CN107523855A - Double anode electroplanting device - Google Patents
Double anode electroplanting device Download PDFInfo
- Publication number
- CN107523855A CN107523855A CN201610457065.8A CN201610457065A CN107523855A CN 107523855 A CN107523855 A CN 107523855A CN 201610457065 A CN201610457065 A CN 201610457065A CN 107523855 A CN107523855 A CN 107523855A
- Authority
- CN
- China
- Prior art keywords
- anode
- negative electrode
- hollow axle
- electroplanting device
- impressed current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims abstract description 24
- 238000009713 electroplating Methods 0.000 claims abstract description 19
- 230000007246 mechanism Effects 0.000 claims abstract description 8
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 11
- 238000000576 coating method Methods 0.000 abstract description 11
- 229910021645 metal ion Inorganic materials 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 description 10
- 150000001768 cations Chemical class 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of double anode electroplanting device, including electroplating bath, anode, negative electrode, power supply and drive mechanism, anode and negative electrode are in the electroplating bath, power supply connects the anode and negative electrode, in the technical program, also include impressed current anode, negative electrode includes a hollow axle and some plating piece fixed structures located at hollow axle surface, and impressed current anode is inside the hollow axle and is coaxial therewith arranging, anode is located at the cathode outer side, and the drive mechanism is connected with the hollow axle to drive negative electrode to rotate.One impressed current anode is set by cathode center, under double anode effect, metal ion is assembled from multiple directions to plating piece, and ion translational speed is reduced simultaneously, when avoiding the bath concentration from changing, metal ion is largely gathered in the same position of workpiece, improves thickness of coating uniformity.Negative electrode is provided with multiple plating piece fixed structures simultaneously, can disposably complete multi-group workpiece plating work, electroplating efficiency is high, and electroplanting device utilization rate is high, and use cost reduces.
Description
Technical field
The invention belongs to electroplanting device field, more particularly to a kind of double anode electroplanting device.
Background technology
Electroplating technology is widely used on various different purposes and field, primarily to make workpiece attractive in appearance or
Improve that workpiece is wear-resisting, some performances such as corrosion-resistant.Electroplanting device generally includes electroplating bath, electroplate liquid, the moon
The components such as pole, anode, workpiece to be plated, wherein workpiece to be plated is connected on negative electrode, containing tangible in electroplate liquid
Into the metal ion of coating.When bestowing applied voltage between negative electrode and anode, workpiece surface accumulation zone to be plated
The electronics of negative electrical charge.The metal cation of positively charged is attracted by electronics and thing to be plated is flowed to by electroplate liquid
Surface, with thing surface to be plated and electronics with reference to and be deposited on thing surface to be plated and form plated film.Plating at present
Device mainly sets an anode, in order to form complete coating, workpiece one to be plated in workpiece surface to be plated
As rotated under negative electrode drive, but metal ion is much larger than workpiece in the speed that workpiece surface to be plated is assembled
Velocity of rotation, cause workpiece surface thickness of coating skewness.
The content of the invention
The present invention seeks to：It is simple in construction to provide one kind, the double anode electroplanting device of homogeneous coating can be formed.
The technical scheme is that：A kind of double anode electroplanting device, including electroplating bath, anode, negative electrode,
Power supply, and drive mechanism, the anode and negative electrode are in the electroplating bath, described in the power supply connection
Anode and negative electrode, in the technical program, in addition to impressed current anode, the negative electrode include a hollow axle and
Some plating piece fixed structures located at hollow axle surface, the impressed current anode is in the hollow axle
Portion simultaneously is coaxial therewith arranging, the anode is located at the cathode outer side, the drive mechanism with it is described hollow
Rotating shaft is connected to drive negative electrode to rotate.The electroplanting device is by setting an impressed current anode, the plating of negative electrode both sides
Metal cation is acted on by anode and impressed current anode in liquid, from inside and outside both direction to the work to be plated on negative electrode
Part is assembled, and workpiece both sides thickness of coating is uniform, and on the other hand, metal ion is in anode and impressed current anode phase
Assemble under mutual repulsive interaction to negative electrode, speed reduces, and when metal cation concentration fluctuates, avoids
Metal ion is largely gathered in the same position of workpiece to be plated, further increases workpiece entirety coating uniform
Property；Negative electrode can one-time fix multigroup treat by setting multigroup plating piece fixed structure on rotating shaft surface simultaneously
Workpiece is plated, electroplating efficiency improves, and utilization ratio of device improves, so as to reduce electroplating cost.
Further, the anode includes at least two anode units, they towards the impressed current anode,
And it is distributed along the even circumferential using the impressed current anode axle center as the center of circle.Multiple anode units are in cathode outer side
It is uniformly distributed, metal ion uniform force in electroplate liquid, it is uniform forms coating.
Further, the impressed current anode cross section is circular or annular.
Further, the plating piece fixed structure includes some circumferentially equal in the hollow axle surface
The connection sheet of even distribution, the end of adjacent two connection sheet are provided with a plating piece resettlement groove.Cathode surface is provided with
Multiple plating piece resettlement grooves, can one-time fix multigroup workpiece to be plated, improve electroplating efficiency, reduce plating into
This；Electroplate liquid flowing is stirred in connection sheet rotary course simultaneously, improves the uniformity of bath concentration.
Further, the anode unit of the anode is positive plate or anode rod.
Further, in addition to injection equipment, the injection equipment are provided with multiple jets, the jet
It is uniformly distributed between the anode and impressed current anode.More jets are uniformly distributed, when increasing electroplate liquid,
Bath concentration uniformity in electroplating bath can be improved.
It is an advantage of the invention that：
1. the electroplanting device, by setting an impressed current anode, metal cation is by sun in the electroplate liquid of negative electrode both sides
Pole and impressed current anode effect, from inside and outside both direction to the workpiece to be plated aggregation on negative electrode, so as to workpiece two
Side thickness of coating is uniform, on the other hand, metal ion under anode and impressed current anode repulsive interaction to
Negative electrode aggregation velocity reduces, and when concentration of metal ions fluctuates, avoids metal ion and largely assembles
At the same position of workpiece to be plated, workpiece coating uniformity is further increased.
2. jet is evenly arranged in device, and the stirring action of negative electrode rotation, improve dense in electroplate liquid
Degree is evenly distributed, and impressed current anode and negative electrode are axially symmetric structure, and anode unit is uniformly distributed, electroplate liquid
In each regional metal ion uniform force, so as to improve that each regional metal cation is assembled to negative electrode one
Cause property, and then improve the uniformity of thickness of coating.
3. negative electrode secures multiple plating piece resettlement grooves by way of connection sheet, can in each plating piece resettlement groove
Corresponding fixed one or more workpiece, can disposably realize multi-group workpiece uniform coated, and electroplating efficiency is high,
Electroplanting device utilization rate is high, reduces energy consumption and puts into and reduce electroplating wastewater amount simultaneously, electroplating cost is low.
Brief description of the drawings
Below in conjunction with the accompanying drawings and embodiment the invention will be further described：
Fig. 1 is the structural representation of this double anode electroplanting device.
Wherein:1. electroplating bath；2. negative electrode；21. hollow axle；22. connection sheet；23. plating piece resettlement groove；3.
Power supply；4 impressed current anodes；5. anode unit.
Embodiment
Embodiment 1:Double anode electroplanting device as shown in Figure 1, including electroplating bath 1, anode, negative electrode 2, electricity
Source 3, drive mechanism (are not drawn into) in figure, and impressed current anode 4, injection equipment (is not drawn into) in figure, anode
With negative electrode 2 in the electroplating bath 1, power supply 3 connects the anode and negative electrode 2.The negative electrode 2
Some plating piece fixed structures including a hollow axle 21 and located at the surface of hollow axle 21, it is described auxiliary
Supporing yang pole 4 is located at the inside of hollow axle 21 and is coaxial therewith arranging, the anode is located at described the moon
The outside of pole 2, the drive mechanism are connected with the hollow axle 21 to drive negative electrode 2 around hollow axle
21 central shafts rotate vertically.The cross section of impressed current anode 4 is circular or annular, auxiliary in Fig. 1
The supporing yang section of pole 4 is annular, vertically in tubular construction, its center axis and the hollow axle of negative electrode 2
21 central axis overlaps.The anode includes at least two anode units 5, and they are towards the auxiliary
Anode 4, and be distributed along the even circumferential using the axle center of impressed current anode 4 as the center of circle.Anode unit 5 is
Positive plate or anode rod.This example Fig. 1 Anodics include two anode units 5, and they are positive plate,
Respectively symmetrically it is arranged in the outside of negative electrode 2 or so two.The plating piece fixed structure includes some in described hollow
Circumferentially equally distributed connection sheet 22, the end of adjacent two connection sheet 22 are provided with one to the surface of rotating shaft 21
Plating piece resettlement groove 23.The surface of hollow axle 21 is provided with 9 connection sheets 22 and 9 platings in this example Fig. 1
Part resettlement groove 23.Workpiece to be plated is fixed in plating piece resettlement groove 23, and each plating piece resettlement groove 23 can root
One or more workpiece to be plated is correspondingly fixed according to workpiece size, injection equipment is provided with multiple jets, institute
Jet is stated to be uniformly distributed between the positive plate and impressed current anode 4.
The foregoing examples are merely illustrative of the technical concept and features of the invention, its object is to allow be familiar with this skill
The people of art is can to understand present disclosure and implement according to this, and the protection of the present invention can not be limited with this
Scope.All equivalent transformations done according to spirit of the invention or modification, it should all cover the present invention's
Within protection domain.
Claims (6)
1. a kind of double anode electroplanting device, including electroplating bath (1), anode, negative electrode (2), power supply (3),
And drive mechanism, the anode and negative electrode (2) are in the electroplating bath (1), the power supply (3)
Connect the anode and negative electrode (2), it is characterised in that also including impressed current anode (4), the negative electrode (2)
Some plating piece fixed structures including a hollow axle (21) and located at hollow axle (21) surface,
The impressed current anode (4) is internal located at the hollow axle (21) and is coaxial therewith arranging, the sun
On the outside of the negative electrode (2), the drive mechanism is connected with the hollow axle (21) to drive for pole
Dynamic negative electrode (2) rotation.
2. double anode electroplanting device according to claim 1, it is characterised in that, the anode includes
At least two anode units (5), they aid in sun towards the impressed current anode (4), and along with described
Pole (4) axle center is distributed for the even circumferential in the center of circle.
3. double anode electroplanting device according to claim 1 or 2, it is characterised in that, the auxiliary
Anode (4) cross section is circular or annular.
4. double anode electroplanting device according to claim 1, it is characterised in that, the plating piece is fixed
Structure include it is some in the hollow axle (21) surface circumferentially equally distributed connection sheet (22),
The end of adjacent two connection sheet (22) is provided with a plating piece resettlement groove (23).
5. double anode electroplanting device according to claim 2, it is characterised in that, the sun of the anode
Pole unit (5) is positive plate or anode rod.
6. double anode electroplanting device according to claim 1, it is characterised in that, in addition to spraying machine
Structure, the injection equipment are provided with multiple jets, the jet be uniformly distributed in the anode with it is auxiliary
Between supporing yang pole (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610457065.8A CN107523855B (en) | 2016-06-22 | 2016-06-22 | Double-anode electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610457065.8A CN107523855B (en) | 2016-06-22 | 2016-06-22 | Double-anode electroplating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107523855A true CN107523855A (en) | 2017-12-29 |
| CN107523855B CN107523855B (en) | 2023-12-15 |
Family
ID=60734039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610457065.8A Active CN107523855B (en) | 2016-06-22 | 2016-06-22 | Double-anode electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107523855B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110042445A (en) * | 2019-05-31 | 2019-07-23 | 广东华祐新材料有限公司 | One kind covering copper equipment and covers copper method |
| CN110438538A (en) * | 2018-08-22 | 2019-11-12 | 盛青永致半导体设备(苏州)有限公司 | Electroplating DEVICE AND electroplating METHOD |
| CN110872720A (en) * | 2018-08-30 | 2020-03-10 | 广州倬粤动力新能源有限公司 | Fixing equipment for connecting graphene alloy grid with metal layer |
| CN111321448A (en) * | 2020-03-17 | 2020-06-23 | 宁海县鑫鸿汽车部件有限公司 | Metal product electroplating equipment |
| CN111455435A (en) * | 2020-05-20 | 2020-07-28 | 韦耀峰 | Iron metal batch plating device capable of realizing complete plating function |
| CN113322504A (en) * | 2021-06-02 | 2021-08-31 | 深圳市金源康实业有限公司 | Physical coarsening electroplating device and process for replacing coarsening of harmful hexavalent complexes |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2403792Y (en) * | 2000-01-28 | 2000-11-01 | 杨聚泰 | Apparatus for auxiliary anode spraying zinc liquid electroplating steel conduit inwall |
| US20020104754A1 (en) * | 2001-02-06 | 2002-08-08 | Danny Wu | Electroplating apparatus for wheel disk |
| CN101586248A (en) * | 2009-03-12 | 2009-11-25 | 苏州市康普来电镀有限公司 | Rotary swing type cathode hang-plating machine |
| CN205907375U (en) * | 2016-06-22 | 2017-01-25 | 苏州市康普来表面处理科技有限公司 | Device is electroplated to double anode |
-
2016
- 2016-06-22 CN CN201610457065.8A patent/CN107523855B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2403792Y (en) * | 2000-01-28 | 2000-11-01 | 杨聚泰 | Apparatus for auxiliary anode spraying zinc liquid electroplating steel conduit inwall |
| US20020104754A1 (en) * | 2001-02-06 | 2002-08-08 | Danny Wu | Electroplating apparatus for wheel disk |
| CN101586248A (en) * | 2009-03-12 | 2009-11-25 | 苏州市康普来电镀有限公司 | Rotary swing type cathode hang-plating machine |
| CN205907375U (en) * | 2016-06-22 | 2017-01-25 | 苏州市康普来表面处理科技有限公司 | Device is electroplated to double anode |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110438538A (en) * | 2018-08-22 | 2019-11-12 | 盛青永致半导体设备(苏州)有限公司 | Electroplating DEVICE AND electroplating METHOD |
| CN110438538B (en) * | 2018-08-22 | 2024-02-20 | 盛青永致半导体设备(苏州)有限公司 | Electroplating device and electroplating method |
| CN110872720A (en) * | 2018-08-30 | 2020-03-10 | 广州倬粤动力新能源有限公司 | Fixing equipment for connecting graphene alloy grid with metal layer |
| CN110042445A (en) * | 2019-05-31 | 2019-07-23 | 广东华祐新材料有限公司 | One kind covering copper equipment and covers copper method |
| CN111321448A (en) * | 2020-03-17 | 2020-06-23 | 宁海县鑫鸿汽车部件有限公司 | Metal product electroplating equipment |
| CN111321448B (en) * | 2020-03-17 | 2021-03-23 | 佳波(惠州)电镀有限公司 | Metal product electroplating equipment |
| CN111455435A (en) * | 2020-05-20 | 2020-07-28 | 韦耀峰 | Iron metal batch plating device capable of realizing complete plating function |
| CN113322504A (en) * | 2021-06-02 | 2021-08-31 | 深圳市金源康实业有限公司 | Physical coarsening electroplating device and process for replacing coarsening of harmful hexavalent complexes |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107523855B (en) | 2023-12-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107523855A (en) | Double anode electroplanting device | |
| CN104979566A (en) | Composite electrode, preparation method and uses thereof | |
| CN101985767A (en) | Plating bath capable of realizing different deposition rates | |
| CN103233249A (en) | Upper-electrolyte-inlet copper foil all-in-one equipment | |
| CN106283139A (en) | Nickel tungsten Graphene composite plating bath, coating and preparation method thereof | |
| CN205907375U (en) | Device is electroplated to double anode | |
| CN1236024A (en) | Processing method and device for drum electroplating | |
| CN105648514A (en) | Stirring mechanism for electro-deposition | |
| CN105753112A (en) | Activated carbon cloth/graphene composite electrode and method and device for preparing activated carbon cloth/graphene composite electrode | |
| CN201890924U (en) | Plasma vacuum ceramic coating device | |
| CN102568977A (en) | Method for preparing metallized carbon nanotube cathode by electrophoretic deposition in assistance of magnetic field | |
| CN208562555U (en) | A kind of electroplanting device with jet anode | |
| CN102936744B (en) | Chromium plating fixture for hole parts | |
| CN205603714U (en) | A rabbling mechanism for electro -deposition | |
| CN202465854U (en) | Multi-head electronic gun | |
| CN209702887U (en) | Copper plating on stainless steel pipe inner surface device | |
| CN203956087U (en) | For the preparation of the LASER HEATING rotary-atomizing equipment of metal or alloy powder | |
| CN208218985U (en) | Rotary cylinder-block electroplanting device | |
| CN103334146B (en) | Electroplating method of wear-resisting nano composite plate | |
| CN102296336A (en) | Solar cell electroplating equipment capable of improving electroplating uniformity | |
| CN104451834A (en) | Nickel impact apparatus for nickel electroplating assembly line | |
| CN216998629U (en) | Sand device on two-side anode | |
| CN205774869U (en) | The electronic component electroplating bath of thickness and color high uniformity | |
| CN103668414A (en) | Preparation method of novel efficient electroplating roller | |
| CN115976580B (en) | Fine 3D circulation electrodeposition shower nozzle device and 3D printer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210416 Address after: 226400 No.159 Mudanjiang Road, Rudong Economic Development Zone, Rudong County, Nantong City, Jiangsu Province Applicant after: Nantong kangpulai Precision Industry Co.,Ltd. Address before: 215123 Suzhou City, Jiangsu Province, Xiangcheng District Huang Qiao Town occupied the village Applicant before: SUZHOU COPLATE SURFACE TREATMENT TECHNOLOGY Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |