CN107491772A - A kind of fingerprint recognition module and PCB main board - Google Patents
A kind of fingerprint recognition module and PCB main board Download PDFInfo
- Publication number
- CN107491772A CN107491772A CN201710878359.2A CN201710878359A CN107491772A CN 107491772 A CN107491772 A CN 107491772A CN 201710878359 A CN201710878359 A CN 201710878359A CN 107491772 A CN107491772 A CN 107491772A
- Authority
- CN
- China
- Prior art keywords
- chip body
- main board
- fingerprint recognition
- recognition module
- stitch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
Landscapes
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
Abstract
The invention discloses a kind of fingerprint recognition module and PCB main board, the fingerprint recognition module includes chip body, the chip body front surface coated ink layer, the chip body back side are vertically provided with complex root stitch, and the edge at the chip body back side is additionally provided with the raised annular Lou Tong areas of a circle.The present invention is installed by way of stitch inserting, has been simplified the usual FPC soft boards used, can have been conceded many spaces to the peripheral components on mainboard.
Description
Technical field
The present invention relates to induction chip field, more particularly to a kind of fingerprint recognition module and PCB main board.
Background technology
With developing rapidly for the electronic products such as mobile phone, computer, fingerprint is all had been provided with the electronic product such as mobile phone, computer
Identification function, by identifying that finger print unlocks, provide easily encryption function to people and improve the security of equipment.Fingerprint
Identification function is achieved by installing fingerprint recognition module additional on mobile phone, as shown in figure 1, fingerprint recognition mould in the prior art
The generic way that group is connected with mainboard is to be connected by FPC soft boards with mainboard, makes fingerprint recognition module normal work, but on mainboard
There are many peripheral components, can take many spaces of mainboard using the connected mode of FPC soft boards, cause the typesetting between other devices
It is very compact, or arrange and fail to lay down, it will ultimately result in other functions and performance and go wrong.
The content of the invention
The present invention proposes a kind of fingerprint recognition module and PCB to solve technical problem present in above-mentioned prior art
Mainboard.
The technical solution adopted by the present invention is：
A kind of fingerprint recognition module, including chip body, the chip body front surface coated ink layer, the chip body back side are vertically set
There is complex root stitch, the edge at the chip body back side is additionally provided with the raised annular Lou Tong areas of a circle.
The stitch be square ring-type arrangement.
The distance of the stitch and chip body edge is more than or equal to 0.8mm.
The chip body, which is located on the inside of stitch, is provided with the square Lou Tong areas of sinking, and the square edge of Lou Tong areas one lacks
Conductive fabric is posted on angle, the square Lou Tong areas surface.
The ink film thickness is between 0.020mm to 0.045mm.
The ink layer is dumb light type ink or light type ink.
The invention also provides a kind of PCB main board for installing above-mentioned fingerprint recognition module, the PCB main board attachment face is provided with
The through hole of corresponding chip body stitch, the PCB main board attachment face are additionally provided with corresponding chip body annular Lou Tong areas and square Lou Tong areas
The mainboard Lou Tong areas of profile.
Chip body edge coating is corresponded on the PCB main board white silk-screen for contraposition.
The through hole coordinates with stitch leaves welded gaps, and the stitch is welded in through hole.
Coated with filling glue at the outer rim that the PCB main board is bonded with chip body, the material of the filling glue is asphalt mixtures modified by epoxy resin
Fat.
Compared with the prior art, the advantage of the invention is that：
The present invention, can be on PCB main board by the way that directly by way of stitch welding, fingerprint recognition module is connected with mainboard
Peripheral components concede many spaces, eliminate FPC soft boards, so as to which Material Cost reduces, reduce manufacturing procedure, and make whole fingerprint
Module thickness can reduce 0.15-0.2mm.
Brief description of the drawings
Fig. 1 is the front view of prior art fingerprint recognition module；
Fig. 2 is the positive plan view of fingerprint recognition module of the present invention；
Fig. 3 is the plan view at the fingerprint recognition module back side of the present invention；
Fig. 4 is the side view of the fingerprint recognition module of the present invention；
Fig. 5 is that the PCB main board of the present invention mounts the plan view in face；
Fig. 6 is the half sectional view after the assembling of the present invention.
Embodiment
Below in conjunction with the accompanying drawings and the principle and structure of the present invention are described in detail embodiment.
As shown in Figure 2, Figure 3, Figure 4, a kind of fingerprint recognition module proposed by the present invention, including chip body 1, chip body 1 be in
Tabular, chip body are fingerprint recognition chip, and the front of chip body 1 is coated with ink layer 11, and ink layer 11 can be dumb light type
Ink or light type ink, as protective layer, increase the texture of outside with it is attractive in appearance.Stitch is interval with the back side of chip body 1
12, the back side of the vertical chip body 1 of stitch 12, the circuit for chip body 1 connects, and stitch 12 is arranged in the ring that chip body is square
Shape, the raised ring Xing Loutong areas 13 of the dorsal edge of chip body 1 in the outside of stitch 12, for being grounded.Core on the inside of stitch
The lamellar body back side is additionally provided with one piece of square Lou Tong area 14, the surface indentation in square Lou Tong areas 14, makes it with the back side of chip body 1 not same
One plane, and conductive fabric is posted on the square surface of Lou Tong areas 14, there be a corner unfilled corner in square Lou Tong areas 14, and separation forms one piece of list
Only corner block 141, the prime direction of chip body stitch is distinguished during for installing and plays foolproof function.
In the present invention, the big I of chip body 1 needs to formulate according to different, and stitch 12 and the nearest edge of chip body 1
Distance be more than or equal to 0.8mm, the thickness of ink layer 11 is between 0.020mm to 0.045mm.
As shown in Figure 5, Figure 6, another embodiment of the present invention proposes a kind of PCB for being used to install above-mentioned fingerprint recognition module
Mainboard 2, the attachment face of PCB main board 2 are provided with the through hole 21 of corresponding chip body stitch 12, and through hole 21 is nearby additionally provided with and chip body
The mainboard Lou Tong areas 22 that annular Lou Tong areas and square Lou Tong areas profile are correspondingly arranged, when chip body 1 and PCB main board 2 be installed just
Normal circuit connection, instead of FPC soft boards, other peripheral components on PCB main board 2 is had more installing spaces.On PCB main board 2
The edge of corresponding chip body 1 is also coated with white silk-screen, contraposition during for installing, reduces installation difficulty.After installation, chip body
Coated with filling glue at 1 outer rim being bonded with PCB main board 2, prevent chip body 1 with PCB main board 2 because gap occurs in mismachining tolerance,
The material for wherein filling glue is epoxy resin.The unilateral big 0.1mm more unilateral than chip body stitch of through hole, reserved for through hole fit pin
Welded gaps, tin and welding in convenience, welding can pass through the operation of SMT chip mounters and complete.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
- A kind of 1. fingerprint recognition module, it is characterised in that including chip body, the chip body front surface coated ink layer, the core The lamellar body back side is vertically provided with complex root stitch, and the edge at the chip body back side is additionally provided with the raised annular Lou Tong areas of a circle.
- 2. fingerprint recognition module as claimed in claim 1, it is characterised in that the stitch be square ring-type arrangement.
- 3. fingerprint recognition module as claimed in claim 2, it is characterised in that the distance of the stitch and chip body edge is more than Or equal to 0.8mm.
- 4. fingerprint recognition module as claimed in claim 3, it is characterised in that the chip body, which is located on the inside of stitch, to be provided with Square Lou Tong areas, the square edge unfilled corner of Lou Tong areas one, conductive fabric is posted on the square Lou Tong areas surface.
- 5. fingerprint recognition module as claimed in claim 1, it is characterised in that the thickness of the ink layer arrives in 0.020mm Between 0.045mm.
- 6. fingerprint recognition module as claimed in claim 5, it is characterised in that the ink layer is dumb light type ink or light type Ink.
- A kind of 7. PCB main board for installing fingerprint recognition module as claimed in any one of claims 1 to 6, it is characterised in that institute The through hole that PCB main board attachment face is provided with corresponding chip body stitch is stated, the PCB main board attachment face is additionally provided with corresponding chip body annular Lou Tong areas and the mainboard Lou Tong areas of square Lou Tong areas profile.
- 8. PCB main board as claimed in claim 7, it is characterised in that it is useful that chip body edge coating is corresponded on the PCB main board In the white silk-screen of contraposition.
- 9. PCB main board as claimed in claim 7, it is characterised in that the through hole coordinates with stitch leaves welded gaps, described Stitch is welded in through hole.
- 10. PCB main board as claimed in claim 7, it is characterised in that the outer rim coating that the PCB main board is bonded with chip body There is filling glue, the material of the filling glue is epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710878359.2A CN107491772A (en) | 2017-09-26 | 2017-09-26 | A kind of fingerprint recognition module and PCB main board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710878359.2A CN107491772A (en) | 2017-09-26 | 2017-09-26 | A kind of fingerprint recognition module and PCB main board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107491772A true CN107491772A (en) | 2017-12-19 |
Family
ID=60652174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710878359.2A Pending CN107491772A (en) | 2017-09-26 | 2017-09-26 | A kind of fingerprint recognition module and PCB main board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107491772A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015085786A1 (en) * | 2013-12-13 | 2015-06-18 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition device and mobile terminal |
| WO2015106581A1 (en) * | 2014-01-14 | 2015-07-23 | 深圳市倍通控制技术有限公司 | Pcb board and electronic product using same |
| CN106845433A (en) * | 2017-02-08 | 2017-06-13 | 捷开通讯(深圳)有限公司 | Fingerprint recognition module and electronic equipment |
| CN107146779A (en) * | 2017-06-30 | 2017-09-08 | 中芯长电半导体（江阴）有限公司 | The encapsulating structure and method for packing of fingerprint recognition chip |
-
2017
- 2017-09-26 CN CN201710878359.2A patent/CN107491772A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015085786A1 (en) * | 2013-12-13 | 2015-06-18 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition device and mobile terminal |
| WO2015106581A1 (en) * | 2014-01-14 | 2015-07-23 | 深圳市倍通控制技术有限公司 | Pcb board and electronic product using same |
| CN106845433A (en) * | 2017-02-08 | 2017-06-13 | 捷开通讯(深圳)有限公司 | Fingerprint recognition module and electronic equipment |
| CN107146779A (en) * | 2017-06-30 | 2017-09-08 | 中芯长电半导体（江阴）有限公司 | The encapsulating structure and method for packing of fingerprint recognition chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 253000 No. 6596, Dongfanghong East Road, Yuanqiao Town, economic and Technological Development Zone, De Zhou City, Shandong Province (e-n-303-46, Dezhou Zhongyuan science and technology innovation and entrepreneurship Park) Applicant after: Yingwang Technology (Shandong) Co.,Ltd. Address before: 518000 702, Hengyu center, Dengliang Road, Nanshan District, Shenzhen, Guangdong Applicant before: INONE TECHNOLOGY (SHENZHEN) Co.,Ltd. Address after: 518000 702, Hengyu center, Dengliang Road, Nanshan District, Shenzhen, Guangdong Applicant after: INONE TECHNOLOGY (SHENZHEN) Co.,Ltd. Address before: 518000 702, Hengyu center, Dengliang Road, Nanshan District, Shenzhen, Guangdong Applicant before: XOLO TECHNOLOGY (SHENZHEN) Ltd. |
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| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171219 |
|
| RJ01 | Rejection of invention patent application after publication |