body and/or humidity phase It is higher than the temperature and/or humidity of semiconductor laser external environment condition, and the difference being higher by is equal to or more than setting difference, then by the One temp-controled mode is switched to second temperature control model.
- A kind of 8. temprature control method of semiconductor laser, it is characterised in that the semiconductor laser has accommodating cavity, Laser and the cooling body for being cooled down to laser are housed in the accommodating cavity body；The temprature control method includes step：Cavity inner temperature gathers：Gather the temperature in the space in accommodating cavity body around laser；Temperature setting：The work shell temperature of laser is determined according to the cavity inner temperature of collection, the work shell temperature is equal to or higher than Cavity inner temperature, and the temperature controlling point of cooling body is equal to cavity inner temperature；Determine input current：According to the functional relation of input current and the work gentle optical output power of laser of shell, ensure laser Device Output optical power is substantially constant, calculates input current corresponding to work at present shell temperature；Humidity collection in cavity：Gather the humidity in the space in accommodating cavity body around laser；Temperature adjusts：Work shell temperature is determined according to the humidity of collection, and after adjusting temperature controlling point, returns and determines input current step.
- 9. temprature control method as claimed in claim 8, it is characterised in that in temperature adjustment, preset wet in cavity The upper threshold and bottom threshold of degree, when humidity ＜ bottom thresholds in cavity, then new temperature controlling point=current temperature controlling point-the first is set Step-length, new work shell temperature=new temperature controlling point, and input current step is returned, input current is calculated according to new work shell temperature； When humidity ＞ upper thresholds in cavity, then new temperature controlling point=current step-length of temperature controlling point+the first, new work shell temperature=new control are set Warm spot, and input current step is returned, input current is calculated according to new work shell temperature；As humidity ＜ in bottom threshold ＜ cavitys Upper threshold, then return to input current step；Wherein, the first step-length represents the step-length of temperature adjustment.
- 10. temprature control method as claimed in claim 9, it is characterised in that the value of first step-length is with the liter of humidity It is high and reduce.
- A kind of 11. semiconductor laser, it is characterised in that including：Housing, the housing enclose to form accommodating cavity；Laser, the laser are arranged in accommodating cavity body；Cooling body, the cooling body carry out cooling temperature control to laser；Parameter detecting mechanism, the parameter detecting mechanism includes temperature sensor and humidity sensor, in the outside of the housing And/or it is provided with the parameter detecting mechanism in accommodating cavity body；And control circuit, the laser, cooling body and parameter detecting mechanism are connected with control circuit respectively, the control The temperature and humidity signal that circuit gathers according to parameter detecting mechanism, it is determined that the work shell temperature of laser condensation vapor can be prevented, And according to the functional relation of input current, the gentle optical output power of laser of shell that works, ensure optical output power of laser substantially Under stable, input current corresponding to work at present shell temperature is calculated, and laser is adjusted with this input current.
- 12. semiconductor laser as claimed in claim 11, it is characterised in that be arranged on the parameter detecting mechanism of hull outside For the first parameter detecting mechanism, the temperature and humidity that the control circuit gathers according to the first parameter detecting mechanism determines that environment reveals Point temperature, and the temperature controlling point of the gentle cooling body of work shell of laser is arranged to equal and is greater than or equal to ambient dew point temperature Degree.
- 13. semiconductor laser as claimed in claim 11, it is characterised in that the parameter detecting machine being arranged in accommodating cavity body Structure is the second parameter detecting mechanism, and the temperature that the control circuit gathers the second parameter detecting mechanism is as the initial of laser The temperature controlling point of the work gentle cooling body of shell, and the humidity gathered according to the second parameter detecting mechanism adjusts the gentle temperature control of work shell Point.
- 14. semiconductor laser as claimed in claim 13, it is characterised in that preset the upper threshold of humidity in cavity And bottom threshold, when humidity ＜ bottom thresholds, then new temperature controlling point=current step-length of temperature controlling point-the first, new work shell temperature are set =new temperature controlling point, and redefine input current；When humidity ＞ upper thresholds in cavity, then new temperature controlling point=current temperature control is set The step-length of point+the first, new work shell temperature=new temperature controlling point, and redefine input current；When bottom threshold ＜ humidity ＜ threshold values The upper limit, then keep present input current；Wherein, the first step-length represents the step-length of temperature adjustment.
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| PCT/CN2017/084839 WO2018006657A1 (en) | 2016-07-04 | 2017-05-18 | Semiconductor laser and temperature control method therefor |
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| CN111462707A (en) * | 2020-04-27 | 2020-07-28 | 北京航空航天大学 | Modeling compensation-based temperature drift suppression method for liquid crystal power stabilizing system |
| JP2020177990A (en) * | 2019-04-16 | 2020-10-29 | パナソニックＩｐマネジメント株式会社 | Laser device and laser processing apparatus using the same |
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| CN107579429B (en) | 2020-12-04 |
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