CN1075451C - Flexible IC module and method of its manufacture, and method of manufacturing information carrier comprising flexible IC module - Google Patents

Abstract

There is a flexible IC module utilizable for the production of contactless IC cards and a method for producing an information carrier using the flexible IC module. IC chips are embedded in a flexible substrate comprising a nonwoven fabric or the like having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property. This flexible IC module is produced in the following procedure. A first nonwoven fabric having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property is placed on a bottom force. An IC chip and a coil are placed on the first nonwoven fabric after positioning them. A second nonwoven fabric is superposed on the IC chip and coil. A top force is pressed onto the second nonwoven fabric, and the first and second nonwoven fabrics, the IC chip and the coil are integrated by hot pressing.

Description

Flexible IC module and manufacture method thereof and the method for using flexible IC module manufacturing information carrier

The present invention relates to as flexible IC module, the method for making flexible IC module and the method for using flexible IC module manufacturing information carrier as the information carrier basis of contactless IC-card etc.

Can use contactless information carrier to replace monthly ticket, driving license, phonecard and cash card in the prior art as contactless IC-card etc., owing to reckoned with its extensive use, so one of most important technical assignment is how to simplify manufacturing step and reduce unit cost.

Here, for making the contactless IC-card, use following method now, comprise: the reinforcement material of being made by glass fibre or analog is passed in boring, leave in the hole with IC-card with as the coil of contactless signal transmitting apparatus, form substrate with resin-sealed hole then, and the preceding and dorsal part that at last cover plate is put into substrate obtains the contactless IC-card of needs.

According to this method, to suitable dimensions, can prepare and be arranged on the contactless IC-card that the interior coil position of substrate can be regulated exactly according to the size of the coil size adjustment by will boring.Thus, can carry out the transmission of electric power and signal between IC-card and the external unit expeditiously.

For another method; be disclosed in for example NIKKEI MECHANICAL1997.1.6; No.497; the 16-17 page or leaf; this method comprises: with the IC chip and as the coil of contactless data transmission device bonding on it first resin sheet and do not have second resin sheet of this IC chip and coil be placed on respectively the fixed mould of injector and flexible mould mutually in the face of on the part; close up mould; use the resin cavity filling then, obtain constituting the contactless IC-card that comprises first and second resin plates, IC chip and coil of one thus with potting resin.

According to this method, owing to can obtain the contactless IC-card that resin plate (cover plate) bonds to the front and the back side by injection molding, so the conventional method that its substrate that is embedded in IC chip and coil bonds to cover plate the preceding and back side of substrate later on curing is compared, the contactless IC-card can be more effectively made, and manufacturing cost can be reduced.

On the other hand, for being installed in being connected of IC chip on the contactless IC-card and coil, use usually to be installed in the IC chip on the circuit board and coil to be connected to method on the electrode terminal that is formed on the circuit board.

Molded on this method and technology, therefore can connect IC chip and circuit board and circuit board and coil in high reliability ground.

Yet in the conventional method of an above-mentioned preparation contactless IC-card, IC chip and coil leave in the hole that gets out in the reinforcement material, use the inside and outside of resin solidification hole then.Therefore, do not have the internal intensity in hole of reinforcement material very low, stress concentrates on the inside in hole, and when applying the improper external force of for example bending etc., substrate ruptures easily.

In addition, because with resin-sealed hole with resin dipping (impregnate) reinforcement material and solidify reinforcement material and must be arranged on exactly to be drilled with in the reinforcement material that needs the hole at IC chip and coil and carry out afterwards, so preparation process is very complicated, be difficult to the cheap information carrier of preparation.Particularly, when the different contactless IC-card of preparation on identical production line, according to deposit within it the IC chip and the size of coil, the size difference in the hole of different reinforcement materials.Thus, manufacturing step is further complicated, causes the manufacturing cost of contactless IC-card to increase.

On the other hand, because the conventional method of an above-mentioned back preparation contactless IC-card is to be placed on an injection molding on the mould with the cover plate that is bonded with IC chip and coil to carry out, the contact of high temperature melting resin applies and does not apply the partial cover plate of bonding agent.Therefore, have now found that since apply different with the thermal expansivity of those parts that do not apply bonding agent, easily at these portion boundary places formation wrinkle.According to experiment, even carry out various variations when resin temperature, injection rate and injection pressure, being difficult to make does not on the cover board have the contactless of wrinkle IC-card yet.

Because the contactless IC-card so those IC-card feels wrinkly from the teeth outwards and outward appearance are all not so good, has reduced commercial value with finger manipulation and very directly perceived.In addition, when printing cover plate surperficial after the preparation contactless IC-card, can not on the surface of card, carry out printing attractive in appearance, so they there is not commercial value equally.

In addition, the conventional method of attachment of IC chip and coil needs circuit board as necessary building block.Therefore, the cost height, and be difficult to make very thin flexible contactless IC-card.

The invention solves these problems, the purpose of this invention is to provide a kind of structure that can prepare the flexible IC module of information carrier easily, the method of a kind of low cost and the flexible IC module of high efficiency preparation is provided, and provides a kind of and use above flexible IC module with low cost and prepare the method for the fine and specious information carrier of feel when using expeditiously.

The structure of＜flexible IC module 〉

In order to overcome the above problems, structure for flexible IC module, this structure that the present invention uses comprises: at thickness direction compressibility arranged, have automatic pressurization adhesion property and resin dipping character and have the flexible base, board of given shape and intended size, and install and attach part on flexible base, board, that install is partially submerged in the groove that the part by the compressed flexible substrate forms.

The part of installing can be fully inserted in flexible base, board, or is embedded in the interior outside that partly is exposed to simultaneously of one side of flexible base, board.In the previous case, the front of the flexible base, board of formation and the back side are flat state, in the later case, comprise that the front and the back side of the flexible base, board on embedded part surface is flat state.

In this manual, " adhesion property automatically pressurizes " is meant this specific character of flexible base, board, promptly when under room temperature or heating, pressure being applied to flexible base, board, the fiber that constitutes flexible base, board is bonding, or when pressure is applied on a plurality of stacked flexible base, boards, these flexible base, boards are bonding mutually, and flexible base, board remains on the state that reduces than volume before exerting pressure.

For the textile fabric that also has automatic pressurization adhesion property, knitted fabric or adhesive-bonded fabric, can use those fibers of the so-called conjugate fibre that comprises that each is made up of the different part of two or more fusing points; Those fibers by the different synthetic resin of the two or more fusing points of blend spinning potpourri that obtain or the synthetic resin fiber that fusing point is different; And those fibers that comprise glass fibre, carbon fiber, Kepler's fiber, man-made fiber, natural fiber or their combination, these fibre resin bonding agents are bonding mutually.Woven fabric, knitted fabric, adhesive-bonded fabric or paper for they are pressurizeed adhesion property automatically with the synthetic resin of appropriate amount dipping can use those fibers that comprise glass fibre, carbon fiber, Kepler's fiber, man-made fiber, natural fiber or their combination.For adhesive-bonded fabric, can use all adhesive-bonded fabrics that have to fixed structure, those fibers that for example comprise the fibrous silk screen at random that obtains by the fabric synthetic resin fibril (filament) of opening melt spinning preparation, and the meticulous reticulate texture made of the synthetic resin fiber of the formulations prepared from solutions by the injection initial polymer.

If desired, the circuitous pattern that needs can be printed on the surface of the flexible base, board that parts are installed on it, and the sort circuit figure comprises transmission data/or the coil of power supply.

Installing and attach parts on flexible structure comprises and for example is selected from the IC chip, the IC module, the contactless transmitting device that is used for data and/or power supply, capacitor, resistor, solar cell, image display, optical record medium, Magnetooptic recording medium, the transparent code information display spare that uses infrared absorber to form, infrared transmitter or luminophor, and pinpoint accuracy ground is positioned at magnet or ferromagnet on the part that is provided with the carrier that is used for reader-write device with information carrier, and at least one part in the combination of these parts and other parts.Coil can be used as the contactless transmitting device of data and/or power supply.For the lead that constitutes coil, preferably include copper, aluminium or analog heart yearn, cover the weld metal layers (bonding metal layer) of heart yearn and as polyurethane etc. covers weld metal layers so that a kind of with as in the easy insulation course that is connected of other electronic unit of IC chip etc. as gold or scolder etc.

In addition, when IC chip and coil were installed as parts, the preferred input and output side that directly two ends of coil is connected to the IC chip was with the thickness that reduces flexible IC module and reduce cost.Be connected for IC chip and the direct of coil, can use wedge bonding (wedge bonding) method, but according to this method, there is following problem: 1. owing to the part in compression of coil is flattened, so burn out crushed element and the boundary member between the crushed element not sometimes by apply ultrasound wave and high pressure to the coupling part; 2. because ultrasound wave and high pressure are applied to the coupling part, and the IC chip is damaged sometimes, particularly when using the thick thin chip of about 50-150 μ m, damage clearly; 3. the condition that is provided with that needs complexity owing to ultrasound wave, so the control of condition of contact is very difficult, is difficult to produce stable flawless goods.Therefore, preferred especially the use and the welding method or the fusion welding method that can not produce these problems.

The method of the IC chip that has been pre-formed at input and output side by the prominent point (solder bump) of scolder is carried out the welding (soldering) of coil to the IC chip, the coil two ends that are used for the contactless transmission allow the prominent point of contact scolder, soldering tip is pressed onto the two ends of coil then, by the point of dashing forward from the energy melting solder of soldering tip.On the other hand, method by prominent some IC chip that has been pre-formed at input and output side of scolder is carried out the melting welding (welding) of coil to the IC chip, the coil two ends that are used for the contactless transmission allow the prominent point (gold bump) of contact gold, welding gun (welding head) is pressed onto the two ends of coil, by the prominent point of energy fusing gold from welding gun.

Enough use to the soldering tip of the welding that is higher than temperature of fusion and the welding gun of melting welding connecting METAL HEATING PROCESS, also can use the soldering tip of same structure.

In having the flexible IC module of above structure, that install is partly embedded in the substrate as adhesive-bonded fabric etc., and module can be protected mounted component effectively thus.In addition because substrate be by being formed by adhesive-bonded fabric or the analog with resin dipping, therefore can by with resin dipping substrate and by bonding cover plate preparation of impregnating resin as contactless IC-card etc. need information carrier.At this moment, can flood substrate substantially equably, therefore on the surface of substrate, not form wrinkle, and can prepare the information carrier of high commercial value with resin.In addition, in the IC of this structure module, substrate is made up of pliability very high adhesive-bonded fabric or analog, so it not only can be used as the ingredient of smooth information carrier, and can be used as and be provided at sweep or carry out the information carrier that repeated deformation is partly located.

The preparation method of＜flexible IC module 〉

The preparation method of flexible IC module is as follows:

1. preparing at thickness direction has compressibility, has automatic pressurization adhesion property and resin dipping character and has first flexible base, board and second flexible base, board of given shape and intended size.After this, the needs that install are partly located and are placed between first and second flexible base, boards.Then, under room temperature or heating, in thickness direction, compress these first flexible base, boards and second flexible base, board, thus first and second flexible base, boards are formed one, will mounted component be embedded in the groove that forms in substrate by applying force of compression simultaneously.

2. the needs that will install are partly located and are placed on the one side of flexible base, board.After this, under room temperature or heating in thickness direction the compressed flexible substrate, mounted component to be embedded in the groove of compressed flexible substrate formation.

According to above method 1. and 2., only material by stacked needs and parts then under room temperature or heating in thickness direction the lamination of compression gained just can obtain the flexible IC module of needs.Thus, can carry out the manufacturing of flexible IC module very expeditiously.

3. the IC chip is located and is placed on the one side of first flexible base, board.Individually, coil location and being placed on the one side of flexible second substrate.The distance that the two ends of coil are provided with is to be provided at the distance of setting between the input and output side of IC chip.Then, first and second flexible base, boards that superpose are so that placing the surface of first flexible base, board of IC chip faces mutually with the surface of second flexible base, board of placing coil, and the input and output side of IC chip contacts the two ends of coil.These first and second flexible base, boards compress in thickness direction under room temperature or heating, thus first and second flexible base, boards are combined into one, by exerting pressure IC chip and coil are embedded in the groove that forms in part first and second substrates simultaneously.In addition, from outside surface heat and pressure are applied to the input and output end parts with second substrate that two ends of input and output end parts and coil is electrically connected mutually with coil.

4. coil location and be placed on thickness direction and compressibility arranged, have automatic pressurization adhesion property and resin dipping character and have on the one side of flexible base, board of given shape and intended size the distance of the distance that the two ends of coil are provided with between the input and output side that is provided at the IC chip, setting.Then, the IC chip is placed on the one side of described flexible base, board, and input and output side allows two ends of contact coil.Under room temperature or heating, in thickness direction, compress this flexible base, board, IC chip and coil are embedded in the groove that forms in flexible base, board by exerting pressure.In addition, from outside surface heat and pressure are applied to the input and output end parts with second substrate that two ends of input and output end parts and coil is electrically connected mutually with coil.

According to method 3. and 4., the coil that IC chip and two ends are directly connected to the input and output side of IC chip is used as wants mounted component, can prepare thin IC module thus.In addition, two end predetermined fixed of coil are provided with distance between the end and equal the distance that is provided with between the input and output side of IC chip on flexible base, board, and IC chip and being connected of coil are easy to, and can prepare flexible IC module effectively.

The preparation method of＜information carrier 〉

The preparation method of information carrier is as follows:

1. prepare information carrier by the following method, may further comprise the steps: the reservations office that first cover plate and second cover plate is placed on the fixed mould and the flexible mould of injection mold device respectively; Flexible IC module is superimposed upon on the cover plate that is placed on fixed mould or flexible mould place; Closed fixed mould and flexible mould also are filled in resin in the cavity of mould formation; And flood flexible base, board equably with potting resin, open fixed mould and flexible mould then and take out as the information carrier that needs product.

According to this method, can omit and want the bonding of mounted component and cover plate.Thus, can carry out the preparation of information carrier effectively, in addition, the thermal load that is applied to cover plate during potting resin can homogenising, can prevent the wrinkling of the cover plate that caused by inhomogeneous thermal load.Therefore, can prepare high-quality information carrier expeditiously, in addition, the design and printing that can be satisfied with etc.And, because the part that will install that is supported by flexible base, board during potting resin is between two cover plates, therefore can select to be adjusted in the position that is provided with of parts in the thickness direction of information carrier by the thickness of regulating substrate.In addition, because the part that will install is supported by flexible base, board, can strengthen the effect of guard block thus.Certainly can be with the adhesive-bonded fabric and the analog of resin dipping owing to use, so resin can fill apace, can the negative effect mould cycle.

2. prepare information carrier by following method, may further comprise the steps: with first hot-melt plate, flexible IC module and second hot-melt plate with the upper surface of this sequential cascade at counterdie; The heating situation under in thickness direction will on be molded into the lamination that second hot-melt plate comes the compressed flexible IC module and first and second hot-melt plates, melt first and second hot-melt plates thus; And, make the module moulding obtain the information carrier of specific thickness by hot pressing afterwards with the flexible IC module of the melt impregnation of first and second hot-melt plates.

3. prepare information carrier by following method, may further comprise the steps: with first cover plate, first hot-melt plate, flexible IC module and second hot-melt plate and second cover plate with the upper surface of this sequential cascade at counterdie; Under the situation of heating in thickness direction will on be molded into the lamination of the second cover plate compressed flexible IC module, first and second hot-melt plates and first and second cover plates, melt first and second hot-melt plates thus; And, use melt bonds first and second cover plates simultaneously with the flexible IC module of the melt impregnation of first and second hot-melt plates, make the module moulding obtain the information carrier of specific thickness by hot pressing afterwards.

4. prepare information carrier by following method, may further comprise the steps: pull out the top (topend) that is wound on flexible IC module, first hot-melt plate and second hot-melt plate continuous on the roller from roller (roll); The flexible IC module that to pull out from each roller and the first and second hot-melt plates stacked roller that leads is layered in first and second hot-melt plates respectively on the front and the back side of flexible IC module; Lamination guiding heating-backer roll with the flexible IC module and first and second hot-melt plates compresses lamination in thickness direction under the situation of heating, melt first and second hot-melt plates thus; And with the flexible IC module of the melt impregnation of first and second hot-melt plates, roll-type compacting (roll pressing) makes the module moulding obtain the information carrier of specific thickness.

5. prepare information carrier by following method, may further comprise the steps: pull out the top that is wound on flexible IC module continuous on each roller, first hot-melt plate, second hot-melt plate, first cover plate and second cover plate from roller; Stacked roller first and second hot-melt plates that will lead from flexible IC module, first and second hot-melt plates and first and second cover plates that each roller is pulled out are laminated to respectively on the front and the back side of flexible IC module, and first and second cover plates are layered in respectively on the outside surface of first and second hot-melt plates; The lamination of flexible IC module, first and second hot-melt plates and first and second cover plates is directed to heating-backer roll, under the situation of heating, in thickness direction, compresses lamination, melt first and second hot-melt plates thus; And, use melt bonds first and second cover plates simultaneously with the flexible IC module of the melt impregnation of first and second hot-melt plates, the roll-type compacting makes the module moulding obtain the information carrier of specific thickness.

Manufacture method at 2. above-information carrier of mentioning in 5. has the effect identical with the method for front, in addition, owing to form the shell of flexible IC module by roll-type compacting, therefore can prepare information carrier expeditiously, thereby and the throughput rate that can improve information carrier reduced cost.

Fig. 1 is the planimetric map of the flexible IC module of first example according to the present invention, and is local cut.

Fig. 2 is the amplification profile along the line A-A intercepting of Fig. 1.

Fig. 3 is for being installed in the planimetric map of the critical piece of IC chip on the flexible IC module and coil according to first example.

Fig. 4 A and 4B are the sectional view of the lead of formation coil.

Fig. 5 A shows the sectional view of a method that directly is connected IC chip and coil and the state of coupling part with 5B.

Fig. 6 A shows the sectional view of another method that directly is connected IC chip and coil and the state of coupling part with 6B.

Fig. 7 shows the state that uses welder to be applied to direct installation IC chip and coil.

Fig. 8 is the planimetric map of second flexible IC module of example according to the present invention.

Fig. 9 is the amplification profile along the line B-B intercepting of Fig. 8.

Figure 10 shows the figure of first example of flexible IC module manufacture method.

Figure 11 A, 11B, 11C and 11D show the figure of second example of flexible IC module manufacture method.

Figure 12 A, 12B, 12C and 12D show the figure of second example of flexible IC module manufacture method.

Figure 13 A, 13B, 13C and 13D show the figure of first example of IC-card manufacture method.

Figure 14 shows the figure of second example of IC-card manufacture method.

Figure 15 shows the figure of the 3rd example of IC-card manufacture method.

Figure 16 shows the figure of the 4th example of IC-card manufacture method.

Figure 17 shows the figure of the 5th example of IC-card manufacture method.

In above figure, numeral 1 is represented the IC chip, and 1a represents input and output side, and 1b represents the scolder point of dashing forward, 1c represents scolder, 1d represents the prominent point (gold bump) of gold, and 2 represent coil, and 2a represents heart yearn, 2b represents insulation course, the 2c representative connects metal level, and 3 represent flexible base, board, and 4 represent first hot-melt plate, 5 represent second hot-melt plate, the flexible IC module of 10 representatives, 11 represent counterdie, and 12 represent first adhesive-bonded fabric, 13 represent second adhesive-bonded fabric, 14 represent patrix, and 15 represent groove, and 21 represent first intermediate product, 22 represent second intermediate product, 23 represent the 3rd intermediate product, and 24 represent ultrasonic vibrator, and 31 represent the phase one intermediate product, 32 represent second stage intermediate product, 33 represent the three phases intermediate product, and 41 represent first cover plate, and 42 represent fixed mould, 43 represent second cover plate, 44 represent moveable die, and 45 represent air vent, and 46 represent cavity, 47 representative inlets, 51 and 52 represent soldering tip, and 61a and 61b represent electrode, and 62 represent welding gun, the spool that 63a and 63b representative are reeled and be with, the high stopband of 64 representatives, 65 represent motor, and 71-79 represents roller.

Introduce first example of the flexible IC module according to the present invention below with reference to Fig. 1-7.Fig. 1 is the planimetric map according to the flexible IC module of this example, and is local cut.Fig. 2 is the amplification profile along the line A-A intercepting of Fig. 1.Fig. 3 is for being installed in the planimetric map of the critical piece of IC chip on the flexible IC module and coil according to this example.Fig. 4 A and 4B are the sectional view of the lead of formation coil.Fig. 5 A shows the sectional view of a method that directly is connected IC chip and coil and the state of coupling part with 5B.Fig. 6 A shows the sectional view of another method that directly is connected IC chip and coil and the state of coupling part with 6B.Fig. 7 shows the state that uses welder to be applied to direct installation IC chip and coil.

From Fig. 1-3 as can be seen, flexible IC module in this example comprises by IC chip 1 and coil 2 and embeds the flexible base, board 3 that the non-woven fleece in it is made fully, described coil 2 is directly connected to input and output side (pad) 1a of IC chip 1, in the contactless state, receive power supply from reader-write device (not shown) to the IC chip, in the contactless state from to reader-write device (not shown) transmission data.

For IC chip 1, can use the optional IC chip that is installed in routinely on the contactless IC-card, but preferred especially gross thickness reduces to the IC chip of about 50-150 μ m, so that reduce the thickness of contactless IC-card.The structure of IC chip is known, and this is not an inventive point of the present invention in addition, has therefore omitted the introduction to it.

For coil 2, can use by making, shown in Fig. 4 A as the high-conductive metal material of copper or aluminium etc. with as the insulation course 2b of covering heart yearn 2a such as resin.In addition, also can use and comprise heart yearn 2a, cover the weld metal layers 2c of heart yearn 2a and cover the insulation course 2b of weld metal layers 2c as gold or scolder etc., shown in Fig. 4 B.

The diameter of lead is 20-100 μ m, and this lead can depend on the characteristic of IC chip around a few to tens of circles, forms coil 2 thus.

Especially preferably carry out the direct welding (bon ding) of IC chip 1 and coil 2 by wedge bonding, welding or melting welding.

When wedge bonding IC chip 1 and coil 2, the input and output side 1a place that the prominent point of gold 1d is pre-formed at IC chip 1 is shown in Fig. 5 A.At this moment,, can use the coil that does not have weld metal layers 2c, but the preferred especially heart yearn 2a that covers with the gold layer, so that easier and weld securely for coil 2.Carry out the wedge bonding of input and output side 1a and coil 2 by following mode: the end of coil 2 is stacked on the input and output side 1a, and use ultrasound wave that soldering tip 51 is pressed on the coil 2, melt the prominent point of gold simultaneously by the energy carbonization insulation course 2b that produces, shown in Fig. 5 A.Thus, shown in Fig. 5 B, coil 2 directly is connected with the input and output side 1a of IC chip 1.

In the situation of welding IC chip 1 and coil 2, by plating the input and output side 1a place that scolder is pre-formed the prominent point of scolder 1b at IC chip 1, as shown in Figure 6A.At this moment,, can use the coil that does not have weld metal layers 2c, but the preferred especially heart yearn 2a that covers with gold layer or analog, so that improve and the wetting capacity of scolder and easier and weld securely for coil 2.Carry out the welding of input and output side 1a and coil 2 by following mode: the end of coil 2 is stacked on the input and output side 1a, the soldering tip 52 that is heated to fixed temperature is pressed on the coil 2, by the prominent point of an energy carbonization insulation course 2b while melting solder 1b who produces, as shown in Figure 6A.Thus, shown in Fig. 6 B, by the input and output side 1a of scolder 1c welding coil 2 and IC chip 1.At the prominent point of the input and output side 1a of IC chip 1 a formation scolder 1b place,, can top identical mode weld owing to can use the heart yearn 2a that covers with solder layer to be used as coil 2.In addition, also can form scolder prominent some 1b at the input and output side 1a place of IC chip 1 and use the heart yearn 2a that covers with solder layer as coil 2.

In the situation of melting welding IC chip 1 and coil 2, can use the prominent point of gold to be formed on the IC chip of input and output side 1a or comprise coil of conductive wire that the heart yearn 2a that covered by the gold layer forms or IC chip and coil all use.For welding machine, can use comprise that the slight distance that has with gap d is separated from each other the welding gun 62 of the electrode 61a that be arranged in parallel and 61b, the band that is provided at welding gun 62 places around spool (ribbon winding reel) 63a and 63b, reel and be arranged on band shape heating resistor 64 and the end of part resistance contact electrode 61a and 61b and the motor 65 that drives driven roller 63a on these spools 63a and the 63b, as shown in Figure 7.For band shape heating resistor 64, most preferably comprise the molybdenum band of highly purified monocrystalline molybdenum, be high specific electrical resistance and temperature conductivity owing to it, it can produce high temperature partly, and it has high strength in addition.

In melting welding, the end of coil 2 directly is stacked in the input and output side 1a of IC chip 1, and welding gun 62 is pressed into coil 2, as shown in Figure 7.Then, the pulse power is applied to electrode 61a and 61b, the heat carbonization insulation course 2b that utilizes band shape heating resistor 64 to produce, and prominent point of gold or gold layer that carbonization simultaneously covers heart yearn 2a perhaps all melt the two.Motor 65 is driven roller 63a on request, clean band shape heating resistor 64 total energy contact welding guns 62.When the brush of removing carbonide was provided on the band shape heating resistor 64, band shape heating resistor 64 can repeatedly use, and can reduce maintenance expense.

The welding machine of Fig. 7 also can be with being made in the heating source that weld at soldering tip 52 places, as shown in Figure 6A.

Adhesive-bonded fabric for constituting flexible base, board 3 can use any given adhesive-bonded fabric, as long as they have the compressibility of thickness direction, adhesion property and the resin dipping character of pressurizeing automatically.For example, can use and comprise that the silk screen that is formed by Manufactured staple fibre, staple fibre comprise glass fibre, carbon fiber, Kepler's fiber, man-made fiber, natural fiber or their combination.In addition, can use silk screen by the adhesive-bonded fabric of directly making, for example comprise by opening and moltenly spin synthetic resin yarn or have the tiny cancellated synthetic resin fibril made by the solution of injection initial polymer or those adhesive-bonded fabrics of irregular (random) fibroplastic silk screen that synthetic resin fiber obtains by the material spinning that is used for fiber.Have synthetic resin fiber silk screen adhesive-bonded fabric can by revolve the system bonding (spunbonding) method, melt and spray (melt blowing) method, the system of revolving (flash spinning) method etc. is made fast.In addition, the method for bonding gained silk screen comprises thermal bonding, latex bonded method etc.When use had the adhesive-bonded fabric of the silk screen that is formed by synthetic resin fiber, silk screen can be formed by the potpourri of the high-melting-point that is easy to bonding fiber and low-melting synthetic resin fiber.

For these adhesive-bonded fabrics,, therefore can use low-melting synthetic resin that contains at least a portion and the adhesive-bonded fabric that itself has automatic pressurization adhesion property because they are used as flexible base, board 3.On the other hand, after adhesive-bonded fabric produces the adhesion property that pressurizes automatically, do not contain low-melting synthetic resin and itself do not have the low-melting-point resin dipping of the adhesive-bonded fabric of automatic pressurization adhesion property, can be used as flexible base, board 3 thus yet with appropriate amount.

The thickness setting of considering the thickness of final contactless IC-card and making the cover plate that the contactless IC-card uses carries out the thickness of the flexible base, board 3 behind the pressing mold.Basically, thickness is enough to a certain extent greater than the thickness of wanting mounted component.For example, when the thick IC chip of 50 μ m 1 being installed and comprise diameter less than the coil of conductive wire 2 of the thickness of IC chip 1, the thickness of flexible base, board 3 can be for more than the 70 μ m, when the thick IC chip of 150 μ m 1 being installed and comprise diameter less than the coil of conductive wire 2 of the thickness of IC chip 1, the thickness of flexible base, board 3 can be for more than the 170 μ m.

In the situation of the flexible IC module of this example,, therefore can protect these IC chips 1 and coil 2 effectively because the IC chip 1 that will install and coil 2 are fully inserted in comprising the substrate 3 of adhesive-bonded fabric etc.In addition, because substrate 3 is by adhesive-bonded fabric with to have other of resin dipping character fibrous, therefore by with resin dipping substrate 3 with use the contactless IC-card that this resin bonding cover plate can be made to be needed.At this moment, substrate can flood with resin equably.Therefore, on the surface of substrate, do not form wrinkle, and, do not need to use the dividing plate (spacersheet) that is generally used for making the thickness homogenising.The contactless IC-card that can prepare thus, high commercial value.In addition, because the IC module of this structure comprises that substrate and the pliability is made up of adhesive-bonded fabric etc. are very high, it not only can be used as the ingredient of plate shape contactless IC-card, the part that also can be used as the ingredient of sweep or repeatedly be out of shape.

In addition, because the IC chip directly is connected with coil 2, so circuit board can omit, and the thickness of flexible IC module and final contactless IC-card can reduce, thereby can reduce manufacturing cost.Particularly, when welding method or fusion welding method are used for direct connection of IC chip and coil 2, and use the wedge bonding method to compare to obtain following advantage.Promptly, the wedge bonding method is undertaken by following method: on the coil 2 of soldering tip 51 weight to the input and output side 1a that is stacked in IC chip 1, to be applied to welding portion simultaneously by the ultrasound wave that soldering tip 51 sends and make insulation course 2b fracture, and quicken the fusing of gold plate 2d by energy.Therefore, shown in Fig. 5 B, the end of coil 2 is deformed into flat condition, easily breaks in the marginal portion of crushed element not.In addition, the wedge bonding method applies ultrasound wave and high pressure to the coupling part, is easy to damage the IC chip, and damage is very remarkable when using the thick thin IC chip of about 50-150 μ m.In addition, because the wedge bonding method has utilized that the condition that is provided with is very complicated, the maintenance of condition of contact and the very difficult ultrasound wave of control, cause being difficult to stably make flawless product.

On the other hand, in the method for welding method and melting welding, the coupling part is not applied ultrasound wave, in addition, little than in the wedge bonding method of soldering tip 52 or welding gun 62.Therefore, can not cause the fracture of coil 2 or breaking of IC chip, in addition, owing to do not use ultrasound wave, so the maintenance of condition of contact and control are easy to.When using according to welding method of the present invention, owing to used the lead that comprises the heart yearn 2a that covers by weld metal layers 2c and insulation course 2b, therefore on heart yearn 2a, do not form oxide film, therefore do not need to use the solder flux that is welded to connect common needs.Thus, can avoid because the manufacturing step that the cleaning step of additional solder flux causes complicated.

Next, below with reference to Fig. 8 and 9 second example introducing according to flexible IC module of the present invention.Fig. 8 is the planimetric map of the flexible IC module of this example, and Fig. 9 is the amplification profile along the line B-B intercepting of Fig. 8.

From Fig. 8 and 9 as can be seen, the flexible IC module of this example coil 2 that has IC chip 1 and be directly connected to the input and output side 1a of IC chip 1 is embedded in the structure in the side of the flexible base, board of being made by adhesive-bonded fabric 3.The other parts of the flexible IC module in other parts and first example are identical, for avoiding repeating to have omitted the introduction to them.

The flexible IC module of this example has and the identical effect of first example, in addition, has because IC chip 1 and coil 2 are embedded in the side of flexible base, board 3, and module can make thinner, can further simplify the advantage of manufacturing, therefore can make at lower cost.

Introduce the manufacture method of flexible IC module below according to the present invention.

First example of the manufacture method of＜flexible IC module 〉

Introduce first example of above-mentioned flexible IC module manufacture method below with reference to Figure 10.Figure 10 shows the manufacture method of flexible IC module.

Before making flexible IC module, preparation has compressibility at thickness direction, have automatic pressurization adhesion property and resin dipping character and have first adhesive-bonded fabric and second adhesive-bonded fabric of given shape and intended size.Simultaneously, the end of preparation coil 2 is directly connected to IC chip 1 (see figure 3) of its output and output terminal 1a.

After this, as shown in figure 10, first adhesive-bonded fabric 12 with automatic pressurization adhesion property is placed on the counterdie 11 with smooth and flat surfaces, and IC chip 1 and connected coil 2 location also are placed on first adhesive-bonded fabric 12.Then, second adhesive-bonded fabric 13 with automatic pressurization adhesion property is stacked on these IC chips 1 and the coil 2, after this have smooth and patrix 14 flat surfaces and be pressed onto on second adhesive-bonded fabric 13, and under the situation of heating in thickness direction compression first and second adhesive-bonded fabrics 12 and 13.Thus, obtain the flexible IC module of needs.In the introduction below, the method by counterdie and patrix compressed flexible IC module ingredient is called " hot pressing " in thickness direction under the situation of heating.The printing of needs is carried out on surface to the flexible IC module of gained.

When compressing first and second adhesive-bonded fabrics 12 and 13 equably in thickness direction, these first and second adhesive-bonded fabrics 12 and 13 compress more some more in those parts that IC chip 1 and coil 2 are set.Therefore, the groove 15 consistent with the profile of IC chip 1 and coil 2 is formed on the inside surface of adhesive-bonded fabric 12 and 13, and IC chip 1 and coil 2 are embedded in the groove shown in Figure 2 15.In addition, be used as first and second adhesive-bonded fabrics 12 and 13 that form flexible base, board 3, therefore remove pressure and obtain shape shown in Figure 2 afterwards owing to have the adhesive-bonded fabric of automatic pressurization adhesion property.In addition, be adjusted to proper range, flood first and second adhesive-bonded fabrics 12 and 13 with resin after making flexible IC module, so module can be applied to the manufacturing of information carrier less than 100% by compressibility with first and second adhesive-bonded fabrics 12 and 13.

According to this routine this method, only by preparation in advance make first and second adhesive-bonded fabrics 12 that flexible IC module needs and 13 and the IC chip 1 and the coil 2 of welding, stack gradually these parts and parts then in thickness direction the lamination of compression gained can obtain the flexible IC module that needs, therefore, can make flexible IC module expeditiously.In addition, because the two ends of coil 2 directly are connected to the input and output side 1a of IC chip 1, therefore flexible IC module can make very thin.

If in manufacture method shown in Figure 10, omitted second adhesive-bonded fabric 13, can make the flexible IC module of second example so.

Second example of the manufacture method of＜flexible IC module 〉

Below with reference to second example that has the flexible IC module manufacture method of above structure more than Figure 11 A-D introduction.

At first, shown in Figure 11 A, preparation comprises that coil 2 is embedded in first intermediate product 21 of first adhesive-bonded fabric 12 in the one side.Make described first intermediate product 21 by following mode: first adhesive-bonded fabric 12 that will have automatic pressurization adhesion property is placed on the counterdie with smooth and flat surfaces, coil 2 is located and is placed on first adhesive-bonded fabric 12, to have smooth and patrix 14 flat surfaces then and be pressed onto on the coil 2, and hot pressing they.When coil 2 was placed on first adhesive-bonded fabric 12, the two ends of coil 2 were arranged in parallel, so that the distance of using between the input and output side 1a on distance between the two ends of coil 2 and the IC chip 1 is basic identical.

Simultaneously, shown in Figure 11 B, preparation comprises that IC chip 1 is embedded in second intermediate product 22 of second adhesive-bonded fabric 13 in the one side.Prepare described second intermediate product 22 by following mode: second adhesive-bonded fabric 13 that will have automatic pressurization adhesion property is placed on the counterdie with smooth and flat surfaces, IC chip 1 is located and is placed on second adhesive-bonded fabric 13, to have then smooth and flat surfaces on be molded on the IC chip 1, and hot pressing they.At this moment, IC chip 1 towards on be provided in second adhesive-bonded fabric 13 so that input and output side 1a is exposed on the surface of second adhesive-bonded fabric 13.

Then, shown in Figure 11 C, stacked first and second intermediate product 21 and 22, so that the face of the face of IC chip 1 and coil 2 is faced mutually, two ends of the input and output side 1a contact coil 2 of IC chip 1, use thus counterdie 11 and patrix 14 once more hot pressing they, make the 3rd intermediate product 23 that comprise mutual all-in-one-piece first and second adhesive-bonded fabrics 12 and 13, IC chip 1 and coil 2 thus.

At last, shown in Figure 11 D, ultrasonic vibrator 24 is pressed onto on the outside surface that has corresponding to part first adhesive-bonded fabric 12 of the coil 2 of the position of the input and output side 1a of IC chip 1, apply ultrasound wave thus, the heat melts that produces by pressure and ultrasound wave covers insulation course and low-melting metal level of the lead of coil, and two ends of input and output side 1a and coil 2 are electrically connected mutually thus.Obtain the flexible IC module of needs thus.

Making according to this example in the method for flexible IC module and since two ends of coil 2 in advance with given fixed interval on first adhesive-bonded fabric 12, therefore can carry out at an easy rate and being electrically connected of IC chip 1.That is, some IC chips 1 that are used to make flexible IC module have the very little input and output side of about 100 μ m on the whole.On the other hand, the about 50 μ m of the diameter of wire of coil 2.Therefore, the very difficult coupling part for preparing IC chip 1 and coil 2 effectively, the while is the two ends of fixed coil not.Can increase manufacturing efficient to a certain extent by the IC chip that uses special anchor clamps or input and output side to extend, but manufacturing step becomes complicated, and very difficult significantly increasing made efficient.According to this routine method, coil 2 is fixed to the adhesive-bonded fabric as flexible IC module ingredient, so manufacturing step is uncomplicated, and can obtain flawless product expeditiously.

The 3rd example of the manufacture method of＜flexible IC module 〉

Introduce the 3rd example of flexible IC module manufacture method with above structure below with reference to Figure 12 A-12D.

At first, shown in Figure 12 A, preparation comprises that coil 2 is embedded in the phase one intermediate product 31 of first adhesive-bonded fabric 12 in the one side.Described phase one intermediate product 31 can be made by following mode: first adhesive-bonded fabric 12 that will have automatic pressurization adhesion property is placed on the counterdie with smooth and flat surfaces, coil 2 is located and is placed on first adhesive-bonded fabric 12, to have smooth and patrix 14 flat bottom surface then and be pressed onto on the coil 2, and hot pressing they.When coil 2 was placed on first adhesive-bonded fabric 12, the two ends of coil 2 were arranged in parallel, so that the distance of using between the input and output side 1a on distance between the two ends of coil 2 and the IC chip 1 is basic identical.The manufacturing step of first intermediate product 21 in these steps and second example is identical.

Then, shown in Figure 12 B, preparation comprises that IC chip 1 and coil 2 are embedded in the subordinate phase intermediate product 32 of first adhesive-bonded fabric 12 in the one side in first intermediate product 31 by IC chip 1 is embedded in.Being prepared as follows of described subordinate phase intermediate product 32: the supine phase one intermediate product 32 of the embedding of coil 2 are placed on the counterdie with smooth and flat surfaces, with IC chip 1 location and be placed on the part phase one intermediate product 31 at two ends of the coil 2 that embedding is set, so that input and output side 1a faces down, and two ends of input and output side 1a contact coil 2, will have then smooth and flat bottom surface on be molded on the IC chip 1 and once more hot pressing they.

In addition, shown in Figure 12 C, second adhesive-bonded fabric 13 is stacked in IC chip 1 and coil 2 embeds on the one side of subordinate phase intermediate product 32 wherein, by counterdie 11 and patrix 14 hot pressing gained lamination once more, obtain comprising the 3rd intermediate product 33 of all-in-one-piece first and second adhesive-bonded fabrics 12 and 13, IC chip 1 and coil 2 thus.

At last, shown in Figure 12 D, ultrasonic vibrator 24 is pressed onto on the outside surface that has corresponding to part first adhesive-bonded fabric 12 of the coil 2 of the position of the input and output side 1a of IC chip 1, apply ultrasound wave thus, the heat melts that produces by pressure and ultrasound wave covers insulation course and low-melting metal level of the lead of coil, and the two ends of input and output side 1a and coil 2 are electrically connected mutually.Obtain the required flexible IC module of complete embedded type thus.

This routine method has the same effect of method in above second example equally.

After the manufacturing of the subordinate phase intermediate product 32 shown in Figure 12 B,, can make the flexible IC module of an embedded type so if the input and output side 1a of IC chip 1 is electrically connected to two ends of coil 2.

In addition, in above example, flexible base, board 3 comprises adhesive-bonded fabric, but flexible IC module also can use textile fabric, knit goods, paper, leather or analog with similar method manufacturing.

In addition, in above example, IC chip 1 and coil 2 introduced as the flexible IC module that is partially submerged in it that will install, embedded flexible IC module in it but can prepare the other parts that to install equally by similar method.

Next, introduce the method for the contactless IC-card that uses the flexible IC module preparation needs that prepare with mode above-mentioned.

First example of the manufacture method of＜contactless IC-card 〉

At first, as shown in FIG. 13A, first cover plate 41 is arranged on the fixed mould 42 of injector, and second cover plate 43 is arranged on the flexible mould 44 of injector simultaneously.At this moment, as shown in FIG. 13A, pass fixed mould 42 and air hole 45 that flexible mould 44 gets out by utilization and hold cover plate cover plate 41 is closely contacted with 44 with mould 42 with 43.

Cover plate 41 and 43 can comprise any given optional transparent or opaque synthetic resin board, as long as they have the thermal resistance of requirement, but do not produce the synthetic resin board of chlorine when preferably including thermal treatment especially, for example antipollution polyethylene terephthalate (hereinafter being called " PET ") and PEN.Can on the front of cover plate 41 and 43 or the back side, carry out the printing that needs.

In order to strengthen the adhesion with substrate 3, preferably on the back side of cover plate 41 and 43, form tiny irregularity (irregularities), irregularity is for example corresponding to the irregularity of the abrasive grain size of the #400-1000 of appointment among the JIS.In addition, when the front of cover plate 41 and 43 is directly printed, preferably on the front of cover plate 41 and 43, form tiny out-of-flatness part equally to strengthen printing performance.At this moment, for the receptivity that improves China ink with strengthen the performance be suitable for printing, on the front of cover plate 41 and 43, form tiny irregularity preferably corresponding to JIS in the irregularity of abrasive grain size of #3000-10000 of appointment.For example can make this cover plate: with diameter (for example abrasive grain) method that to be 0.1 μ m mix with the material of cover plate to the method in section embeds cover plate by electrostatic precipitation the raw material thin plate of filling out of tens μ m, with filler with the method on the surface of mill section crystal grain grinding raw material thin plate by following method.

Then, shown in Figure 13 B, the flexible IC module 10 for preparing by above method is stacked on first cover plate 41 that is placed in the fixed mould 42.

After fixed mould 42 and flexible mould 44 closures, resin 47 is filled in the cavity 46 that is formed by mould 42 and 44, shown in Figure 13 C from entering the mouth.As mentioned above, the substrate 3 of flexible IC module 10 comprises having the adhesive-bonded fabric that can be flooded by resin, so the substrate 3 resins dipping of being filled in the cavity 46.

Then, shown in Figure 13 D, go out the contactless IC-card of given shape and intended size by the compression molded that increases flexible mould 44.Simultaneously, cut off inlet 47 by flexible mould 44.

At last, shown in Figure 13 E, open mould 42 and 44, take out and to comprise all-in-one-piece first and second cover plates 41 and 43 and the contactless IC-card of flexible IC module 10.

According to the manufacture method of this example information carrier, bonding can the omission of the mounted component (IC chip 1 and coil 2) and first and second cover plates 41 and 43, can carry out the manufacturing of contactless IC-card effectively thus.In addition, can homogenising owing to be applied to the thermal load of cover plate 41 and 43 during potting resin, can prevent the cover plate 41 that causes by uneven thermal load and 43 wrinkle.Therefore, can make high-quality contactless IC-card expeditiously, in addition, the design that can improve the quality is printed.In addition, want mounted component to be clipped in wherein first and second adhesive-bonded fabrics, therefore in the thickness direction of contactless IC-card,, can selectively regulate the position setting of wanting installing component by regulating the thickness of each adhesive-bonded fabric because flexible IC module 10 comprises.In addition, owing to want mounted component to keep, therefore can strengthen the protection effect of installing component by substrate 3.

This method does not need the complex steps of routine techniques, for example forms cutting hole in substrate, leave in parts in the hole and uses resin-sealed hole, and therefore, make needs the contactless of shape IC-card marked downly.

Second example of the manufacture method of＜contactless IC-card 〉

This routine method is the contactless information carrier that does not have cover plate by so-called pressure sintering manufacturing.

Promptly, as shown in figure 14, comprise as first hot-melt plate 4, the previously prepared flexible IC module 10 of the thermoplastic resin of PET etc. and comprise with identical or different second hot-melt plate 5 of thermoplastic resin first hot-melt plate 4 with this sequence stack on upper surface for plate shaped counterdie 11, will be for plate shaped patrix 14 be reduced on second hot-melt plate 5, at predetermined heating and pressurized conditions lower compression lamination.In described compression process, first and second hot- melt plates 4 and 5 fusings, a part or whole part dipping of melt constitutes in the flexible base, board 3 of flexible IC module 10.In this way, the flexible IC module 10 and first and second hot- melt plates 4 and 5 are integral, and first and second hot- melt plates 4 and 5 become the shell of flexible IC module 10.Then, if desired, regulate the shape of periphery, design and printing is carried out to obtain to needing the contactless information carrier of product in the surface of hot-melt plate.

In Figure 14, show the method for hot pressing contactless information carrier one by one for ease of explanation.Yet, also can use a plurality of contactless information carriers of flexible IC module 10 hot pressing simultaneously, flexible IC module 10 comprises a plurality of large scale flexible base, boards of wanting mounted component to embed with given interval.

The method of making the contactless information carrier according to this example forms the shell of flexible IC module 10 by so-called pressure sintering, so can easily control heating condition and the contractive condition that forms shell, can prepare the contactless information carrier of pinpoint accuracy thus.

The 3rd example of the manufacture method of＜contactless IC-card 〉

This routine method is the contactless information carrier that has cover plate by so-called pressure sintering manufacturing.

Promptly, as shown in figure 15, comprise first cover plate 41, comprise first hot-melt plate 4, previously prepared flexible IC module 10, comprise second hot-melt plate 5 that thermoplastic resin and first hot-melt plate 4 are identical or different and comprise thermal resistance as thermoplastic resins such as PET as the good resin material of Polyvinylchloride thermal resistances such as (being hereinafter referred to as " PVC ") and second cover plate 43 that first cover plate 41 is identical or different with this sequence stack on upper surface for plate shaped counterdie 11, will be for plate shaped patrix 14 be reduced on second cover plate 43, at predetermined heating and pressurized conditions lower compression lamination.In described compression process, first and second hot- melt plates 4 and 5 fusings, the part melt impregnation is to the flexible base, board 3 that constitutes flexible IC module 10, and first and second cover plates 41 and 43 bond to first and second hot- melt plates 4 and 5 simultaneously.Thus, flexible IC module 10, first and second hot- melt plates 4 and 5 and first and second cover plates 41 and 43 constitute one, and flexible IC module 10 forms shell.

Then, if desired, regulate the shape of periphery, design and printing is carried out to obtain to needing the contactless information carrier of product in the surface of hot-melt plate.In this embodiment, the same flexible IC module 10 of using regulation structure and size can obtain a plurality of contactless information carriers simultaneously by a hot pressing.The method of the manufacturing contactless information carrier of this example has the same effect of manufacturing contactless information carrier method shown in Figure 14 equally.

The 4th example of the manufacture method of＜contactless IC-card 〉

This routine method is the contactless information carrier that does not have cover plate by the manufacturing of so-called roll-type pressing.

Promptly, as shown in figure 16, comprise a plurality of want mounted component with given interval embed the band shape flexible base, board in it flexible IC module 10, comprise as the first band shape hot-melt plate 4 of thermoplastic resins such as PET and comprise the thermoplastic resin and the first band shape hot-melt plate 4 identical or different second be with shape hot-melt plate 5 respectively on roller (roller) 71,72 and 73.First hot-melt plate 4 that to pull out from roller 72 and 73 and second hot-melt plate 5 are layered on the front and the back side of the flexible IC module 10 of pulling out from roller 71, and this lamination passes the roller 74 of heating and pressurization to compress it then.In Figure 16, numeral 75 expression carry-over pinch rolls, 76 expression deflector rolls, the stacked roller of 77 expressions.

In the process of the roller 74 that passes heating and pressurization, first and second hot- melt plates 4 and 5 fusings, a part or whole part dipping of melt constitutes the flexible base, board 3 of flexible IC module 10.In this way, the flexible IC module 10 and first and second hot- melt plates 4 and 5 are integral, and first and second hot- melt plates 4 and 5 become the shell of flexible IC module 10.Then, carry out the design and printing on the lamination, cut the contactless information carrier that lamination needing to obtain the needs of product afterwards.

Form the shell of flexible IC module 10 by so-called roll-type pressing according to the method for this example manufacturing contactless information carrier, therefore compare with the shell that forms flexible IC module 10 by so-called pressure sintering, the formation shell step of contactless information carrier can be more effectively carried out, and the manufacturing cost of contactless information carrier can be reduced.

The 5th example of the manufacture method of＜contactless IC-card 〉

This routine method is the contactless information carrier that has cover plate by the manufacturing of so-called roll-type pressing.

Promptly, as shown in figure 17, comprise a plurality of want mounted component with given interval embed the band shape flexible base, board in it flexible IC module 10, comprise the first band shape hot-melt plate 4, comprise identical or different second being with shape hot-melt plate 5 and comprising that band female cap plate 41 and 43 as the good resin material of thermal resistances such as PVC is respectively on roller 71,72,73,78 and 79 of the thermoplastic resin and first hot-melt plate 4 as thermoplastic resins such as PET.First hot-melt plate 4 that to pull out from roller 72 and 73 and second hot-melt plate 5 are layered on the front and the back side of the flexible IC module 10 of pulling out from roller 71, in addition, on the surface of first cover plate 41 that will pull out from roller 78 and 79 and second cover plate 43 surface that is layered in first hot-melt plate 4 respectively and second hot-melt plate 5.Described then lamination passes the roller 74 of heating and pressurization to compress it.In Figure 17, same numeral 75 expression carry-over pinch rolls, 76 expression deflector rolls, the stacked roller of 77 expressions.

According to the method for Figure 17, in the process of the roller 74 that passes heating and pressurization, first and second hot- melt plates 4 and 5 fusings, the part melt impregnation constitutes the flexible base, board 3 of flexible IC module 10.The flexible IC module 10 and first and second cover plates 41 and 43 are integral.First and second cover plates 41 and 43 bond to first and second hot- melt plates 4 and 5 simultaneously, and flexible IC module 10 forms shell.After this, carry out design and printing and cut lamination and obtain to needing the contactless information carrier of product.

The method of the manufacturing contactless information carrier of this example has manufacturing contactless information carrier shown in Figure 16 equally.

Other example of the present invention is listed below.

1. in above example, flexible base, board 3 comprises adhesive-bonded fabric.Yet, use textile fabric, knit goods, paper, leather or analog can make the contactless IC-card equally.

2. in above example, use to comprise that the flexible IC module that IC chip 1 and coil 2 embed the substrate 3 in it prepares the contactless IC-card.Yet, use the flexible IC module that comprises the substrate 3 in IC chip 1 and its one side of coil 2 embeddings can prepare the contactless IC-card equally by similar method.

3. in above example, IC chip 1 and coil 2 have been introduced as the manufacturing that is partially submerged into the flexible IC module in it that will install.Yet, use its flexible IC module that is embedded in other parts can prepare the contactless IC-card equally by similar method.

4. in above example, introduced the manufacturing of contactless IC-card, but the same naturally contactless IC-card that forms easily as other shapes such as coil and band shapes.

5. for the method that connects between IC chip and the coil, except the method for in above example, listing, also can use the method that connects IC chip and coil by electroconductive resin.

6. Yi Shang example has been introduced the method for attachment of the input and output side 1a and the coil 2 of IC chip, comprise and use lead to weld by soldering tip, wherein heart yearn 2a or weld metal layers 2c are covered by insulation course 2b, the input and output side 1a of IC chip is connected to coil 2, and the energy carbonization of sending with soldering tip is also removed insulation course 2b and is welded.This method not only is suitable for the input and output side 1a of IC chip and being connected of coil 2, is suitable for being connected or the connection of magnetic head interior loop of wire jumper and circuit board equally.

In flexible IC module of the present invention; want mounted component to be embedded in and comprise in the flexible base, board of adhesive-bonded fabric or analog; therefore the protection effect of installing component is good; operate easily in the manufacturing of this external contactless IC-card and analog and want mounted component; particularly, the coil of little IC chip or low rigidity.In addition, because the pliability of substrate is very high, so module not only is used as the component part of the contactless IC-card of flat type, also can extensively be used as the information carrier at the part place that is provided at sweep or repeated deformation.And, because the IC chip directly is installed to coil, therefore can omit the use circuit board, the thickness of flexible IC module, the thickness of promptly final contactless IC-card can reduce, and cost also can reduce in addition.Particularly, when directly connecting IC chip and coil by welding process or fusing process of intermediate, the reliability of connection also can strengthen.

The method according to this invention, only by will mounted component location and be placed on thickness direction and have compressibility, have between the adhesive-bonded fabric of automatic pressurization adhesion property and resin dipping character, hot pressing afterwards they.Therefore, can be fabricated to contactless IC-card and other thing of final products at low cost.

In the method for information carrier constructed in accordance, resin is filled in the flexible IC module setting mould cavity wherein method and can omits and want the bonding of mounted component and cover plate, so can carry out the manufacturing of information carrier effectively.In addition, can be even owing to be applied to the thermal load of cover plate during potting resin, therefore can suppress the wrinkling of the cover plate that causes by uneven thermal load.Therefore, high-quality information carrier can be made expeditiously, in addition, the quality of design and printing can be improved.And owing to want mounted component between two cover plates by what flexible base, board supported during potting resin, therefore the thickness by the adjusting flexible base, board can suitably be adjusted in the position of installing component in the thickness direction of information carrier.In addition, because mounted component is supported by flexible base, board, therefore can strengthen the effect of protection mounting portion.Certainly, be used as baseplate material,, can not reduce mould cycle so resin can be filled apace owing to have the adhesive-bonded fabric or the analog of resin dipping character.

In the method for information carrier constructed in accordance, prepare in advance by pressure sintering flexible IC module the formation shell method to as final products the quality of information carrier with the resin completion method identical effect is arranged, in addition, can carry out this method by simple manufacturing equipment, help producing in batches.

In the method for information carrier constructed in accordance, prepare in advance by the roll-type pressing flexible IC module the formation shell method to as final products the quality of information carrier with the resin completion method identical effect is arranged, in addition, this method can be automatically and is carried out the stacked of each parts continuously, helps thus producing in batches.

Claims (16)

1. flexible IC module, it is characterized in that, being included in thickness direction has compressibility, has automatic pressurization adhesion property and has the given shape of resin dipping character and the flexible base, board of intended size, and the mounting portion of supporting by described flexible base, board, in the groove that a described part that is partly embedded in by the compressed flexible substrate forms.

2. according to the flexible IC module of claim 1, it is characterized in that, being partly embedded in the flexible base, board of installation, the front and the back side of flexible base, board form with flat state.

3. according to the flexible IC module of claim 1, it is characterized in that, in the one side that is partly embedded in flexible base, board to be installed, comprise that the front and the back side of the flexible base, board on embedded part surface forms with flat state.

4. according to the flexible IC module of claim 1, it is characterized in that flexible base, board comprises textile fabric, knitted fabric or the adhesive-bonded fabric that has automatic pressurization adhesion property in essence.

5. according to the flexible IC module of claim 1, it is characterized in that transparent code information display spare, infrared transmitter or the luminophor that mounted component is selected from IC chip, IC module, is used for the contactless transmitting device of data and/or power supply, capacitor, resistor, solar cell, liquid crystal indicator, image display device, optical record medium, Magnetooptic recording medium, use infrared absorber form and at least one part of carefully closing of magnet or ferromagnet and these parts and other parts.

6. according to the flexible IC module of claim 1, it is characterized in that having IC chip and input and output side that is directly connected to the IC chip and the contactless transmission coil that is used for data and/or power supply as the mounting portion.

7. according to the flexible IC module of claim 6, it is characterized in that two ends of the input and output side of IC chip and contactless transmission coil directly are connected by wedge bonding method, welding process or fusing process of intermediate.

8. according to the flexible IC module of claim 6 or 7, it is characterized in that the contactless transmission coil comprises heart yearn, covers the insulation course of the weld metal layers and the covering weld metal layers of heart yearn.

9. according to the flexible IC module of claim 1, it is characterized in that the circuitous pattern that needs is printed on the partially flexible substrate, wherein this plate upper mounting component and circuitous pattern are electrically connected with the part of installation.

10. according to the flexible IC module of claim 9, it is characterized in that the coil that is used for data and/or power supply forms as circuitous pattern by printing.

11. the manufacture method of a flexible IC module, it is characterized in that, comprise the positioning parts of the needs that will install and be arranged on thickness direction compressibility is arranged, have automatic pressurization adhesion property and have given shape and first flexible base, board of intended size and the step between second flexible base, board that resin floods character, with room temperature or the heating under compress first and second flexible base, boards at thickness direction, by force of compression these first and second flexible base, boards are formed as one, parts are embedded into step in the groove that in part first and second flexible base, boards, forms by applying force of compression simultaneously.

12. the manufacture method of a flexible IC module, it is characterized in that, comprise the positioning parts of the needs that will install and be arranged on thickness direction compressibility is arranged, have automatic pressurization adhesion property and has the given shape of resin dipping character and a face of the flexible base, board of intended size on step, with room temperature or the heating under in thickness direction the compressed flexible substrate, will mounted component be embedded in the groove that on part compressed flexible substrate, forms by force of compression.

13. flexible IC module according to claim 11 or 12, it is characterized in that, want mounted component to comprise the IC chip and be directly connected to the contactless transmission coil of the input and output side of IC chip, these IC chips and coil location also are placed on the predetermined portions of flexible base, board.

14. flexible IC module according to claim 13, it is characterized in that, the two ends of the input and output side of IC chip and contactless transmission coil directly are connected by being pre-formed at the prominent point of the scolder at the input and output side place of IC chip, in the state of the prominent point of the two ends of contactless transmission coil permission contact scolder, soldering tip is pressed onto the two ends of contactless transmission coil, the prominent point of the energy melting solder that sends with soldering tip, thus the two ends of the input and output side and the contactless transmission coil of IC chip directly connected.

15. the manufacture method of a flexible IC module is characterized in that, comprising:

With IC chip location and be arranged on thickness direction compressibility is arranged, have step on the face of first flexible base, board of the given shape of automatic pressurization adhesion property and resin dipping character and intended size,

To be used for the contactless transmission coil location of data and/or power supply and be arranged on the identical or different and distances two ends of coil of the material that comprises the material and first flexible base, board equaling step on a face of second flexible base, board of the distance of setting between the input and output side of IC chip

One with first and second flexible base, boards is superimposed upon on another, so that placed side and the input and output side of IC chip and the two ends step of connecting of coil of coil are faced in the placed side of IC chip,

Under room temperature or heating, in thickness direction, compress first and second flexible base, boards, by force of compression these first and second flexible base, boards are formed as one, simultaneously parts are embedded into by applying in the groove that force of compression forms in part first and second substrates, and

From outside surface heat and pressure are applied to the input and output end parts with second flexible base, board that two ends of its input and output end parts and coil is electrically connected mutually with coil.

16. the manufacture method of a flexible IC module is characterized in that, comprising:

To be used for the contactless transmission coil location of data and/or power supply and be arranged at thickness direction a face that compressibility is arranged, have first flexible base, board of the given shape of automatic pressurization adhesion property and resin dipping character and intended size, and the distance between two ends of coil is set to the step of the distance set between the input and output side of IC chip

The IC chip is located and is arranged on the face of flexible base, board, the step at the two ends of the input and output side contact coil of permission IC chip,

Under room temperature or heating in thickness direction the compressed flexible substrate, IC chip and coil are embedded into by applying in the groove that force of compression forms in the partially flexible substrate, and

Heat and pressure are applied to the step of input and output end parts from outside surface with the flexible base, board that two ends of its input and output end parts and coil is electrically connected mutually with coil.

Images