CN107561877B - PCB developing horizontal line, developing method and PCB - Google Patents
PCB developing horizontal line, developing method and PCB Download PDFInfo
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- CN107561877B CN107561877B CN201710806359.1A CN201710806359A CN107561877B CN 107561877 B CN107561877 B CN 107561877B CN 201710806359 A CN201710806359 A CN 201710806359A CN 107561877 B CN107561877 B CN 107561877B
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Abstract
The invention discloses a PCB developing horizontal line, a developing method and a PCB, wherein the developing method comprises the following steps: A. carrying out developing solution cleaning on the PCB to be processed, and carrying out first water washing on the PCB cleaned by the developing solution; B. and carrying out ultrasonic overflow water washing on the PCB subjected to the first water washing, and carrying out secondary water washing on the PCB subjected to the ultrasonic overflow water washing so as to finish the development treatment. According to the invention, by adding the ultrasonic overflow washing process and performing ultrasonic overflow washing on the PCB, the ink and the dry film fragments attached to the PCB are vibrated and loosened by ultrasonic vibration, and the vibrated and loosened ink and dry film fragments are washed by second washing, so that the residual ink and dry film fragments on the PCB, particularly impurities in small holes of the PCB, are reduced, and the cleanliness of developing washing is improved.
Description
Technical Field
The invention relates to the field of PCBs, in particular to a PCB developing horizontal line, a developing method and a PCB.
Background
After pattern exposure, the PCB needs to use a developing horizontal line to complete image development, namely, photosensitive ink which is not cured by light on the board surface is removed through development. The printed circuit board development horizontal line generally includes a development processing part and a water washing post-processing part disposed in tandem, and the PCB treated by the development processing part is water-washed by the water washing processing part. However, after the development treatment, the Printed Circuit Board (PCB) has ink and dry film fragments adhered to the surface of the PCB, and the PCB is difficult to wash clean only by water washing. In particular, the ink remaining in the respective holes of the PCB is liable to cause waste.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
In view of the above defects in the prior art, the present invention provides a PCB board developing horizontal line, a developing method and a PCB board, and aims to solve the problems of poor effect of removing ink on the PCB board and easy waste in the prior art.
The technical scheme of the invention is as follows:
a PCB board development level, comprising: the developing device and the water washing device are arranged in the same horizontal direction, and the developing device comprises a multistage developing tank; the water washing device comprises a first water washing component, an ultrasonic water washing component and a second water washing component which are arranged in sequence; the ultrasonic washing assembly comprises an ultrasonic washing tank and an ultrasonic generator arranged in the ultrasonic washing tank, and ultrasonic waves are generated by the ultrasonic transmitter to carry out ultrasonic washing on a PCB (printed circuit board) arranged in the ultrasonic washing tank.
The PCB board develops water flat line, wherein, ultrasonic rinsing bath top is provided with spray set, through spray set pours into the clear water into ultrasonic rinsing bath to carry out the overflow washing to the PCB board of placing in ultrasonic rinsing bath.
PCB board development water flat line, wherein, supersound washing unit still includes filter equipment, filter equipment with the supersound wash bowl is connected to overflow water that produces when rinsing the overflow filters.
The PCB board development water line, wherein, first washing subassembly and second washing subassembly all include multistage wash bowl.
A PCB developing method comprises the following steps:
A. carrying out developing solution cleaning on the PCB to be processed, and carrying out first water washing on the PCB cleaned by the developing solution;
B. and carrying out ultrasonic overflow water washing on the PCB subjected to the first water washing, and carrying out secondary water washing on the PCB subjected to the ultrasonic overflow water washing so as to finish the development treatment.
The PCB developing method comprises the following specific steps:
b1, carrying out ultrasonic water washing on the PCB subjected to the first water washing, and carrying out overflow water washing on the PCB in the ultrasonic water washing process;
and B2, carrying out second water washing on the PCB subjected to the ultrasonic water washing to finish the developing treatment.
The PCB board developing method, wherein the step B1 specifically includes:
when the PCB after the first washing is subjected to ultrasonic washing, performing overflow washing on the PCB in the ultrasonic washing; and stopping the overflow water washing at the end of the ultrasonic water washing.
The PCB developing method comprises the steps that ultrasonic sound pressure of ultrasonic washing is 2-5mv, and ultrasonic washing time is 15-20 ms.
According to the PCB developing method, the water flow of the overflow water washing is 4-6L/min, and the overflow time is 15-20 ms.
A PCB manufactured by using the developing method as described in any one of the above.
Has the advantages that: according to the invention, the ultrasonic washing component is added in the washing section, the ink and the dry film fragments stuck on the PCB surface are vibrated and loosened through ultrasonic washing, and the ink and the dry film fragments are taken away from the PCB surface through water flow circulation, so that the purpose of removing the ink and the dry film fragments on the PCB surface is achieved, and the reject ratio is reduced.
Drawings
FIG. 1 is a schematic diagram of a PCB development horizontal line provided by the present invention.
FIG. 2 is a flowchart illustrating a PCB developing method according to a preferred embodiment of the present invention.
Detailed Description
The invention provides a PCB developing horizontal line, a developing method and a PCB, and the invention is further described in detail below in order to make the purpose, technical scheme and effect of the invention clearer and more clear. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The invention provides a PCB developing horizontal line, which comprises a developing device 10 and a washing device, wherein the developing device 10 and the washing device are arranged in the same horizontal direction, and the developing device is positioned in front of the washing device, namely a PCB firstly passes through the developing device 10 and then passes through the washing device, as shown in figure 1. The developing device comprises a multi-stage developing tank, and the water washing device comprises a first water washing component 20, an ultrasonic water washing component 30 and a second water washing component 40 which are arranged in front and back; the ultrasonic washing assembly comprises an ultrasonic washing tank and an ultrasonic generator arranged in the ultrasonic washing tank, and ultrasonic waves are generated by the ultrasonic generator to carry out ultrasonic washing on the PCB after the PCB is washed for the first time. According to the invention, the ultrasonic washing component is additionally arranged behind the first washing component, the PCB after the first washing is subjected to ultrasonic washing through the ultrasonic washing component, the printing ink and the dry film fragments attached to the PCB are loosened by vibration, and then the loosened printing ink and the loosened dry film fragments are cleaned through the second washing component, so that the printing ink and the dry film fragments on the PCB are thoroughly removed, the cleanliness of the PCB cleaning is improved, and the reject ratio of the PCB is reduced.
Further, washing subassembly and second washing subassembly all include multistage wash bowl for the first time, and communicate the transmission path that sets up a PCB board of treating and pass through around the horizontal direction in each developer tank, wash bowl and the supersound wash bowl, through transmission path transmits the PCB board of treating to last wash bowl from first developer tank in proper order. For example, the developing device comprises a 5-stage developing tank, the first water washing assembly comprises a 6-stage first water washing tank, and the second water washing assembly comprises a 6-stage second water washing tank; the PCB passes through the transfer passage from the first-stage developing tank through the 5-stage developing tank, the 6-stage first rinsing tank, the ultrasonic rinsing tank, and the 6-stage second rinsing tank in sequence.
Further, supersound washing subassembly still includes spray set, spray set up in supersound wash bowl top, through spray set injects the clear water into the supersound wash bowl for the water overflow in the supersound wash bowl realizes carrying out the overflow washing to the PCB board of placing in the supersound wash bowl. In practical application, the ultrasonic rinsing bath can be provided with the overflow mouth, and when carrying out overflow washing through spray set to the PCB board of placing in the ultrasonic rinsing bath, the water in the ultrasonic rinsing bath flows through the overflow mouth, conveniently retrieves the overflow water that overflow washing produced like this.
Further, the ultrasonic water washing assembly can further comprise a filtering device, wherein a water inlet of the filtering device is connected with the overflow port through a water pipe, and water flowing out of the overflow port is filtered. In practical application, in order to save water, the water outlet of the filtering device can be connected with the spraying device, so that the recycling of overflow water is realized. For example, in a preferred embodiment of the present invention, the filtering device includes a filtering pump, a filtering barrel and a filtering cotton core disposed in the filtering barrel, the filtering barrel is provided with a water inlet and a water outlet, the water inlet is connected with an overflow port of the ultrasonic rinsing tank through the filtering pump, overflow water after the overflow water washing is introduced into the filtering barrel through the filtering pump, and is filtered through the filtering cotton core in the filtering barrel, so as to filter ink and dry film fragments carried in the overflow water; finally, the filtered water flows back to the spraying device through the water outlet to realize cleaning and recycling. Of course, the spraying device may comprise a reservoir through which the overflow washing water is stored.
The invention also provides a PCB developing method, as shown in FIG. 2, which comprises the following steps:
s1, washing the PCB to be processed with the developing solution, and washing the PCB washed with the developing solution for the first time;
and S2, carrying out ultrasonic overflow water washing on the PCB subjected to the first water washing, and carrying out second water washing on the PCB subjected to the ultrasonic overflow water washing to finish the developing treatment.
The invention solves the problem of unclean cleaning of ink and dry film fragments attached to the PCB by adding the ultrasonic overflow water washing process. That is, in step S2, after the first washing is performed on the PCB, the ultrasonic overflow washing is performed on the PCB, so that the ink and the dry film fragments attached to the PCB are shaken loose by the ultrasonic vibration, and the shaken loose ink and dry film fragments are washed away by the second washing, thereby reducing the residual ink and dry film fragments on the PCB, especially the impurities in the small holes of the PCB, and improving the cleanliness of the developing washing.
Specifically, in step S1, the PCB to be processed may be subjected to development cleaning by a multi-stage developing tank, and each developing tank may be cleaned by a new liquid, that is, a new display liquid is used to wash the surface of the PCB. The PCB can be developed and cleaned by adopting the existing developing and cleaning method and parameters, and the specific description is not needed here.
Further, in step S2, the supersound overflow washing indicates to carry out the overflow washing when carrying out the supersound washing to the PCB board, can in time take out the supersound wash bowl through the overflow water with the printing ink and the dry film piece that shake loose through the supersound like this to in-process with PCB from the transmission of supersound wash bowl to second washing subassembly, the printing ink and the dry film piece that shake loose reattach in the PCB board. Illustratively, the step S2 may specifically include:
s21, carrying out ultrasonic water washing on the PCB subjected to the first water washing, and carrying out overflow water washing on the PCB in the ultrasonic water washing process;
and S22, carrying out second water washing on the PCB subjected to the ultrasonic water washing to finish the developing treatment.
Specifically, in the step S21, the ultrasonic washing refers to placing the PCB after the first washing in an ultrasonic washing tank, oscillating the PCB after the first washing by using ultrasonic waves generated by the ultrasonic washing tank, and separating impurities such as ink and dry film fragments attached to the PCB from the PCB by oscillation. In addition, when the PCB is arranged in the ultrasonic rinsing bath, the PCB is subjected to overflow rinsing, impurities which are separated from the PCB are taken away from the ultrasonic rinsing bath through overflow water, and the ultrasonic rinsing effect is further improved.
For example, the step S21 may specifically be:
s211, when the PCB after the first washing is subjected to ultrasonic washing, performing overflow washing on the PCB in the ultrasonic washing; and stopping the overflow water washing at the end of the ultrasonic water washing.
Specifically, in step S211, the ultrasonic water washing and the overflow water washing are started synchronously, and are ended synchronously. That is, the ultrasonic water washing and the overflow water washing are synchronous processes, and the time of the ultrasonic water washing and the time of the overflow water washing are equal.
Furthermore, the ultrasonic sound pressure of the ultrasonic washing is 2-5mv, and the ultrasonic washing time is 15-20 ms. Correspondingly, the time of the overflow water washing is also 15-20ms, and in addition, the water flow of the overflow water washing can be 4-6L/min, and preferably 5L/min; the overflow water temperature is 30 +/-2 ℃. In this embodiment, the ultrasonic sound pressure of 2-5mv is determined through research and development, because for the outer layer circuit, when the ultrasonic sound pressure is too large, the NPTH hole sealing dry film is broken, so that the resistance welding sound pressure value is too large, and when the resistance welding sound pressure value is too large, the resistance welding green oil bridge is easy to shake loose and fall off; for the inner layer circuit, when the ultrasonic sound pressure is too large, the ink is easy to shake loose to form an open circuit gap; on the contrary, when the ultrasonic sound pressure is too small, the effect of vibrating and loosening the ink and the dry film fragments attached to the PCB cannot be obtained.
Example one
The embodiment provides a method for developing a PCB, which specifically includes:
s101, carrying out first developing and cleaning on the PCB to be processed, wherein the transmission speed of the PCB is 5.0m/min, the temperature of the developing solution is 30 +/-2 ℃, the pressure is 2.0kg/cm2,
s102, carrying out second developing and cleaning on the PCB subjected to the first developing and cleaning, wherein the temperature of the new liquid is 30 +/-2 ℃, and the pressure is 2.0kg/cm 2;
s103, carrying out first water washing on the PCB subjected to the second development cleaning, wherein the temperature of water is 30 +/-2 ℃, and the water washing pressure is 1.6 +/-0.3 kg/cm 2;
s104, simultaneously performing ultrasonic wave immersion cleaning and overflow water cleaning on the PCB subjected to the first water cleaning, wherein the ultrasonic sound pressure is 2-5mv, the immersion cleaning time is 15-20S, and the overflow water cleaning flow is 5L/min;
s105, carrying out secondary water washing on the PCB subjected to ultrasonic soaking, wherein the temperature of water is 30 +/-2 ℃, and the water washing pressure is 1.6 +/-0.3 kg/cm 2;
s106, drying the PCB subjected to the second washing, wherein the drying temperature is 45 +/-5 ℃, and the wind pressure is 10 +/-5 kPa.
Further, by comparing the PCB developed and cleaned by the method of the present embodiment with the PCB developed and cleaned by the developing method, it is obtained that the reject ratio of the PCB obtained by the method of the present invention is significantly reduced. Specifically, as shown in the following table.
The invention also provides a PCB board preferred embodiment, which adopts the developing method to carry out developing water washing.
In summary, the invention adds the ultrasonic overflow washing process, and the ultrasonic overflow washing is performed on the PCB, so that the ink and the dry film fragments attached to the PCB are vibrated and loosened by the ultrasonic vibration, and the vibrated ink and the dry film fragments are washed by the second washing, thereby reducing the residual ink and the dry film fragments on the PCB, especially the impurities in the small holes of the PCB, and improving the cleanliness of the developing washing.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (5)
1. A PCB board development horizontal line, comprising: the developing device and the water washing device are arranged in the same horizontal direction, and the developing device comprises a multistage developing tank; the water washing device comprises a first water washing component, an ultrasonic water washing component and a second water washing component which are arranged in sequence; the ultrasonic washing assembly comprises an ultrasonic washing tank and an ultrasonic generator arranged in the ultrasonic washing tank, the ultrasonic washing assembly further comprises a spraying device, the spraying device is arranged above the ultrasonic washing tank, clear water is injected into the ultrasonic washing tank through the spraying device, so that water in the ultrasonic washing tank overflows, ultrasonic waves are generated through the ultrasonic transmitter to carry out ultrasonic overflow washing on the PCB arranged in the ultrasonic washing tank, the ultrasonic washing and the overflow washing are synchronously started and synchronously finished; first washing subassembly and second washing subassembly all include multistage wash bowl, and communicate the transmission path that sets up a PCB board of treating and pass through around the horizontal direction in each developer tank, wash bowl and the supersound wash bowl, through transmission path transmits the PCB board of treating to final stage wash bowl from first-stage developer tank in proper order.
2. The PCB board developing horizontal line of claim 1, wherein the ultrasonic water washing device further comprises a filtering device, and the filtering device is connected with the ultrasonic water washing tank and is used for filtering overflow water generated in overflow water washing.
3. The PCB development horizontal line of claim 1, wherein the first and second water washing assemblies each comprise a multi-stage water washing tank.
4. A PCB board developing method is characterized by comprising the following steps:
A. carrying out developing solution cleaning on the PCB to be processed, and carrying out first water washing on the PCB cleaned by the developing solution;
B. carrying out ultrasonic overflow water washing on the PCB subjected to the first water washing, and carrying out second water washing on the PCB subjected to the ultrasonic overflow water washing so as to finish development treatment;
the step B specifically comprises the following steps:
b1, carrying out ultrasonic water washing on the PCB subjected to the first water washing, and carrying out overflow water washing on the PCB in the ultrasonic water washing process; and stopping the overflow water washing when the ultrasonic water washing is finished;
b2, carrying out second water washing on the PCB subjected to the ultrasonic water washing to finish the development treatment;
wherein the ultrasonic sound pressure of the ultrasonic washing is 2-5mv, and the ultrasonic washing time is 15-20 ms;
the water flow of the overflow water washing is 4-6L/min, and the overflow time is 15-20 ms;
after the PCB to be processed is cleaned by the developing solution from the developing tank through the transmission channel, the PCB to be processed is sequentially transmitted to the first water washing component to finish the first water washing, the ultrasonic water washing component to finish the ultrasonic overflow water washing and the second water washing component to finish the second water washing; the ultrasonic washing assembly comprises an ultrasonic washing tank and an ultrasonic generator arranged in the ultrasonic washing tank, the ultrasonic washing assembly further comprises a spraying device, the spraying device is arranged above the ultrasonic washing tank and used for injecting clear water into the ultrasonic washing tank, so that water in the ultrasonic washing tank overflows and is washed by ultrasonic waves generated by the ultrasonic generator for carrying out ultrasonic overflow washing on a PCB (printed circuit board) arranged in the ultrasonic washing tank.
5. A PCB board manufactured by the developing method of claim 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710806359.1A CN107561877B (en) | 2017-09-08 | 2017-09-08 | PCB developing horizontal line, developing method and PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710806359.1A CN107561877B (en) | 2017-09-08 | 2017-09-08 | PCB developing horizontal line, developing method and PCB |
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| Publication Number | Publication Date |
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| CN107561877A CN107561877A (en) | 2018-01-09 |
| CN107561877B true CN107561877B (en) | 2021-02-09 |
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| CN201710806359.1A Active CN107561877B (en) | 2017-09-08 | 2017-09-08 | PCB developing horizontal line, developing method and PCB |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110899205A (en) * | 2019-12-05 | 2020-03-24 | 深南电路股份有限公司 | Cleaning and drying device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201812133U (en) * | 2010-08-19 | 2011-04-27 | 高德(苏州)电子有限公司 | Development horizontal line of printed circuit board |
| CN103118449A (en) * | 2013-01-31 | 2013-05-22 | 景旺电子（深圳）有限公司 | PCB (printed circuit board) board production method utilizing solder mask dry film and PCB board |
| CN204697395U (en) * | 2015-06-26 | 2015-10-07 | 深圳市翔宇电路有限公司 | The horizontal overflow water cooling system of PCB |
| CN205570908U (en) * | 2016-04-11 | 2016-09-14 | 昆山首源电子科技有限公司 | PCB leaf fat china ink self - cleaning device based on ultrasonic wave |
-
2017
- 2017-09-08 CN CN201710806359.1A patent/CN107561877B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201812133U (en) * | 2010-08-19 | 2011-04-27 | 高德(苏州)电子有限公司 | Development horizontal line of printed circuit board |
| CN103118449A (en) * | 2013-01-31 | 2013-05-22 | 景旺电子（深圳）有限公司 | PCB (printed circuit board) board production method utilizing solder mask dry film and PCB board |
| CN204697395U (en) * | 2015-06-26 | 2015-10-07 | 深圳市翔宇电路有限公司 | The horizontal overflow water cooling system of PCB |
| CN205570908U (en) * | 2016-04-11 | 2016-09-14 | 昆山首源电子科技有限公司 | PCB leaf fat china ink self - cleaning device based on ultrasonic wave |
Non-Patent Citations (1)
| Title |
|---|
| 剖析光致成像工艺要点及改良;程静 等;《印制电路信息》;20150430(第2期);5-10 * |
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