CN107520545B - Method for drilling holes - Google Patents
Method for drilling holes Download PDFInfo
- Publication number
- CN107520545B CN107520545B CN201710781014.5A CN201710781014A CN107520545B CN 107520545 B CN107520545 B CN 107520545B CN 201710781014 A CN201710781014 A CN 201710781014A CN 107520545 B CN107520545 B CN 107520545B
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- China
- Prior art keywords
- laser
- hole
- drilling
- overlapping region
- drilling holes
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
The present invention relates to a kind of method for drilling holes.For the method for drilling holes the following steps are included: default bore path, the bore path includes overlapping region interconnected and Non-overlapping Domain；Laser drilling parameters are configured according to the bore path, the laser drilling parameters include laser frequency and pulse width, and the laser frequency is constant, and the pulse width for being allocated to the overlapping region is less than the pulse width for being allocated to the Non-overlapping Domain；And focused on laser to workpiece according to the laser drilling parameters, and the laser is moved along the Workpiece boring path, in processing hole on the workpiece.The processing yield of the method for drilling holes is higher.
Description
Technical field
The present invention relates to a kind of method for drilling holes.
Background technique
In laser PCB (Printed circuit board, printed circuit board) capillary processing technology, especially UV
(ultraviolet, ultraviolet light) laser processing bores a complete hole and generally requires laser facula number in varying numbers.For
For the characteristic of UV laser, the relationship that the average maximum power of laser frequency, pulse width and laser is mutual is quite close.
When realizing UV laser energy attenuation, generally by change control signal pulse frequency and pulse width come
Realize the control of laser energy size.But after laser control system setting fixed pulse frequency and pulse width, transmitting
Each light spot energy size of laser energy is fixed, therefore the interface of the micropore in processing will appear hot spot overlapping
Phenomenon leads to " emphasis " phenomenon occur.For another example, when processing blind hole, screw processing mode, the laser at blind hole center are used
Energy density is excessive, leads to the damage of the bottom copper of PCB, make partly or completely PCB scrap, reduce processing yield.
Summary of the invention
Based on this, it is necessary to provide a kind of processing yield higher method for drilling holes.
A kind of method for drilling holes, comprising the following steps: default bore path, the bore path includes interconnected
Overlapping region and Non-overlapping Domain；Laser drilling parameters are configured according to the bore path, the laser drilling parameters include swashing
Light frequency and pulse width, the laser frequency is constant, and the pulse width for being allocated to the overlapping region is described less than being allocated to
The pulse width of Non-overlapping Domain；And it is focused on laser to workpiece according to the laser drilling parameters, and bored along the workpiece
The mobile laser in hole path, in processing hole on the workpiece.
In a wherein embodiment, described focus according to the laser drilling parameters specifically includes on laser to workpiece
Following steps: the laser drilling parameters are transferred to energy control apparatus by controller, and the energy control apparatus is according to
Laser drilling parameters generate pulse signal and are delivered to laser, and the laser emits laser according to the pulse signal.
In a wherein embodiment, the laser drilling parameters are transferred to the energy hole and filled by the controller
It is further comprising the steps of before setting: to send laser enabling signal to the energy control apparatus to start the energy hole dress
It sets.
In a wherein embodiment, the controller electrically connects with the energy control apparatus with the laser
It connects.
In a wherein embodiment, the pulse width for being allocated to the Non-overlapping Domain is equal, and is allocated to described
The numerical value of the pulse width of overlapping region and the overlapping degree of the overlapping region are inversely proportional.
In a wherein embodiment, the laser is UV laser, and the workpiece is pcb board, and the hole is round hole.
In a wherein embodiment, the hole is circular through hole, the section start of the periphery in the hole and the hole
The termination of periphery is overlapped and forms the overlapping region.
In a wherein embodiment, the hole is blind round hole, and the bore path is helical trajectory.
In a wherein embodiment, the bore path includes outer ring section, transition and inner ring section, the transition
One end connect with outer ring section, the other end of the transition is connect with the inner ring section, the transition with it is described outside
It is formed with the first overlapping region at circle section interconnection, is formed with the second weight at the transition and the inner ring section interconnection
Folded region.
In a wherein embodiment, the pulse width for being allocated to the Non-overlapping Domain is kept constant.
In above-mentioned method for drilling holes, since the pulse width for being allocated to the overlapping region is described non-less than being allocated to
The pulse width of overlapping region, therefore the opposite reduction of each received laser energy in the overlapping region, even if there is light
The phenomenon that spot is overlapped leads to " emphasis " phenomenon occur, can also guarantee that the laser energy density in the overlapping region is unlikely to
It is excessive, and then workpiece is avoided damage to, improve the processing yield of bore operation.
Detailed description of the invention
Fig. 1 is the step flow chart of the method for drilling holes of an embodiment.
Fig. 2 is the pulse signal figure of the method for drilling holes of an embodiment.
Fig. 3 is the block diagram for the drilling equipment that the method for drilling holes of an embodiment uses.
Fig. 4 is the drilling track graph of the blind round hole of an embodiment.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give better embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose of providing these embodiments is that making to understand more the disclosure
Add thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term used herein is intended merely to the mesh of description specific embodiment
, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more relevant listed items
Any and all combinations.
The present invention relates to a kind of method for drilling holes.For example, the method for drilling holes, comprising the following steps: default to bore
Hole path, the bore path include overlapping region interconnected and Non-overlapping Domain；Swashed according to bore path configuration
Light drilling parameter, the laser drilling parameters include laser frequency and pulse width, and the laser frequency is constant, are allocated to described
The pulse width of overlapping region is less than the pulse width for being allocated to the Non-overlapping Domain；And according to the laser drilling parameters
It focuses on laser to workpiece, and moves the laser along the Workpiece boring path, in processing hole on the workpiece.
Please refer to Fig. 1 and Fig. 2, a kind of method for drilling holes, comprising the following steps:
In step S101, bore path is preset, the bore path includes overlapping region interconnected and non-overlap
Region；
In step S102, laser drilling parameters are configured according to the bore path, the laser drilling parameters include swashing
Light frequency and pulse width, the laser frequency is constant, and the pulse width for being allocated to the overlapping region is described less than being allocated to
The pulse width of Non-overlapping Domain；For example, the pulse period T for wherein controlling the pulse signal of laser is constant, and pulse width W root
Change according to the overlapping degree of bore path, and
In step S103, focused on laser to workpiece according to the laser drilling parameters, and along the Workpiece boring road
The mobile laser of diameter, in processing hole on the workpiece.
In above-mentioned method for drilling holes, since the pulse width for being allocated to the overlapping region is described non-less than being allocated to
The pulse width of overlapping region, therefore the opposite reduction of each received laser energy in the overlapping region, even if there is light
The phenomenon that spot is overlapped leads to " emphasis " phenomenon occur, can also guarantee that the laser energy density in the overlapping region is unlikely to
It is excessive, and then workpiece is avoided damage to, improve the processing yield of bore operation.
Also referring to Fig. 3, for example, for the ease of controlling the transmitting of laser, it is described poly- according to the laser drilling parameters
Specifically includes the following steps: the laser drilling parameters are transferred to energy control apparatus by controller 10 on burnt laser to workpiece
20, the energy control apparatus generates pulse signal according to the laser drilling parameters and is delivered to laser 30, the laser
Device emits laser according to the pulse signal.For example, a kind of method for drilling holes, comprising the following steps: default bore path, institute
Stating bore path includes overlapping region interconnected and Non-overlapping Domain；Laser drill ginseng is configured according to the bore path
Number, the laser drilling parameters include laser frequency and pulse width, and the laser frequency is constant, is allocated to the overlapping region
Pulse width be less than and be allocated to the pulse width of the Non-overlapping Domain；And controller transmits the laser drilling parameters
To energy control apparatus, the energy control apparatus generates pulse signal according to the laser drilling parameters and is delivered to laser
Device, the laser according to the pulse signal emit laser to workpiece on, and along the Workpiece boring path move it is described swash
Light, in processing hole on the workpiece.By the way that the controller and the energy control apparatus is arranged, so that the laser
Energy hole be achieved.
For example, in order to start the energy control apparatus, the laser drilling parameters are transferred to described by the controller
Further comprising the steps of before energy control apparatus: transmission laser enabling signal 40 starts described to the energy control apparatus
Energy control apparatus.For example, a kind of method for drilling holes, comprising the following steps: default bore path, the bore path include
Overlapping region interconnected and Non-overlapping Domain；Laser drilling parameters, the laser drill are configured according to the bore path
Parameter includes laser frequency and pulse width, and the laser frequency is constant, and the pulse width for being allocated to the overlapping region is less than
It is allocated to the pulse width of the Non-overlapping Domain；It sends laser enabling signal and starts the energy to the energy control apparatus
Amount control device；The laser drilling parameters are transferred to energy control apparatus by controller, and the energy control apparatus is according to institute
It states laser drilling parameters to generate pulse signal and be delivered to laser, the laser emits laser extremely according to the pulse signal
On workpiece, and the laser is moved along the Workpiece boring path, in processing hole on the workpiece.By to the energy control
Device processed emits laser enabling signal so that the energy control apparatus can receive the laser drill work parameter it
Preceding starting, successfully to receive laser drill work parameter.
For example, for the ease of realizing to the bore operation of PCB, the controller and the laser with the energy control
Device processed is electrically connected.The controller is computer, and the laser is UV laser.The workpiece is pcb board, the Kong Weiyuan
Shape hole.The hole is circular through hole, and the section start of the periphery in the hole is overlapped with the termination of the periphery in the hole and forms institute
State overlapping region.The hole is blind round hole, and the bore path is helical trajectory.For example, the method for drilling holes, including
Following steps: default bore path, the bore path includes overlapping region interconnected and Non-overlapping Domain；According to described
Bore path configures laser drilling parameters, and the laser drilling parameters include laser frequency and pulse width, the laser frequency
Constant, the pulse width for being allocated to the overlapping region is less than the pulse width for being allocated to the Non-overlapping Domain；And according to
The laser drilling parameters focus on UV to PCB, and move the UV laser along the PCB bore path, on the PCB
Process round hole.By selecting UV laser, the laser and the PCB are adapted, and then by the laser drill
Method is suitable on PCB.
For example, for the ease of accurately adjusting laser energy density when drilling, the method for drilling holes includes following
Step: default bore path, the bore path includes overlapping region interconnected and Non-overlapping Domain；According to the drilling
Path configures laser drilling parameters, and the laser drilling parameters include laser frequency and pulse width, and the laser frequency is constant,
The pulse width for being allocated to the overlapping region is less than the pulse width for being allocated to the Non-overlapping Domain, wherein being allocated to described
The pulse width of Non-overlapping Domain is equal, be allocated to the pulse width of the overlapping region numerical value and the overlapping region
Overlapping degree is inversely proportional；It sends laser enabling signal and starts the energy control apparatus to the energy control apparatus；Control
The laser drilling parameters are transferred to energy control apparatus by device, and the energy control apparatus is produced according to the laser drilling parameters
Raw pulse signal is simultaneously delivered to laser, and the laser emits on laser to workpiece according to the pulse signal, and along described
The mobile laser in Workpiece boring path, in processing hole on the workpiece.It is wide by the pulse for being allocated to the overlapping region
The numerical value of degree and the overlapping degree of the overlapping region are inversely proportional, so that the configuration of the energy density of the laser is more uniform,
That is the energy density of overlapping region and the energy density of Non-overlapping Domain is equal, to admirably avoid asking the damage of pcb board
Topic.
For example, for the ease of in being drilled with blind round hole on PCB, referring to Fig. 4, the hole 50 is blind round hole.It is described to swash
Light device processes the blind hole by issuing multiple continuous hot spots 60 along the drilling track.The bore path includes outer ring
Section 51, transition 52 and inner ring section 53, one end of the transition are connect with the outer ring section, the other end of the transition and
The first overlapping region 54, the gradual change are formed at the inner ring section connection, the transition and outer ring section interconnection
The second overlapping region 55 is formed at section and the inner ring section interconnection.For example, a kind of method for drilling holes, including following step
Rapid: default bore path, the bore path includes overlapping region interconnected and Non-overlapping Domain；According to the drilling road
Diameter configures laser drilling parameters, and the laser drilling parameters include laser frequency and pulse width, and the laser frequency is constant, matches
Set the pulse width for being less than to the pulse width of the overlapping region and being allocated to the Non-overlapping Domain；Send laser enabling signal
To the energy control apparatus to start the energy control apparatus；The laser drilling parameters are transferred to energy control by controller
Device processed, the energy control apparatus generates pulse signal according to the laser drilling parameters and is delivered to laser, described to swash
Light device emits on laser to workpiece according to the pulse signal, and moves the laser along the Workpiece boring path, in institute
It states and processes hole on workpiece, the bore path includes outer ring section, transition and inner ring section, one end of the transition and described outer
Section connection is enclosed, the other end of the transition is connect with the inner ring section, at the transition and outer ring section interconnection
It is formed with the first overlapping region, is formed with the second overlapping region at the transition and the inner ring section interconnection.It is allocated to
The pulse width of the laser of first overlapping region and second overlay region is less than remaining for being allocated to the bore path
The pulse width of partial laser.The pulse width for being allocated to the Non-overlapping Domain is kept constant.By to the drilling road
The setting of diameter, the pulse width for being allocated to the laser of first overlapping region and second overlay region are described less than being allocated to
The pulse width of the laser of the rest part of bore path, so that the method for drilling holes is more suitable for being drilled on PCB
Blind round hole.
For example, for UV laser, boring a complete hole in laser PCB capillary processing technology and generally requiring quantity not
Deng laser facula number.For the characteristic of UV laser, laser frequency, pulse width and average maximum power are mutual
Relationship is quite close.When realizing UV laser energy attenuation, general pulse frequency and pulse by changing control signal
Width realizes the control of laser energy size.But after laser control system setting fixed pulse frequency and pulse width,
Each light spot energy size of the laser energy of transmitting is fixed.Since each light spot energy size is fixed,
The interface in hole will appear the phenomenon that hot spot overlapping, lead to " emphasis " phenomenon occur.Or when processing blind hole, spiral shell is used
Processing method is revolved, the laser energy density at blind hole center is excessive, causes to hurt bottom copper.Make partly or completely circuit board scrap, increase
Add the production cost and testing cost of PCB enterprise.Then a kind of method of laser energy attenuation is needed, can accurately be controlled each sharp
The size of light light spot energy promotes the processing quality of product.
The method of this laser energy attenuation needs first to set laser arteries and veins on PC (personal computer, PC)
Frequency is rushed, on the basis of fixed laser pulse frequency, then the width parameter of each pulse is set (cannot be separately provided before every
The width of a pulse).Then the parameter set is handed down to laser energy attenuation system by PC.Laser energy attenuation system is connecing
After receiving external laser enabling signal, by the pulse sequence parameter output pulse signal set to laser, to accurately control
The energy size for making each hot spot achievees the purpose that improve drilling effect.
It is the helical trajectory figure of processing blind hole according to Fig. 4, one of them small circle represents small light spot one by one, can see
When to hot spot along the track rapidoprint of spiral, the close quarters that energy is excessively concentrated can be generated, such laser energy is close
It spends greatly, causes to hurt bottom copper.To improve this part processing effect, need to reduce the light spot energy in energy-intensive region.According to
It shown in Fig. 2-3, needs first to set laser pulse frequency on PC, on the basis of fixed laser pulse frequency, further according to processing work
Skill requires to set the width parameter of each pulse.Then these parameters set are handed down to laser energy attenuation system by PC
System.Laser energy attenuation system exports pulse after receiving external laser enabling signal, by the pulse sequence parameter set
Signal will successively issue laser according to each laser facula energy size set to laser, laser.Swash identical
Under the conditions of light frequency, it can be seen that the difference of fixed pulse width signal and variable pulse width signal.Fixed pulse signal
Each pulse signal width is fixed consistent.And the single pulse width of variable pulse signal be can be according to processing technology
It is required that change.On the basis of frequency is certain, the pulse width for changing single pulse signal then means single laser facula
The change of energy size.To reach the processing effect in ideal.Circuit board scrappage will be reduced in this way, reduce PCB enterprise
Production cost and testing cost.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Only several embodiments of the present invention are expressed for embodiment described above, and the description thereof is more specific and detailed, but
It cannot be construed as a limitation to the scope of the present invention.It should be pointed out that for the ordinary skill people of this field
For member, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to of the invention
Protection scope.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of method for drilling holes, which comprises the following steps:
Default bore path, the bore path includes overlapping region interconnected and Non-overlapping Domain；
Laser drilling parameters are configured according to the bore path, the laser drilling parameters include laser frequency and pulse width,
The laser frequency is constant, and the pulse width for being allocated to the overlapping region is wide less than the pulse for being allocated to the Non-overlapping Domain
Degree；And
It is focused on laser to workpiece according to the laser drilling parameters, and moves the laser along the Workpiece boring path, with
In processing hole on the workpiece；
Wherein, the overlapping degree of the numerical value and the overlapping region that are allocated to the pulse width of the overlapping region is inversely proportional.
2. method for drilling holes according to claim 1, which is characterized in that described to be focused according to the laser drilling parameters
It is described specifically includes the following steps: the laser drilling parameters are transferred to energy control apparatus by controller on laser to workpiece
Energy control apparatus generates pulse signal according to the laser drilling parameters and is delivered to laser, and the laser is according to
Pulse signal emits laser.
3. method for drilling holes according to claim 2, which is characterized in that the controller is by the laser drilling parameters
It is further comprising the steps of before being transferred to the energy control apparatus: send laser enabling signal to the energy control apparatus with
Start the energy control apparatus.
4. method for drilling holes according to claim 2 or 3, which is characterized in that the controller and the laser are equal
It is electrically connected with the energy control apparatus.
5. method for drilling holes according to claim 1, which is characterized in that be wherein allocated to the arteries and veins of the Non-overlapping Domain
Width is rushed to be equal.
6. method for drilling holes according to claim 1, which is characterized in that the laser is UV laser, and the workpiece is
Pcb board, the hole are round hole.
7. method for drilling holes according to claim 6, which is characterized in that the hole is circular through hole, the week in the hole
The section start of edge is overlapped with the termination of the periphery in the hole and forms the overlapping region.
8. method for drilling holes according to claim 6, which is characterized in that the hole is blind round hole, the drilling road
Diameter is helical trajectory.
9. method for drilling holes according to claim 8, which is characterized in that the bore path includes outer ring section, gradual change
Section and inner ring section, one end of the transition are connect with the outer ring section, the other end of the transition and the inner ring Duan Lian
It connects, is formed with the first overlapping region, the transition and the inner ring section at the transition and outer ring section interconnection
The second overlapping region is formed at interconnection.
10. method for drilling holes according to claim 1, which is characterized in that be allocated to the pulse of the Non-overlapping Domain
Width is kept constant.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710781014.5A CN107520545B (en) | 2017-09-01 | 2017-09-01 | Method for drilling holes |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710781014.5A CN107520545B (en) | 2017-09-01 | 2017-09-01 | Method for drilling holes |
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| CN107520545B true CN107520545B (en) | 2019-06-21 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109922601B (en) * | 2019-03-14 | 2021-12-07 | 深圳市大族数控科技股份有限公司 | Processing method of blind hole of circuit board |
| CN110385521B (en) * | 2019-08-29 | 2021-03-16 | 西安交通大学 | Femtosecond laser processing device and method for silicon carbide rapid deep etching |
| CN111001941B (en) * | 2019-12-26 | 2021-12-21 | 武汉华工激光工程有限责任公司 | Laser drilling method |
| CN113210856B (en) * | 2021-04-22 | 2022-07-19 | 广东工业大学 | PCB short-wavelength pulse laser drilling method and related drilling device |
| CN114682932B (en) * | 2022-04-14 | 2024-02-09 | 强一半导体(苏州)股份有限公司 | Method for laser processing through holes suitable for green ceramic chips |
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| CN107520545A (en) | 2017-12-29 |
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