CN107561430A - A kind of double semiconductor die testing machine device - Google Patents
A kind of double semiconductor die testing machine device Download PDFInfo
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- CN107561430A CN107561430A CN201710892727.9A CN201710892727A CN107561430A CN 107561430 A CN107561430 A CN 107561430A CN 201710892727 A CN201710892727 A CN 201710892727A CN 107561430 A CN107561430 A CN 107561430A
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Abstract
The present invention discloses a kind of double semiconductor die testing machine device, including test machine cabinet and hanging machine case, and two pci extended housings and two power amplifier cabinets are provided with described test machine cabinet；Described hanging machine case includes left side skeleton, right side skeleton, top panel and downside transverse slat；Described left side skeleton and the front and rear side of right side skeleton are provided with installation step and screwed hole.The present invention is in the case where original Cabinet Size is constant, two pci extended housings and two power amplifier cabinets are installed, and in order to realize duplexing bit test, the volume of matrix cabinet inside can also become big, therefore demountable hanging machine case installation matrix cabinet is set, the front end installation test machine control panel of hanging machine case, can is engaged with two pci extended housings and two power amplifier cabinets by matrix cabinet and realizes duplexing bit test, and single unit system does not change the dimensional structure of former test cabinet, is more prone to assembling and realizes.
Description
Technical field
The invention belongs to semiconductor detection, and in particular to a kind of double semiconductor die testing machine device.
Background technology
As shown in figure 1, needing that three cabinets are housed inside existing semiconductor die testing machine, pci extended housings are (i.e.
PXI cabinets), power amplifier cabinet (i.e. 5142 cabinets) and matrix cabinet (i.e. MATRIX cabinets).Generally test machine in test
Only need to test every time chip piece can (either simplex bit test), but due to there is fraction chip testing overlong time, cause whole
Individual testing process is time-consuming excessively, production capacity is relatively low；In order to improve this segment chip testing efficiency, we determine to enter existing test machine
Row improves, and can survey two chips (double) simultaneously, can so shorten and test the consumed time, and improve economic effect
Benefit.
The content of the invention
The purpose of the present invention be in view of the deficienciess of the prior art, provide one kind can realize duplexing bit test, and
Occupy little space, can the switching of single double double semiconductor die testing machine body.
Technical scheme：It is of the present invention solve the problems, such as used by technical scheme be：A kind of double semiconductor die testing machine
Device, including test machine cabinet and hanging machine case, two pci extended housings and two work(are installed in described test machine cabinet
Rate amplifier cabinet；Described hanging machine case includes left side skeleton, right side skeleton, top panel and downside transverse slat；Described left side
The front and rear side of skeleton and right side skeleton is provided with installation step and screwed hole, and the front side end and rear side of described test cabinet
End be provided with matching used installation step and screwed hole, by the cooperation of installation step and screwed hole make test machine cabinet and
Hanging machine case is detachably installed；And matrix cabinet is also equipped with described hanging machine case, described matrix cabinet and two pci
Extended housing and two power amplifier cabinets form the semiconductor die testing machine of double.
Preferably, the size of described test machine cabinet is：720mm*563mm*670mm；Described hanging machine case
Size is：563mm*670mm 720mm*262mm*670mm；The size of described pci extended housings is：178mm*450mm*
446mm；The size of described power amplifier cabinet is：133mm*450mm*523mm；The size of described matrix cabinet is：
224mm*440mm*593mm。
Preferably, also include dismountable test machine control panel, it is provided with described test machine control panel pair
The installation step and screwed hole answered；The test machine control panel is detachably arranged in the front side end of hanging outdoor unit cabinet；And inciting somebody to action
After hanging machine case dismounting, the test machine control panel is detachably arranged in the front side end of test machine cabinet.
Preferably, described test machine cabinet both sides are additionally provided with radiator fan, position is again provided with hanging machine case
Put corresponding radiator fan.
Beneficial effect：The invention has the advantages that：
(1) present invention pulls out the matrix cabinet of inside to come in the case where original Cabinet Size is constant；Installation two
Pci extended housings and two power amplifier cabinets, and in order to realize duplexing bit test, the electronic component of matrix cabinet inside
Quantity increase, volume can also become big, therefore set demountable hanging machine case installation matrix cabinet, the front end peace of hanging machine case
Test machine control panel is filled, being engaged by matrix cabinet with two pci extended housings and two power amplifier cabinets can
To realize duplexing bit test, and single unit system does not change the dimensional structure of former test cabinet, is more prone to assembling and realizes；
(2) present invention can also realize the switching of single-station and double, and hanging machine case is easily removable, after dismounting, survey
Test-run a machine control panel may be mounted at the front end of test machine cabinet, and test machine cabinet inside re-replaces into pci extended housings, work(
The structure of rate amplifier cabinet and original matrix cabinet, it is fewer due to only having available for the test of semiconductor chip single-station
The chip testing time is longer, it is necessary to which double is tested, and other chips still can use the test machine of single-station, thus not
With always using the test machine of double large volume, while also reduce the requirement to test machine quantity, cost is saved.
Brief description of the drawings
Fig. 1 is existing single-station test device；
Fig. 2 is the structure chart of the present invention；
Fig. 3 is hanging outdoor unit box structure figure in the present invention；
Fig. 4 is the test machine control panel structure chart of front end in the present invention.
Embodiment
Below in conjunction with the accompanying drawings and specific embodiment, the present invention is furture elucidated, and the present embodiment is with technical solution of the present invention
Premised under implemented, it should be understood that these embodiments are only illustrative of the invention and is not intended to limit the scope of the invention.
As shown in Figure 2, Figure 3 and Figure 4, a kind of double semiconductor die testing machine device, including test machine cabinet 1 and outer
On-hook case 2, two pci extended housings 3 and two power amplifier cabinets 4 are installed in described test machine cabinet 1；Described
Hanging machine case 2 includes left side skeleton 21, right side skeleton 22, top panel 23 and downside transverse slat 24；Described left side skeleton 21 and the right side
The front and rear side of side skeleton 22 is provided with installation step 26 and screwed hole 27, and the front side end and rear side of described test cabinet 1
End is provided with matching used installation step and screwed hole, makes test machine machine by the cooperation of installation step 26 and screwed hole 27
Case 1 and hanging machine case 2 are detachably installed；And matrix cabinet 5 is also equipped with described hanging machine case 2, described matrix cabinet 5
The semiconductor die testing machine of double is formed with two pci extended housings 3 and two power amplifier cabinets.
In the present invention, the size constancy of test machine cabinet 1, pci extended housings 3 and power amplifier cabinet 4, and matrix machine
Case 5 becomes big, and the size of described test machine cabinet 1 is：720mm*563mm*670mm；The size of described hanging machine case 2 is：
720mm*262mm*670mm；The size of described pci extended housings 3 is：178mm*450mm*446mm；Described power amplification
The size of device cabinet 4 is：133mm*450mm*523mm；The size of described matrix cabinet 5 is：224mm*440mm*593mm.
Also include dismountable test machine control panel 6, corresponding installation is provided with described test machine control panel 6
Step 26 and screwed hole 27；The test machine control panel 6 is detachably arranged in the front side end of hanging outdoor unit cabinet 1；And by outside
After on-hook case 2 is dismantled, the test machine control panel 6 is detachably arranged in the front side end of test machine cabinet 1.
The described both sides of test machine cabinet 1 are additionally provided with radiator fan 7, and it is relative to be again provided with position on hanging machine case 2
The radiator fan 7 answered.
The present invention pulls out the matrix cabinet of inside to come in the case where original Cabinet Size is constant；Two pci are installed
Extended housing and two power amplifier cabinets, and in order to realize duplexing bit test, the electronic component number of matrix cabinet inside
Amount increase, volume can also become big, therefore set demountable hanging machine case installation matrix cabinet, the front end installation of hanging machine case
Test machine control panel, can is engaged with two pci extended housings and two power amplifier cabinets by matrix cabinet
Duplexing bit test is realized, and single unit system does not change the dimensional structure of former test cabinet, is more prone to assembling and realizes.
The present invention can also realize the switching of single-station and double, and hanging machine case is easily removable, after dismounting, test machine
Control panel may be mounted at the front end of test machine cabinet, and test machine cabinet inside re-replaces into pci extended housings, power is put
The structure of big device cabinet and original matrix cabinet, available for the test of semiconductor chip single-station, due to there was only fewer chip
Testing time is longer, it is necessary to which double is tested, and other chips still can use the test machine of single-station, thus without one
It is straight to use the test machine of double large volume, while the requirement to test machine quantity is also reduced, save cost.
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (4)
- A kind of 1. double semiconductor die testing machine device, it is characterised in that：Including test machine cabinet (1) and hanging machine case (2) two pci extended housings (3) and two power amplifier cabinets (4), are installed in described test machine cabinet (1)；It is described Hanging machine case (2) include left side skeleton (21), right side skeleton (22), top panel (23) and downside transverse slat (24)；A described left side The front and rear side of side skeleton (21) and right side skeleton (22) is provided with installation step (26) and screwed hole (27), and described test The front side end and rear side end of cabinet (1) are provided with matching used installation step and screwed hole, by installation step (26) and The cooperation of screwed hole (27) makes test machine cabinet (1) and hanging machine case (2) detachably install；And in described hanging machine case (2) It is also equipped with matrix cabinet (5), described matrix cabinet (5) and two pci extended housings (3) and two power amplifier cabinets Form the semiconductor die testing machine of double.
- A kind of 2. double semiconductor die testing machine device according to claim 1, it is characterised in that：The size of described test machine cabinet (1) is：720mm*563mm*670mm；The size of described hanging machine case (2) is：720mm*262mm*670mm；The size of described pci extended housings (3) is：178mm*450mm*446mm；The size of described power amplifier cabinet (4) is：133mm*450mm*523mm；The size of described matrix cabinet is：224mm*440mm*593mm.
- A kind of 3. double semiconductor die testing machine device according to claim 1, it is characterised in that：Also include removable The test machine control panel (6) unloaded, corresponding installation step (26) and screw thread are provided with described test machine control panel (6) Hole (27)；The test machine control panel (6) is detachably arranged in the front side end of hanging outdoor unit cabinet (1)；And by hanging machine case (2) after dismantling, the test machine control panel (6) is detachably arranged in the front side end of test machine cabinet (1).
- A kind of 4. double semiconductor die testing machine device according to claim 1, it is characterised in that：Described test Machine cabinet (1) both sides are additionally provided with radiator fan (7), and the corresponding radiator fan in position is again provided with hanging machine case (2) (7)。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710892727.9A CN107561430A (en) | 2017-09-27 | 2017-09-27 | A kind of double semiconductor die testing machine device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710892727.9A CN107561430A (en) | 2017-09-27 | 2017-09-27 | A kind of double semiconductor die testing machine device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107561430A true CN107561430A (en) | 2018-01-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710892727.9A Pending CN107561430A (en) | 2017-09-27 | 2017-09-27 | A kind of double semiconductor die testing machine device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112880979A (en) * | 2021-01-19 | 2021-06-01 | 苏州长光华芯光电技术股份有限公司 | Double-station device for testing luminous chip |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100013495A1 (en) * | 2008-07-21 | 2010-01-21 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Testing card for peripheral component interconnect interfaces |
| CN101995491A (en) * | 2009-08-26 | 2011-03-30 | 中芯国际集成电路制造(上海)有限公司 | Adaptation board, modifying method of double-station testing machine and testing method thereof |
| CN103687364A (en) * | 2013-11-29 | 2014-03-26 | 成都国蓉科技有限公司 | Power source box |
| CN104133127A (en) * | 2014-07-07 | 2014-11-05 | 珠海市运泰利自动化设备有限公司 | Multifunctional linkage test device |
| CN207457431U (en) * | 2017-09-27 | 2018-06-05 | 上海旻艾半导体有限公司 | Double-station semiconductor die testing machine device |
-
2017
- 2017-09-27 CN CN201710892727.9A patent/CN107561430A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100013495A1 (en) * | 2008-07-21 | 2010-01-21 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Testing card for peripheral component interconnect interfaces |
| CN101995491A (en) * | 2009-08-26 | 2011-03-30 | 中芯国际集成电路制造(上海)有限公司 | Adaptation board, modifying method of double-station testing machine and testing method thereof |
| CN103687364A (en) * | 2013-11-29 | 2014-03-26 | 成都国蓉科技有限公司 | Power source box |
| CN104133127A (en) * | 2014-07-07 | 2014-11-05 | 珠海市运泰利自动化设备有限公司 | Multifunctional linkage test device |
| CN207457431U (en) * | 2017-09-27 | 2018-06-05 | 上海旻艾半导体有限公司 | Double-station semiconductor die testing machine device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112880979A (en) * | 2021-01-19 | 2021-06-01 | 苏州长光华芯光电技术股份有限公司 | Double-station device for testing luminous chip |
| CN112880979B (en) * | 2021-01-19 | 2023-11-28 | 苏州长光华芯光电技术股份有限公司 | Double-station device for testing light-emitting chip |
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Address after: 201306 Pudong New Area 6 new town, 66 Nanhui, Shanghai Applicant after: Shanghai semiconductor Semiconductor Co., Ltd. Address before: 200120 6 6, Fei Du Road, Lingang New Town, Pudong New Area, Shanghai. Applicant before: Shanghai min AI Mdt InfoTech Ltd |
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