CN107488831A - A kind of continuous evaporating-plating system - Google Patents

A kind of continuous evaporating-plating system Download PDF

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Publication number
CN107488831A
CN107488831A CN201710718862.1A CN201710718862A CN107488831A CN 107488831 A CN107488831 A CN 107488831A CN 201710718862 A CN201710718862 A CN 201710718862A CN 107488831 A CN107488831 A CN 107488831A
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CN
China
Prior art keywords
crucible
evaporation
storage
transfer tube
plating system
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Application number
CN201710718862.1A
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Chinese (zh)
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CN107488831B (en
Inventor
徐超
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to CN201710718862.1A priority Critical patent/CN107488831B/en
Publication of CN107488831A publication Critical patent/CN107488831A/en
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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/246Replenishment of source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/26Vacuum evaporation by resistance or inductive heating of the source
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Abstract

The invention discloses a kind of continuous evaporating-plating system, the system includes:Crucible, the evaporation crucible memory storage deposition material is deposited, the evaporation crucible top is provided with evaporation and exported;Store crucible, the storage crucible memory storage deposition material;Transfer tube, one end of the transfer tube connect the storage crucible, and the other end connects the evaporation crucible;Valve, the valve are arranged on the pipeline of the transfer tube;Temperature control equipment, the temperature control equipment are connected with evaporation crucible, storage crucible and the transfer tube, for controlling the evaporation crucible, storage crucible and the temperature of transfer tube.The continuous evaporating-plating system of the present invention avoids traditional cooling filling heating process, reduces the possibility that substrate pollutes, also improves production efficiency, reduce production cost.

Description

A kind of continuous evaporating-plating system
Technical field
The present invention relates to evaporation coating technique field, more particularly to a kind of continuous evaporating-plating system.
Background technology
OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode, abbreviation OLED) display screens due to With thin, light, wide viewing angle, actively luminous, glow color continuously adjustabe, fast response time, energy consumption is small, driving voltage is low, work Temperature range is wide, simple production process, luminous efficiency are high and can Flexible Displays the advantages that, be listed under great development prospect Generation Display Technique.
Prepare OLED to usually require to be deposited using small molecule, small molecule evaporation mainly heats under high vacuum environment Organic material, the organic material of subliming type or fusion is set to vaporize at high operating temperatures, after deposition material distillation or vaporization The vapor deposition of atom, molecule or atomic group composition is in substrate surface film forming.
But due to the finite capacity of crucible is deposited, it is often necessary to begin to speak to add deposition material, and be deposited from addition is cooled to The foundation that material arrives high vacuum environment again is time-consuming longer, which greatly limits the production capacity of evaporator, adds OLED display Cost of manufacture, in addition, addition deposition material also easily causes dust to enter into evaporation cavity, so as to cause substrate contamination.
The content of the invention
The present invention solves the technical problem of a kind of continuous evaporating-plating system is provided, continuous evaporating-plating can be realized.
In order to solve the above technical problems, the technical solution adopted by the present invention is a kind of continuous evaporating-plating system, including:Earthenware is deposited Crucible, the evaporation crucible memory storage deposition material, the evaporation crucible top are provided with evaporation and exported;Store crucible, the storage Crucible memory storage deposition material;Transfer tube, one end of the transfer tube connect the storage crucible, and the other end connects the evaporation Crucible;Valve, the valve are arranged on the pipeline of the transfer tube;Temperature control equipment, the temperature control equipment and institute State evaporation crucible, storage crucible connect with transfer tube, for the temperature for controlling the evaporation crucible, storing crucible and transfer tube. Further, the deposition material is fusion material;
Further, the bottom of one end connection storage crucible of the transfer tube, the other end connect the evaporation earthenware The middle and upper part of crucible;
Further, the valve is electrically operated valve;
Further, the quantity of the temperature control equipment is three, and crucible, storage crucible and biography is deposited with described respectively Defeated pipe connection, for controlling the evaporation crucible, storage crucible and the temperature of transfer tube;
Further, the temperature control equipment includes heater strip, and the heater strip is wrapped in the evaporation crucible, storage The outer surface of crucible and transfer tube, for controlling the evaporation crucible, storage crucible and the temperature of transfer tube;
Further, the evaporation crucible and storage crucible also include deposition material detector, the deposition material detection Device is inside the evaporation crucible and storage crucible;
Further, the temperature control equipment also includes temperature indicator;
Further, the storage crucible and crucible is deposited it is shaped as cylinder or cuboid;
Further, in addition to baffle plate, the baffle plate setting is in the top of the evaporation outlet.
The beneficial effects of the invention are as follows:The situation of prior art is different from, the present invention can be in the evaporation in evaporation crucible Material consumption totally when, deposition material in storage crucible is supplemented to by transfer tube in evaporation crucible, it is continuous so as to realize Evaporation.The continuous evaporating-plating system of the present invention avoids traditional cooling filling heating process, therefore, reduces substrate and pollutes Possibility, also improve production efficiency, reduce production cost.
Brief description of the drawings
Fig. 1 is the structural representation of the embodiment of continuous evaporating-plating system one of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made Embodiment, belong to the scope of protection of the invention.
Fig. 1 is the structural representation of the embodiment of continuous evaporating-plating system one of the present invention.The continuous steaming that present embodiment provides Plating system, including:Cavity 101 is deposited, the vacuum plant 102 being connected with evaporation cavity.It is deposited in the side wall of cavity 101 and is provided with Cavity door 103, cavity door 103 is located at the sidepiece of evaporation cavity 101 or top, particular location do not limit.The interior of cavity 101 is deposited Portion is provided with substrate 104 to be deposited, evaporation crucible 106, storage crucible 107, transfer tube 108.The top of evaporation crucible 106 is set There is evaporation outlet 114, the top of evaporation outlet 114 is provided with baffle plate 105, and the evaporation memory storage deposition material of crucible 106 is simultaneously provided with the One deposition material detector 112, the deposition material are fusion material.The storage internal memory of crucible 107 is contained with being deposited in crucible 106 Identical deposition material, and the second deposition material detector 113 is installed.One end connection storage crucible 107 of transfer tube 108, Other end connection evaporation crucible 106.In the present embodiment, evaporation crucible 106 is shaped as cylinder or rectangular with storage crucible 107 Body, do not limit herein.Further, in the present embodiment, the bottom of one end connection storage crucible 107 of transfer tube 108, The middle and upper part of other end connection evaporation crucible 106.In other embodiments, transfer tube 108 and storage crucible 107, evaporation crucible 106 link position can do the adjustment of adaptability according to actual conditions, not limit herein.Set on the pipeline of transfer tube 108 There is valve 115.In the present embodiment, valve 115 is electrically operated valve, and in other embodiments, the type of valve 115 is according to reality Situation does the adjustment of adaptability, does not limit herein.
The continuous evaporating-plating system of the present embodiment also includes the first temperature control equipment, second temperature control device and the 3rd temperature Control device is spent, temperature control equipment is connected with evaporation crucible 106, storage crucible 107 and the transfer tube 108, for controlling The temperature of the evaporation crucible 106, storage crucible 107 and transfer tube 108.In the present embodiment, the first temperature control equipment, Two temperature control equipments and the 3rd temperature control equipment include the first heater strip 109, the second heater strip 110 and the 3rd heating respectively Silk 111, it is connected respectively with evaporation crucible 106, storage crucible 107 and transfer tube 108, for controlling evaporation crucible 106, storage earthenware The temperature of crucible 107 and transfer tube 108.Further, the first temperature control equipment, second temperature control device and the 3rd temperature control Device processed respectively further comprises temperature indicator (not shown), for understanding evaporation crucible 106, storage crucible 107 and in real time Temperature value in transfer tube 108.First heater strip 109, the second heater strip 110 and the 3rd heater strip 111, are respectively wound around evaporation The outer surface of crucible 106, storage crucible 107 and transfer tube 108.
Hereinafter, the structure with reference to this continuous evaporating-plating system describes its course of work in detail.
Vacuumize process first is carried out to evaporation cavity 101.In the present embodiment, vacuum plant 102 is to whole evaporation cavity 101 Vacuum pumping is carried out, conventional vacuum plant 102 is mechanical pump, molecular pump, condenser pump, is not limited herein.Before evaporation, Need to carry out vacuumizing to evaporation cavity 101, because the volume that cavity 101 is deposited is bigger, by evaporation cavity 101 by normal pressure Being extracted into high vacuum state, time-consuming, selects several vacuum plants 102 while carry out vacuumizing that duration can be reduced, specifically from several Individual vacuum plant 102 does not limit herein.Vacuum plant 102 carries out vacuumizing to evaporation cavity 101 and reaches predetermined Gao Zhen After reciprocal of duty cycle, evaporation crucible 106 is heated by the first heater strip 109, starts to be deposited when temperature reaches preset temperature.
The top of evaporation crucible 106 is provided with evaporation outlet 114, and evaporation outlet 114 is shaped as circular or rectangle, herein not Limit, circle is illustrated that in the present embodiment.The top of evaporation crucible 106 is also disposed with baffle plate 105 and to be deposited Substrate 104, when deposition material reaches preset temperature in evaporation crucible 106, deposition material evaporation, atom, molecule after evaporation Or the steam of atomic group composition is by being deposited outlet 114 in the surface filming of substrate 104.Due to just starting evaporation rate during evaporation It is unstable, the film quality of evaporation on the substrate 104 can be caused bad, so moving stop 105 makes its screening when just starting evaporation Firmly evaporation outlet 114, as shown in Figure 1.Baffle plate 105 is removed again after evaporation rate is stable, can now obtain matter on the substrate 104 Measure good film.
When the deposition material that the first deposition material detector 112 is detected in evaporation crucible 106 will be finished, the is opened Two temperature control equipments, second temperature control device heat to storage crucible 107, make the evaporation material in storage crucible 107 Material reaches molten condition.The valve 115 on the pipeline of transfer tube 108 is opened, the deposition material stored in crucible 107 can automatically flow into Into evaporation crucible 106, when the deposition material in inflow evaporation crucible 106 reaches scheduled volume, valve 115 is closed.It can be seen that will Deposition material by storage crucible 107 add evaporation crucible 106 in it is easy to operate, without cooling and vacuum breaker, realize continuous steaming Plating, reduce number of beginning to speak, reduce the pollution level of substrate 104, improve the production capacity of evaporator, reduce production cost.
When the deposition material stored in crucible 107 is added into evaporation crucible 106, Open valve 115, crucible will be stored Deposition material in 107 is heated to molten condition, and the deposition material being deposited in crucible 106 is heated into vapor state.Set the The temperature of one temperature control equipment is higher than second temperature control device, in present embodiment, sets the heating of the first heater strip 109 Calorific capacity of the value higher than the second heater strip 110.When the deposition material being deposited in crucible 106 reaches predetermined amount, valve is closed 115, and stop heating storage crucible 107.
The situation of prior art is different from, the present invention can make to deposit when the deposition material being deposited in crucible is depleted Deposition material in storage crucible is supplemented in evaporation crucible by transfer tube, so as to realize continuous evaporating-plating.The continuous steaming of the present invention Plating system avoids traditional cooling filling heating process, therefore, reduces the possibility that substrate pollutes, also improves production Efficiency, reduce production cost.
Obviously, those skilled in the art can carry out the essence of various changes and modification without departing from the present invention to the present invention God and scope.So, if these modifications and variations of the present invention belong to the scope of the claims in the present invention and its equivalent technologies Within, then the present invention is also intended to comprising including these changes and modification.

Claims (10)

  1. A kind of 1. continuous evaporating-plating system, it is characterised in that including:
    Crucible, the evaporation crucible memory storage deposition material is deposited, the evaporation crucible top is provided with evaporation and exported;
    Store crucible, the storage crucible memory storage deposition material;
    Transfer tube, one end of the transfer tube connect the storage crucible, and the other end connects the evaporation crucible;
    Valve, the valve are arranged on the pipeline of the transfer tube;
    Temperature control equipment, the temperature control equipment is connected with evaporation crucible, storage crucible and the transfer tube, for controlling The temperature of the evaporation crucible, storage crucible and transfer tube.
  2. 2. a kind of continuous evaporating-plating system according to claim 1, it is characterised in that the deposition material is melting section bar Material.
  3. A kind of 3. continuous evaporating-plating system according to claim 1, it is characterised in that, described in one end connection of the transfer tube Store the bottom of crucible, the middle and upper part of the other end connection evaporation crucible.
  4. 4. a kind of continuous evaporating-plating system according to claim 1, it is characterised in that the valve is electrically operated valve.
  5. 5. a kind of continuous evaporating-plating system according to claim 1, it is characterised in that the quantity of the temperature control equipment is Three, respectively with it is described evaporation crucible, storage crucible and transfer tube be connected, for control it is described evaporation crucible, store crucible and The temperature of transfer tube.
  6. 6. a kind of continuous evaporating-plating system according to claim 5, it is characterised in that the temperature control equipment includes heating Silk, the heater strip is wrapped in the outer surface of the evaporation crucible, storage crucible and transfer tube, for controlling the evaporation earthenware The temperature of crucible, storage crucible and transfer tube.
  7. 7. a kind of continuous evaporating-plating system according to claim 1, it is characterised in that the evaporation crucible and storage crucible are also Including deposition material detector, the deposition material detector is inside the evaporation crucible and storage crucible.
  8. 8. a kind of continuous evaporating-plating system according to claim 1, it is characterised in that the temperature control equipment also includes temperature Spend display.
  9. 9. a kind of continuous evaporating-plating system according to claim 1, it is characterised in that storage crucible and the evaporation crucible It is shaped as cylinder or cuboid.
  10. 10. a kind of continuous evaporating-plating system according to claim 1, it is characterised in that also including baffle plate, the baffle plate setting In the top of the evaporation outlet.
CN201710718862.1A 2017-08-21 2017-08-21 A kind of continuous evaporating-plating system Active CN107488831B (en)

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CN107488831B CN107488831B (en) 2019-11-26

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110724911A (en) * 2019-11-06 2020-01-24 深圳市华星光电半导体显示技术有限公司 Evaporation crucible, evaporation system and method for evaporating OLED
WO2020077719A1 (en) * 2018-10-17 2020-04-23 武汉华星光电半导体显示技术有限公司 Evaporation device
CN112011763A (en) * 2020-08-05 2020-12-01 Tcl华星光电技术有限公司 Evaporation plating equipment and material supplementing method thereof

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WO2007141235A1 (en) * 2006-06-06 2007-12-13 Aixtron Ag Apparatus and method for vapour depositing a powdered organic starting material
US20140326181A1 (en) * 2013-05-02 2014-11-06 Samsung Display Co., Ltd. Deposition apparatus
KR20150049685A (en) * 2013-10-30 2015-05-08 주식회사 선익시스템 Apparatus for supplying evaporation material and evaporator source including the same
CN105088144A (en) * 2015-08-07 2015-11-25 京东方科技集团股份有限公司 Crucible replacing device
CN205420530U (en) * 2016-03-17 2016-08-03 合肥鑫晟光电科技有限公司 Evaporation plating equipment
KR101713112B1 (en) * 2016-07-26 2017-03-08 에스엔유 프리시젼 주식회사 Deposition material supply apparatus which can continuously charged
CN106947941A (en) * 2017-04-13 2017-07-14 合肥鑫晟光电科技有限公司 Deposition system

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007141235A1 (en) * 2006-06-06 2007-12-13 Aixtron Ag Apparatus and method for vapour depositing a powdered organic starting material
US20140326181A1 (en) * 2013-05-02 2014-11-06 Samsung Display Co., Ltd. Deposition apparatus
KR20150049685A (en) * 2013-10-30 2015-05-08 주식회사 선익시스템 Apparatus for supplying evaporation material and evaporator source including the same
CN105088144A (en) * 2015-08-07 2015-11-25 京东方科技集团股份有限公司 Crucible replacing device
CN205420530U (en) * 2016-03-17 2016-08-03 合肥鑫晟光电科技有限公司 Evaporation plating equipment
KR101713112B1 (en) * 2016-07-26 2017-03-08 에스엔유 프리시젼 주식회사 Deposition material supply apparatus which can continuously charged
CN106947941A (en) * 2017-04-13 2017-07-14 合肥鑫晟光电科技有限公司 Deposition system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020077719A1 (en) * 2018-10-17 2020-04-23 武汉华星光电半导体显示技术有限公司 Evaporation device
CN110724911A (en) * 2019-11-06 2020-01-24 深圳市华星光电半导体显示技术有限公司 Evaporation crucible, evaporation system and method for evaporating OLED
CN112011763A (en) * 2020-08-05 2020-12-01 Tcl华星光电技术有限公司 Evaporation plating equipment and material supplementing method thereof

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