CN107484335A - A kind of test pcb board for testing dual density QSFP interfaces - Google Patents
A kind of test pcb board for testing dual density QSFP interfaces Download PDFInfo
- Publication number
- CN107484335A CN107484335A CN201710644753.XA CN201710644753A CN107484335A CN 107484335 A CN107484335 A CN 107484335A CN 201710644753 A CN201710644753 A CN 201710644753A CN 107484335 A CN107484335 A CN 107484335A
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- CN
- China
- Prior art keywords
- pcb board
- interfaces
- plate
- dust
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The present invention provides a kind of test pcb board for testing dual density QSFP interfaces,Including mounting hole,Expansion link,Fixture block,Fixed plate,Hinge,Dust excluding plate,Dirt-proof boot and notch,The mounting hole is opened on the left of pcb board body interior,The expansion link is fixed on inside mounting hole,The fixture block is fixed on expansion link left side,The design solves the problems, such as that original pcb board is inconvenient to splice,The fixed plate is arranged on pcb board body right side,The hinge is arranged on fixed plate right side,The dust excluding plate is arranged on the upside of fixed plate,The dirt-proof boot is arranged on dust excluding plate front end face,The notch is opened in centre position on the right side of dust excluding plate,The design solves the problems, such as that original pcb board does not have dust reduction capability,The present invention is rational in infrastructure,It is easy to combination to install,It is easy to use,Functional,It is applied widely,Reliability is high.
Description
Technical field
The present invention is a kind of test pcb board for testing dual density QSFP interfaces, belongs to machine components equipment technical field.
Background technology
PCB, also known as printed circuit board (PCB), are the suppliers of electronic component electrical connection, and its development has 100
History for many years, it is mainly designed to layout design, and the major advantage using circuit board is to greatly reduce wiring and assembling
Mistake, improve the gentle productive labor rate of Automated water, according to the wiring board number of plies can be divided into single sided board, dual platen, four laminates,
Six laminates and other multilayer circuit boards.
In the prior art, for existing pcb board without the device of splicing, two pieces of pcb boards are not convenient enough in assembling, existing
Pcb board is fitted without dust-proof device, and pcb board can be polluted in use for a long time by dust, reduces pcb board service life, existing
Some pcb board functions are more single, are badly in need of a kind of test pcb board for testing dual density QSFP interfaces now to solve above-mentioned appearance
The problem of.
The content of the invention
In view of the deficienciess of the prior art, it is an object of the present invention to provide a kind of test for testing dual density QSFP interfaces
Pcb board, to solve the problems mentioned in the above background technology, the present invention are rational in infrastructure, are easy to combination to install, easy to use, work(
Energy property is strong, applied widely, and reliability is high.
To achieve these goals, the present invention is to realize by the following technical solutions：One kind test dual density QSFP
The test pcb board of interface, including QSFP interfaces, splicing body, pcb board body, signal wire, SMA interfaces and dust-proof mechanism, institute
QSFP interfaces are stated on the downside of pcb board body upper surface, the splicing body is arranged on the left of pcb board body, the signal
Line is fixed on the upside of SMA interfaces, and the SMA interfaces are arranged on pcb board body upper surface centre position, the dust-proof mechanism installation
In pcb board body right side, the splicing body includes mounting hole, expansion link and fixture block, and the mounting hole is opened in pcb board
On the left of body interior, the expansion link is fixed on inside mounting hole, and the fixture block is fixed on expansion link left side, the dust-proof machine
Structure includes fixed plate, hinge, dust excluding plate, dirt-proof boot and notch, and the fixed plate is arranged on pcb board body right side, described
Hinge is arranged on fixed plate right side, and the dust excluding plate is arranged on the upside of fixed plate, and the dirt-proof boot is arranged on dust-proof front edge of board
Face, the notch are opened in centre position on the right side of dust excluding plate.
Further, the pcb board body interior is provided with signalling channel, and the signalling channel is provided with 16, and 16
Individual signalling channel specification is identical.
Further, the SMA interfaces are provided with 16, and 16 SMA interface specifications are identical.
Further, the splicing body is provided with two groups, and two spelling connection mechanism specifications are identical.
Further, the pcb board body right side is provided with neck, and the fixture block is fixed by neck and pcb board body
Connection.
Further, the hinge is provided with two, and two hinge specifications are identical, the dust excluding plate by two hinges with
Fixed plate is rotatablely connected.
Beneficial effects of the present invention：The test pcb board of a kind of test dual density QSFP interfaces of the present invention, because the present invention adds
Adding mounting hole, expansion link and fixture block, this is designed to two pieces of pcb boards being stitched together, and convenient use personnel, which assemble, to be used,
Operating efficiency is improved, solves the problems, such as that original pcb board is inconvenient to splice, improves the property easy to use of the present invention.
Because the present invention with the addition of fixed plate, hinge, dust excluding plate, dirt-proof boot and notch, this is designed to effectively reduce ash
Pollution of the dirt to pcb board, the cleannes of pcb board are maintained, solve the problems, such as that original pcb board does not have dust reduction capability, improve
The service life of the present invention.
Because signalling channel is provided with 16, SMA interfaces are provided with 16, and the design improves the transmission speed of signal of the present invention
Degree, because hinge is provided with two, the design facilitates staff to rotate dust excluding plate, and the present invention is rational in infrastructure, is easy to combine
Installation, easy to use, functional is applied widely, and reliability is high.
Brief description of the drawings
The detailed description made by reading with reference to the following drawings to non-limiting example, further feature of the invention,
Objects and advantages will become more apparent upon：
Fig. 1 is a kind of structural representation for the test pcb board for testing dual density QSFP interfaces of the present invention；
Fig. 2 is the structural representation of splicing body in a kind of test pcb board for testing dual density QSFP interfaces of the present invention；
Fig. 3 is the structural representation of dust-proof mechanism in a kind of test pcb board for testing dual density QSFP interfaces of the present invention；
In figure：1-QSFP interfaces, 2- splicing bodies, 3-PCB plates body, 4- signal wires, 5-SMA interfaces, 6- dust-proof mechanisms, 21-
Mounting hole, 22- expansion links, 23- fixture blocks, 61- fixed plates, 62- hinges, 63- dust excluding plates, 64- dirt-proof boots, 65- notches.
Embodiment
To be easy to understand the technical means, the inventive features, the objects and the advantages of the present invention, with reference to
Embodiment, the present invention is expanded on further.
Fig. 1-Fig. 3 is referred to, the present invention provides a kind of technical scheme：A kind of test PCB for testing dual density QSFP interfaces
Plate, including QSFP interfaces 1, splicing body 2, pcb board body 3, signal wire 4, SMA interfaces 5 and dust-proof mechanism 6, QSFP interfaces 1
On the downside of the upper surface of pcb board body 3, splicing body 2 is arranged on the left side of pcb board body 3, and signal wire 4 is fixed on SMA interfaces
5 upsides, SMA interfaces 5 are arranged on the upper surface centre position of pcb board body 3, and dust-proof mechanism 6 is arranged on the right side of pcb board body 3.
Splicing body 2 includes mounting hole 21, expansion link 22 and fixture block 23, and mounting hole 21 is opened in inside pcb board body 3
Left side, expansion link 22 are fixed on inside mounting hole 21, and fixture block 23 is fixed on the left side of expansion link 22, and this is designed to two pieces
Pcb board body 3 is stitched together, and convenient use personnel, which assemble, to be used, and improves operating efficiency, solving original pcb board is inconvenient to spell
The problem of connecing.
Dust-proof mechanism 6 includes fixed plate 61, hinge 62, dust excluding plate 63, dirt-proof boot 64 and notch 65, and fixed plate 61 is installed
In the right side of pcb board body 3, hinge 62 is arranged on the right side of fixed plate 61, and dust excluding plate 63 is arranged on the upside of fixed plate 61, dust-proof
Set 64 is arranged on the front end face of dust excluding plate 63, and notch 65 is opened in the right side centre position of dust excluding plate 63, and this is designed to effectively reduce
Pollution of the dust to pcb board, the cleannes of pcb board are maintained, solve the problems, such as that original pcb board does not have dust reduction capability.
The inside of pcb board body 3 is provided with signalling channel, and signalling channel is provided with 16, and 16 signalling channel specification phases
Together, SMA interfaces 5 are provided with 16, and 16 specifications of SMA interfaces 5 are identical, and splicing body 2 is provided with two groups, and two spellings pick
The specification of structure 2 is identical, and the right side of pcb board body 3 is provided with neck, and fixture block 23 is fixedly connected by neck with pcb board body 3, hinge
62 are provided with two, and two specifications of hinge 62 are identical, and dust excluding plate 63 is rotatablely connected by two hinges 62 with fixed plate 61.
Embodiment：Staff is needing to splice two pieces of pcb board bodies 3 in use, by pulling fixture block 23,
Fixture block 23 drives expansion link 22 protruding, then inserts fixture block 23 in the neck on the right side of pcb board body 3, realizes to two pieces
The assembling splicing of pcb board body 3, improve the property easy to use of the present invention.
Staff is pulled upwardly dust excluding plate 63, dust excluding plate when testing dual density QSFP interfaces 1 using pcb board body 3
63 are rotated by two hinges 62, realize that dirt-proof boot 64 and SMA interfaces 5 depart from, and convenient use personnel are by data wire and SMA interfaces
5 connections, after use, dust excluding plate 63 is fallen, and the dirt-proof boot 64 of the front end face of dust excluding plate 63 is just enclosed on SMA interfaces 5,
Dust-proof effect is played, ensure that will not enter dust in SMA interfaces 5, improve the service life of the present invention.
The general principle and principal character and advantages of the present invention of the present invention has been shown and described above, for this area skill
For art personnel, it is clear that the invention is not restricted to the details of above-mentioned one exemplary embodiment, and without departing substantially from the present invention spirit or
In the case of essential characteristic, the present invention can be realized in other specific forms.Which point therefore, no matter from the point of view of, all should incite somebody to action
Embodiment regards exemplary as, and be it is nonrestrictive, the scope of the present invention by appended claims rather than on state
Bright restriction, it is intended that all changes fallen in the implication and scope of the equivalency of claim are included in the present invention
It is interior.Any reference in claim should not be considered as to the involved claim of limitation.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that those skilled in the art should for clarity
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It is appreciated that other embodiment.
Claims (6)
1. a kind of test pcb board for testing dual density QSFP interfaces, including QSFP interfaces, splicing body, pcb board body, signal
Line, SMA interfaces and dust-proof mechanism, it is characterised in that：The QSFP interfaces are arranged on the downside of pcb board upper surface, the splicing
Mechanism is arranged on the left of pcb board body, and the signal wire is fixed on the upside of SMA interfaces, and the SMA interfaces are arranged on pcb board sheet
Body upper surface centre position, the dust-proof mechanism are arranged on pcb board body right side；The splicing body includes mounting hole, stretched
Contracting bar and fixture block, the mounting hole are opened on the left of pcb board body interior, and the expansion link is fixed on inside mounting hole, institute
State fixture block and be fixed on expansion link left side；The dust-proof mechanism includes fixed plate, hinge, dust excluding plate, dirt-proof boot and notch, institute
State fixed plate and be arranged on pcb board body right side, the hinge is arranged on fixed plate right side, and the dust excluding plate, which is arranged on, to be fixed
On the upside of plate, the dirt-proof boot is arranged on dust excluding plate front end face, and the notch is opened in centre position on the right side of dust excluding plate.
A kind of 2. test pcb board for testing dual density QSFP interfaces according to claim 1, it is characterised in that：The PCB
Plate body interior is provided with signalling channel, and the signalling channel is provided with 16, and 16 signalling channel specifications are identical.
A kind of 3. test pcb board for testing dual density QSFP interfaces according to claim 1, it is characterised in that：The SMA
Interface is provided with 16, and 16 SMA interface specifications are identical.
A kind of 4. test pcb board for testing dual density QSFP interfaces according to claim 1, it is characterised in that：The spelling
Connection mechanism is provided with two groups, and two spelling connection mechanism specifications are identical.
A kind of 5. test pcb board for testing dual density QSFP interfaces according to claim 1, it is characterised in that：The PCB
Plate body right side is provided with neck, and the fixture block is fixedly connected by neck with pcb board.
A kind of 6. test pcb board for testing dual density QSFP interfaces according to claim 1, it is characterised in that：The conjunction
Page is provided with two, and two hinge specifications are identical, and the dust excluding plate is rotatablely connected by two hinges and fixed plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710644753.XA CN107484335A (en) | 2017-08-01 | 2017-08-01 | A kind of test pcb board for testing dual density QSFP interfaces |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710644753.XA CN107484335A (en) | 2017-08-01 | 2017-08-01 | A kind of test pcb board for testing dual density QSFP interfaces |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107484335A true CN107484335A (en) | 2017-12-15 |
Family
ID=60597012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710644753.XA Pending CN107484335A (en) | 2017-08-01 | 2017-08-01 | A kind of test pcb board for testing dual density QSFP interfaces |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107484335A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3013851B1 (en) * | 1998-12-28 | 2000-02-28 | 日本電気株式会社 | Dust-proof structure of communication equipment |
| CN201403274Y (en) * | 2009-03-24 | 2010-02-10 | 深圳市四方电气技术有限公司 | Dustproof structure of electronic device |
| CN202634959U (en) * | 2011-11-29 | 2012-12-26 | 厦门普罗太克科技有限公司 | Novel dustproof anti-interference box body for UPS device circuit boards |
| CN103120036B (en) * | 2010-09-20 | 2015-09-02 | 财路Mk株式会社 | Spliced tellite |
| CN105592656A (en) * | 2014-10-24 | 2016-05-18 | 天津市能信科技有限公司 | Dust shield |
-
2017
- 2017-08-01 CN CN201710644753.XA patent/CN107484335A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3013851B1 (en) * | 1998-12-28 | 2000-02-28 | 日本電気株式会社 | Dust-proof structure of communication equipment |
| CN201403274Y (en) * | 2009-03-24 | 2010-02-10 | 深圳市四方电气技术有限公司 | Dustproof structure of electronic device |
| CN103120036B (en) * | 2010-09-20 | 2015-09-02 | 财路Mk株式会社 | Spliced tellite |
| CN202634959U (en) * | 2011-11-29 | 2012-12-26 | 厦门普罗太克科技有限公司 | Novel dustproof anti-interference box body for UPS device circuit boards |
| CN105592656A (en) * | 2014-10-24 | 2016-05-18 | 天津市能信科技有限公司 | Dust shield |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171215 |
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| WD01 | Invention patent application deemed withdrawn after publication |