CN107493087A - Oscillator, electronic equipment and moving body - Google Patents
Oscillator, electronic equipment and moving body Download PDFInfo
- Publication number
- CN107493087A CN107493087A CN201710407093.3A CN201710407093A CN107493087A CN 107493087 A CN107493087 A CN 107493087A CN 201710407093 A CN201710407093 A CN 201710407093A CN 107493087 A CN107493087 A CN 107493087A
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- Prior art keywords
- temperature
- circuit
- oscillator
- ground wire
- wiring
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- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 35
- 239000010453 quartz Substances 0.000 description 50
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 50
- 230000010355 oscillation Effects 0.000 description 40
- 238000004806 packaging method and process Methods 0.000 description 22
- 239000000758 substrate Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 230000005611 electricity Effects 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 238000007664 blowing Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000007767 bonding agent Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- PSHMSSXLYVAENJ-UHFFFAOYSA-N dilithium;[oxido(oxoboranyloxy)boranyl]oxy-oxoboranyloxyborinate Chemical compound [Li+].[Li+].O=BOB([O-])OB([O-])OB=O PSHMSSXLYVAENJ-UHFFFAOYSA-N 0.000 description 2
- -1 golden projection) Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- 230000024241 parasitism Effects 0.000 description 2
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 241000251468 Actinopterygii Species 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- 229910002902 BiFeO3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910003334 KNbO3 Inorganic materials 0.000 description 1
- 241000222712 Kinetoplastida Species 0.000 description 1
- 229910003327 LiNbO3 Inorganic materials 0.000 description 1
- 229910003237 Na0.5Bi0.5TiO3 Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- FSAJRXGMUISOIW-UHFFFAOYSA-N bismuth sodium Chemical compound [Na].[Bi] FSAJRXGMUISOIW-UHFFFAOYSA-N 0.000 description 1
- 229910002115 bismuth titanate Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910000154 gallium phosphate Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000011534 incubation Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 235000016768 molybdenum Nutrition 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
- UKDIAJWKFXFVFG-UHFFFAOYSA-N potassium;oxido(dioxo)niobium Chemical compound [K+].[O-][Nb](=O)=O UKDIAJWKFXFVFG-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- UYLYBEXRJGPQSH-UHFFFAOYSA-N sodium;oxido(dioxo)niobium Chemical compound [Na+].[O-][Nb](=O)=O UYLYBEXRJGPQSH-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION, OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
- H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
- H03L1/04—Constructional details for maintaining temperature constant
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/021—Particular circuit arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/023—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples provided with specially adapted connectors
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1917—Control of temperature characterised by the use of electric means using digital means
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION, OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
- H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
- H03L1/022—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only by indirect stabilisation, i.e. by generating an electrical correction signal which is a function of the temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K2007/163—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements provided with specially adapted connectors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION, OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
- H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
- H03L1/022—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only by indirect stabilisation, i.e. by generating an electrical correction signal which is a function of the temperature
- H03L1/027—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only by indirect stabilisation, i.e. by generating an electrical correction signal which is a function of the temperature by using frequency conversion means which is variable with temperature, e.g. mixer, frequency divider, pulse add/substract logic circuit
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION, OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
- H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
- H03L1/028—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only of generators comprising piezoelectric resonators
Abstract
Oscillator, electronic equipment and moving body.Oscillator includes：Container；Oscillating element, it is housed in the above-described container；Heating circuit, it houses in the above-described container, the temperature of the oscillating element is controlled；Temperature sensing circuit, it is housed in the above-described container；Temperature-control circuit, it houses in the above-described container, the heating circuit is controlled according to the output of the temperature sensing circuit；Connecting wiring, it is housed in the above-described container, by being electrically connected to ground for the ground wire of the temperature sensing circuit and the temperature-control circuit；And ground wire outside terminal, it is configured in the outer surface of the container, with the ground wire of the temperature sensing circuit and being electrically connected to ground for the temperature-control circuit.
Description
Technical field
The present invention relates to oscillator, electronic equipment and moving body.
Background technology
As described in Japanese Unexamined Patent Publication 2015-122607 publications, in the past, as shaking using quartz oscillation element
Device is swung, is known to the quartz (controlled) oscillator (OCXO) with thermostat.The oscillator of Japanese Unexamined Patent Publication 2015-122607 publications has electricity
Circuit component (vibration IC), heater, vibrating reed and their packaging part is housed, heater is heated and makes the week of vibrating reed
Enclose temperature and keep constant, thereby, it is possible to avoid the influence of environment temperature, play high frequency stability.
The content of the invention
Also, in the oscillator of Japanese Unexamined Patent Publication 2015-122607 publications, consideration makes circuit possessed by heater element
The ground wire terminal of the ground wire terminal and circuit element (vibration IC) of element (heater IC) is together via the internal wiring of packaging part
And electrically connected with configuring the ground wire mounting terminal on packaging part bottom surface.But the resistance of internal wiring is larger, in heater IC
The electric current flowed through is larger, so, heater IC ground changes according to the working condition of heater.On the other hand, shake
It is faint to swing the electric current flowed through in IC, so, the ground for vibrating IC does not almost change.Thus, for example, in low temperature and from outer
Under the harsh environment of portion's blowing, the characteristic of " output of temperature-temperature sensor " and the reality of temperature sensor set in IC is vibrated
Border output can produce skew, possibly can not carry out temperature control exactly.
It is an object of the present invention to provide oscillator, electronic equipment and the shifting that can reduce temperature controlled precision reduction
Kinetoplast.
The present invention is completed to solve at least a portion in above-mentioned problem, following application examples can be used as real
It is existing.
The oscillator of the application example has：Oscillating element；Heating circuit, its temperature to the oscillating element are controlled
System；Temperature sensing circuit；Temperature-control circuit, it is according to work of the output of the temperature sensing circuit to the heating circuit
It is controlled；Container, it has receiving space, and the oscillating element, the heating circuit, institute are housed in the receiving space
State temperature sensing circuit and the temperature-control circuit；Ground wire outside terminal, it is configured on the outer surface of the container, with institute
The ground wire of the ground wire and the temperature-control circuit of stating temperature sensing circuit is electrically connected；And connecting wiring, it is in institute
State the ground wire of the temperature sensing circuit and being electrically connected to ground for the temperature-control circuit in receiving space.
Thus, obtain that the oscillator that temperature controlled precision reduces can be reduced.
In the oscillator of the application example, preferably described heating circuit and the temperature sensing circuit are included in same circuit
In element.
Thereby, it is possible to be accurately controlled to the temperature of heating circuit, it can more precisely make oscillating element
Environment temperature keeps constant, can play higher frequency stability.
In the oscillator of the application example, preferably described connecting wiring is bonding line.
Thus, the structure of connecting wiring is simple.
In the oscillator of the application example, multiple connecting wirings are preferable configured with.
Thereby, it is possible to more easily being electrically connected to ground the ground wire of temperature sensing circuit and temperature-control circuit.
In the oscillator of the application example, preferably described oscillator has the cloth of multiple connecting wiring electrical connections
Line, the wiring are configured in the container in a manner of towards the receiving space.
Thereby, it is possible to more easily being electrically connected to ground the ground wire of temperature sensing circuit and temperature-control circuit.And
And the surface of the wiring can be implemented gold-plated, the resistance of wiring can be reduced.
In the oscillator of the application example, preferably described container has insulating properties, has and supports the oscillating element, described
Heating circuit, the temperature sensing circuit and the temperature-control circuit base and with the base be coupled so that with
The lid of the receiving space is formed between the base, the ground wire outside terminal configuration is on the base.
Thus, via the internal wiring of base, the ground of the ground wire of the temperature sensing circuit and the temperature-control circuit
Line easily electrically connects with ground wire outside terminal respectively.
In the oscillator of the application example, preferably via the connecting wiring by the ground wire of the temperature sensing circuit and institute
The electrical path being electrically connected to ground of temperature-control circuit is stated not by the wiring for the inside for being embedded in the container.
Thereby, it is possible to further improve temperature controlled precision.
In the oscillator of the application example, preferably described heating circuit and the temperature sensing circuit are included in the 1st and integrated
In circuit element, the temperature-control circuit is included in the 2nd integrated circuit component, is had and the 1st integrated circuit component
Ground wire terminal electrical connection and when overlooking the 1st ground line pattern that is overlapped with the 1st integrated circuit component and with it is described
The ground wire terminal electrical connection of 2nd integrated circuit component and the 2nd ground overlapped when overlooking with the 2nd integrated circuit component
Line pattern, the 1st ground line pattern and the 2nd ground line pattern are electrically connected by the connecting wiring.
Thus, the 1st ground line pattern and the 2nd ground line pattern play function as screen layer, can be more stably to vibration
Element is driven.
The electronic equipment of the application example has the oscillator of above-mentioned application examples.
Thus, the higher electronic equipment of reliability is obtained.
The moving body of the application example has the oscillator of above-mentioned application examples.
Thus, the higher moving body of reliability is obtained.
Brief description of the drawings
Fig. 1 is the sectional view of the oscillator of embodiment.
Fig. 2 is the sectional view for the packaging part that the oscillator shown in Fig. 1 has.
Fig. 3 is the top view of the packaging part shown in Fig. 2.
Fig. 4 is the top view of the packaging part shown in Fig. 2.
Fig. 5 is the curve map for showing the frequency characteristic when making oscillator starting in the environment of -10 DEG C.
Fig. 6 is the curve of current value for showing to flow through in the heater element when making oscillator starting in the environment of -10 DEG C
Figure.
Fig. 7 is frequency characteristic when showing the convergence when making the oscillator drives of present embodiment in the environment of -10 DEG C
Curve map.
Fig. 8 is frequency characteristic when showing the convergence when making the oscillator drives of existing construction in the environment of -10 DEG C
Curve map.
Fig. 9 is the stereogram of the structure for the personal computer for showing mobile model (or notebook type).
Figure 10 is the stereogram for the structure for showing portable telephone (in addition to PHS).
Figure 11 is the stereogram for the structure for showing digital still camera.
Figure 12 is the stereogram for showing automobile.
Embodiment
Below, embodiment shown with reference to the accompanying drawings is carried out detailed to the oscillator, electronic equipment and moving body of the present invention
Explanation.
Fig. 1 is the sectional view of the oscillator of the preferred embodiment of the present invention.Fig. 2 is that the oscillator shown in Fig. 1 has
The sectional view of packaging part.Fig. 3 and Fig. 4 is the top view of the packaging part shown in Fig. 2 respectively.Fig. 5 is shown in the environment of -10 DEG C
The curve map of frequency characteristic when making oscillator starting.Fig. 6 is to show the heating when making oscillator starting in the environment of -10 DEG C
The curve map of the current value flowed through in element.Fig. 7 is to show the receipts when making the oscillator drives of the present invention in the environment of -10 DEG C
The curve map of frequency characteristic when holding back.Fig. 8 is to show the convergence when making the oscillator drives of existing construction in the environment of -10 DEG C
When frequency characteristic curve map.In addition, below, for convenience of description, by the upside in Fig. 1 be referred to as " on ", downside is referred to as
" under ".
Oscillator 1 shown in Fig. 1 is the quartz (controlled) oscillator (OCXO) with thermostat, as shown in Fig. 2 having：As vibration
The quartz oscillation element 2 of element；Heating circuit 31, its temperature to quartz oscillation element 2 are controlled；Temperature sensing circuit
32, it detects the environment temperature of quartz oscillation element 2；Temperature-control circuit 42, it is right according to the output of temperature sensing circuit 32
The work of heating circuit 31 is controlled；As the packaging part 5 of container, it has receiving space S, is housed in receiving space S
Quartz oscillation element 2, heating circuit 31, temperature sensing circuit 32 and temperature-control circuit 42；Ground wire outside terminal 631, it is matched somebody with somebody
Put on the outer surface of packaging part 5, be electrically connected respectively with the ground wire of temperature sensing circuit 32 and the ground wire of temperature-control circuit 42
Connect；And connecting wiring 7, it is in receiving space S by the ground wire of temperature sensing circuit 32 and the ground wire of temperature-control circuit 42
Electrical connection.According to this oscillator 1, can reduce temperature controlled precision reduces.Below, oscillator 1 is described in detail.
As shown in figure 1, oscillator 1 has quartz oscillation element 2；Heater element 3 as the 1st integrated circuit component；Make
For the circuit element 4 of the 2nd integrated circuit component；Connecting wiring 7；By quartz oscillation element 2, heater element 3, the and of circuit element 4
Connecting wiring 7 is housed in the packaging part 5 in receiving space S；Cover the outside packaging part 8 of packaging part 5.
[packaging part]
Packaging part 5 has insulating properties, has supporting quartz oscillation element 2, heater element 3, circuit element 4 and connecting wiring
7 base 51 and the lid 52 as lid that the formation receiving space S between base 51 is coupled so that with base 51.
As shown in Fig. 2 base 51 is in the cavity-like with the recess 511 in upper surface open.Also, recess 511 has
1st recess 511a of the upper surface open of base 51, the 1st recess 511a bottom surface opening second recesses 511b, recessed the 2nd
3rd recess 511c of portion 511b bottom surface opening, the 3rd recess 511c bottom surface opening the 4th recess 511d.On the other hand,
Lid 52 engages with the upper surface of base 51, to block the opening of recess 511.So, the opening covered 52 of recess 511 is blocked, by
This, forms receiving space S, and quartz oscillation element 2, heater element 3, circuit element 4 and connection cloth are housed in receiving space S
Line 7.
Receiving space S has carried out gas-tight seal, turns into decompression state (such as below 10Pa.Preferably vacuum).Thus, energy
Enough persistently carry out the stabilized driving of quartz oscillation element 2.But receiving space S environment is not particularly limited, for example, also may be used
Turn into atmospheric pressure to fill the inert gases such as nitrogen, argon.
As the structural material of base 51, it is not particularly limited, but the various ceramics such as can use aluminum oxide.
In this case, can be by being sintered the layered product of potsherd (raw cook) to manufacture base 51.Also, as the knot of lid 52
Structure material, is not particularly limited, and is the approximate part of structural material of linear expansion coefficient and base 51.For example, setting bottom
In the case that the structural material of seat 51 is the ceramics, the preferably structural material of lid 52 is the alloy such as can cut down.
Also, as shown in Fig. 2 base 51 has the multiple internal terminals 61 configured on the 3rd recess 511c bottom surface, matched somebody with somebody
Put the multiple outside terminals 63 of multiple internal terminals 62, configuration on the bottom surface of base 51 on the 1st recess 511a bottom surface.
Multiple internal terminals 61 electrically connect via bonding line with circuit element 4 respectively, multiple internal terminals 62 respectively via bonding line with
Heater element 3, quartz oscillation element 2 electrically connect.Also, as needed, these terminals 61,62,63 are via being embedded in base 51
Interior internal wiring 64 electrically connects.
Also, the multiple outside terminals 63 configured on the bottom surface of base 51 include ground wire outside terminal 631, heater element
3 ground wire and the ground wire of circuit element 4 electrically connect with the ground wire outside terminal 631.So, it is more by being configured on base 51
Individual outside terminal 63, is easily electrically connected via internal wiring 64 with internal terminal 61,62.
[heater element]
Heater element 3 is housed in receiving space S, is fixed on via bonding agent etc. on second recesses 511b bottom surface.Heating
Element 3 be quartz oscillation element 2 is heated and make quartz oscillation element 2 temperature generally remain it is constant have it is so-called
The electronic unit of " temperature incubation function ".Quartz oscillation element 2 is heated using this heater element 3, makes quartz oscillation element 2
Temperature generally remain constant, thereby, it is possible to suppress the variation of the frequency caused by the temperature change of use environment, obtain
Oscillator 1 with excellent frequency stability.Additionally, it is preferred that heater element 3 is controlled to the temperature of quartz oscillation element 2,
Be close to represent the summit temperature of zero-temperature coefficient (it is different according to specification, still, for example, 70 DEG C~100 DEG C left sides
It is right).Thereby, it is possible to play more excellent frequency stability.
Heater element 3 for example possesses the heating circuit 31 with power transistor and is made up of diode or thermistor
Temperature sensing circuit 32, the temperature of heating circuit 31 is controlled according to the output from temperature sensing circuit 32, can
Quartz oscillation element 2 is set to keep steady temperature.So, heating circuit 31 and temperature sensing circuit 32 are included in same circuit element
I.e. in heater element 3, thereby, it is possible to be accurately controlled to the temperature of heater element 3, it can more precisely make quartz
The environment temperature of vibrating elements 2 keeps constant, can play higher frequency stability.In addition, heating circuit 31 and temperature inspection
The structure of slowdown monitoring circuit 32 is not particularly limited.
As shown in figure 3, be provided with multiple terminals 33 in the upper surface of heater element 3, these multiple terminals 33 respectively via
Bonding line electrically connects with internal terminal 62.Also, multiple terminals 33 include ground wire terminal 331, the ground wire of heating circuit 31 and
The ground wire of temperature sensing circuit 32 electrically connects with the ground wire terminal 331.In other words, temperature sensing circuit 32 and heating circuit 31 with
Public is electrically connected to ground.Also, ground wire terminal 331 is from internal terminal 62 (ground wire internal terminal 621 described later) via base
Internal wiring 64 in 51 electrically connects with ground wire outside terminal 631.
[quartz oscillation element]
Quartz oscillation element 2 is configured in receiving space S, is supported on heater element 3.As shown in figure 4, this quartz shakes
Dynamic element 2 has the electrode 22 of quartz base plate 21 and configuration on quartz base plate 21.
Quartz base plate 21 is to make SC cut quartz base plate to turn into the plan view shape of circular by etching, being machined etc.
Obtained from shape.Quartz base plate is cut by using SC, frequency agility and resistance caused by parasitism vibrates is can obtain and rises
The quartz oscillation element 2 that less, temperature characterisitic is also stablized.
In addition, to be not limited to circular or ellipse, Long Circle etc. non-linear for the plan view shape of quartz base plate 21
Shape, it can also be the linear shapes such as triangle, rectangle.But as in the present embodiment, by turning into quartz base plate 21
Circle, the symmetry of quartz base plate 21 improve, and can effectively suppress the vibration of secondary vibration (parasitism vibration).
Electrode 22 has 1st exciting electrode 221a and 1st of the configuration on the upper surface of quartz base plate 21 (interarea)
The 2nd exciting electrode 222a and the 2nd of extraction electrode 221b and configuration on the lower surface of quartz base plate 21 (another interarea)
Extraction electrode 222b.
The quartz oscillation element 2 of this structure is fixed on heater element 3 in outer edge via the fixed component 29 of electric conductivity
Upper surface on.Fixed component 29 engages heater element 3 and quartz oscillation element 2, also, will configure in heater element 3
The 2nd extraction electrode 222b electrical connections of terminal 33 and quartz oscillation element 2 on upper surface, and then, by heater element 3 and quartz
Vibrating elements 2 is thermally coupled.On the other hand, the 1st extraction electrode 221b electrically connects via bonding line with internal terminal 62.
In addition, as long as fixed component 29 has electric conductivity and zygosity concurrently, it is not particularly limited, such as metal can be used
Grafting material (such as golden projection), alloy bond material (such as the projection such as gold-tin alloy, scolding tin), conductive adhesive (such as
Make the bonding agent of the scattered polyimides system of the metal microparticles such as silver-colored inserts) etc..
[circuit element]
As shown in Fig. 2 circuit element 4 is fixed on via bonding agent etc. on the 4th recess 511d bottom surface.Also, circuit elements
Part 4 electrically connects via bonding line with internal terminal 61.This circuit element 4 at least has vibrate quartz oscillation element 2 to shake
Swing circuit 41 and the temperature-control circuit being controlled according to the work of the output of temperature sensing circuit 32 to heating circuit 31
42。
As shown in figure 3, set multiple terminals 43 on the upper surface of circuit element 4, these multiple terminals 43 respectively via
Bonding line electrically connects with corresponding internal terminal 61.Also, include and (the temperature control electricity of circuit element 4 in multiple terminals 43
Road 42) ground wire connection ground wire terminal 431.Also, ground wire terminal 431 passes through from internal terminal 61 (ground wire internal terminal 611)
Electrically connected by internal wiring 64 with ground wire outside terminal 631.That is, the ground wire terminal 331 of ground wire terminal 431 and heater element 3 with
Public ground wire outside terminal 631 electrically connects.
Also, it is provided between the 4th recess 511d bottom surface and circuit element 4 and the ground wire terminal of circuit element 4 431
The wiring 69 (the 2nd ground line pattern) of electrical connection, the wiring 69 are configured to overlap with circuit element 4 when overlooking.Thus, for example,
The Capacitance Coupled between internal wiring 64 and quartz oscillation element 2 can be reduced, can be more stably to quartz oscillation element 2
It is driven.
[connecting wiring]
Connecting wiring 7 is configured in receiving space S, by being electrically connected to ground for the ground wire of heater element 3 and circuit element 4.
Specifically, as shown in figure 3, ground wire terminal 331 of the configuration on the upper surface of heater element 3 is via as connecting wiring 7
Bonding line BW71 electrically connects with the ground wire internal terminal 621 included in multiple internal terminals 62.Ground wire internal terminal 621 is via work
Electrically connected for the bonding line BW72 of connecting wiring 7 with configuring the wiring 651 on second recesses 511b bottom surface.The configuration of wiring 651
On the 3rd recess 511c bottom surface, via the bonding line BW73 as connecting wiring 7 with and ground wire internal terminal 611 electrically connect
Wiring 652 electrically connect.And then ground wire internal terminal 611 (wiring 652) via the bonding line BW74 as connecting wiring 7 with
The ground wire terminal 431 configured on the upper surface of circuit element 4 electrically connects.So, by being used as the bonding line of connecting wiring 7
BW71, BW72, BW73, BW74, the ground wire of temperature sensing circuit 32 and being electrically connected to ground for temperature-control circuit 42.Pass through setting
(conducting reduces current potential for this connecting wiring 7, the ground wire of temperature sensing circuit 32 and the earth short of temperature-control circuit 42
Difference), following effect can be played.
First, structure the problem of point in the past in the absence of connecting wiring 7 is illustrated.As described above, heater element 3
The ground wire terminal 331 of (temperature sensing circuit 32) and the ground wire terminal 431 of circuit element 4 (temperature-control circuit 42) respectively via
Internal wiring 64 electrically connects with ground wire outside terminal 631.Here, internal wiring 64 is typically by high melting point metal materialses such as tungsten, molybdenums
Form, in the preparation method of base 51, can not be gold-plated to the implementation of its surface etc., there is higher resistance.Also, environment temperature is got over
It is low, then bigger electric current (such as being up to 200mA or so) is flowed through in heating circuit 31.Therefore, according to due to interior
Voltage caused by the dead resistance of portion's wiring 64 reduces, (stream in the case of being low temperature in the environment temperature of quartz oscillation element 2
In the case of crossing larger current) and high temperature in the case of (in the case of flowing only through smaller current), the ground of heater element 3
Change.Specifically, for example, the electric current flowed through in heating circuit 31 be 200mA, the dead resistance of internal wiring 64 be 0.5
In the case of Ω, the ground of heater element 3 changes 100mV.On the other hand, without flow through heater element 3 in circuit element 4
So big electric current, the ground of circuit element 4 have almost no change.Therefore, " temperature set in advance in circuit element 4
The characteristic of degree-temperature sensing circuit output " can produce skew with the actual output from temperature sensing circuit 32.That is, for example,
In the case that the variation of the ground of heater element 3 is 100mV caused by the dead resistance due to internal wiring 64,
The output valve of temperature sensing circuit 32 rises 100mV and is input to temperature-control circuit 42.Therefore, the basis of temperature-control circuit 42
Driving of the temperature offset from actual temperature to heating circuit 31 is controlled, the temperature controlled precision of temperature-control circuit 42
Deteriorate.
On the other hand, in the oscillator 1 of present embodiment, using connecting wiring 7 by the ground wire terminal of heater element 3
331 and the ground wire terminal 431 of circuit element 4 electrically connect, and not via internal wiring 64.That is, via connecting wiring 7 by ground terminal
The ground wire terminal 431 (ground wire of temperature-control circuit 42) of sub 331 (ground wires of temperature sensing circuit 32) and circuit element 4 is electrically connected
The electrical path connect is not by the internal wiring 64 for the inside for being embedded in base 51 (packaging part 5).
Bonding line BW71, BW72, BW73, BW74 as connecting wiring 7 are, for example, by Au (gold), Cu (copper), aluminium (Al)
Formed Deng as main material, fully inhibit resistance.Also, the ground wire internal terminal being connected with bonding line BW71~BW74
621 are exposed to receiving space S respectively with wiring 651,652, so, in the manufacture of base 51, its surface can be implemented to plate
Gold, actually its surface is implemented gold-plated.Therefore, ground wire internal terminal 621 and wiring 651,652 fully inhibit electricity respectively
Resistance.Thus, by the resistance in the path that ground wire terminal 331 and ground wire terminal 431 are connected via connecting wiring 7 suppress well below
The resistance in the path of ground wire terminal 331 and ground wire terminal 431 is connected via internal wiring 64.Thus, shaking according to this structure
Device 1 is swung, the variation of the ground of heater element 3 caused by the dead resistance of the internal wiring 64 can be reduced,
The precision of the drive control of the heating circuit 31 of temperature-control circuit 42 can be significantly improved.
According to the frequency characteristic after just starting, just start after curent change and frequency characteristic during convergence
Experimental data, it was demonstrated that the effect above.Fig. 5 is to make oscillator starting in the environment of the wind for showing at -10 DEG C and blowing over wind speed 3m/s
When frequency characteristic curve map.In addition, the Δ f (ppb) in Fig. 5 is to target oscillation frequency on the basis of target oscillation frequency
And the difference of actual oscillation frequency carries out value obtained from ppb conversions.It can be seen from the figure, the oscillator 1 of present embodiment is with showing
Some oscillators (that is, only connects ground wire terminal 331 and ground wire terminal 431 without connecting wiring 7 via internal wiring 64
Oscillator) to compare, the time before frequency convergence is roughly equal, and still, the frequency variation (swing) before convergence is suppressed
Smaller, frequency swimmingly restrains.
Fig. 6 is in the heater element 3 when making oscillator starting in the environment of the wind for showing at -10 DEG C and blowing over wind speed 3m/s
The curve map of the current value flowed through.It can be seen from the figure, the oscillator 1 of present embodiment is compared with existing oscillator, electric current
Time before value convergence is roughly equal, still, the current value before convergence is changed into (swing) and suppresses smaller, current value is suitable
Freely restrain.
Fig. 7 and Fig. 8 is to make oscillator drives, frequency convergence in the environment of the wind for showing at -10 DEG C and blowing over wind speed 3m/s
Situation curve map, Fig. 7 shows present embodiment, and Fig. 8 shows existing structure.Shaken in addition, the F in Fig. 7 and Fig. 8 is target
Frequency is swung, dF is the difference of target frequency and actual oscillation frequency.These Fig. 7 and Fig. 8 are compared and understood, present embodiment
Compared with existing oscillator, the swing (amplitude) of frequency during convergence fully reduces oscillator 1.
It can be seen from curve map more than, according to oscillator 1, compared with existing oscillator, frequency and electric current can be made
Value swimmingly restrains, and can suppress smaller by the swing of the frequency after convergence, thus it is possible to improve temperature-control circuit
The precision of the drive control of 42 pairs of heating circuits 31.
When particularly in the range of normal temperature, the maximum current value flowed through in heating circuit 31 is more than 100mA's
In the case of, this oscillator 1 can effectively play the effect, in more than 150mA, can more efficiently play the effect,
In more than 200mA, the effect can be effectively further played.In addition, " normal temperature scope " refer to be able to maintain that regulation with
On the scope of oscillating characteristic (in other words, the producer of oscillator 1 or supplier ensure frequency accuracy or the temperature recommended
Scope.The accuracy guarantee scope of oscillating characteristic e.g. described in the specifications of oscillator 1.Also, it is maximum rated or exhausted
It is the temperature range that regular event can be repeated in oscillator 1 to maximum rated temperature range).In addition, in general,
It is required that frequency accuracy as defined in ensureing more than -40 DEG C, in less than 85 DEG C of use temperature range.
Connecting wiring 7 is illustrated above.As in the present embodiment, by setting connecting wiring 7 as bonding line
BW71, BW72, BW73, BW4, it can be directly connected to wish the terminal (wiring) connected each other directly and with shorter distance, so,
Resistance can further be reduced.Also, the structure of connecting wiring 7 is simple, without lavishly efficiently realizing connecting wiring 7
Overall configuration structure.And then 651,652 configuration free degree increase is connected up, can be easily by the ground terminal of heater element 3
The ground wire terminal 431 of son 331 and circuit element 4 electrically connects.
Especially, in the present embodiment, multiple bonding lines as connecting wiring 7 are configured (to be divided into multiple wires to carry out
Configuration), i.e. by bonding line BW71 connections ground wire terminal 331 and ground wire internal terminal 621, pass through bonding line BW72 connections ground
Line internal terminal 621 and wiring 651, by bonding line BW73 connecting wirings 651 and wiring 652, are connected by bonding line BW74
Wiring 652 and ground wire terminal 431, thus it is possible to the overall configuration structure of connecting wiring 7 is more efficiently realized, can be more
Easily the ground wire terminal 431 of the ground wire terminal 331 of heater element 3 and circuit element 4 is electrically connected.Especially, ground wire terminal
331st, ground wire internal terminal 621, wiring 651, wiring 652 and ground wire terminal 431 are matched somebody with somebody in a manner of centre is across step difference
Put, so, step difference can be crossed over come the mutual multiple bonding lines of connection terminal (wiring) by configuring, and can easily be connected
They.
Also, in the present embodiment, have and electrically connect multiple connecting wirings 7 and in a manner of towards receiving space S
The wiring on packaging part 5 is configured (that is, by the ground wire internal terminal 621 of bonding line BW71, BW72 electrical connection, by bonding line
The wiring 651 of BW72, BW73 electrical connection and the wiring 652 for electrically connecting bonding line BW73, BW74).As described above, these ground wires
Internal terminal 621 and wiring 651,652 are entered in a manner of towards receiving space S (being exposed at least partially in receiving space S)
Row configuration, so, its surface is implemented gold-plated.That is, ground wire internal terminal 621 and wiring 651,652 include Gold plated Layer, resistance drop
It is low.Therefore, it is possible to more efficiently play the effect above (precision of the temperature-control circuit 42 to the drive control of heating circuit 31
Improve).Also, by using this wiring, the ground wire terminal 331 and circuit elements of heater element 3 can be connected simplerly
The ground wire terminal 431 of part 4.
Also, 651 (the 1st ground line patterns) of wiring are configured in second recesses in a manner of being overlapped when overlooking with heater element 3
Between 511b bottom surface and heater element 3.Thus, for example, the electricity between internal wiring 64 and quartz oscillation element 2 can be reduced
Hold coupling, more stably quartz oscillation element 2 can be driven.
[outside packaging part]
As shown in figure 1, outside packaging part 8 has the base substrate 81 and and base substrate being made up of printed circuit board
The lid 82 of 81 engagements, houses the circuit blocks 9 such as packaging part 5, electric capacity, resistance in the internal space S 1 formed by them.Encapsulation
Part 5 engages via lead frame 83 with base substrate 81, is supported by the state of the separation of base substrate 81.In addition, lead
Packaging part 5 is fixed on base substrate 81 by framework 83, also, by the outside terminal 63 of packaging part 5 with being formed in base substrate
Terminal (not shown) electrical connection on 81.
Internal space S 1 has carried out gas-tight seal, turns into decompression state (such as below 10Pa degree.Preferably vacuum).By
This, internal space S 1 plays function as thermal insulation layer, the more difficult temperature change by use environment of quartz oscillation element 2
Influence.Therefore, it is possible to more precisely make the temperature of quartz oscillation element 2 keep constant.But the environment of internal space S 1 is not
It is limited to this, for example, it is also possible to the inert gases such as nitrogen, argon, helium are filled, can also be to atmosphere opening.
Oscillator 1 is illustrated above.In the present embodiment, heating circuit 31 and temperature sensing circuit 32 include
In same circuit element is heater element 3, still, heating circuit 31 and temperature sensing circuit 32 can also separate.For example, with
Heater element 3 is separately constructed temperature sensing circuit 32 and configured near heater element 3.In this case, temperature
Detection circuit 32 can use the structure for including thermistor or thermoelectric pile etc..Also, in the present embodiment, connecting wiring 7
It is made up of bonding line, still, the structure of connecting wiring 7 is not particularly limited, for example, it is also possible to by structures such as wiring, metal couplings
Into.It can be less than 2 or more than 4 also, the radical of connecting wiring 7 also can suitably be set.Also, at this
In embodiment, there is the mutual wiring of connection bonding line (ground wire internal terminal 621 and wiring 651,652), still, these cloth
Line can also omit.In this case, for example, directly ground wire terminal 331 and ground wire terminal 431 are electrically connected by bonding line BW71
Connect.
Also, the structure for using quartz oscillation element 2 as oscillating element in the present embodiment, is illustrated, still, is shaken
Swing element and be not limited to quartz oscillation element 2, such as aluminium nitride (AlN), lithium niobate (LiNbO3), lithium tantalate can be used
(LiTaO3), lead zirconate titanate (PZT), lithium tetraborate (Li2B4O7), langasite (La3Ga5SiO14), potassium niobate (KNbO3),
Potassium phosphate (GaPO4), GaAs (GaAs), zinc oxide (ZnO, Zn2O3), barium titanate (BaTiO3), lead titanates (PbPO3), niobium
Sour potassium sodium ((K, Na) NbO3), bismuth ferrite (BiFeO3), sodium niobate (NaNbO3), bismuth titanates (Bi4Ti3O12), bismuth-sodium titanate
(Na0.5Bi0.5TiO3) oxide substrate such as；The piezoelectricity such as aluminium nitride or tantalum pentoxide (Ta2O5) is laminated on the glass substrate
Body material and the stacked piezoelectric substrate that forms or the piezoelectric vibration device using piezoelectric ceramics etc..Also, it can also use in silicon
The vibrating elements for configuring piezoelectric element on substrate and forming.Also, quartz oscillation element 2 is not limited to the quartz oscillation member that SC is cut
Part, such as the quartz oscillation element that AT is cut, BT is cut, Z is cut, LT is cut etc. can also be used.
[electronic equipment]
Then, the electronic equipment of the oscillator with the present invention is illustrated.
Fig. 9 is the structure for showing to apply the personal computer of the mobile model (or notebook type) of the electronic equipment of the present invention
Stereogram.
In the figure, personal computer 1100 is aobvious by the main part 1104 with keyboard 1102 and with display part 1108
Show that unit 1106 is formed, display unit 1106 is rotatably supported on main part 1104 via hinge structure portion.
Oscillator 1 is built-in with this personal computer 1100.
Figure 10 is the solid for showing to apply the structure of the portable telephone (in addition to PHS) of the electronic equipment of the present invention
Figure.
In the figure, portable telephone 1200 has antenna (not shown), multiple operation buttons 1202, the and of receiving mouth 1204
Mouth piece 1206, display part 1208 is configured between operation button 1202 and receiving mouth 1204.In this portable telephone 1200
In be built-in with oscillator 1.
Figure 11 is the stereogram for showing to apply the structure of the digital still camera of the electronic equipment of the present invention.
The back side for the shell (fuselage) 1302 being configured in digital still camera 1300 sets display part 1310, according to
Image pickup signal based on CCD is shown that display part 1310 plays work(as the view finder that subject is shown as to electronic image
Energy.Also, set in the face side (rear side in figure) of shell 1302 comprising optical lens (imaging optical system) and CCD etc.
Light receiving unit 1304.Moreover, photographer confirms the shot object image shown in display part 1310, after shutter release button 1306 are pressed,
The CCD of time point image pickup signal is transferred to memory 1308 and stored.In in this digital still camera 1300
It is equipped with oscillator 1.
This electronic equipment has oscillator 1, thus it is possible to play the effect of the oscillator 1, can play excellent
Reliability.
In addition, in addition to the portable telephone of personal computer, Figure 10, Figure 11 digital still camera except Fig. 9, this
The electronic equipment of invention can also for example be applied to smart mobile phone, tablet terminal, clock and watch (including intelligent watch), ink jet type discharge
Device (such as ink-jet printer), laptop PC, television set, HMD (head mounted display) etc. wearable terminal,
Video camera, video recorder, on-vehicle navigation apparatus, pager, electronic notebook (in addition to electronic notebook with communication function), electricity
Sub- dictionary, calculator, electronic game station, word processor, work station, visual telephone, tamper-proof televimonitor, electronics are double
Tube telescope, POS terminal, Medical Devices (such as electronic thermometer, sphygmomanometer, blood-glucose meter, electrocardiogram measuring device, ultrasonic wave
Diagnostic device, fujinon electronic video endoscope), fish finder, various sensing equipments, mobile terminal base station equipment, metrical instrument class (example
Such as metrical instrument class of vehicle, aircraft, ship), flight simulator, the webserver.
[moving body]
Then, the moving body of the oscillator with the present invention is illustrated.
Figure 12 is the stereogram for showing to apply the automobile of the moving body of the present invention.
As shown in figure 12, oscillator 1 is built-in with automobile 1500.Oscillator 1 for example can be widely applied for no key
Into, anti-theft control system, onboard navigation system, air conditioning for automobiles, anti-lock braking system (ABS), air bag, tire pressure
Monitoring system (TPMS：Tire Pressure Monitoring System), engine control, hybrid vehicle or electronic
Electronic control unit (the ECU of the battery monitor of automobile, vehicle body attitude control system etc.：electronic control
unit)。
This automobile 1500 has oscillator 1, thus it is possible to play the effect of the oscillator 1, can play excellent
Reliability.
Oscillator, electronic equipment and the moving body of the present invention, still, this hair are illustrated above according to embodiment illustrated
Bright not limited to this, the structure in each portion can be replaced into the arbitrary structures with identical function.Also, can also be additional to the present invention
Other arbitrary structures things.
Claims (10)
1. a kind of oscillator, it includes：
Container；
Oscillating element, it is housed in the above-described container；
Heating circuit, it houses in the above-described container, the temperature of the oscillating element is controlled；
Temperature sensing circuit, it is housed in the above-described container；
Temperature-control circuit, it is housed in the above-described container, according to the output of the temperature sensing circuit to the heating circuit
It is controlled；
Connecting wiring, it is housed in the above-described container, by the ground wire of the temperature sensing circuit and the temperature-control circuit
It is electrically connected to ground；And
Ground wire outside terminal, it is configured in the outer surface of the container, ground wire and the temperature with the temperature sensing circuit
Degree control circuit is electrically connected to ground.
2. oscillator according to claim 1, wherein,
The heating circuit and the temperature sensing circuit are included in same circuit element.
3. oscillator according to claim 1 or 2, wherein,
The connecting wiring is bonding line.
4. oscillator according to claim 1 or 2, wherein,
The oscillator includes multiple connecting wirings.
5. oscillator according to claim 4, wherein,
The oscillator includes configuring the wiring of multiple connecting wiring electrical connections, the wiring in the above-described container, at least
A part is exposed to the space in the container.
6. oscillator according to claim 1 or 2, wherein,
The container has insulating properties, including supporting oscillating element, the heating circuit, the temperature sensing circuit and the institute
The lid stated the base of temperature-control circuit and engaged with the base,
The ground wire outside terminal configuration is on the base.
7. oscillator according to claim 1 or 2, wherein,
Via the connecting wiring being electrically connected to ground the ground wire of the temperature sensing circuit and the temperature-control circuit
Electrical path is not by the wiring for the inside for being embedded in the container.
8. oscillator according to claim 1, wherein,
The oscillator includes：
1st integrated circuit component, it includes the heating circuit and the temperature sensing circuit；
2nd integrated circuit component, it includes the temperature-control circuit；
1st ground line pattern, it is electrically connected with the ground wire terminal of the 1st integrated circuit component, and when overlooking with the described 1st
Integrated circuit component overlaps；And
2nd ground line pattern, it is electrically connected with the ground wire terminal of the 2nd integrated circuit component, and when overlooking with the described 2nd
Integrated circuit component overlaps,
The 1st ground line pattern and the 2nd ground line pattern are electrically connected by the connecting wiring.
9. a kind of electronic equipment, it includes the oscillator described in claim 1.
10. a kind of moving body, it includes the oscillator described in claim 1.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016116221A JP6733330B2 (en) | 2016-06-10 | 2016-06-10 | Oscillators, electronic devices and mobiles |
| JP2016-116221 | 2016-06-10 |
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| Publication Number | Publication Date |
|---|---|
| CN107493087A true CN107493087A (en) | 2017-12-19 |
| CN107493087B CN107493087B (en) | 2023-06-02 |
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| CN201710407093.3A Active CN107493087B (en) | 2016-06-10 | 2017-06-02 | Oscillator, electronic apparatus, and moving object |
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|---|---|
| US (1) | US10651855B2 (en) |
| JP (1) | JP6733330B2 (en) |
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| JP6665487B2 (en) * | 2015-11-02 | 2020-03-13 | セイコーエプソン株式会社 | Integrated circuit device, electronic device, electronic equipment, and base station |
| JP2018152828A (en) * | 2017-03-15 | 2018-09-27 | セイコーエプソン株式会社 | Vibration device, oscillator, electronic device, and mobile object |
| JP2020120159A (en) * | 2019-01-18 | 2020-08-06 | セイコーエプソン株式会社 | Oscillator, electronic equipment and mobile object |
| US20240056030A1 (en) * | 2021-02-25 | 2024-02-15 | Daishinku Corporation | Oven-controlled crystal oscillator |
| CN116762272A (en) * | 2021-02-25 | 2023-09-15 | 株式会社大真空 | Constant temperature bath type piezoelectric oscillator |
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| US7310024B2 (en) * | 2005-02-28 | 2007-12-18 | Milliren Bryan T | High stability double oven crystal oscillator |
| JP6183156B2 (en) * | 2013-10-30 | 2017-08-23 | セイコーエプソン株式会社 | Package, vibrating device, oscillator, electronic equipment and mobile object |
| JP2015119212A (en) * | 2013-12-16 | 2015-06-25 | 日本電波工業株式会社 | Oscillator |
| JP6376330B2 (en) | 2014-03-25 | 2018-08-22 | セイコーエプソン株式会社 | Electronic parts, electronic devices and mobile objects |
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2016
- 2016-06-10 JP JP2016116221A patent/JP6733330B2/en not_active Expired - Fee Related
-
2017
- 2017-06-02 CN CN201710407093.3A patent/CN107493087B/en active Active
- 2017-06-06 US US15/614,923 patent/US10651855B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015056728A (en) * | 2013-09-11 | 2015-03-23 | 日本電波工業株式会社 | Oscillator |
| CN104734704A (en) * | 2013-12-20 | 2015-06-24 | 精工爱普生株式会社 | Quantum interference device, atomic oscillator, electronic device, and moving object |
| CN104734658A (en) * | 2013-12-24 | 2015-06-24 | 精工爱普生株式会社 | Oscillator, electronic apparatus, and moving object |
Also Published As
| Publication number | Publication date |
|---|---|
| US20170359075A1 (en) | 2017-12-14 |
| JP6733330B2 (en) | 2020-07-29 |
| JP2017220887A (en) | 2017-12-14 |
| US10651855B2 (en) | 2020-05-12 |
| CN107493087B (en) | 2023-06-02 |
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