CN107557733B - Method for plating silver on electrical contact - Google Patents
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- CN107557733B CN107557733B CN201710764200.8A CN201710764200A CN107557733B CN 107557733 B CN107557733 B CN 107557733B CN 201710764200 A CN201710764200 A CN 201710764200A CN 107557733 B CN107557733 B CN 107557733B
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- 238000007747 plating Methods 0.000 title claims abstract description 70
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 46
- 239000004332 silver Substances 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 28
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 46
- 238000004140 cleaning Methods 0.000 claims abstract description 39
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims abstract description 30
- 238000007733 ion plating Methods 0.000 claims abstract description 19
- 229910052786 argon Inorganic materials 0.000 claims abstract description 15
- 238000001035 drying Methods 0.000 claims abstract description 15
- 238000010849 ion bombardment Methods 0.000 claims abstract description 15
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000010891 electric arc Methods 0.000 claims abstract description 11
- 239000007789 gas Substances 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims abstract description 8
- 238000005086 pumping Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 230000007935 neutral effect Effects 0.000 claims description 7
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 7
- 238000001291 vacuum drying Methods 0.000 claims description 7
- 238000005498 polishing Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 150000002500 ions Chemical class 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention discloses a method for plating silver on an electrical contact, which comprises the following steps: (1) carrying out surface oil removal and rust removal treatment on the electrical contact, and cleaning and drying the electrical contact; (2) placing the electrical contact into a plating chamber, and pumping the vacuum degree of the plating chamber to 10‑5Pa～10‑4Pa, then introducing argon, and keeping the vacuum degree less than 2 Pa; (3) starting a pulse Ag target power supply and a pulse negative bias power supply to carry out ion bombardment cleaning on the power contact; (4) adjusting the gas discharge current density of the cathode to be in micro-arc discharge to obtain the current density>0.1A/cm2While<1A/cm2The micro-arc ion plating method is used for silver plating, the silver plating time is 1-2h, and the silver-plated electrical contact is obtained; (5) and cooling, and taking out the silver-plated electrical contact after the temperature is reduced to room temperature along with the furnace. The micro-arc ion plating method is adopted to carry out silver plating treatment on the electrical contact, and the method has the advantages of environmental protection, better plating binding force, higher efficiency and the like.
Description
Technical Field
The invention belongs to the technical field of electric contact manufacturing, and particularly relates to a silver plating method for an electric contact.
Background
High-voltage circuit breakers and disconnectors are the most important components in power systems, and electrical contacts are indispensable electrical contact devices of high-voltage switches such as circuit breakers and disconnectors, and it is very important that the high reliability is achieved. In order to reduce the contact resistance, a layer of silver is plated on the contact part of the conductive contact in an electroplating mode to prevent the contact from being oxidized and improve the conductivity. The contact of the switch equipment has a self-cleaning function during operation, namely, the contact needs to be subjected to surface self-cleaning through friction when being contacted and closed, and the contact is in failure in order to prevent a silver coating layer from peeling off in the friction process and ensure the binding force of the coating.
The silver coating is a noble metal coating, has the functions of lubrication, friction reduction, adhesion prevention, conductivity enhancement and the like as a functional coating, is widely applied to various fields, is easy to polish, and has strong light reflecting capacity and good heat conduction, electric conduction and welding performance. Silver plating was first applied for decoration. In the electronic industry, the communication equipment and the instrument manufacturing industry, silver plating is widely adopted to reduce the contact resistance of the surfaces of metal parts and improve the welding capacity of the metal. In addition, metallic reflectors in searchlights and other reflectors also need to be silvered. Silver plating is not suitable for printed circuit boards because silver atoms are easy to diffuse and slide along the surface of the material, and the silver whiskers are easy to generate in humid atmosphere to cause short circuit, and the used silver plating solution is mainly cyanide plating solution.
At present, the most common silver plating process of the electrical contact is silver electroplating, and the following problems exist in the method of hanging plating by adopting cyanide plating solution: (1) the rack plating is suitable for single-piece small-batch production, and the production efficiency is low; (2) the binding force of the coating is unreliable due to the limitation of the process and the pre-plating treatment, and the coating falls off in the friction process; (3) the silver electroplating process is carried out in cyanide electroplating solution, and cyanide is extremely toxic and easily causes harm to human bodies and pollution to the environment.
Disclosure of Invention
Aiming at the technical problems, the invention provides a silver plating method for an electric contact, which is more environment-friendly, has better plating layer bonding force and higher efficiency.
The technical scheme of the invention is as follows: a method of silver plating an electrical contact comprising the steps of:
(1) carrying out surface oil removal and rust removal treatment on the electrical contact, and cleaning and drying the electrical contact;
(2) putting the electrical contact into a plating chamber, pumping the vacuum degree of the plating chamber to 10 < -5 > Pa to 10 < -4 > Pa, introducing argon, and keeping the vacuum degree less than 2 Pa;
(3) starting a pulse Ag target power supply and a pulse negative bias power supply to carry out ion bombardment cleaning on the power contact;
(4) adjusting the gas discharge current density of the cathode to be in micro-arc discharge, and carrying out silver plating by a micro-arc ion plating method with the current density being more than 0.1A/cm2 and less than 1A/cm2 for 1-2h to obtain a silver-plated electrical contact;
(5) and cooling, and taking out the silver-plated electrical contact after the temperature is reduced to room temperature along with the furnace.
Furthermore, the material of the electrical contact can be any one of aluminum material, pure copper material, CuCr1 material, CuCr1Zr material or CuW alloy material.
Further, the shape of the electrical contact is a solid of revolution or a plate.
Further, the surface of the electrical contact is polished in the step (1), the electrical contact is placed in a neutral oil and rust removing agent, an ultrasonic cleaning machine is used for cleaning an electrical contact sample for 10-20min at the frequency of 20 KHZ-50 KHZ, and the cleaned electrical contact is placed in a vacuum drying machine for drying for 1-5 min.
Further, the flow rate of the argon in the step (2) is 30-250 CCM.
Further, the ion bombardment cleaning parameters of the step (3) are as follows: the pulse Ag target voltage is 400V-1000V, the pulse width is 0.5 mus-5 mus, and the pulse frequency is 12 KHz-20 KHz; the pulse negative bias is-150V to-500V, the pulse width is 0.5 mu s to 2 mu s, and the pulse frequency is 25KHz to 100 KHz; the ion cleaning time is 20-40 min.
Further, the process parameters of the micro-arc ion plating method in the step (4) are as follows: keeping the vacuum degree at 0.8-1.3 Pa, the pulse Ag target voltage at 350-650V, the pulse width at 2.5-20 mus, and the total range of gradient pulse frequency at 10-100 KHz; the pulse negative bias is-50V to-150V, the pulse width is 0.2-4.5 mus, the pulse frequency is 120 KHz-180 KHz, and the silver plating time is 1-2 h.
Further, the gradient pulse frequency in step (2) includes a first gradient: the pulse frequency is 10 KHz-30 KHz, and the pulse width is 80 mus-280 mus; a second gradient: the pulse frequency is 60 KHz-70 KHz, and the pulse width is 300 mus-800 mus; a third gradient: the pulse frequency is 70 KHz-100 KHz, and the pulse width is 1000 mus-2000 mus.
Compared with the prior art, the invention has the beneficial effects that: the invention adjusts the gas discharge current density of the cathode to be in a micro-arc discharge area, and the current density>0.1A/cm2(glow discharge) by<1A/cm2(arc discharge), control the gas discharge in the critical range of glow discharge to arc discharge, make the source of the plating material have magnetron sputtering "cascade collision" and "hot emission" of the multi-arc ion plating at the same time, form the micro arc ion plating method, adopt the micro arc ion plating method to carry on the silver plating to the electrical contact, have deposition rate fast, around advantages such as being good of plating nature, the coating thickness that is prepared distributes evenly, compactness is high, the cohesion is good, wear-resisting and coefficient of friction are low. Compared with the silver electroplating process, the preparation method is simpler and more stable, has less working procedures and high yield, and can meet the requirements of industrial production. In a word, the method for plating silver on the electrical contact has the advantages of environmental protection, better plating layer bonding force, higher efficiency and the like.
Detailed Description
In order to facilitate an understanding of the invention, further explanation follows with reference to specific examples.
Example 1
A method of silver plating an electrical contact comprising the steps of:
(1) carrying out surface oil removal and rust removal treatment on the electrical contact, and cleaning and drying the electrical contact; the electrical contact is made of pure copper materials and is in a shape of a revolving body, the surface of the electrical contact is polished by a polishing machine, then the electrical contact is placed in a neutral oil and rust removing agent, an ultrasonic cleaning machine is used for cleaning an electrical contact sample at a frequency of 20KHZ for 10min, and then the cleaned electrical contact is placed in a vacuum drying machine for drying for 1 min.
(2) Placing the electrical contact into a plating chamber, pumping the vacuum degree of the plating chamber to 10-5Pa, and introducing argon, wherein the flow rate of the argon is 30CCM, and the vacuum degree is kept at 0.5 Pa;
(3) and starting a pulse Ag target power supply and a pulse negative bias power supply to carry out ion bombardment cleaning on the power contact, wherein the ion bombardment cleaning parameters are as follows: the pulse Ag target voltage is 400V, the pulse width is 0.5 mu s, and the pulse frequency is 12 KHz; the pulse negative bias is-150V, the pulse width is 0.5 mus, and the pulse frequency is 25 KHz; the ion cleaning time is 20 min.
(4) Adjusting the gas discharge current density of the cathode to be in micro-arc discharge, and carrying out silver plating by a micro-arc ion plating method with the current density being more than 0.1A/cm2 and less than 1A/cm2 for 1h to obtain a silver-plated electrical contact; wherein, the process parameters of the micro-arc ion plating method are as follows: the vacuum degree is kept at 0.8Pa, the pulse Ag target voltage is 350V, the pulse width is 2.5 mu s, and the gradient pulse frequency comprises a first gradient: the pulse frequency is 10KHz, and the pulse width is 80 mus; a second gradient: the pulse frequency is 60KHz, and the pulse width is 300 mus; a third gradient: the pulse frequency is 70KHz, and the pulse width is 1000 mus; the pulse negative bias is-50 VV, the pulse width is 0.2 mus, the pulse frequency is 120KHz, and the silver plating time is 1 h.
(5) And cooling, and taking out the silver-plated electrical contact after the temperature is reduced to room temperature along with the furnace.
And (3) testing results: the thickness was 25 μm, the surface roughness was 1.1 μm, the hardness was HV130, the porosity was 28/cm 2, and the plating resistivity was 18 μ Ω.
Example 2
A method of silver plating an electrical contact comprising the steps of:
(1) carrying out surface oil removal and rust removal treatment on the electrical contact, and cleaning and drying the electrical contact; the electrical contact is made of CuCr1 material and is in the shape of a revolving body, the surface of the electrical contact is polished by a polishing machine, then the electrical contact is put into a neutral oil and rust removing agent, an ultrasonic cleaning machine is used for cleaning an electrical contact sample at the frequency of 30KHZ for 15min, and then the cleaned electrical contact is put into a vacuum drying machine for drying for 3 min.
(2) And placing the electric contact into a plating chamber, pumping the vacuum degree of the plating chamber to 10-5Pa, and introducing argon, wherein the flow rate of the argon is 140CCM, and the vacuum degree is kept at 1 Pa.
(3) Starting a pulse Ag target power supply and a pulse negative bias power supply to carry out ion bombardment cleaning on the power contact; wherein the ion bombardment cleaning parameters are as follows: the pulse Ag target voltage is 700V, the pulse width is 2.5 mus, and the pulse frequency is 16 KHz; the pulse negative bias is-320V, the pulse width is 1.2 mus, and the pulse frequency is 60 KHz; the ion cleaning time is 30 min.
(4) Adjusting the gas discharge current density of the cathode to be in micro-arc discharge, and carrying out silver plating by a micro-arc ion plating method with the current density being more than 0.1A/cm2 and less than 1A/cm2, wherein the silver plating time is 1.5h, so as to obtain a silver-plated electrical contact; wherein, the process parameters of the micro-arc ion plating method are as follows: the vacuum degree is kept to be 1Pa, the pulse Ag target voltage is 500V, the pulse width is 12 mu s, and the gradient pulse frequency comprises a first gradient: the pulse frequency is 20KHz, and the pulse width is 180 mus; a second gradient: the pulse frequency is 65KHz, and the pulse width is 650 mus; a third gradient: the pulse frequency is 85KHz, and the pulse width is 1500 mus; the pulse negative bias is-100V, the pulse width is 2 mus, the pulse frequency is 150KHz, and the silver plating time is 1.5 h.
(5) And cooling, and taking out the silver-plated electrical contact after the temperature is reduced to room temperature along with the furnace.
And (3) testing results: the thickness was 35 μm, the surface roughness was 0.9 μm, the hardness was HV145, the porosity was 20/cm 2, and the plating resistivity was 17 μ Ω.
Example 3
(1) Carrying out surface oil removal and rust removal treatment on the electrical contact, and cleaning and drying the electrical contact; the electrical contact is made of CuCr1Zr material and is shaped into a plate, the surface of the electrical contact is polished by a polishing machine, then the electrical contact is put into a neutral oil and rust removing agent, an ultrasonic cleaning machine is used for cleaning an electrical contact sample at a frequency of 50KHZ for 20min, and then the cleaned electrical contact is put into a vacuum drying machine for drying for 5 min.
(2) Placing the electrical contact into a plating chamber, pumping the vacuum degree of the plating chamber to 10-4Pa, and introducing argon, wherein the flow rate of the argon is 250CCM, and the vacuum degree is kept at 1.5 Pa;
(3) starting a pulse Ag target power supply and a pulse negative bias power supply to carry out ion bombardment cleaning on the power contact; wherein the ion bombardment cleaning parameters are as follows: the pulse Ag target voltage is 1000V, the pulse width is 5 mus, and the pulse frequency is 20 KHz; the pulse negative bias is-500V, the pulse width is 2 mus, and the pulse frequency is 100 KHz; the ion cleaning time is 40 min.
(4) Adjusting the gas discharge current density of the cathode to be in micro-arc discharge, and carrying out silver plating by using a micro-arc ion plating method with the current density being more than 0.1A/cm2 and less than 1A/cm2, wherein the silver plating time is 2h, so as to obtain a silver-plated electrical contact; wherein, the process parameters of the micro-arc ion plating method are as follows: the vacuum degree is kept at 1.3Pa, the pulse Ag target voltage is 650V, the pulse width is 20 mus, and the gradient pulse frequency comprises a first gradient: the pulse frequency is 30KHz, and the pulse width is 280 mus; a second gradient: the pulse frequency is 70KHz, and the pulse width is 800 mus; a third gradient: the pulse frequency is 100KHz, and the pulse width is 2000 mus; the pulse negative bias is-150V, the pulse width is 4.5 mus, the pulse frequency is 180KHz, and the silver plating time is 2 h.
(5) And cooling, and taking out the silver-plated electrical contact after the temperature is reduced to room temperature along with the furnace.
And (3) testing results: the thickness was 45 μm, the surface roughness was 0.8 μm, the hardness was HV150, the porosity was 22/cm 2, and the plating resistivity was 18 μ Ω.
Example 4
A method of silver plating an electrical contact comprising the steps of:
(1) carrying out surface oil removal and rust removal treatment on the electrical contact, and cleaning and drying the electrical contact; the electrical contact is made of aluminum materials and is shaped as a plate, the surface of the electrical contact is polished by a polishing machine, then the electrical contact is placed in a neutral oil and rust removing agent, an ultrasonic cleaning machine is used for cleaning an electrical contact sample at a frequency of 25KHZ for 12min, and then the cleaned electrical contact is placed in a vacuum drying machine for drying for 4 min.
(2) And placing the electrical contact into a plating chamber, pumping the vacuum degree of the plating chamber to 10-4Pa, and introducing argon, wherein the flow rate of the argon is 160CCM, and the vacuum degree is kept to 1.2 Pa.
(3) Starting a pulse Ag target power supply and a pulse negative bias power supply to carry out ion bombardment cleaning on the power contact; wherein the ion bombardment cleaning parameters are as follows: the pulse Ag target voltage is 680V, the pulse width is 2.0 mus, and the pulse frequency is 15 KHz; the pulse negative bias is-280V, the pulse width is 1.2 mus, and the pulse frequency is 60 KHz; the ion cleaning time is 30 min.
(4) Adjusting the gas discharge current density of the cathode to be in micro-arc discharge, and carrying out silver plating by a micro-arc ion plating method with the current density being more than 0.1A/cm2 and less than 1A/cm2, wherein the silver plating time is 1.5h, so as to obtain a silver-plated electrical contact; wherein, the process parameters of the micro-arc ion plating method are as follows: the vacuum degree is kept to be 1Pa, the pulse Ag target voltage is 450V, the pulse width is 15 mu s, and the gradient pulse frequency comprises a first gradient: the pulse frequency is 22KHz, and the pulse width is 200 mus; a second gradient: the pulse frequency is 62KHz, and the pulse width is 600 mus; a third gradient: the pulse frequency is 80KHz, and the pulse width is 1300 mus; the pulse negative bias is-85V, the pulse width is 2.3 mus, the pulse frequency is 155KHz, and the silver plating time is 1.5 h.
(5) And cooling, and taking out the silver-plated electrical contact after the temperature is reduced to room temperature along with the furnace.
And (3) testing results: the thickness was 30 μm, the surface roughness was 1.0 μm, the hardness was HV135, the porosity was 24/cm 2, and the plating resistivity was 19 μ Ω.
Example 5
A method of silver plating an electrical contact comprising the steps of:
(1) carrying out surface oil removal and rust removal treatment on the electrical contact, and cleaning and drying the electrical contact; the electrical contact is made of CuW alloy material and is in a shape of a revolving body, the surface of the electrical contact is polished by a polishing machine, then the electrical contact is put into a neutral oil and rust removing agent, an ultrasonic cleaning machine is used for cleaning an electrical contact sample for 15min at the frequency of 30KHZ, and then the cleaned electrical contact is put into a vacuum drying machine for drying for 3 min.
(2) And placing the electric contact into a plating chamber, pumping the vacuum degree of the plating chamber to 10-5Pa, and introducing argon, wherein the flow rate of the argon is 140CCM, and the vacuum degree is kept at 1 Pa.
(3) Starting a pulse Ag target power supply and a pulse negative bias power supply to carry out ion bombardment cleaning on the power contact; wherein the ion bombardment cleaning parameters are as follows: the pulse Ag target voltage is 700V, the pulse width is 2.5 mus, and the pulse frequency is 16 KHz; the pulse negative bias is-320V, the pulse width is 1.2 mus, and the pulse frequency is 60 KHz; the ion cleaning time is 30 min.
(4) Adjusting the gas discharge current density of the cathode to be in micro-arc discharge, and carrying out silver plating by a micro-arc ion plating method with the current density being more than 0.1A/cm2 and less than 1A/cm2, wherein the silver plating time is 1.5h, so as to obtain a silver-plated electrical contact; wherein, the process parameters of the micro-arc ion plating method are as follows: the vacuum degree is kept to be 1Pa, the pulse Ag target voltage is 500V, the pulse width is 12 mu s, and the gradient pulse frequency comprises a first gradient: the pulse frequency is 20KHz, and the pulse width is 180 mus; a second gradient: the pulse frequency is 65KHz, and the pulse width is 650 mus; a third gradient: the pulse frequency is 85KHz, and the pulse width is 1500 mus; the pulse negative bias is-100V, the pulse width is 2 mus, the pulse frequency is 150KHz, and the silver plating time is 1.5 h.
(5) And cooling, and taking out the silver-plated electrical contact after the temperature is reduced to room temperature along with the furnace.
And (3) testing results: the thickness was 36 μm, the surface roughness was 0.9 μm, the hardness was HV160, the porosity was 18/cm 2, and the plating resistivity was 16 μ Ω.
While the invention has been described and illustrated with reference to specific embodiments thereof, those skilled in the art will appreciate that various changes, modifications and substitutions can be made therein without departing from the spirit and scope of the invention. It is the intention, therefore, to be limited only as indicated by the scope of the claims which follow and that such claims be interpreted as broadly as is reasonable.
Claims (1)
1. A method of silver plating an electrical contact comprising the steps of:
(1) carrying out surface oil removal and rust removal treatment on the electrical contact, and cleaning and drying the electrical contact;
(2) putting the electrical contact into a plating chamber, pumping the vacuum degree of the plating chamber to 10 < -5 > Pa to 10 < -4 > Pa, introducing argon, and keeping the vacuum degree less than 2 Pa;
(3) starting a pulse Ag target power supply and a pulse negative bias power supply to carry out ion bombardment cleaning on the power contact;
(4) adjusting the gas discharge current density of the cathode to be in micro-arc discharge, and carrying out silver plating by a micro-arc ion plating method with the current density being more than 0.1A/cm2 and less than 1A/cm2 for 1-2h to obtain a silver-plated electrical contact;
(5) cooling, taking out the silver-plated electrical contact after the temperature is reduced to room temperature along with the furnace;
the material of the electrical contact can be any one of aluminum material, pure copper material, CuCr1 material, CuCr1Zr material or CuW alloy material;
the shape of the electrical contact is a revolving body or a plate;
polishing the surface of the electrical contact, putting the electrical contact into a neutral oil and rust removing agent, cleaning an electrical contact sample for 10-20min at a frequency of 20-50 KHZ by using an ultrasonic cleaning machine, and then putting the cleaned electrical contact into a vacuum drying machine for drying for 1-5 min;
the flow rate of the argon in the step (2) is 30-260 CCM;
the ion bombardment cleaning parameters of the step (3) are as follows: the pulse Ag target voltage is 400V-1000V, the pulse width is 0.5 mus-5 mus, and the pulse frequency is 12 KHz-20 KHz; the pulse negative bias is-150V to-500V, the pulse width is 0.5 mu s to 2 mu s, and the pulse frequency is 25KHz to 100 KHz; the ion cleaning time is 20-40 min;
the process parameters of the micro-arc ion plating method in the step (4) are as follows: keeping the vacuum degree at 0.8-1.3 Pa, the pulse Ag target voltage at 350-650V, the pulse width at 2.5-20 mus, and the total range of gradient pulse frequency at 10-100 KHz; the pulse negative bias is-50V to-150V, the pulse width is 0.2-4.5 mus, the pulse frequency is 120 KHz-180 KHz, and the silver plating time is 1-2 h.
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| CN108468030B (en) * | 2018-03-20 | 2020-05-19 | 西安福莱电工合金有限公司 | Magnetron sputtering method for silver plating on surface of copper contact |
| CN112366107B (en) * | 2020-11-11 | 2021-12-10 | 福达合金材料股份有限公司 | Preparation method of silver metal oxide sheet-shaped electrical contact |
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| JPH05101890A (en) * | 1991-10-08 | 1993-04-23 | Tdk Corp | Electrode forming method of electroluminescent element |
| CN1426870A (en) * | 2001-12-17 | 2003-07-02 | 中国科学院兰州化学物理研究所 | Silver base conductive cold preventive welding film |
| CN103397304A (en) * | 2013-08-21 | 2013-11-20 | 南京浩穰环保科技有限公司 | Micro-arc ion plating method |
| CN105925935A (en) * | 2016-05-17 | 2016-09-07 | 苏州市康普来表面处理科技有限公司 | Physical vapor deposition technology applied to communication system assembly for replacing water electroplating |
-
2017
- 2017-08-30 CN CN201710764200.8A patent/CN107557733B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05101890A (en) * | 1991-10-08 | 1993-04-23 | Tdk Corp | Electrode forming method of electroluminescent element |
| CN1426870A (en) * | 2001-12-17 | 2003-07-02 | 中国科学院兰州化学物理研究所 | Silver base conductive cold preventive welding film |
| CN103397304A (en) * | 2013-08-21 | 2013-11-20 | 南京浩穰环保科技有限公司 | Micro-arc ion plating method |
| CN105925935A (en) * | 2016-05-17 | 2016-09-07 | 苏州市康普来表面处理科技有限公司 | Physical vapor deposition technology applied to communication system assembly for replacing water electroplating |
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