CN107520545A - Method for drilling holes - Google Patents
Method for drilling holes Download PDFInfo
- Publication number
- CN107520545A CN107520545A CN201710781014.5A CN201710781014A CN107520545A CN 107520545 A CN107520545 A CN 107520545A CN 201710781014 A CN201710781014 A CN 201710781014A CN 107520545 A CN107520545 A CN 107520545A
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- CN
- China
- Prior art keywords
- laser
- drilling
- overlapping region
- overlapping
- drilling holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to a kind of method for drilling holes.The method for drilling holes comprises the following steps：Default bore path, the bore path include overlapping region and the Non-overlapping Domain being connected with each other；Laser drilling parameters are configured according to the bore path, the laser drilling parameters include laser frequency and pulse width, and the laser frequency is constant, and the pulse width for being allocated to the overlapping region is less than the pulse width for being allocated to the Non-overlapping Domain；And focused on according to the laser drilling parameters on laser to workpiece, and the laser is moved along the Workpiece boring path, with processing hole on the workpiece.The processing yield of the method for drilling holes is higher.
Description
Technical field
The present invention relates to a kind of method for drilling holes.
Background technology
In laser PCB (Printed circuit board, printed circuit board (PCB)) capillary processing technology, especially UV
(ultraviolet, ultraviolet) laser machines, and bores a complete hole and generally requires the laser facula number that quantity does not wait.For
For the characteristic of UV laser, the relation that the average maximum power of laser frequency, pulse width and laser is mutual is quite close.
When UV Laser energy attenuations are realized, typically by the pulse frequency that changes control signal and pulse width come
Realize the control of laser energy size.But after laser control system setting fixed pulse frequency and pulse width, transmitting
Each light spot energy size of laser energy is fixed, therefore the interface of the micropore in processing occurs that hot spot is overlapping
Phenomenon, cause " emphasis " phenomenon occur.And for example, when processing blind hole, screw processing mode, the laser at blind hole center are used
Energy density is excessive, causes the damage of PCB bottom copper, make partly or completely PCB scrap, reduce processing yield.
The content of the invention
Based on this, it is necessary to provide a kind of processing yield higher method for drilling holes.
A kind of method for drilling holes, comprises the following steps：Default bore path, the bore path include what is be connected with each other
Overlapping region and Non-overlapping Domain；Laser drilling parameters are configured according to the bore path, the laser drilling parameters include swashing
Light frequency and pulse width, the laser frequency is constant, and the pulse width for being allocated to the overlapping region is described less than being allocated to
The pulse width of Non-overlapping Domain；And focused on according to the laser drilling parameters on laser to workpiece, and bored along the workpiece
The laser is moved in hole path, with processing hole on the workpiece.
In a wherein embodiment, described focused on according to the laser drilling parameters specifically includes on laser to workpiece
Following steps：The laser drilling parameters are transferred to energy control apparatus by controller, and the energy control apparatus is according to
Laser drilling parameters produce pulse signal and are delivered to laser, and the laser launches laser according to the pulse signal.
In a wherein embodiment, the laser drilling parameters are transferred to the energy hole and filled by the controller
It is further comprising the steps of before putting：Laser enabling signal is sent to fill to start the energy hole to the energy control apparatus
Put.
In a wherein embodiment, the controller electrically connects with the laser with the energy control apparatus
Connect.
In a wherein embodiment, it is equal to be allocated to the pulse width of the Non-overlapping Domain, is allocated to described
The numerical value of the pulse width of overlapping region and the overlapping degree of the overlapping region are inversely proportional.
In a wherein embodiment, the laser is UV laser, and the workpiece is pcb board, and the hole is circular port.
In a wherein embodiment, the hole is manhole, the section start of the periphery in the hole and the hole
The termination of periphery overlaps and forms the overlapping region.
In a wherein embodiment, the hole is blind round hole, and the bore path is helical trajectory.
In a wherein embodiment, the bore path includes outer ring section, transition and inner ring section, the transition
One end be connected with the outer ring section, the other end of the transition is connected with the inner ring section, the transition with it is described outer
Enclose at section interconnection formed with the first overlapping region, the transition with the inner ring section interconnection formed with the second weight
Folded region.
In a wherein embodiment, the pulse width for being allocated to the Non-overlapping Domain keeps constant.
In above-mentioned method for drilling holes, because the pulse width for being allocated to the overlapping region is described non-less than being allocated to
The pulse width of overlapping region, therefore the relative reduction of the laser energy received every time in the overlapping region, even if there is light
The overlapping phenomenon of spot, cause " emphasis " phenomenon occur, can also ensure that the laser energy density in the overlapping region is unlikely to
It is excessive, and then workpiece is avoided damage to, improve the processing yield of bore operation.
Brief description of the drawings
Fig. 1 is the step flow chart of the method for drilling holes of an embodiment.
Fig. 2 is the pulse signal figure of the method for drilling holes of an embodiment.
Fig. 3 is the block diagram for the drilling equipment that the method for drilling holes of an embodiment uses.
Fig. 4 is the drilling track graph of the blind round hole of an embodiment.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give the better embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose for providing these embodiments is to make to understand more the disclosure
Add thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used herein is intended merely to describe the mesh of specific embodiment
, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more related Listed Items
Arbitrary and all combination.
The present invention relates to a kind of method for drilling holes.For example, the method for drilling holes, comprises the following steps：It is default to bore
Hole path, the bore path include overlapping region and the Non-overlapping Domain being connected with each other；Swashed according to bore path configuration
Light drilling parameter, the laser drilling parameters include laser frequency and pulse width, and the laser frequency is constant, are allocated to described
The pulse width of overlapping region is less than the pulse width for being allocated to the Non-overlapping Domain；And according to the laser drilling parameters
Focus on laser to workpiece, and move the laser along the Workpiece boring path, with processing hole on the workpiece.And for example,
A kind of method for drilling holes comprises the following steps：Default bore path, the bore path include the overlapping region being connected with each other
With Non-overlapping Domain；According to the bore path configure laser drilling parameters, the laser drilling parameters include laser frequency with
Pulse width.For example, the laser frequency is constant, the pulse width for being allocated to the overlapping region is described non-heavy less than being allocated to
The pulse width in folded region；And focused on according to the laser drilling parameters on laser to workpiece, and along the Workpiece boring road
The laser is moved in footpath, with processing hole on the workpiece.
Fig. 1 and Fig. 2 is referred to, a kind of method for drilling holes, is comprised the following steps：
In step S101, preset bore path, the bore path include be connected with each other overlapping region with it is non-overlapped
Region；
In step S102, laser drilling parameters are configured according to the bore path, the laser drilling parameters include swashing
Light frequency and pulse width, the laser frequency is constant, and the pulse width for being allocated to the overlapping region is described less than being allocated to
The pulse width of Non-overlapping Domain；For example, wherein control the pulse period T of the pulse signal of laser constant, and pulse width W roots
Change according to the overlapping degree of bore path, and
In step S103, focused on according to the laser drilling parameters on laser to workpiece, and along the Workpiece boring road
The laser is moved in footpath, with processing hole on the workpiece.
In above-mentioned method for drilling holes, because the pulse width for being allocated to the overlapping region is described non-less than being allocated to
The pulse width of overlapping region, therefore the relative reduction of the laser energy received every time in the overlapping region, even if there is light
The overlapping phenomenon of spot, cause " emphasis " phenomenon occur, can also ensure that the laser energy density in the overlapping region is unlikely to
It is excessive, and then workpiece is avoided damage to, improve the processing yield of bore operation.
Also referring to Fig. 3, for example, for the ease of controlling the transmitting of laser, it is described to gather according to the laser drilling parameters
Following steps are specifically included on burnt laser to workpiece：The laser drilling parameters are transferred to energy control apparatus by controller 10
20, the energy control apparatus produces pulse signal according to the laser drilling parameters and is delivered to laser 30, the laser
Device launches laser according to the pulse signal.For example, a kind of method for drilling holes, comprises the following steps：Default bore path, institute
State overlapping region and Non-overlapping Domain that bore path includes being connected with each other；Laser drill ginseng is configured according to the bore path
Number, the laser drilling parameters include laser frequency and pulse width, and the laser frequency is constant, is allocated to the overlapping region
Pulse width be less than and be allocated to the pulse width of the Non-overlapping Domain；And controller transmits the laser drilling parameters
To energy control apparatus, the energy control apparatus produces pulse signal according to the laser drilling parameters and is delivered to laser
Device, the laser according to the pulse signal launch laser to workpiece on, and along the Workpiece boring path move it is described swash
Light, with processing hole on the workpiece.By setting the controller and the energy control apparatus, so that the laser
Energy hole be achieved.
For example, in order to start the energy control apparatus, the laser drilling parameters are transferred to described by the controller
It is further comprising the steps of before energy control apparatus：It is described to start to the energy control apparatus to send laser enabling signal 40
Energy control apparatus.For example, a kind of method for drilling holes, comprises the following steps：Default bore path, the bore path include
The overlapping region of interconnection and Non-overlapping Domain；Laser drilling parameters, the laser drill are configured according to the bore path
Parameter includes laser frequency and pulse width, and the laser frequency is constant, and the pulse width for being allocated to the overlapping region is less than
It is allocated to the pulse width of the Non-overlapping Domain；Laser enabling signal is sent to the energy control apparatus to start the energy
Amount control device；The laser drilling parameters are transferred to energy control apparatus by controller, and the energy control apparatus is according to institute
State laser drilling parameters to produce pulse signal and be delivered to laser, the laser launches laser extremely according to the pulse signal
On workpiece, and the laser is moved along the Workpiece boring path, with processing hole on the workpiece.By to the energy control
Device processed launches laser enabling signal so that the energy control apparatus can receive the laser drill work parameter it
Preceding startup, successfully to receive laser drill work parameter.
For example, for the ease of realizing to PCB bore operation, the controller and the laser with the energy control
Device processed is electrically connected with.The controller is computer, and the laser is UV laser.The workpiece is pcb board, the Kong Weiyuan
Shape hole.The hole is manhole, and the section start of the periphery in the hole overlaps with the termination of the periphery in the hole and forms institute
State overlapping region.The hole is blind round hole, and the bore path is helical trajectory.For example, the method for drilling holes, including
Following steps：Default bore path, the bore path include overlapping region and the Non-overlapping Domain being connected with each other；According to described
Bore path configures laser drilling parameters, and the laser drilling parameters include laser frequency and pulse width, the laser frequency
Constant, the pulse width for being allocated to the overlapping region is less than the pulse width for being allocated to the Non-overlapping Domain；And according to
The laser drilling parameters are focused on UV to PCB, and move the UV laser along the PCB bore paths, with the PCB
Process circular port.Passing through and select UV laser so that the laser can be adapted with the PCB, and then by the laser drill
Method is applied on PCB.
For example, for the ease of adjusting laser energy density during drilling exactly, the method for drilling holes includes following
Step：Default bore path, the bore path include overlapping region and the Non-overlapping Domain being connected with each other；According to the drilling
Path configures laser drilling parameters, and the laser drilling parameters include laser frequency and pulse width, and the laser frequency is constant,
The pulse width for being allocated to the overlapping region is less than the pulse width for being allocated to the Non-overlapping Domain, wherein being allocated to described
The pulse width of Non-overlapping Domain is equal, is allocated to the numerical value of the pulse width of the overlapping region and the overlapping region
Overlapping degree is inversely proportional；Laser enabling signal is sent to the energy control apparatus to start the energy control apparatus；Control
The laser drilling parameters are transferred to energy control apparatus by device, and the energy control apparatus produces according to the laser drilling parameters
Raw pulse signal is simultaneously delivered to laser, and the laser is launched on laser to workpiece according to the pulse signal, and along described
The laser is moved in Workpiece boring path, with processing hole on the workpiece.It is wide by the pulse for being allocated to the overlapping region
The numerical value of degree and the overlapping degree of the overlapping region are inversely proportional so that and the configuration of the energy density of the laser is more uniform,
That is the energy density of overlapping region and the energy density of Non-overlapping Domain is equal, so as to admirably avoid the damage to pcb board from asking
Topic.
For example, for the ease of in being drilled with blind round hole on PCB, referring to Fig. 4, the hole 50 is blind round hole.It is described to swash
Light device along the drilling track by sending multiple continuous hot spots 60 to process the blind hole.The bore path includes outer ring
Section 51, transition 52 and inner ring section 53, one end of the transition are connected with the outer ring section, the other end of the transition and
The inner ring section connects, formed with the first overlapping region 54, the gradual change at the transition and the outer ring section interconnection
Formed with the second overlapping region 55 at section and the inner ring section interconnection.For example, a kind of method for drilling holes, including following step
Suddenly：Default bore path, the bore path include overlapping region and the Non-overlapping Domain being connected with each other；According to the drilling road
Footpath configures laser drilling parameters, and the laser drilling parameters include laser frequency and pulse width, and the laser frequency is constant, matches somebody with somebody
Put the pulse width for being less than to the pulse width of the overlapping region and being allocated to the Non-overlapping Domain；Send laser enabling signal
To the energy control apparatus to start the energy control apparatus；The laser drilling parameters are transferred to energy control by controller
Device processed, the energy control apparatus produces pulse signal according to the laser drilling parameters and is delivered to laser, described to swash
Light device is launched on laser to workpiece according to the pulse signal, and moves the laser along the Workpiece boring path, with institute
State and hole processed on workpiece, the bore path includes outer ring section, transition and inner ring section, one end of the transition with it is described outer
Section connection is enclosed, the other end of the transition is connected with the inner ring section, at the transition and the outer ring section interconnection
Formed with the first overlapping region, formed with the second overlapping region at the transition and the inner ring section interconnection.It is allocated to
The pulse width of the laser of first overlapping region and second overlay region is less than remaining for being allocated to the bore path
The pulse width of partial laser.The pulse width for being allocated to the Non-overlapping Domain keeps constant.By to the drilling road
The setting in footpath, the pulse width for being allocated to the laser of first overlapping region and second overlay region are described less than being allocated to
The pulse width of the laser of the remainder of bore path, so that the method for drilling holes is more suitable for being drilled with PCB
Blind round hole.
For example, in laser PCB capillary processing technologies, for UV laser, bore a complete hole and generally require quantity not
Deng laser facula number.For the characteristic of UV laser, laser frequency, pulse width and average maximum power are mutual
Relation is quite close.When UV Laser energy attenuations are realized, typically pass through the pulse frequency for changing control signal and pulse
Width realizes the control of laser energy size.But after laser control system setting fixed pulse frequency and pulse width,
Each light spot energy size of the laser energy of transmitting is fixed.Due to each light spot energy size be it is fixed,
The overlapping phenomenon of hot spot occurs in the interface in hole, causes " emphasis " phenomenon occur.Or when processing blind hole, use spiral shell
Processing mode is revolved, the laser energy density at blind hole center is excessive, causes to hinder bottom copper.Make partly or completely circuit board scrap, increase
Add the production cost and testing cost of PCB enterprises.Then a kind of method of Laser energy attenuation is needed, can accurately be controlled each sharp
The size of light light spot energy, lift the processing quality of product.
The method of this Laser energy attenuation, need first to set laser arteries and veins on PC (personal computer, PC)
Frequency is rushed, on the basis of fixed laser pulse frequency, then sets the width parameter of each pulse (can not be separately provided before every
The width of individual pulse).Then the parameter set is handed down to Laser energy attenuation system by PC.Laser energy attenuation system is connecing
After receiving outside laser enabling signal, by the pulse sequence parameter output pulse signal set to laser, so as to accurately control
The energy size of each hot spot is made, reaches the purpose for improving drilling effect.
According to the helical trajectory figure that Fig. 4 is processing blind hole, one of them small circle represents small light spot one by one, can seen
When track rapidoprint to hot spot along spiral, the close quarters that energy is excessively concentrated can be produced, such laser energy is close
Spend greatly, cause to hinder bottom copper.To improve this part processing effect, it is necessary to reduce the light spot energy in energy-intensive region.According to
Shown in Fig. 2-3, need first to set laser pulse frequency on PC, on the basis of fixed laser pulse frequency, further according to processing work
Skill requirement sets the width parameter of each pulse.Then these parameters set are handed down to Laser energy attenuation system by PC
System.Laser energy attenuation system exports pulse after outside laser enabling signal is received, by the pulse sequence parameter set
Signal will send laser successively to laser, laser according to each laser facula energy size set.Swash in identical
Under the conditions of light frequency, it can be seen that the difference of fixed pulse width signal and variable pulse width signal.Fixed pulse signal
Each pulse signal width is fixed consistent.And the individual pulse width of variable pulse signal be can be according to processing technology
It is required that change.On the basis of frequency is certain, changing the pulse width of individual pulse signal then means single laser facula
The change of energy size.So as to reach the processing effect in ideal.Circuit board scrappage will be so reduced, reduces PCB enterprises
Production cost and testing cost.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that the ordinary skill people for this area
For member, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the present invention's
Protection domain.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of method for drilling holes, it is characterised in that comprise the following steps：
Default bore path, the bore path include overlapping region and the Non-overlapping Domain being connected with each other；
Laser drilling parameters are configured according to the bore path, the laser drilling parameters include laser frequency and pulse width,
The laser frequency is constant, and the pulse width for being allocated to the overlapping region is wide less than the pulse for being allocated to the Non-overlapping Domain
Degree；And
Focused on according to the laser drilling parameters on laser to workpiece, and the laser is moved along the Workpiece boring path, with
In processing hole on the workpiece.
2. method for drilling holes according to claim 1, it is characterised in that described to be focused on according to the laser drilling parameters
Following steps are specifically included on laser to workpiece：The laser drilling parameters are transferred to energy control apparatus by controller, described
Energy control apparatus produces pulse signal according to the laser drilling parameters and is delivered to laser, and the laser is according to
Pulse signal launches laser.
3. method for drilling holes according to claim 2, it is characterised in that the controller is by the laser drilling parameters
It is further comprising the steps of before being transferred to the energy control apparatus：Send laser enabling signal to the energy control apparatus with
Start the energy control apparatus.
4. the method for drilling holes according to Claims 2 or 3, it is characterised in that the controller and the laser are equal
It is electrically connected with the energy control apparatus.
5. method for drilling holes according to claim 1, it is characterised in that be wherein allocated to the arteries and veins of the Non-overlapping Domain
Rush that width is equal, be allocated to the numerical value of pulse width of the overlapping region and the overlapping degree of the overlapping region into anti-
Than.
6. method for drilling holes according to claim 1, it is characterised in that the laser is UV laser, and the workpiece is
Pcb board, the hole are circular port.
7. method for drilling holes according to claim 6, it is characterised in that the hole is manhole, the week in the hole
The section start of edge overlaps with the termination of the periphery in the hole and forms the overlapping region.
8. method for drilling holes according to claim 6, it is characterised in that the hole is blind round hole, the drilling road
Footpath is helical trajectory.
9. method for drilling holes according to claim 8, it is characterised in that the bore path includes outer ring section, gradual change
Section and inner ring section, one end of the transition are connected with the outer ring section, the other end of the transition and the inner ring Duan Lian
Connect, formed with the first overlapping region, the transition and the inner ring section at the transition and the outer ring section interconnection
Formed with the second overlapping region at interconnection.
10. method for drilling holes according to claim 1, it is characterised in that be allocated to the pulse of the Non-overlapping Domain
Width keeps constant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710781014.5A CN107520545B (en) | 2017-09-01 | 2017-09-01 | Method for drilling holes |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710781014.5A CN107520545B (en) | 2017-09-01 | 2017-09-01 | Method for drilling holes |
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| CN107520545A true CN107520545A (en) | 2017-12-29 |
| CN107520545B CN107520545B (en) | 2019-06-21 |
Family
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109922601A (en) * | 2019-03-14 | 2019-06-21 | 大族激光科技产业集团股份有限公司 | A kind of processing method of route board blind hole |
| CN110385521A (en) * | 2019-08-29 | 2019-10-29 | 西安交通大学 | A kind of femtosecond laser processing device and method for the quick deep etching of silicon carbide |
| CN111001941A (en) * | 2019-12-26 | 2020-04-14 | 武汉华工激光工程有限责任公司 | Laser drilling method |
| CN114682932A (en) * | 2022-04-14 | 2022-07-01 | 强一半导体（苏州）有限公司 | Method for laser processing through hole suitable for green ceramic chip |
| WO2022222411A1 (en) * | 2021-04-22 | 2022-10-27 | 广东工业大学 | Pcb short-wavelength pulse laser drilling method and related apparatus |
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| CN109922601A (en) * | 2019-03-14 | 2019-06-21 | 大族激光科技产业集团股份有限公司 | A kind of processing method of route board blind hole |
| CN110385521A (en) * | 2019-08-29 | 2019-10-29 | 西安交通大学 | A kind of femtosecond laser processing device and method for the quick deep etching of silicon carbide |
| CN110385521B (en) * | 2019-08-29 | 2021-03-16 | 西安交通大学 | Femtosecond laser processing device and method for silicon carbide rapid deep etching |
| CN111001941A (en) * | 2019-12-26 | 2020-04-14 | 武汉华工激光工程有限责任公司 | Laser drilling method |
| CN111001941B (en) * | 2019-12-26 | 2021-12-21 | 武汉华工激光工程有限责任公司 | Laser drilling method |
| WO2022222411A1 (en) * | 2021-04-22 | 2022-10-27 | 广东工业大学 | Pcb short-wavelength pulse laser drilling method and related apparatus |
| CN114682932A (en) * | 2022-04-14 | 2022-07-01 | 强一半导体（苏州）有限公司 | Method for laser processing through hole suitable for green ceramic chip |
| CN114682932B (en) * | 2022-04-14 | 2024-02-09 | 强一半导体(苏州)股份有限公司 | Method for laser processing through holes suitable for green ceramic chips |
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