CN107481755A - A kind of bit structure of polymorphic magnetic storage - Google Patents

A kind of bit structure of polymorphic magnetic storage Download PDF

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Publication number
CN107481755A
CN107481755A CN201610419994.XA CN201610419994A CN107481755A CN 107481755 A CN107481755 A CN 107481755A CN 201610419994 A CN201610419994 A CN 201610419994A CN 107481755 A CN107481755 A CN 107481755A
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CN
China
Prior art keywords
magnetic
polymorphic
bit structure
magnetic storage
bit
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Pending
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CN201610419994.XA
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Chinese (zh)
Inventor
李辉辉
孟皓
刘鲁萍
刘少鹏
戴强
刘波
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CETHIK Group Ltd
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CETHIK Group Ltd
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Priority to CN201610419994.XA priority Critical patent/CN107481755A/en
Publication of CN107481755A publication Critical patent/CN107481755A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency

Abstract

The present invention relates to a kind of bit structure of polymorphic magnetic storage, the bit structure of the memory includes polymorphic magnetic tunnel junction memory cell array, the on-off circuit being made up of wordline, bit line and switching device.The bit structure of the polymorphic magnetic storage have the advantages that the reading speed of magnetic RAM (MRAM) it is fast, can erasable infinitely, energy consumption be low and Flouride-resistani acid phesphatase;It is safe meanwhile the polymorphic magnetic storage only could realize reprogram under the auxiliary of magnetic field, it can be used as the multiple programmable memory of preferable high security;Meanwhile the magnetic tunnel junction memory unit of the polymorphic magnetic storage has multiple resistance states, the information of 3 or 4 bits can be recorded inside a memory cell, the density of data storage is effectively improved, reduces chip area.The memory bit can be used for needing microprocessor and digital circuit of the characteristics such as safe, reading speed is fast, energy consumption is low, Flouride-resistani acid phesphatase, anti-adverse environment etc..

Description

A kind of bit structure of polymorphic magnetic storage
Technical field
The present invention relates to nonvolatile memory and semiconductor applications, more particularly to a kind of bit of polymorphic magnetic storage Structure.
Background technology
Current magnetic storage bit is more using the 1T1R of triode one MTJ (MTJ) resistance of series connection Structure, in order to ensure to provide sufficiently large reset current and device reliability for MTJ, the size of triode generally can not be done too Small, therefore, the storage density of magnetic storage is limited to provide the size of the triode of reset current for MTJ.
The content of the invention
The present invention to overcome above-mentioned weak point, and it is an object of the present invention to provide a kind of bit structure of polymorphic magnetic storage, Effectively lift the information storage density of magnetic storage.Principle of the invention based on magnetic RAM, it is proposed that Using bit of the MTJ as the polymorphic magnetic storage of information memory cell, the magnetic storage bit has MRAM Reading speed it is fast, can erasable infinitely, energy consumption is low and the advantages that Flouride-resistani acid phesphatase, and multiple bits can be stored in a bit Information.
The present invention is to reach above-mentioned purpose by the following technical programs:A kind of bit structure of polymorphic magnetic storage, bag Include:Polymorphic magnetic tunnel junction memory cell array, on-off circuit;On-off circuit connects with polymorphic magnetic tunnel junction memory cell array Connect, control it.
Preferably, the polymorphic magnetic tunnel junction memory unit has multiple resistance states, by two MTJs Serial or parallel connection combination is formed, and one of magnetic tunnel becomes bottom pinning, and another is top pinning, two magnetic tunnels The pinning direction of knot is identical.
Preferably, the thin magnetic film of the MTJ is magnetic anisotropy or perpendicular magnetic anisotropic in plane Any one.
Preferably, the magnetic tunnel becomes arbitrary shape;Preferably, in plane magnetic anisotropy magnetic tunnel Become ellipse in road;The magnetic tunnel of perpendicular magnetic anisotropic becomes circle.
Preferably, the MTJ is made up of pinning layer thin magnetic film, free layer thin magnetic film, insulating interlayer, Insulating interlayer is clipped between pinning layer thin magnetic film, free layer thin magnetic film;The direction of magnetization of pinning layer thin magnetic film is fixed;From External magnetic field is depended on by the magnetization orientation of layer thin magnetic film and spin polarized current acts on, for producing different resistance states.
Preferably, the constituent of the pinning layer thin magnetic film, free layer thin magnetic film is times of iron, cobalt, boron, nickel Meaning is a kind of or combines;The constituent of the insulating interlayer is any one of aluminum oxide, magnesia or combined.
Preferably, the mode that is connected in series of described two MTJs is to share a direct stacking of pinning layer to be formed Multilayer film, pass through any one in wire realization interconnection, shared electrode realization interconnection.
Preferably, the parallel of described two magnetic tunnel-junctions be share a direct stacking of pinning layer formed it is more Tunic and then any one that interconnection, shared electrode realization interconnection are realized by wire.
Preferably, described on-off circuit include wordline, bit line, switching device, switching device respectively with wordline, bit line Connection;Described switching device is any one in diode selecting device, CMOS transistor.
Preferably, absolute resistance of the polymorphic magnetic tunnel junction memory unit by two MTJs of control Value obtains multiple resistance states with tunneling resistance ratio;The absolute resistance value of two of which MTJ and tunneling resistance ratio Value can be identical or different.
Preferably, the electric current that described on-off circuit can be provided is much smaller than and compiled based on spin transfer torque principle Cheng Suoxu electric currents;On-off circuit provide size of current by reduce supply voltage, reduce supply current, using current-limiting circuit, Transistor width is reduced to be regulated and controled.
The beneficial effects of the present invention are:1) present invention uses MTJ (MTJ) as the more of information memory cell State magnetic storage bit, have the advantages that MRAM reading speed is fast, can erasable infinitely, energy consumption is low and Flouride-resistani acid phesphatase, be to manage The high performance magnetic memory thought;2) the magnetic tunnel junction memory unit of the polymorphic magnetic storage bit has multiple resistance shapes State, the information of 3 or 4 bits can be recorded inside a memory cell, is effectively improved the density of data storage, reduced Chip area.
Brief description of the drawings
Fig. 1 is a kind of position of polymorphic magnetic storage according to embodiments of the present invention using diode selecting device as switch The schematic diagram of meta structure;
Fig. 2 is a kind of bit of polymorphic magnetic storage according to embodiments of the present invention using CMOS transistor as switch The schematic diagram of structure;
Fig. 3 is a kind of structural representation of polymorphic magnetic tunnel junction memory unit according to embodiments of the present invention;
Fig. 4 is the structural representation of another polymorphic magnetic tunnel junction memory unit according to embodiments of the present invention;
Fig. 5 is the structural representation of the third polymorphic magnetic tunnel junction memory unit according to embodiments of the present invention;
Fig. 6 is the structural representation of the 4th kind of polymorphic magnetic tunnel junction memory unit according to embodiments of the present invention.
Embodiment
With reference to specific embodiment, the present invention is described further, but protection scope of the present invention is not limited in This:
Embodiment 1:Fig. 1 reference is:Wordline WL, bit line BL, MTJ MTJ, switch are diode;Fig. 2 Reference be:Wordline WL, bit line BL, MTJ MTJ, switch are CMOS transistor;Fig. 3 to Fig. 6 reference For:Free magnetic layer FL (Free Layer), pinned magnetic PL (Pinned Layer), insulating barrier IL (Insulating Layer), MTJ MTJ.
In the present embodiment, the bit structure of polymorphic magnetic storage is as shown in figure 1, including wordline WL, bit line BL, magnetic tunnel The polymorphic magnetic memory cell of road knot 1MTJ1 and MTJ 2MTJ2 composition, the memory cell selecting being made up of diode are opened Close.Memory cell selecting switch can also use CMOS transistor, as shown in Figure 2.Both the above structure can optional one.
Wherein, MTJ1 and MTJ2 magnetospheric magnetization horizontally or vertically magnetizes in direction along face, and MTJ1 and MTJ2 Pinning layer position is different, and a pinning layer is in bottom, then another pinning layer is at top.The pinning of MTJ1 and MTJ2 pinning layer Direction is identical.
In the present embodiment, polymorphic magnetic tunnel junction memory unit is as shown in figure 3, two MTJ pass through a shared pinning layer Direct stacking forms multilayer film.
Embodiment 2:In the present embodiment, the bit structure of polymorphic magnetic storage is as shown in figure 1, including wordline WL, bit line The polymorphic magnetic memory cell of BL, MTJ 1MTJ1 and MTJ 2MTJ2 compositions, the storage being made up of diode Unit selection switchs.Memory cell selecting switch can also use CMOS transistor, as shown in Figure 2.Both the above structure can be optional One.
Wherein, MTJ1 and MTJ2 magnetospheric magnetization horizontally or vertically magnetizes in direction along face, and MTJ1 and MTJ2 Pinning layer position is different, and a pinning layer is in bottom, then another pinning layer is at top.The pinning of MTJ1 and MTJ2 pinning layer Direction is identical.
In the present embodiment, polymorphic magnetic tunnel junction memory unit is as shown in figure 4, two MTJ pass through wire or shared one Electrode realizes interconnection.Wherein, up, MTJ2 pinning layers are in lower section for MTJ1 pinning layers.
Embodiment 3:In the present embodiment, the bit structure of polymorphic magnetic storage is as shown in figure 1, including wordline WL, bit line The polymorphic magnetic memory cell of BL, MTJ 1MTJ1 and MTJ 2MTJ2 compositions, the storage being made up of diode Unit selection switchs.Memory cell selecting switch can also use CMOS transistor, as shown in Figure 2.Both the above structure can be optional One.
Wherein, MTJ1 and MTJ2 magnetospheric magnetization horizontally or vertically magnetizes in direction along face, and MTJ1 and MTJ2 Pinning layer position is different, and a pinning layer is in bottom, then another pinning layer is at top.The pinning of MTJ1 and MTJ2 pinning layer Direction is identical.
In the present embodiment, polymorphic magnetic tunnel junction memory unit is as shown in figure 5, two MTJ pass through wire or shared one Electrode realizes interconnection.Wherein, MTJ1 pinning layers are in lower section, and MTJ2 pinning layers are up.
Embodiment 4:In the present embodiment, the bit structure of polymorphic magnetic storage is as shown in figure 1, including wordline WL, bit line The polymorphic magnetic memory cell of BL, MTJ 1MTJ1 and MTJ 2MTJ2 compositions, the storage being made up of diode Unit selection switchs.Memory cell selecting switch can also use CMOS transistor, as shown in Figure 2.Both the above structure can be optional One.
Wherein, MTJ1 and MTJ2 magnetospheric magnetization horizontally or vertically magnetizes in direction along face, and MTJ1 and MTJ2 Pinning layer position is different, and a pinning layer is in bottom, then another pinning layer is at top.The pinning of MTJ1 and MTJ2 pinning layer Direction is identical.
In the present embodiment, polymorphic magnetic tunnel junction memory unit is as shown in fig. 6, two MTJ are in parallel by wire or electrode Realize interconnection.Wherein, up, MTJ2 pinning layers are in lower section for MTJ1 pinning layers.
The technical principle for being the specific embodiment of the present invention and being used above, if conception under this invention institute The change of work, during the spirit that its caused function is still covered without departing from specification and accompanying drawing, it should belong to the present invention's Protection domain.

Claims (10)

  1. A kind of 1. bit structure of polymorphic magnetic storage, it is characterised in that including:Polymorphic magnetic tunnel junction memory cell array, On-off circuit;On-off circuit is connected with polymorphic magnetic tunnel junction memory cell array, is controlled it.
  2. A kind of 2. bit structure of polymorphic magnetic storage according to claim 1, it is characterised in that:The polymorphic magnetic Tunneling junction memory cell has multiple resistance states, is combined and formed by two MTJ serial or parallel connections, one of magnetic Bottom pinning is become in property tunnel, and another is top pinning, and the pinning direction of two MTJs is identical.
  3. A kind of 3. bit structure of polymorphic magnetic storage according to claim 2, it is characterised in that:The magnetic tunnel Knot be made up of pinning layer thin magnetic film, free layer thin magnetic film, insulating interlayer, insulating interlayer be clipped in pinning layer thin magnetic film, from By between layer thin magnetic film;The direction of magnetization of pinning layer thin magnetic film is fixed;The magnetization orientation of free layer thin magnetic film depends on External magnetic field and spin polarized current effect, for producing different resistance states.
  4. A kind of 4. bit structure of polymorphic magnetic storage according to claim 3, it is characterised in that:The magnetic tunnel The thin magnetic film of knot is any one of magnetic anisotropy or perpendicular magnetic anisotropic in plane.
  5. A kind of 5. bit structure of polymorphic magnetic storage according to claim 4, it is characterised in that:The magnetic tunnel Become arbitrary shape;Preferably, the magnetic tunnel of magnetic anisotropy becomes ellipse in plane;Perpendicular magnetic anisotropic Magnetic tunnel becomes circle.
  6. A kind of 6. bit structure of polymorphic magnetic storage according to claim 3, it is characterised in that:The pinning layer magnetic Property film, free layer thin magnetic film constituent for iron, cobalt, boron, nickel any one or combination;The structure of the insulating interlayer Into any one that composition is aluminum oxide, magnesia or combine.
  7. A kind of 7. bit structure of polymorphic magnetic storage according to claim 2, it is characterised in that:Described two magnetic The mode that is connected in series of tunnel knot is to share the direct stacking of a pinning layer to form multilayer film, interconnection is realized by wire, is shared One electrode realizes any one in interconnection.
  8. A kind of 8. bit structure of polymorphic magnetic storage according to claim 2, it is characterised in that:Described two magnetic tunnels The parallel of road knot is to share the direct stacking of a pinning layer to form multilayer film and then realize interconnection by wire, share One electrode realizes any one of interconnection.
  9. A kind of 9. bit structure of polymorphic magnetic storage according to claim 1, it is characterised in that:Described switch electricity Road includes wordline, bit line, switching device, and switching device is connected with wordline, bit line respectively;Described switching device selects for diode Select any one in device, CMOS transistor.
  10. A kind of 10. bit structure of polymorphic magnetic storage according to claim 1, it is characterised in that:Described switch The electric current that circuit can be provided is much smaller than is programmed required electric current based on spin transfer torque principle;The electricity that on-off circuit provides Stream size is by reducing supply voltage, reduction supply current, being regulated and controled using current-limiting circuit, diminution transistor width.
CN201610419994.XA 2016-06-13 2016-06-13 A kind of bit structure of polymorphic magnetic storage Pending CN107481755A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108538879A (en) * 2018-03-09 2018-09-14 上海新储集成电路有限公司 A kind of memory cell structure of three-dimensional storage
CN110277490A (en) * 2019-06-24 2019-09-24 中国科学院微电子研究所 STT-MRAM reference unit and preparation method thereof and chip comprising the reference unit
CN110660435A (en) * 2018-06-28 2020-01-07 中电海康集团有限公司 MRAM memory cell, array and memory
WO2020177451A1 (en) * 2019-03-01 2020-09-10 浙江驰拓科技有限公司 Spin-orbit torque magnetic random access memory unit and magnetic random access memory
CN111739570A (en) * 2019-03-25 2020-10-02 中电海康集团有限公司 SOT-MRAM memory cell and SOT-MRAM memory

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CN1402254A (en) * 2001-08-02 2003-03-12 三菱电机株式会社 Thin film magnetic storage device with storage unit contg. magnetic tunnel node
CN1428786A (en) * 2001-12-21 2003-07-09 株式会社东芝 Magnetic random access memory and mfg. method thereof
US20030209769A1 (en) * 2001-08-09 2003-11-13 Nickel Janice H. Multi-bit MRAM device with switching nucleation sites
TW200603155A (en) * 2004-05-21 2006-01-16 Taiwan Semiconductor Mfg Co Ltd Multiple sensing level mram cell structures
CN102479542A (en) * 2010-11-29 2012-05-30 希捷科技有限公司 Magnetic memory cell with multi-level cell (mlc) data storage capability
CN102804438A (en) * 2009-06-11 2012-11-28 高通股份有限公司 Magnetic tunnel junction device and fabrication
CN103544982A (en) * 2007-02-12 2014-01-29 艾弗伦茨科技公司 An improved high capacity low cost multi-state magnetic memory
CN104584134A (en) * 2012-08-20 2015-04-29 高通股份有限公司 Multi-level memory cell using multiple magnetic tunnel junctions with varying MgO thickness
CN104658593A (en) * 2013-11-18 2015-05-27 三星电子株式会社 Magnetic memory devices having perpendicular magnetic tunnel structures therein

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CN1402254A (en) * 2001-08-02 2003-03-12 三菱电机株式会社 Thin film magnetic storage device with storage unit contg. magnetic tunnel node
US20030209769A1 (en) * 2001-08-09 2003-11-13 Nickel Janice H. Multi-bit MRAM device with switching nucleation sites
CN1428786A (en) * 2001-12-21 2003-07-09 株式会社东芝 Magnetic random access memory and mfg. method thereof
TW200603155A (en) * 2004-05-21 2006-01-16 Taiwan Semiconductor Mfg Co Ltd Multiple sensing level mram cell structures
CN103544982A (en) * 2007-02-12 2014-01-29 艾弗伦茨科技公司 An improved high capacity low cost multi-state magnetic memory
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CN102479542A (en) * 2010-11-29 2012-05-30 希捷科技有限公司 Magnetic memory cell with multi-level cell (mlc) data storage capability
CN104584134A (en) * 2012-08-20 2015-04-29 高通股份有限公司 Multi-level memory cell using multiple magnetic tunnel junctions with varying MgO thickness
CN104658593A (en) * 2013-11-18 2015-05-27 三星电子株式会社 Magnetic memory devices having perpendicular magnetic tunnel structures therein

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108538879A (en) * 2018-03-09 2018-09-14 上海新储集成电路有限公司 A kind of memory cell structure of three-dimensional storage
CN110660435A (en) * 2018-06-28 2020-01-07 中电海康集团有限公司 MRAM memory cell, array and memory
CN110660435B (en) * 2018-06-28 2021-09-21 中电海康集团有限公司 MRAM memory cell, array and memory
WO2020177451A1 (en) * 2019-03-01 2020-09-10 浙江驰拓科技有限公司 Spin-orbit torque magnetic random access memory unit and magnetic random access memory
CN111739570A (en) * 2019-03-25 2020-10-02 中电海康集团有限公司 SOT-MRAM memory cell and SOT-MRAM memory
CN111739570B (en) * 2019-03-25 2022-05-31 中电海康集团有限公司 SOT-MRAM memory cell and SOT-MRAM memory
CN110277490A (en) * 2019-06-24 2019-09-24 中国科学院微电子研究所 STT-MRAM reference unit and preparation method thereof and chip comprising the reference unit
CN110277490B (en) * 2019-06-24 2023-06-09 中国科学院微电子研究所 STT-MRAM reference cell, preparation method thereof and chip comprising reference cell

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Application publication date: 20171215