CN107529382B - The performance test apparatus of satellite semiconductor cooler - Google Patents
The performance test apparatus of satellite semiconductor cooler Download PDFInfo
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- CN107529382B CN107529382B CN201318000783.XA CN201318000783A CN107529382B CN 107529382 B CN107529382 B CN 107529382B CN 201318000783 A CN201318000783 A CN 201318000783A CN 107529382 B CN107529382 B CN 107529382B
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- semiconductor cooler
- hot junction
- cold end
- pressing plate
- performance test
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The performance test apparatus of satellite semiconductor cooler provided by the invention, including simulation heating plate, cold end briquetting, semiconductor cooler, hot junction pressing plate, heat pipe, heat sink, thermocouple and multilayer insulation component, electric heating sheets fictitious load is pasted on simulation heating plate, heating plate is pasted onto on cold end briquetting with heat-conducting silicon rubber, cold end briquetting is installed by screw and hot junction pressing plate, semiconductor cooler is pasted onto between cold end briquetting and hot junction pressing plate, in semiconductor cooler and cold end briquetting, the contact surface coated with thermally conductive silicone grease of hot junction pressing plate；Heat pipe one end is arranged on hot junction pressing plate, the other end is arranged on heat sink, and in heat pipe contact face coated with thermally conductive silicone grease, electric heater is pasted on heat sink, and spray pitch-dark, thermocouple is pasted onto on each part, and simulation heating plate, cold end briquetting, semiconductor cooler and hot junction pressing plate are all coated on inside by multilayer insulation component.The experimental rig is simple in construction, and cost is low, it is easy to accomplish, material source is abundant, and technique is simple.
Description
Technical field
The present invention relates to a kind of Satellite Experiment device, and in particular to a kind of performance test dress of satellite semiconductor cooler
Put.
Background technology
With the development of space optics load technology, the image quality of optics load requires more and more higher, its CCD device
The power consumption of part is increasing and requires to maintain relatively low temperature levels.Semiconductor cooler as a kind of small volume, make
It is increasingly used in convenient active temperature control device in the temperature control of CCD device.In specific application,
Semiconductor cooler need to be made a service test, prove the feasibility of its application.
In conventional semiconductor refrigerator performance test, semiconductor cooler hot junction is typically arranged on to the installing plate of constant temperature
On, cold end arrangement temperature measuring point simultaneously covers the heat-barrier materials such as sponge, and the maximum temperature difference of hot and cold side is tested.How mould
Intend CCD device practical application condition, obtaining the performance parameter of semiconductor cooler turns into the key issue of engineer applied.
In practical application, semiconductor cooler cold end is arranged on the exchanging structure of CCD device, semiconductor system
Hot aluminium sheet is expanded in the installation of cooler hot junction, and will expand the heat dissipation of hot aluminium sheet to external cooling face by heat pipe.Therefore, it is comprehensive
Close all parts and link for considering heat transfer, design composition semiconductor cooler performance test apparatus.
The content of the invention
In order to solve the above-mentioned technical problem, the purpose of the present invention is the needs according to practical application, proposes that a kind of satellite is used
The performance test apparatus of semiconductor cooler, the device are on the basis of semiconductor cooler operation principle, and synthesis is examined
Consider all parts to be conducted heat in semiconductor cooler application and link, design composition semiconductor cooler performance test dress
Put, to obtain various semiconductor cooler working parameters.
Technical scheme provided by the invention is：A kind of performance test apparatus of satellite semiconductor cooler is provided, including
Simulation heating plate, cold end briquetting, semiconductor cooler, hot junction pressing plate, heat pipe, heat sink, thermocouple and multilayer every
Hot component, electric heating sheets fictitious load is pasted on the simulation heating plate, and heating plate is pasted onto cold end with heat-conducting silicon rubber
On briquetting, the cold end briquetting is installed by screw and hot junction pressing plate, and the semiconductor cooler is pasted onto cold end briquetting
Between the pressing plate of hot junction, in semiconductor cooler and cold end briquetting, the contact surface coated with thermally conductive silicone grease of hot junction pressing plate；Institute
To state heat pipe one end and be arranged on hot junction pressing plate, the other end is arranged on heat sink, pastes electric heater on the heat sink, and
Spray pitch-dark, the thermocouple is pasted onto the simulation heating plate, cold end briquetting, hot junction pressing plate, heat pipe, heat sink
On, the multilayer insulation component all coats simulation heating plate, cold end briquetting, semiconductor cooler and hot junction pressing plate
Internally.
As the improvement of experimental rig of the present invention, the electric heater is polyimides constantan paper tinsel electric heater.
As the improvement of experimental rig of the present invention, the heat-conducting silicon rubber is GDA-508 heat-conducting silicon rubbers.
As the improvement of experimental rig of the present invention, the cold end briquetting is installed by 4 M3 screws and hot junction pressing plate.
As the further improvement of above-mentioned experimental rig, the installation pressure after the screw-driving is between 25-100psi.
As the improvement of experimental rig of the present invention, the heat-conducting silicone grease is D-3 heat-conducting silicone greases.
As the improvement of experimental rig of the present invention, it is described it is pitch-dark for SR107-E51 it is pitch-dark.
As the improvement of experimental rig of the present invention, the thermocouple is copper-constantan thermocouple.
As the improvement of experimental rig of the present invention, the multilayer insulation component includes at least 20 layers of insulating unit, each
Insulating unit is made up of one layer of two-sided aluminized mylar and one layer of polyamide fibre silk screen.
The beneficial effects of the invention are as follows：The heat transfer relation between all parts can be more really simulated, is semiconductor system
The practical application of cooler provides data；It can realize that different loads, difference are inputted at a temperature of power consumptions and different radiating surfaces
The test of semiconductor cooler performance data；Experimental rig is simple in construction, it is easy to accomplish；Material source is abundant, technique
Simply, it is easy to accomplish；Experimental rig cost is relatively low.
Brief description of the drawings
Technical scheme is illustrated below by way of embodiment.
Fig. 1 is semiconductor cooler performance test apparatus schematic diagram.
Embodiment
In order to realize semiconductor cooler performance test, embodiment of the invention is as follows：
A kind of performance test apparatus of satellite semiconductor cooler, including simulation heating plate 1, cold end briquetting 2, half
Conductor refrigerator 3, hot junction pressing plate 4, heat pipe 5, heat sink 6, thermocouple and the component of multilayer insulation 7, the simulation
Electric heating sheets fictitious load is pasted in heating plate 1, heating plate is pasted onto on cold end briquetting 2 with heat-conducting silicon rubber, described
Cold end briquetting 2 is installed by 4 M3 screws with hot junction pressing plate 4, and installation pressure is between 25-100psi with guarantee
The good contact of cool and heat ends, the semiconductor cooler 3 are pasted onto between cold end briquetting 2 and hot junction pressing plate 4,
Semiconductor cooler 3 and cold end briquetting 2, the contact surface coated with thermally conductive silicone grease of hot junction pressing plate 4 are to reduce thermal contact resistance；
Described one end of heat pipe 5 is arranged on hot junction pressing plate 4, and the other end is arranged on heat sink 6, and is coated in the contact surface of heat pipe 5
Heat-conducting silicone grease, electric heater being pasted on the heat sink 6, and spraying pitch-dark, the thermocouple is pasted onto simulation heating
Plate 1, cold end briquetting 2, hot junction pressing plate 4, heat pipe 5, on heat sink 6 to obtain temperature data, the multilayer insulation
Simulation heating plate 1, cold end briquetting 2, semiconductor cooler 3 and hot junction pressing plate 4 are all coated on inside by component 7,
To reduce the influence of cross-ventilation and moisture.
Selected for optics load CCD device during semiconductor cooler 3, it is necessary to obtain fixed load lower semiconductor refrigeration
The hot and cold side temperature difference of device 3, and suitable input power consumption is chosen for semiconductor cooler 3, and consider optional on star
The temperature levels of radiating surface.Using the performance test apparatus of semiconductor cooler 3, can obtain cold under different loads
Warm end temperature difference, and suitable input power consumption is chosen according to result of the test, and at a temperature of more realistically assessing certain heat sink
The cold junction temperature of semiconductor cooler 3 it is horizontal.
Claims (9)
- A kind of 1. performance test apparatus of satellite semiconductor cooler, it is characterised in that including simulation heating plate, Cold end briquetting, semiconductor cooler, hot junction pressing plate, heat pipe, heat sink, thermocouple and multilayer insulation component, it is described Electric heating sheets fictitious load is pasted on simulation heating plate, heating plate is pasted onto on cold end briquetting with heat-conducting silicon rubber, described Cold end briquetting is installed by screw and hot junction pressing plate, the semiconductor cooler be pasted onto cold end briquetting and hot junction pressing plate it Between, in semiconductor cooler and cold end briquetting, the contact surface coated with thermally conductive silicone grease of hot junction pressing plate；Heat pipe one end peace Mounted in hot junction pressing plate, the other end is arranged on heat sink, and on heat pipe contact face coated with thermally conductive silicone grease, the heat sink Paste electric heater, and spray it is pitch-dark, the thermocouple be pasted onto the simulation heating plate, cold end briquetting, hot junction pressure Plate, heat pipe, on heat sink, the multilayer insulation component by simulation heating plate, cold end briquetting, semiconductor cooler and Hot junction pressing plate is all coated on inside.
- 2. semiconductor cooler performance test apparatus as claimed in claim 1, it is characterised in that the electrical heating Device is polyimides constantan paper tinsel electric heater.
- 3. semiconductor cooler performance test apparatus as claimed in claim 1, it is characterised in that the thermal conductive silicon Rubber is GDA-508 heat-conducting silicon rubbers.
- 4. semiconductor cooler performance test apparatus as claimed in claim 1, it is characterised in that the cold end pressure Block is installed by 4 M3 screws and hot junction pressing plate
- 5. the semiconductor cooler performance test apparatus as described in claim 1 or 4, it is characterised in that the spiral shell The installation pressure after tightening is followed closely between 25-100psi.
- 6. semiconductor cooler performance test apparatus as claimed in claim 1, it is characterised in that the thermal conductive silicon Fat is D-3 heat-conducting silicone greases.
- 7. semiconductor cooler performance test apparatus as claimed in claim 1, it is characterised in that described pitch-dark to be SR107-E51 is pitch-dark.
- 8. semiconductor cooler performance test apparatus as claimed in claim 1, it is characterised in that the thermocouple For copper-constantan thermocouple.
- 9. semiconductor cooler performance test apparatus as claimed in claim 1, it is characterised in that the multilayer every Hot component includes at least 20 layers of insulating unit, and each insulating unit is by one layer of two-sided aluminized mylar and one layer of polyamide fibre Silk screen forms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201318000783.XA CN107529382B (en) | 2013-02-05 | 2013-02-05 | The performance test apparatus of satellite semiconductor cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201318000783.XA CN107529382B (en) | 2013-02-05 | 2013-02-05 | The performance test apparatus of satellite semiconductor cooler |
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| Publication Number | Publication Date |
|---|---|
| CN107529382B true CN107529382B (en) | 2015-07-15 |
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| CN201318000783.XA Active CN107529382B (en) | 2013-02-05 | 2013-02-05 | The performance test apparatus of satellite semiconductor cooler |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108489481A (en) * | 2018-03-29 | 2018-09-04 | 北京航天控制仪器研究所 | A kind of photo sensitive device refrigeration cool-down align structures for star sensor |
| CN108661993A (en) * | 2018-06-04 | 2018-10-16 | 北京航天时代光电科技有限公司 | A method of heating piece is assembled on inclined-plane |
| CN108791964A (en) * | 2018-06-15 | 2018-11-13 | 上海卫星工程研究所 | A kind of thermal protection method and apparatus suitable for star outside antenna rectangular waveguide |
| CN109883748A (en) * | 2019-04-02 | 2019-06-14 | 无锡厦泰生物科技有限公司 | A kind of separate type low-heat leads TEC detection device |
| CN112612307A (en) * | 2020-12-18 | 2021-04-06 | 北京京仪自动化装备技术有限公司 | Linkage control system and method for special temperature control equipment and load device for semiconductor |
| CN113030686A (en) * | 2021-05-27 | 2021-06-25 | 武汉乾希科技有限公司 | Test apparatus and test method for semiconductor refrigerators |
| CN115291458A (en) * | 2022-07-22 | 2022-11-04 | 上海卫星工程研究所 | Satellite-borne camera multi-difference power consumption refrigerating unit, combined heat control method and satellite |
-
2013
- 2013-02-05 CN CN201318000783.XA patent/CN107529382B/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108489481A (en) * | 2018-03-29 | 2018-09-04 | 北京航天控制仪器研究所 | A kind of photo sensitive device refrigeration cool-down align structures for star sensor |
| CN108661993A (en) * | 2018-06-04 | 2018-10-16 | 北京航天时代光电科技有限公司 | A method of heating piece is assembled on inclined-plane |
| CN108661993B (en) * | 2018-06-04 | 2020-07-14 | 北京航天时代光电科技有限公司 | Method for assembling heating sheet on inclined plane |
| CN108791964A (en) * | 2018-06-15 | 2018-11-13 | 上海卫星工程研究所 | A kind of thermal protection method and apparatus suitable for star outside antenna rectangular waveguide |
| CN109883748A (en) * | 2019-04-02 | 2019-06-14 | 无锡厦泰生物科技有限公司 | A kind of separate type low-heat leads TEC detection device |
| CN112612307A (en) * | 2020-12-18 | 2021-04-06 | 北京京仪自动化装备技术有限公司 | Linkage control system and method for special temperature control equipment and load device for semiconductor |
| CN113030686A (en) * | 2021-05-27 | 2021-06-25 | 武汉乾希科技有限公司 | Test apparatus and test method for semiconductor refrigerators |
| CN115291458A (en) * | 2022-07-22 | 2022-11-04 | 上海卫星工程研究所 | Satellite-borne camera multi-difference power consumption refrigerating unit, combined heat control method and satellite |
| CN115291458B (en) * | 2022-07-22 | 2024-03-12 | 上海卫星工程研究所 | Satellite-borne camera multiple differential power consumption refrigerating unit, combined heat control method and satellite |
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