CN107576165A - Chip drying system and chip load plate - Google Patents
Chip drying system and chip load plate Download PDFInfo
- Publication number
- CN107576165A CN107576165A CN201710947094.7A CN201710947094A CN107576165A CN 107576165 A CN107576165 A CN 107576165A CN 201710947094 A CN201710947094 A CN 201710947094A CN 107576165 A CN107576165 A CN 107576165A
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- chip
- side wall
- load plate
- drying system
- bottom wall
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Abstract
The invention discloses a kind of chip drying system and chip load plate, its chips drying system includes：Pallet；The chip load plate being arranged in the pallet, the chip load plate includes bottom wall and side wall, the bottom wall forms accommodation space with the side wall, supporting construction is provided with the accommodation space, chip is placed in the supporting construction and cavity is formed between the bottom wall, has gap between the chip sides and side wall；The drying unit dried to the chip, it is arranged on the surface of the pallet.The cavity of the present invention can ensure well-ventilated during chip is dried, and do not allow the globule to assemble, have good drying effect.
Description
Technical field
The present invention relates to chip drying technology field, is carried more particularly to a kind of chip drying system and chip
Disk.
Background technology
ITO is substituted to manufacture transparent conductive film in LED industry be a kind of trend by ZnO at present, and ZnO film chemistry humidifying
Etching phase has the advantages that technique is simple, cost is low, yield is high and etch by-products easily exclude for dry etching, more excellent
Gesture.LED chip is performed etching after ZnO film is deposited, using etching liquid to ZnO film, then through deionized water soaking and washing, cleaning
Afterwards due to the effect of LED chip surface tension, LED chip surface can remain a layer of water drops, therefore carry out drying to LED chip and be
Extremely it is necessary.
The content of the invention
The technical problem to be solved in the present invention is the chip drying system and chip load plate of a kind of good drying effect.
The technical scheme is that：A kind of chip drying system is provided, including：
Pallet；
The multiple chip load plates being arranged in the pallet, each chip load plate include bottom wall and side wall, the bottom wall with it is described
Side wall forms accommodation space, is provided with supporting construction in the accommodation space, chip be placed in the supporting construction and with institute
State and form cavity between bottom wall, there is gap between the chip sides and side wall；
The drying unit dried to the chip, it is arranged on the surface of the pallet.
The supporting construction is the multiple support blocks being uniformly arranged in accommodation space.
The multiple support block is connected with bottom wall and side wall simultaneously respectively.
The multiple support block is in bar shaped, and is extended towards the center of the accommodation space.
The rhone of multiple and accommodation space and chip load plate ft connection is provided with the side wall.
The drying unit is warm-air drier.
Air intake filter is provided with the warm-air drier.
The warm-air drier quantity is two.
The present invention also provides a kind of chip load plate, and the chip load plate includes bottom wall and side wall, the bottom wall and the side
Wall forms accommodation space, is evenly arranged with supporting construction in the accommodation space, chip is by being placed in the supporting construction
Cavity is formed between the bottom wall, and there is gap between the chip sides and side wall.
The rhone of multiple and accommodation space and chip load plate ft connection is provided with the side wall.
Chips of the present invention are placed on the support structure and form sky between bottom wall, what the cavity was dried in chip
During can ensure well-ventilated, do not allow the globule to assemble, there is good drying effect.
Brief description of the drawings
Fig. 1 is chips drying system structure chart of the embodiment of the present invention.
Fig. 2 is the schematic diagram that chips load plate of the embodiment of the present invention is positioned in pallet.
Fig. 3 is chips carrying disc structure figure of the embodiment of the present invention.
Embodiment
Such as Fig. 1 and Fig. 2, the chip drying system that is proposed in the embodiment of the present invention, including pallet 10, chip load plate 20 and dry
Equipment for drying 30, pallet 10 are square, and pallet 10 includes bottom plate and is vertically set on the side plate of bottom plate surrounding, and side plate is formed with bottom plate
Dry the drying area of chip, a length of 400mm of drying area, a width of 250mm.The quantity of chip load plate 20 is multiple, this reality
A quantity of chips load plate 20 is applied as 24, this 24 chip load plates are uniformly arranged in the baking zone of pallet 10
In domain.
Such as Fig. 2 and Fig. 3, chip load plate 20 includes bottom wall 21 and side wall 22, and bottom wall 21 forms accommodation space with side wall 22, holds
Supporting construction is provided with being empty, supporting construction is used for supporting chip and making to form cavity between chip and bottom wall, chip side
There is gap between face and side wall.Supporting construction is the multiple support blocks 23 being uniformly arranged in accommodation space in the present embodiment
（With reference to figure 3）, chip 40 is placed in multiple support blocks 23 so that can have spacing between chip 40 and bottom wall, so as to be formed
Cavity, the cavity can ensure well-ventilated, not allow the globule to assemble have drying well during chip is dried
Effect.
Such as Fig. 3, the present embodiment chips load plate 20 is circle, and support block 23 is in bar shaped, and support number of blocks is three, and this three
Individual support block is connected with bottom wall and side wall simultaneously respectively, can also be positioned only on bottom wall or in side wall.Moreover, these three are propped up
Bracer extends towards the center of accommodation space, connecting line and the branch at the center of one of support block and the center of accommodation space
Angle between the connecting line at the center of another adjacent support block of bracer and the center of accommodation space is 120 degree.Three branch
The centre on the surface that bracer 23 contacts with chip caves inward to form recess 231.
Two vias of screw 211 are provided with the bottom wall of the present embodiment chips load plate, screw is located in screw via
Chip load plate is fixed in pallet.
Such as Fig. 1, drying unit 30 is arranged on the surface of pallet 10, for being carried out to the chip being positioned in drying area
Drying.Because temperature can not be too high in chip drying course, and simple heat can not be leaned on to dry chip, while in order to
It is smooth with heat exchange to ensure that all chips are heated evenly, preferably drying unit is warm-air drier, and hot blast band is provided by warm-air drier
Walk moisture.Warm-air drier quantity can be two, three or four, be two in the present embodiment.Also to ensure that wind regime is clean
Cleanliness, air intake filter 50 is provided with each warm-air drier.Warm-air drier controls PTC heating-up temperatures by temperature sensor.
In drying course, the moisture of chip upper surface hot blast can directly be taken away caused by warm-air drier, due to having the presence of cavity, hot blast
The moisture of chip lower surface is taken away in into cavity.
Such as Fig. 3, multiple drainings with accommodation space and chip load plate ft connection are provided with the side wall 22 of chip load plate
Groove 24, by rhone 24 excessive moisture of the chip in drying course can be made to flow to outside chip load plate.
Supporting construction can also be the multiple support columns being uniformly arranged on bottom wall in the present invention, the cross section shape of support column
Shape is circular or square.
The chip drying system is installed on the flowing water line procedures of ZnO film humidifying etching apparatus, does not influence the normal of equipment
Process flow and activity time.It must assure that the chip in baking zone is dried completely in drying course, but temperature can not be too high,
Time can not be oversize, and within 6 minutes, drying temperature is less than 80 DEG C for all chip drying time controls.
Specific embodiment above is only to illustrate the design of the present invention, and one of ordinary skill in the art is in this hair
Various deformation and change can be made under bright design, these deformations and change are included within protection scope of the present invention.
Claims (10)
- A kind of 1. chip drying system, it is characterised in that including：Pallet；The multiple chip load plates being arranged in the pallet, each chip load plate include bottom wall and side wall, the bottom wall with it is described Side wall forms accommodation space, is provided with supporting construction in the accommodation space, chip be placed in the supporting construction and with institute State and form cavity between bottom wall, there is gap between the chip sides and side wall；The drying unit dried to the chip, it is arranged on the surface of the pallet.
- 2. chip drying system according to claim 1, it is characterised in that the supporting construction is accommodating to be uniformly arranged on Multiple support blocks in space.
- 3. chip drying system according to claim 2, it is characterised in that the multiple support block respectively simultaneously and bottom wall It is connected with side wall.
- 4. chip drying system according to claim 3, it is characterised in that the multiple support block is in bar shaped, and court Extend to the center of the accommodation space.
- 5. chip drying system according to claim 1, it is characterised in that be provided with the side wall multiple with housing sky Between and chip load plate ft connection rhone.
- 6. chip drying system according to any one of claim 1 to 5, it is characterised in that the drying unit is warm Blower fan.
- 7. chip drying system according to claim 6, it is characterised in that air intake filtering is provided with the warm-air drier Device.
- 8. chip drying system according to claim 6, it is characterised in that the warm-air drier quantity is two.
- 9. a kind of chip load plate, it is characterised in that the chip load plate includes bottom wall and side wall, the bottom wall and the side wall shape Into accommodation space, supporting construction is evenly arranged with the accommodation space, chip is by being placed in the supporting construction and institute State and form cavity between bottom wall, and there is gap between the chip sides and side wall.
- 10. chip load plate according to claim 9, it is characterised in that multiple and accommodation space is provided with the side wall With the rhone of chip load plate ft connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710947094.7A CN107576165A (en) | 2017-10-12 | 2017-10-12 | Chip drying system and chip load plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710947094.7A CN107576165A (en) | 2017-10-12 | 2017-10-12 | Chip drying system and chip load plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107576165A true CN107576165A (en) | 2018-01-12 |
Family
ID=61037208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710947094.7A Pending CN107576165A (en) | 2017-10-12 | 2017-10-12 | Chip drying system and chip load plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107576165A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203478848U (en) * | 2013-05-20 | 2014-03-12 | 豪威半导体（上海）有限责任公司 | Tray and chip drying system |
| CN204177143U (en) * | 2014-09-24 | 2015-02-25 | 中华全国供销合作总社昆明食用菌研究所 | A kind of portable Quick-air-drying device |
| CN105775325A (en) * | 2014-12-13 | 2016-07-20 | 西安宝莱特光电科技有限公司 | Anti-deformation spin-coating tray with discontinuous step part |
| CN107062833A (en) * | 2017-05-10 | 2017-08-18 | 黄勇 | A kind of crop seeds drying device |
| CN207439045U (en) * | 2017-10-12 | 2018-06-01 | 深圳市捷佳伟创新能源装备股份有限公司 | Chip drying system and chip load plate |
-
2017
- 2017-10-12 CN CN201710947094.7A patent/CN107576165A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203478848U (en) * | 2013-05-20 | 2014-03-12 | 豪威半导体（上海）有限责任公司 | Tray and chip drying system |
| CN204177143U (en) * | 2014-09-24 | 2015-02-25 | 中华全国供销合作总社昆明食用菌研究所 | A kind of portable Quick-air-drying device |
| CN105775325A (en) * | 2014-12-13 | 2016-07-20 | 西安宝莱特光电科技有限公司 | Anti-deformation spin-coating tray with discontinuous step part |
| CN107062833A (en) * | 2017-05-10 | 2017-08-18 | 黄勇 | A kind of crop seeds drying device |
| CN207439045U (en) * | 2017-10-12 | 2018-06-01 | 深圳市捷佳伟创新能源装备股份有限公司 | Chip drying system and chip load plate |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 518000 D Silicon Valley, Guangdong Province, Longgang, Henggang, Shenzhen No. 89 Ping Ping Road, No. Applicant after: Shenzhen S. C New Energy Equipment Co., Ltd. Address before: 518000 R & D Office of D Silicon Valley, No. 89 Heng Ping highway, Longgang street, Shenzhen, Guangdong. Applicant before: Shenzhen S. C New Energy Equipment Co., Ltd. |