CN107565051A - Display panel, display device and manufacture method - Google Patents
Display panel, display device and manufacture method Download PDFInfo
- Publication number
- CN107565051A CN107565051A CN201710743518.8A CN201710743518A CN107565051A CN 107565051 A CN107565051 A CN 107565051A CN 201710743518 A CN201710743518 A CN 201710743518A CN 107565051 A CN107565051 A CN 107565051A
- Authority
- CN
- China
- Prior art keywords
- substrate
- reflex block
- cover plate
- display panel
- reflex
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the present application discloses a kind of display panel, display device and manufacture method.The display panel includes viewing area and around the encapsulation region of viewing area；Display panel also includes substrate and the cover plate being arranged oppositely with substrate；Wherein, encapsulation region, the surface of cover plate towards substrate are provided with encapsulated layer, encapsulated layer is used for adhesive base plate and cover plate after laser irradiation；In encapsulation region, substrate reduces towards the surface of cover plate formed with multiple reflex blocks, the reflectivity of each reflex block with the increase of the laser intensity of each reflex block present position.The burn-off rate of encapsulated layer that the embodiment can make to be under different laser intensities reaches unanimity, the defects of so as to reduce crackle caused by the stress difference of encapsulation region.The encapsulation adhesion intensity between substrate and cover plate is also contributed to simultaneously, so as to improve the fine ratio of product of display panel.
Description
Technical field
The application is related to display technology field, and in particular to display panel, display device and manufacture method.
Background technology
At present, the encapsulation principle of existing display panel is as follows：Reflecting layer is first formed on substrate, and is formed on the cover board
Encapsulated layer；Then laser irradiation cover plate.Now, reflecting layer can be reflected the laser of incidence, the package material in encapsulated layer
Expect to melt in the presence of laser and the laser of reflection, so as to realize the encapsulation adhesion of substrate and cover plate.
However, the Energy distribution of laser can be considered Gaussian Profile, i.e., the laser in the centre position in Energy distribution region
Energy is high, and the laser energy of two side positions in Energy distribution region is low.On the other hand, in the reflecting layer of display panel, respectively
The reflectivity at place is often identical, and this can make the burn-off rate for the encapsulating material being under different laser energy produce difference,
So as to produce harmful effect to packaging effect.
The content of the invention
In view of drawbacks described above of the prior art, the embodiment of the present application provides a kind of improved display panel, display dress
Put and manufacture method, to solve the technical problem that background section above is mentioned.
In a first aspect, the embodiment of the present application provides a kind of display panel.The display panel includes viewing area and around aobvious
Show the encapsulation region in area；Display panel also includes substrate and the cover plate being arranged oppositely with substrate；Wherein, in encapsulation region, cover plate court
The surface of substrate is provided with encapsulated layer, encapsulated layer is used for adhesive base plate and cover plate after laser irradiation；In encapsulation region, substrate court
To the surface of cover plate formed with multiple reflex blocks, the reflectivity of each reflex block with the laser intensity of each reflex block present position increasing
Add and reduce.
In certain embodiments, each reflex block includes at least one layer of metal level；Different anti-of the laser intensity of present position
The material for penetrating the metal level of the close cover plate of block is different.
In certain embodiments, in same reflection block, the material of each metal level is different, and is provided between adjacent metal
Insulating barrier.
In certain embodiments, insulating barrier has identical material with encapsulated layer, and the material of encapsulated layer includes silicon nitride or two
Silica.
In certain embodiments, the quantity for the metal level that each reflex block includes is identical.
In certain embodiments, in each reflex block, the quantity for the metal level that at least part reflex block is included is different.
In certain embodiments, reflex block comprises at least the first reflex block, the second reflex block and the 3rd reflex block；First is anti-
Penetrate block and include the first metal layer, the second reflex block includes the first metal layer and second metal layer, and the 3rd reflex block includes the first gold medal
Belong to layer, second metal layer and the 3rd metal level；First reflex block, the second reflex block and the 3rd reflex block are alternately arranged in encapsulation region
Row.
In certain embodiments, the material of at least one layer of metal level includes following at least one：Metal molybdenum, metallic aluminium, gold
Category silver or tin indium oxide.
In certain embodiments, display panel also includes the cutting area around encapsulation region, for cutting in substrate and cover plate
Display panel after bonding.
Second aspect, the embodiment of the present application provide a kind of display device, and the display device is included as in first aspect
Display panel described by any embodiment.
The third aspect, the embodiment of the present application provide a kind of manufacture method, and the manufacture method is used to manufacture such as first aspect
In any embodiment described by display panel.The manufacture method includes：One substrate of preparation and a cover plate, wherein, substrate bag
Include viewing area and around the encapsulation region of viewing area；Each functional layer for display is formed in the viewing area of substrate, and in substrate
Encapsulation region forms multiple reflex blocks, and each reflex block includes at least one layer of metal level, wherein, at least one layer of metal level and partial function
Layer is located at same metal level；Encapsulated layer is formed on the cover board, and cover plate and substrate are arranged oppositely, wherein, encapsulated layer and reflection
Block is between cover plate and substrate；Deviate from the surface of substrate in laser irradiation cover plate, so that encapsulated layer fusing adhesive base plate and lid
Plate, wherein, the reflectivity of each reflex block reduces with the increase of the laser intensity of each reflex block present position.
The display panel and manufacture method that the embodiment of the present application provides, by corresponding in surface of the cover plate towards substrate
The position of encapsulation region sets encapsulated layer；And the position corresponding to encapsulation region in surface of the substrate towards cover plate forms multiple reflections
Block；Meanwhile the reflectivity of each reflex block reduces with the increase of the laser intensity of each reflex block present position.So, i.e.,
The encapsulated layer of diverse location is under the laser irradiation of different light intensity, melting for the encapsulating material in these encapsulated layers can also be made
Change speed to reach unanimity, occurred with reducing the situation for making the stress distribution of encapsulated layer uneven because of burn-off rate difference, so as to keep away
The defects of exempting from therefore caused crackle.Further, the display panel and manufacture method that the embodiment of the present application provides contribute to
The encapsulation adhesion intensity between substrate and cover plate is improved, and then improves the fine ratio of product of display panel.
Brief description of the drawings
By reading the detailed description made to non-limiting example made with reference to the following drawings, the application's is other
Feature, objects and advantages will become more apparent upon：
Fig. 1 is the structural representation of existing display panel；
Fig. 2 is a kind of structural representation of the embodiment for the display panel that the application provides；
Fig. 3 is a kind of structural representation of embodiment of the substrate of encapsulation region；
Fig. 4 is the structural representation of another embodiment of the substrate of encapsulation region；
Fig. 5 a- Fig. 5 c are the structural representations of three kinds of arrangement modes of reflex block；
Fig. 6 is the structural representation of another embodiment of the display panel that the application provides；
Fig. 7 is a kind of structural representation of the embodiment for the display device that the application provides；
Fig. 8 is a kind of flow chart of the embodiment for the manufacture method that the application provides.
Embodiment
The principle and feature of the application are described in further detail with reference to the accompanying drawings and examples.It is appreciated that
It is that specific embodiment described herein is used only for explaining related invention, rather than the restriction to the invention.Further need exist for
It is bright, for the ease of description, the part related to invention is illustrate only in accompanying drawing.
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the application can phase
Mutually combination.Describe the application in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
Fig. 1 is referred to, it illustrates the structural representation of existing display panel.As shown in figure 1, display panel generally comprises
Viewing area and around the encapsulation region of viewing area.Viewing area is used for the display for realizing display panel.Encapsulation region is used to form a closing
Space, in wherein each electronic component, avoid being corroded by the air beyond the closing space or vapor so as to protect,
And influence the display effect and service life of display panel.
In this example it is shown that panel includes substrate 11 and cover plate 12.Generally correspond to the area of viewing area in substrate 11
Domain makes and forms each functional layer for display, such as organic light emitting functional layer and thin film transistor (TFT).And cover plate 12 is usual
Positioned at the surface of display panel.Such as if display panel is touch-control display panel, people can contact cover plate 12 by finger
Surface, to realize the touch-control to display panel.Now, in order to realize the assembling of display panel, i.e., by substrate 11 and the envelope of cover plate 12
Dress fitting, as shown in figure 1, cover plate 12 is towards in the surface of substrate 11, corresponding to encapsulation region position formed with encapsulated layer 13, and
Substrate 11 towards in the surface of cover plate 12, corresponding to encapsulation region position formed with reflecting layer 14.Meanwhile reflecting layer 14 formed with
Multiple hole slots.
When laser irradiates display panel from the upside of cover plate 12, i.e., according to when the direction of arrow is irradiated shown in Fig. 1, instead
Penetrating layer 14 can reflect the laser being irradiated to thereon.So, in the encapsulated layer 13 between cover plate 12 and reflecting layer 14
Encapsulating material can be melted in the presence of the laser of upside and the laser of lower lateral reflection, and flow into hole slot, so as to realize base
The encapsulation fitting of plate 11 and cover plate 12.It is pointed out that energy can be considered Gaussian Profile caused by laser, that is to say, that position
Energy in the centre position of Energy distribution is high, and the energy positioned at the both sides position of Energy distribution is low.As shown in figure 1, arrow
Length longer to represent energy higher.So, when carrying out laser irradiation, the envelope of laser energy eminence is corresponded in encapsulated layer 13
Package material is easier to melt.This causes the burn-off rate of the encapsulating material at diverse location in encapsulated layer 13 to produce different,
The defects of so as to which the stress distribution of encapsulation region can be caused uneven, and producing stress difference, and then may cracking, causes
It is not good enough to the protecting effect of each electronic component of viewing area so that the package failure between substrate 11 and cover plate 12.Therefore, this Shen
Please embodiment provide a kind of improved display panel and the manufacture method for manufacturing the display panel, specifically may refer to down
The description of each embodiment in face.
A kind of as shown in Fig. 2 structural representation of embodiment of the display panel provided it illustrates the application.With it is existing
Technology identical is that the display panel in the present embodiment can include viewing area and around the encapsulation region of viewing area.And display surface
Plate also includes substrate 21 and the cover plate 22 being arranged oppositely with substrate 21.Here substrate 21 and the function difference of cover plate 22
Identical with the function of aforesaid substrate 11 and cover plate 12, here is omitted.
Equally, in order to realize that the encapsulation of substrate 21 and cover plate 22 is bonded, corresponding to the position of encapsulation region, cover plate 22 is towards substrate
21 surface is provided with encapsulated layer 23.Encapsulated layer 23 can be used for adhesive base plate 21 and cover plate 22 after laser irradiates.It is and right
Should be in the position of encapsulation region, substrate 21 is towards the surface of cover plate 22 formed with multiple reflex blocks, reflex block as shown in Figure 2
241st, 242 and 243.In order to increase the cohesive force between substrate 21 and cover plate 22, it is also formed with being used to house between each reflex block
The hole slot of encapsulating material.Herein, to the shape of cross section, cross sectional dimensions and depth of hole slot (i.e. perpendicular to substrate 21
The size in direction) it is not intended to limit, it can be designed according to the actual requirements.Such as the shape of cross section of hole slot can be circle,
It is easy to reduce producting process difficulty.The shape of cross section of such as hole slot can be polygon (such as octagon) again, help to increase
The contact surface of the side wall of encapsulating material and hole slot, so as to further improve the cohesive force between substrate 21 and cover plate 22, increase envelope
The firm intensity of dress.
Unlike the prior art, the reflectivity of each reflex block in the present embodiment swashing with each reflex block present position
The increase of light light intensity and reduce.As shown in Fig. 2 because the Energy distribution of laser belongs to Gaussian Profile, so where reflex block 241
The laser intensity of position is less than the laser intensity of the position of reflex block 242, and the laser intensity of the position of reflex block 242 is less than
The laser intensity of the position of reflex block 243.Now, the reflectivity of reflex block 241 is more than the reflectivity of reflex block 242, reflection
The reflectivity of block 242 is more than the reflectivity of reflex block 243.So, the light intensity of the laser reflected by reflex block 241 can be more than
The light intensity of the laser reflected by reflex block 242, the light intensity of the laser reflected by reflex block 242 can be more than by reflex block
The light intensity of 243 laser reflected.So as to which the difference of laser intensity can be made up to a certain extent, and then reduce encapsulated layer 23
In correspond to reflex block 241,242,243 at encapsulating material burn-off rate difference, make in encapsulated layer 23 at diverse location
The burn-off rate of encapsulating material reach unanimity.Can so reduce causes the stress point of encapsulation region because burn-off rate differs greatly
The uneven situation of cloth occurs, and the defects of so as to avoid cracking, improves the manufacture effectively encapsulated between substrate 21 and cover plate 22
Yield.Further, since the burn-off rate of the encapsulating material in encapsulated layer 23 at diverse location reaches unanimity, that is to say, that encapsulation
The fusing amount of encapsulating material in layer 23 at diverse location tends to be identical, can so make the cohesive force of encapsulation region everywhere substantially phase
Together, so as to being favorably improved encapsulation bonding strength.
It should be noted that the display panel in the application can be touch-control display panel, such as mutual capacitance type touch-control display surface
Plate or self-tolerant touch-control display panel；It can also be non-touch-control display panel.And the structure of each reflex block is in this application simultaneously
Do not limit.
In some optional implementations of the present embodiment, each reflex block can include at least one layer of metal level.And institute
Locate the material difference of the metal level of close the cover plate 22 of the different reflex block of laser intensity of position.As shown in Figure 2, reflex block
241st, 242 and 243 layer of metal layer (metal level 2411, metal level 2421 and metal level 2431) is included respectively.Due to reflex block
241st, 242 is different with the laser intensity of 243 present positions, i.e. the order that the laser intensity of present position is ascending is anti-successively
Penetrate block 241, reflex block 242 and reflex block 243.Now, in order that the reflectivity of reflex block 241 is more than the reflection of reflex block 242
Rate, and the reflectivity of reflex block 242 is more than the reflectivity of reflex block 243, metal level 2411, metal level 2421 and metal level 2431
Material it is different.I.e. the reflectivity of the material of metal level 2411 is more than the reflectivity of the material of metal level 2421, and metal
The reflectivity of the material of layer 2421 is more than the reflectivity of the material of metal level 2431.
It is understood that the material of these metal levels can be the various metal materials for being usually used in manufacturing display panel,
And these metal materials have different reflectivity to laser.As an example, the material of these metal levels can be included below extremely
Few one kind：Metal molybdenum, metallic aluminium, argent or tin indium oxide etc..Because the reflectivity of metallic aluminium and argent is generally higher than
Metal molybdenum, so metal level 2411 and metal level 2421 can use metallic aluminium or metallic silver into and metal level 2431 then may be used
To be made of metal molybdenum.
In addition, in order to simplify the production technology of display panel, these metal levels can be with some function metals of viewing area
Layer is formed in same process., can be with for example, if metal level 2431 and the material of the light shielding block positioned at viewing area are metal molybdenum
Layer of metal molybdenum film is first formed on the base plate (21, and the metal molybdenum film at least covers viewing area and encapsulation region.Then to metal
Molybdenum film is patterned processing, to form light shielding block in viewing area and form the metal level of reflex block 243 in encapsulation region
2431.That is, the metal molybdenum film for being pointed to viewing area is patterned processing according to pattern corresponding to light shielding block, simultaneously
The metal molybdenum film for being pointed to encapsulation region is patterned processing according to pattern corresponding to metal level 2431.
As an example, each reflex block can include more metal layers.As shown in figure 3, it illustrates the substrate of encapsulation region
The structural representation of one embodiment.Corresponding to being again provided with multiple reflex blocks, such as reflex block on the substrate 31 of encapsulation region
341st, reflex block 342 and reflex block 343.And the quantity of metal level that these reflex blocks include can be with identical.It is as shown in figure 3, anti-
Penetrate block 341 and include metal level 3411 and metal level 3412；Reflex block 342 includes metal level 3421 and metal level 3422；Reflex block
343 include metal level 3431 and metal level 3432.
Now, if the laser intensity of reflex block 341, reflex block 342 and the position of reflex block 343 increases successively, then
In order that the reflectivity of reflex block 341, reflex block 342 and reflex block 343 reduces successively, in each metal level of each reflex block at least
Material close to the metal level (i.e. positioned at the metal level of the reflex block the superiors) of cover plate is different.That is metal level 3411, metal level
3421 and metal level 3431 material it is different, and the reflectivity of material is sequentially reduced.
It is understood that the material of other metal levels (metal level of non-close cover plate) of each reflex block can be different.
However, in order to simplify production technology, the material of other metal levels of each reflex block can also be identical.In addition, for same reflection
In block, the material of each metal level can be with identical, as metal level 3411 is identical with the material of metal level 3412.In application scenes
In, in same reflection block, the material of each metal level can also be different, as metal level 3411 is different from the material of metal level 3412.
In addition, from figure 3, it can be seen that in same reflection block, insulating barrier is also provided between adjacent metal, such as
Insulating barrier 3413, insulating barrier 3423 and insulating barrier 3433.Acted on by setting insulating barrier to play barrier protection, so as to avoid
Metal level in reflex block produces harmful effect to other electronic components in display panel.Meanwhile by setting insulating barrier can
To increase the height of reflex block, so as to help to expand the adjusting range of the depth of the hole slot between each reflex block.With hole slot
Depth increase, the contact area of encapsulating material and hole slot can be increased, so as to improve encapsulation cohesive force.
Herein, the material of insulating barrier is not intended to limit in this application.But for the consideration for saving the energy, it can use saturating
The material of light rate higher (such as light transmittance be more than 70%) makes insulating barrier.So, it is possible to reduce insulating barrier is to laser energy
Absorb, so as to be favorably improved the energy for the laser that reflex block is reflected, and then accelerate the melting rate of encapsulating material, improve life
Efficiency is produced, reduces production cost.It is understood that under the irradiation of laser, the insulating barrier in reflex block close to cover plate also can
There is melting phenomenon.Now, after mutually being merged in order to avoid different materials, inside produces stress difference so as to influence to encapsulate cohesive force
And/or the validity of encapsulation, as an example, insulating barrier can also have identical material with encapsulated layer, for example, insulating barrier and encapsulation
The material of layer includes silicon nitride and/or silica.In this manner it is ensured that the fusing point of both materials is identical, and formerly fusing
Solidify again during, the inner molecular structure change of both materials is identical.And in order to further simplify production technology, instead
Penetrating the insulating barrier in block can be made with the insulating barrier of viewing area in same process.
Alternatively, there may be at least part reflex block in each reflex block, what these at least part reflex blocks were included
The quantity of metal level is different.Such as reflex block can comprise at least the first reflex block, the second reflex block and the 3rd reflex block.Its
In, the first reflex block can include the first metal layer；Second reflex block can include the first metal layer and second metal layer；3rd
Reflex block can include the first metal layer, second metal layer and the 3rd metal level.Specifically it may refer to shown in Fig. 4, it illustrates
The structural representation of another embodiment of the substrate of encapsulation region.
In Fig. 4, substrate 41 is again provided with multiple reflex blocks corresponding to the position of encapsulation region, such as the first reflex block 441,
Second reflex block 442 and the 3rd reflex block 443.First reflex block 441 includes the first metal layer 4411, and the first metal layer 4411
Between two insulating barriers 4412.Second reflex block 442 includes the first metal layer 4421 and second metal layer 4422.Second gold medal
Belong to layer 4422 between substrate 41 and the first metal layer 4421.And the first metal layer 4421 positioned at two insulating barriers 4423 it
Between.Second metal layer 4422 also is located between two insulating barriers 4423.3rd reflex block 443 includes the first metal layer 4431, the
Two metal levels 4432 and the 3rd metal level 4433.Second metal layer 4432 is located at the metal level 4433 of the first metal layer 4431 and the 3rd
Between.3rd metal level 4433 is between substrate 41 and second metal layer 4432.And each metal level is respectively positioned on two insulation
Between layer 4434.
So, difference in height can be produced between the first reflex block 441, the second reflex block 442 and the 3rd reflex block 443.This
When, the first reflex block 441, the second reflex block 442 and the 3rd reflex block 443 can be alternately arranged in encapsulation region, so as to encapsulate
Rugged surface is formed on the substrate 41 in area, and then increases the contact area with encapsulating material, improves encapsulation adhesion strength.
Herein, the direction being alternately arranged can be cross-sectional direction or the longitudinal section direction of substrate 41 of substrate 41.Three
Between specific alternating pattern may refer to Fig. 5 a- Fig. 5 c, which respectively show the knot of the three of reflex block kind arrangement mode
Structure schematic diagram.
As shown in Figure 5 a, the second reflex block 442 can be between the first reflex block 441 and the 3rd reflex block 443.First
Reflex block 441 can be as shown in Figure 5 a or opposite (i.e. with the position shown in Fig. 5 a with the position of the 3rd reflex block 443
Location swap).
Alternatively, as shown in Figure 5 b, the first reflex block 441 can be located at the second reflex block 442 and the 3rd reflex block 443 it
Between.Now, the position of the second reflex block 442 and the 3rd reflex block 443 can as shown in Figure 5 b or with shown in Fig. 5 b
Position is opposite.
Alternatively, as shown in Figure 5 c, the 3rd reflex block 443 can be located at the first reflex block 441 and the second reflex block 442 it
Between.And the position of the first reflex block 441 and the second reflex block 442 can as shown in Figure 5 c or the position shown in Fig. 5 c
Put opposite.
It should be noted that for the display panel of the various embodiments described above, display panel can also be included around encapsulation region
Cutting area.Cutting area is used to cut the display panel after substrate and cover plate bonding.As shown in fig. 6, display panel includes showing
Show area, encapsulation region and cutting area.Wherein, encapsulation region is set around viewing area, and cutting area is set around encapsulation region.When substrate 61 with
After the encapsulation adhesion of cover plate 62, it can be processed in cutting area, so as to form display panel independent one by one.
The embodiment of the present application additionally provides a kind of display device.The display device can be included described by the various embodiments described above
Display panel.The display device can be the electronic equipment that mobile phone, tablet personal computer, wearable device etc. have display screen.
As an example, display device can be the electronic equipment shown in Fig. 7.
As shown in Figure 7, display device can be by viewing area 701 to user's display picture.It is understood that this implementation
Display device in example can also include structure known to integrated drive electronics, data wire, scan line etc., and here is omitted.
The embodiment of the present application additionally provides a kind of manufacture method, and the manufacture method can be used for manufacturing in the various embodiments described above
Display panel.As shown in figure 8, a kind of flow chart of embodiment of the manufacture method provided it illustrates the application, the manufacture
Method may comprise steps of：
Step 801, one substrate of preparation and a cover plate.Wherein, substrate includes viewing area and around the encapsulation region of viewing area.This
In substrate and cover plate can be outsourcing, such as customization fixed dimension substrate and cover plate；Can also be homemade, such as from
Raw material begin to pass through a series of technique and made；It can also be to pass through the base material of outsourcing and be processed further what is obtained, such as
Zhang Jicai whole to one is cut and forms substrate one by one and cover plate.
Step 802, each functional layer for display is formed in the viewing area of substrate.
Step 803, multiple reflex blocks are formed in the encapsulation region of substrate, each reflex block includes at least one layer of metal level.Wherein,
At least one layer of metal level is located at same metal level with partial function layer.That is, at least one layer of metal level can be with display
The material of the partial function floor in area is identical, and both can be made in same process.Such as the material positioned at encapsulation region is gold
Belonging to the metal level of molybdenum can form when making the material positioned at viewing area and being also the light shielding block of metal molybdenum.
Step 804, encapsulated layer is formed on the cover board, and cover plate and substrate are arranged oppositely.Wherein, encapsulated layer and reflex block
Between cover plate and substrate.
Step 805, the surface of substrate is deviated from laser irradiation cover plate, so that encapsulated layer fusing adhesive base plate and cover plate.Its
In, the reflectivity of each reflex block reduces with the increase of the laser intensity of each reflex block present position.
The manufacture method of the present embodiment, envelope is set by the position for corresponding to encapsulation region in surface of the cover plate towards substrate
Fill layer；And the position corresponding to encapsulation region in surface of the substrate towards cover plate forms multiple reflex blocks；Meanwhile each reflex block
Reflectivity reduces with the increase of the laser intensity of each reflex block present position.Herein, even if at the encapsulated layer of diverse location
Under the laser irradiation of different light intensity, the burn-off rate of the encapsulating material in these encapsulated layers can also be made to reach unanimity, to subtract
The situation for making the stress distribution of encapsulated layer uneven because of burn-off rate difference less occurs, so as to avoid therefore caused crackle etc.
Defect.So, the fine ratio of product of display panel can be not only improved, while also contributes to the encapsulation between substrate and cover plate
Bonding strength.
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.People in the art
Member should be appreciated that invention scope involved in the application, however it is not limited to the technology that the particular combination of above-mentioned technical characteristic forms
Scheme, while should also cover in the case where not departing from the inventive concept, carried out by above-mentioned technical characteristic or its equivalent feature
The other technical schemes for being combined and being formed.Such as features described above has similar work(with (but not limited to) disclosed herein
The technical scheme that the technical characteristic of energy is replaced mutually and formed.
Claims (11)
1. a kind of display panel, it is characterised in that the display panel includes viewing area and around the encapsulation region of the viewing area；
The display panel also includes substrate and the cover plate being arranged oppositely with the substrate；
Wherein, the encapsulation region, the surface of the cover plate towards the substrate are provided with encapsulated layer, the encapsulated layer is used for
The substrate and the cover plate are bonded after laser irradiation；
In the encapsulation region, the substrate towards the surface of the cover plate formed with multiple reflex blocks, each reflex block it is anti-
Penetrate rate reduces with the increase of the laser intensity of each reflex block present position.
2. display panel according to claim 1, it is characterised in that each reflex block includes at least one layer of metal level；
The material of the metal level of the close cover plate of the different reflex block of the laser intensity of present position is different.
3. display panel according to claim 2, it is characterised in that in same reflection block, the material of each metal level is different,
And insulating barrier is provided between adjacent metal.
4. display panel according to claim 3, it is characterised in that the insulating barrier has identical material with the encapsulated layer
Material, the material of the encapsulated layer include silicon nitride or silica.
5. display panel according to claim 2, it is characterised in that the quantity phase for the metal level that each reflex block includes
Together.
6. display panel according to claim 2, it is characterised in that in each reflex block, at least part reflex block institute
Comprising metal level quantity it is different.
7. display panel according to claim 6, it is characterised in that the reflex block comprises at least the first reflex block, the
Two reflex blocks and the 3rd reflex block；
First reflex block includes the first metal layer, and second reflex block includes the first metal layer and second metal layer, institute
State the 3rd reflex block and include the first metal layer, second metal layer and the 3rd metal level；
First reflex block, second reflex block and the 3rd reflex block are alternately arranged in the encapsulation region.
8. display panel according to claim 2, it is characterised in that the material of at least one layer of metal level includes following
It is at least one：Metal molybdenum, metallic aluminium, argent or tin indium oxide.
9. according to the display panel described in one of claim 1-8, it is characterised in that the display panel is also included around described
The cutting area of encapsulation region, for cutting the display panel after the substrate and cover plate bonding.
10. a kind of display device, it is characterised in that the display device includes the display surface as described in one of claim 1-9
Plate.
11. a kind of manufacture method, it is characterised in that the manufacture method is used to manufacture aobvious as described in one of claim 1-9
Show panel, the manufacture method includes：
One substrate of preparation and a cover plate, wherein, the substrate includes viewing area and around the encapsulation region of the viewing area；
Each functional layer for display is formed in the viewing area of the substrate, and multiple reflections are formed in the encapsulation region of the substrate
Block, each reflex block include at least one layer of metal level, wherein, at least one layer of metal level is located at the part functional layer
Same metal level；
Encapsulated layer is formed on the cover plate, and the cover plate and the substrate are arranged oppositely, wherein, the encapsulated layer and institute
Reflex block is stated between the cover plate and the substrate；
Laser irradiates in the cover plate surface for deviating from the substrate, so that encapsulated layer fusing bonds the substrate and described
Cover plate, wherein, the reflectivity of each reflex block reduces with the increase of the laser intensity of each reflex block present position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710743518.8A CN107565051B (en) | 2017-08-25 | 2017-08-25 | Display panel, display device and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710743518.8A CN107565051B (en) | 2017-08-25 | 2017-08-25 | Display panel, display device and manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107565051A true CN107565051A (en) | 2018-01-09 |
| CN107565051B CN107565051B (en) | 2019-08-02 |
Family
ID=60975877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710743518.8A Active CN107565051B (en) | 2017-08-25 | 2017-08-25 | Display panel, display device and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107565051B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112071880A (en) * | 2020-09-07 | 2020-12-11 | Tcl华星光电技术有限公司 | Display panel |
| CN112652727A (en) * | 2020-12-22 | 2021-04-13 | 厦门天马微电子有限公司 | Display panel, display device and packaging method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101095247A (en) * | 2004-10-20 | 2007-12-26 | 康宁股份有限公司 | Optimization of parameters for sealing organic emitting light diode(oled) displays |
| US20130137200A1 (en) * | 2011-11-29 | 2013-05-30 | Semiconductor Energy Laboratory Co., Ltd. | Method of Manufacturing Sealed Body and Method of Manufacturing Light-Emitting Device |
| CN104064687A (en) * | 2014-04-10 | 2014-09-24 | 友达光电股份有限公司 | Display panel |
| CN104332484A (en) * | 2013-07-22 | 2015-02-04 | 三星显示有限公司 | ORGANIC LIGHT EMITTING DISPLAY DEVICE and method for manufacture same |
-
2017
- 2017-08-25 CN CN201710743518.8A patent/CN107565051B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101095247A (en) * | 2004-10-20 | 2007-12-26 | 康宁股份有限公司 | Optimization of parameters for sealing organic emitting light diode(oled) displays |
| US20130137200A1 (en) * | 2011-11-29 | 2013-05-30 | Semiconductor Energy Laboratory Co., Ltd. | Method of Manufacturing Sealed Body and Method of Manufacturing Light-Emitting Device |
| CN104332484A (en) * | 2013-07-22 | 2015-02-04 | 三星显示有限公司 | ORGANIC LIGHT EMITTING DISPLAY DEVICE and method for manufacture same |
| CN104064687A (en) * | 2014-04-10 | 2014-09-24 | 友达光电股份有限公司 | Display panel |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112071880A (en) * | 2020-09-07 | 2020-12-11 | Tcl华星光电技术有限公司 | Display panel |
| CN112071880B (en) * | 2020-09-07 | 2023-10-17 | Tcl华星光电技术有限公司 | display panel |
| CN112652727A (en) * | 2020-12-22 | 2021-04-13 | 厦门天马微电子有限公司 | Display panel, display device and packaging method |
| CN112652727B (en) * | 2020-12-22 | 2022-10-18 | 厦门天马微电子有限公司 | Display panel, display device and packaging method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107565051B (en) | 2019-08-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105470406B (en) | Organic light-emitting display device | |
| CN108155219A (en) | A kind of display panel, its bending method and display device | |
| CN107579078A (en) | Display panel and its manufacture method and display device | |
| CN108258145A (en) | A kind of display panel and display device | |
| CN107565046B (en) | Organic light emitting display panel and its manufacturing method and display device | |
| US8766416B2 (en) | Semiconductor package and fabrication method thereof | |
| CN102237470B (en) | Light emitting diode packaging structure and manufacturing method thereof as well as manufacturing method of base | |
| CN104064687B (en) | Display panel | |
| CN105304582A (en) | Package structure and method for fabricating the same | |
| CN103413789A (en) | Semiconductor device and method for manufacturing the same | |
| WO2014088966A3 (en) | Bonding structure for a microelectronic assembly comprising a high melting point alloy formed by bonding two bond components each comprising a non-low melting point material layer covering a low melting point material layer and corresponding manufacturing method | |
| US9673065B2 (en) | Semiconductor substrate having stress-absorbing surface layer | |
| CN107565051A (en) | Display panel, display device and manufacture method | |
| JP2020528156A (en) | Encapsulation structure, display panel and its creation method | |
| WO2019214285A1 (en) | Display panel motherboard, display panel, and display panel manufacturing method | |
| US20200135836A1 (en) | Display panel, manufacturing method thereof and display device | |
| CN109524566A (en) | Display panel and display device | |
| JP2021149088A (en) | Display device | |
| CN206711895U (en) | A kind of array base palte, electroluminescence display panel and display device | |
| CN109830518B (en) | Display panel and display device | |
| CN205863170U (en) | A kind of display base plate | |
| CN111509021A (en) | Display substrate, preparation method thereof and display panel | |
| CN108648623B (en) | Display screen, manufacturing method thereof and display terminal | |
| JP2021110929A (en) | Display device and manufacturing method for the same | |
| US10433469B1 (en) | Semiconductor package and semiconductor module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211021 Address after: No.8, liufangyuanheng Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province, 430074 Patentee after: WUHAN TIANMA MICRO-ELECTRONICS Co.,Ltd. Patentee after: Wuhan Tianma Microelectronics Co.,Ltd. Shanghai Branch Address before: Room 509, building 1, No. 6111, Longdong Avenue, Pudong New Area, Shanghai, 201201 Patentee before: SHANGHAI TIANMA AM-OLED Co.,Ltd. |
|
| TR01 | Transfer of patent right |