CN107579016A - A kind of interdigitated test structure - Google Patents
A kind of interdigitated test structure Download PDFInfo
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- CN107579016A CN107579016A CN201710772516.1A CN201710772516A CN107579016A CN 107579016 A CN107579016 A CN 107579016A CN 201710772516 A CN201710772516 A CN 201710772516A CN 107579016 A CN107579016 A CN 107579016A
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- metal wire
- wire structure
- metal
- interdigitated
- test structure
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Abstract
The invention discloses a kind of interdigitated test structure, including：The multiple metal structures being oppositely arranged in a first direction；Wherein, the metal structure includes：First metal wire structure；A plurality of second metal wire structure being connected is vertically arranged with first metal wire structure；The 3rd metal wire structure being arranged between adjacent two articles of second metal wire structures；3rd metal wire structure is arranged successively between the short metal wire of predetermined number according to pre-determined distance, and arragement direction is perpendicular to first metal wire structure；It is not connected between 3rd metal wire structure and first metal wire structure and second metal wire structure；It is connected with each other between first metal wire structure in said first direction；It is connected with each other between the adjacent short metal wire in the 3rd metal wire structure in said first direction.The interdigitated test structure can be accurately positioned the position of failpoint.
Description
Technical field
The present invention relates to reliability of technology monitoring technology field, and more specifically, more particularly to a kind of test of interdigitated is tied
Structure.
Background technology
With the continuous development of scientific technology, semiconductor devices be widely used in daily life, work and
In industry, in semiconductor processing, interdigitated test structure is used for reliability of technology monitoring and the monitoring of failpoint.
Existing interdigitated test structure is by applying voltage detecting electric current, using OBIRCH (Optical Beam
Induced Resistance Change, photoinduction resistance variations) and EMMI (Emission Microscope, low-light show
Micro mirror) instrument catches the mode of focus, position the position of failpoint.
But existing interdigitated test structure, the position range of failpoint can only be substantially oriented, can not essence
It is determined that the position of position failpoint.
The content of the invention
To solve the above problems, the invention provides a kind of interdigitated test structure, the interdigitated test structure can essence
It is determined that the position of position failpoint.
To achieve the above object, the present invention provides following technical scheme：
A kind of interdigitated test structure, the interdigitated test structure include：What is be oppositely arranged in a first direction is multiple
Metal structure；
Wherein, the metal structure includes：First metal wire structure；It is vertically arranged and is connected with first metal wire structure
A plurality of second metal wire structure；The 3rd metal wire structure being arranged between adjacent two articles of second metal wire structures；Institute
State the 3rd metal wire structure to be arranged successively according to pre-determined distance between the short metal wire of predetermined number, and arragement direction hangs down
Directly in first metal wire structure；3rd metal wire structure and first metal wire structure and second metal
It is not connected between cable architecture；
It is connected with each other between first metal wire structure in said first direction；Institute in said first direction
State and be connected with each other between the adjacent short metal wire in the 3rd metal wire structure.
Preferably, in above-mentioned interdigitated test structure, in said first direction in the 3rd metal wire structure
Both ends are attached respectively between adjacent short metal wire.
Preferably, in above-mentioned interdigitated test structure, first metal wire structure, second metal wire structure with
And the 3rd metal wire structure relative position immobilizes.
Preferably, in above-mentioned interdigitated test structure, between the multiple metal structures being oppositely arranged in a first direction
Distance meet preparatory condition, and relative position immobilizes.
Preferably, in above-mentioned interdigitated test structure, the first metal wire structure grounding connection.
Preferably, in above-mentioned interdigitated test structure, the distance between adjacent two described second metal wire structures phase
Deng.
Preferably, in above-mentioned interdigitated test structure, the 3rd metal wire structure is located at adjacent two articles described second
The middle position of metal wire structure.
Preferably, in above-mentioned interdigitated test structure, the quantity of second metal wire structure is 20 to 100.
Preferably, in above-mentioned interdigitated test structure, the pre-determined distance between the short metal wire is 40nm-200nm.
By foregoing description, interdigitated test structure provided by the invention includes：It is oppositely arranged in a first direction
Multiple metal structures；
Wherein, the metal structure includes：First metal wire structure；It is vertically arranged and is connected with first metal wire structure
A plurality of second metal wire structure；The 3rd metal wire structure being arranged between adjacent two articles of second metal wire structures；Institute
State the 3rd metal wire structure to be arranged successively according to pre-determined distance between the short metal wire of predetermined number, and arragement direction hangs down
Directly in first metal wire structure；3rd metal wire structure and first metal wire structure and second metal
It is not connected between cable architecture；
It is connected with each other between first metal wire structure in said first direction；Institute in said first direction
State and be connected with each other between the 3rd metal wire structure.
It follows that the 3rd metal wire structure that the interdigitated test structure is made up of setting multiple short metal wires,
And be not connected between the first metal wire structure and the second metal wire structure, in floating state；After the completion of test, lead to
Cross the first metal wire structure grounding connection, based on voltage contrast principle, under a scanning electron microscope, the first metal wire structure
Bright contrast is presented with the second metal wire structure, under normal circumstances when, because the short metal wire in the 3rd metal structure is in floating
The contrast of dull gray will be presented in configuration state, occur bursting when the part between the 3rd metal wire structure and the second metal wire structure or
The attachment structure of the interdigitated test structure causes the short metal wire in the 3rd metal wire structure to be turned on the second metal wire structure,
The short metal wire now turned on is no longer on floating state, also indirect earthed to show bright contrast, not with the second metal knot
The short metal wire of structure conducting still shows the contrast of dull gray.That is, the short metal wire turned on the second metal wire structure
Part is failpoint position, compares and determines the approximate range of failpoint in the prior art, the interdigitated test structure is more
Add the position for being accurately positioned out failpoint.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
The embodiment of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
The accompanying drawing of offer obtains other accompanying drawings.
Fig. 1 is a kind of top view of interdigitated test structure of the prior art；
Fig. 2 is a kind of schematic top plan view of interdigitated test structure provided in an embodiment of the present invention；
Fig. 3 is the first metal wire structure and the second metal knot of a kind of interdigitated configuration provided in an embodiment of the present invention
The side view of structure；
Fig. 4 is a kind of side view of the 3rd metal wire structure of interdigitated configuration provided in an embodiment of the present invention；
Fig. 5 is that a kind of principle of interdigitated test structure when failpoint be present provided in an embodiment of the present invention overlooks signal
Figure；
Fig. 6 provides a kind of side view for connecting the 3rd metal wire structure for the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
With reference to figure 1, Fig. 1 is a kind of top view of interdigitated test structure of the prior art.
As shown in figure 1, in the interdigitated test structure, pass through the two metal line structure C ombA in upper and lower horizontal direction
And apply voltage on CombB, detect the electric current of interdigitated test structure, using OBIRCH (photoinduction resistance variations) and
EMMI (Emission Microscope, low-light microscope) instrument catches the mode of focus, positions the position of failpoint.
When not having disabling portion, CombA interdigitated configuration and CombB interdigitated configuration do not have electric current；When perpendicular
Nogata bursts conducting between metal wire structure due to that can not bear enough voltage, or vertical direction metal wire structure it
Between exist particle cause vertical direction metal wire structure connect conducting cause to fail, by OBIRCH using laser irradiation trigger
The different change of electric current, can only substantially orient the position range of failpoint, failpoint can not be accurately positioned
Position.
Also, it is difficult the position range for capturing failpoint in the case of low current when application voltage is too small；It is electric when applying
When pressing through big, the region between the metal wire structure and metal wire structure of conducting can be damaged.
Based on above mentioned problem, in order to facilitate the understanding of the purposes, features and advantages of the present invention, with reference to
The present invention is further detailed explanation for the drawings and specific embodiments.
With reference to figure 2, Fig. 2 is a kind of schematic top plan view of interdigitated test structure provided in an embodiment of the present invention.
The interdigitated test structure includes：The multiple metal structures 21 being oppositely arranged in a first direction；
Wherein, the metal structure 21 includes：First metal wire structure 22；It is vertical with first metal wire structure 22 to set
Put a plurality of second metal wire structure 23 of connection；The 3rd metal being arranged between adjacent two articles of second metal wire structures 23
Cable architecture 24；3rd metal wire structure 24 is arranged successively between the short metal wire of predetermined number according to pre-determined distance
Cloth, and arragement direction is perpendicular to first metal wire structure 22；3rd metal wire structure 24 and first metal wire
It is not connected between structure 22 and second metal wire structure 23；
It is connected with each other between first metal wire structure 22 in said first direction；In said first direction
It is connected with each other between adjacent short metal wire in 3rd metal wire structure 24.
That is, with reference to figure 3, Fig. 3 is a kind of the first metal knot of interdigitated configuration provided in an embodiment of the present invention
The side view of structure and the second metal wire structure.As shown in figure 3, between multiple metal wire structures 21 it is corresponding in a first direction
Upper stack is set, also, is connected with each other between the first adjacent metal wire structure 22 on first direction, and turns on, the connection
The relative position that measure is additionally operable to fix between the first metal wire structure 22 on first direction does not change.
Corresponding, with reference to figure 4, Fig. 4 is a kind of the 3rd metal knot of interdigitated configuration provided in an embodiment of the present invention
The side view of structure.As shown in figure 4, due to being respectively provided be made up of short metal wire between any two article of second metal wire structure 23
Three metal wire structures 24, then in a first direction, be also mutually attached, and turn on, the company between adjacent short metal wire
The relative position that measure is also additionally operable to fix between the short metal wire on first direction is connect not change.
It should be noted that because short metal wire has certain length, it is necessary to by short metal wire adjacent on first direction
Between both ends be attached respectively.
In embodiments of the present invention, the interdigitated test structure is by setting the 3rd metal being made up of multiple short metal wires
Cable architecture, and be not connected between the first metal wire structure and the second metal wire structure, in floating state；When having tested
Cheng Hou, by by the first metal wire structure grounding connection, based on voltage contrast principle, under a scanning electron microscope, such as Fig. 2 institutes
Show, bright contrast is presented in the first metal wire structure 22 and the second metal wire structure 23, under normal circumstances when, due to the 3rd metal knot
Short metal wire in structure 24, which is in floating state, will be presented the contrast of dull gray, as shown in figure 5, when the 3rd metal wire structure 24 and the
Bursting occurs in part between two metal wire structures 23 or the attachment structure of the interdigitated test structure causes the 3rd metal wire
Short metal wire in structure 24 turns on the second metal wire structure 23, and the short metal wire now turned on is no longer on floating state,
Also it is indirect earthed to show bright contrast, the lining of dull gray is not still showed with the short metal wire of the second metal wire structure 23 conducting
Degree.That is, the short metal line portions turned on the second metal wire structure 23 are failpoint position, compare prior art
In determine the approximate range of failpoint, the interdigitated test structure has more been accurately positioned out the position of failpoint.
Based on the above embodiment of the present invention, in an alternative embodiment of the invention, adjacent two second metal wire structures
The distance between 23 is equal, that is to say, that and the second metal wire structure 23 is uniformly arranged in the first metal wire structure 22, and
The distance is configured according to the resistance to pressure request of test, is not limited in embodiments of the present invention.
Similarly, the distance between multiple metal structures 21 being oppositely arranged in a first direction meet preparatory condition, and phase
Position is immobilized；That is, as shown in figure 3, in a first direction, distance between the first adjacent metal wire structure 22
Meet preparatory condition, and relative position immobilizes.
Based on the above embodiment of the present invention, in an alternative embodiment of the invention, the 3rd metal wire structure 24 is located at phase
The middle position of adjacent two second metal wire structures 23.That is, ensure the short metal wire in the 3rd metal wire structure
It is identical with the distance of the second metal wire structure of both sides, further improve the measuring accuracy of interdigitated test structure.
Preferably, in embodiments of the present invention, the quantity of second metal wire structure 23 is 20 to 100.
Preferably, in embodiments of the present invention, the short metal wire arrangement in the 3rd metal wire structure 24 it is default away from
From for 40nm-200nm.
It should be noted that in embodiments of the present invention, the quantity of the first metal wire structure 22, the second metal wire in accompanying drawing
The quantity of structure 23, the quantity of short metal wire in the 3rd metal wire structure 24 only illustrate by way of example, not
It is construed as limiting.
With reference to figure 6, Fig. 6 provides a kind of side view for connecting the 3rd metal wire structure for the embodiment of the present invention.The present invention carries
A kind of interdigitated test structure supplied, it is necessary to the 3rd metal knot by the superiors on first direction when carrying out failpoint test
Connected between adjacent short metal wire in structure.
As shown in fig. 6, by the form of short metal wire by the adjacent short metal in the 3rd metal wire structure of the superiors
Connected between line, apply voltage on short metal wire 61, for providing test voltage for the 3rd metal wire structure.
Preferably, by the 3rd metal wire structure in any two article of second metal wire structure as shown in fig. 6, being connected
Connect, and each short metal wire 61 be connected in a metal line, by give a metal line apply voltage, for for this
Whole 3rd metal wire structure of interdigitated test structure provides test voltage.
After the completion of testing failpoint, when being positioned to failpoint, the connected mode is removed.
It should be noted that the connected mode only illustrates by way of example in embodiments of the present invention, not
It is construed as limiting.
Based on the above-mentioned whole embodiments of the present invention, a kind of interdigitated test structure provided by the invention, by setting by more
The 3rd metal wire structure that individual short metal wire is formed, and do not connect between the first metal wire structure and the second metal wire structure
Connect, in floating state；After the completion of test, by by the first metal wire structure grounding connection, based on voltage contrast principle,
Under SEM, bright contrast is presented in the first metal wire structure and the second metal wire structure, under normal circumstances when, due to
Short metal wire in 3rd metal structure is in the contrast that dull gray will be presented in floating state, when the 3rd metal wire structure and the second gold medal
Part between category cable architecture occurs bursting or the attachment structure of the interdigitated test structure causes in the 3rd metal wire structure
Short metal wire turned on the second metal wire structure, the short metal wire now turned on is no longer on floating state, also indirect earthed
Bright contrast is showed, the short metal wire not turned on the second metal wire structure still shows the contrast of dull gray.That is,
The short metal line portions turned on the second metal wire structure are failpoint position, compare and determine failpoint in the prior art
Approximate range, the interdigitated test structure has more been accurately positioned out the position of failpoint.
The foregoing description of the disclosed embodiments, professional and technical personnel in the field are enable to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (9)
1. a kind of interdigitated test structure, it is characterised in that the interdigitated test structure includes：It is relative in a first direction to set
The multiple metal structures put；
Wherein, the metal structure includes：First metal wire structure；Be vertically arranged with first metal wire structure be connected it is more
The metal wire structure of bar second；The 3rd metal wire structure being arranged between adjacent two articles of second metal wire structures；Described
Three metal wire structures for predetermined number short metal wire between arranged successively according to pre-determined distance, and arragement direction perpendicular to
First metal wire structure；3rd metal wire structure and first metal wire structure and the second metal knot
It is not connected between structure；
It is connected with each other between first metal wire structure in said first direction；In said first direction described
It is connected with each other between adjacent short metal wire in three metal wire structures.
2. interdigitated test structure according to claim 1, it is characterised in that the 3rd gold medal in said first direction
Both ends are attached respectively between adjacent short metal wire in category cable architecture.
3. interdigitated test structure according to claim 1, it is characterised in that first metal wire structure, described
Two metal wire structures and the 3rd metal wire structure relative position immobilize.
4. interdigitated test structure according to claim 1, it is characterised in that what is be oppositely arranged in a first direction is multiple
The distance between metal structure meets preparatory condition, and relative position immobilizes.
5. interdigitated test structure according to claim 1, it is characterised in that the first metal wire structure ground connection connects
Connect.
6. interdigitated test structure according to claim 1, it is characterised in that adjacent two second metal wire structures
The distance between it is equal.
7. interdigitated test structure according to claim 1, it is characterised in that the 3rd metal wire structure is positioned at adjacent
The middle position of two second metal wire structures.
8. interdigitated test structure according to claim 1, it is characterised in that the quantity of second metal wire structure is
20 to 100.
9. interdigitated test structure according to claim 1, it is characterised in that the pre-determined distance between the short metal wire
For 40nm-200nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710772516.1A CN107579016B (en) | 2017-08-31 | 2017-08-31 | A kind of interdigitated test structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710772516.1A CN107579016B (en) | 2017-08-31 | 2017-08-31 | A kind of interdigitated test structure |
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| Publication Number | Publication Date |
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| CN107579016A true CN107579016A (en) | 2018-01-12 |
| CN107579016B CN107579016B (en) | 2018-09-14 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7592827B1 (en) * | 2007-01-12 | 2009-09-22 | Pdf Solutions, Inc. | Apparatus and method for electrical detection and localization of shorts in metal interconnect lines |
| US7772590B2 (en) * | 2007-03-05 | 2010-08-10 | Systems On Silicon Manufacturing Co. Pte. Ltd. | Metal comb structures, methods for their fabrication and failure analysis |
| US20110037493A1 (en) * | 2009-08-12 | 2011-02-17 | International Business Machines Corporation | Probe-able voltage contrast test structures |
| CN104282594A (en) * | 2014-10-20 | 2015-01-14 | 武汉新芯集成电路制造有限公司 | Test structure for monitoring performance of dielectric layers |
| US20160291084A1 (en) * | 2015-03-30 | 2016-10-06 | Globalfoundries Inc. | Via leakage and breakdown testing |
-
2017
- 2017-08-31 CN CN201710772516.1A patent/CN107579016B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7592827B1 (en) * | 2007-01-12 | 2009-09-22 | Pdf Solutions, Inc. | Apparatus and method for electrical detection and localization of shorts in metal interconnect lines |
| US7772590B2 (en) * | 2007-03-05 | 2010-08-10 | Systems On Silicon Manufacturing Co. Pte. Ltd. | Metal comb structures, methods for their fabrication and failure analysis |
| US20110037493A1 (en) * | 2009-08-12 | 2011-02-17 | International Business Machines Corporation | Probe-able voltage contrast test structures |
| CN104282594A (en) * | 2014-10-20 | 2015-01-14 | 武汉新芯集成电路制造有限公司 | Test structure for monitoring performance of dielectric layers |
| US20160291084A1 (en) * | 2015-03-30 | 2016-10-06 | Globalfoundries Inc. | Via leakage and breakdown testing |
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| Publication number | Publication date |
|---|---|
| CN107579016B (en) | 2018-09-14 |
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