CN107473773B - Manufacturing process of small-size thin buzzer - Google Patents
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Abstract
The application discloses small-size thin buzzing piece's manufacture technology, this technology includes: putting the raw materials for manufacturing the buzzer into a ball mill for mixing and grinding, discharging after 24 hours, and drying; pre-burning the mixed and ground raw materials at 1040 ℃ for 2h, and finely grinding the pre-burned powder for 24 h; mixing and roll-grinding the fine ground powder, the adhesive and the organic solvent for 23 hours, and preparing the obtained slurry into a blank by a casting machine and a sheet punching machine; sequentially carrying out glue discharging, sintering and slicing treatment on the green body; coating silver paste on the sliced products, and carrying out silver firing treatment; adhering the silver-fired product to a metal sheet, and drying and curing; and polarizing the cured product to obtain the piezoelectric ceramic buzzer piece. The manufacturing process provided by the application reverses the sequence of polarization and bonding processes in the prior art, the manufactured piezoelectric buzzer is thicker than that in the prior art, the reliability of the product is not affected, the process difficulty of producing small-size thin buzzer is reduced, the qualification rate is greatly improved, and waste is avoided.
Description
Technical Field
The invention relates to the technical field of buzzer manufacturing, in particular to a manufacturing process of a small-size thin buzzer.
Background
The piezoelectric buzzer is a piezoelectric element which utilizes the piezoelectric effect to excite bending vibration under the action of an electric signal, and is also called a piezoelectric vibrating plate, and the piezoelectric buzzer has the advantages of low power consumption, high reliability, severe working environment resistance, low possibility of electromagnetic interference and the like, so that the piezoelectric buzzer is widely applied to the working fields of household appliances, machine equipment, vehicle theft prevention, home security and the like.
The common piezoelectric ceramic buzzer is a piezoelectric ceramic Piece (PZT) prepared by sintering zirconium, titanium and lead oxides, and the current process for manufacturing the PZT piezoelectric ceramic buzzer is as follows: the method comprises the steps of material preparation, ball milling (mixed milling, pre-sintering, fine milling), molding (casting, isostatic pressing, punching), arranging and sintering (binder removal, sintering), splitting, silver coating, polarization, bonding, testing, packaging and warehousing, wherein the process flow is basically suitable for all specifications and sizes of buzzer pieces.
However, when a small-sized thin buzzer piece with a diameter less than 20mm and a total thickness of 300 μm or less is manufactured, the thinner the piezoelectric piece is, the higher the requirements for the manufacturing process are, and the polarization is difficult to control, the piezoelectric piece is easily broken during polarization, so that the yield of manufacturing the small-sized thin buzzer piece is low, and a great waste is caused.
Disclosure of Invention
The invention provides a manufacturing process of a small-size thin buzzer, and aims to solve the problem that the existing small-size thin buzzer is low in manufacturing qualification rate and causes great waste.
The invention provides a manufacturing process of a small-size thin buzzer, which comprises the following steps:
putting the prepared raw materials into a ball mill for mixed grinding, discharging after 24 hours, and drying;
pre-burning the mixed and ground raw materials at 1040 ℃ for 2h, putting the pre-burned powder into a ball mill for fine grinding, discharging after 24h, and drying;
adding the finely ground powder, the adhesive and the organic solvent into a ball milling tank, mixing for 23 hours on a roller mill, and preparing a blank by a casting machine and a sheet punching machine;
sequentially carrying out glue discharging, sintering and sorting treatment on the green body;
coating silver paste on the sorted product, and carrying out silver firing treatment;
adhering the silver-fired product to a metal sheet, and drying and curing the silver-fired product;
and carrying out polarization treatment on the cured product to obtain the piezoelectric ceramic buzzer piece.
Optionally, the step of putting the prepared raw materials into a ball mill for ball milling and mixing specifically comprises:
after the raw materials are put into a ball mill, adding water with a corresponding proportion into the ball mill;
the raw materials were ground by zirconium balls in a ball mill and mixed.
Optionally, the weight ratio of the raw materials to the water is 1:0.7, and the weight ratio of the zirconium balls in the ball mill is
Optionally, the finely ground powder, the binder and the organic solvent are added into a ball milling tank, mixed for 23 hours on a roller mill, and made into a green body through a casting machine and a sheet punching machine, and the method specifically comprises the following steps:
mixing the finely ground powder, the adhesive, a xylene solution and an absolute ethyl alcohol solution according to a proper ratio to prepare slurry;
preparing the slurry into a qualified film with required thickness by adjusting the scraper gap and the drying curve of a casting machine;
and punching the film to obtain a blank with the required size.
Optionally, the green body is sequentially subjected to glue discharging, sintering and sorting treatment, and the method specifically comprises the following steps:
carrying out glue discharging treatment on the blank at the temperature of 30-800 ℃, wherein the glue discharging period is 40 h;
putting the green body with the glue discharged into a resistance furnace, and sintering for 2h at 1300 ℃;
and sorting the sintered product to obtain the ceramic chip.
Optionally, the polarizing treatment of the cured product specifically includes:
placing a plurality of cured products on a copper plate for polarization of a voltage resistance tester, setting polarization voltage according to the thickness of the products, and carrying out polarization treatment on the products one by one;
and testing the capacity, loss, resonant frequency and resistance parameters of the product by a testing machine after the polarization is finished.
Optionally, the polarization voltage is 3 kv/mm.
The technical scheme provided by the invention can have the following beneficial effects:
the invention provides a manufacturing process of a small-size thin buzzer, which comprises the following steps: putting the prepared raw materials into a ball mill for mixed grinding, discharging after 24 hours, and drying; pre-burning the mixed and ground raw materials at 1040 ℃ for 2h, putting the pre-burned powder into a ball mill for fine grinding, discharging after 24h, and drying; adding the finely ground powder, the adhesive and the organic solvent into a ball milling tank, mixing for 23 hours on a roller mill, and preparing a blank by a casting machine and a sheet punching machine; sequentially carrying out glue discharging, sintering and sorting treatment on the green body; coating silver paste on the sorted product, and carrying out silver firing treatment; and carrying out polarization treatment on the cured product to obtain the piezoelectric ceramic buzzer piece. The manufacturing process provided by the application improves the manufacturing process of the existing buzzer piece, reverses the sequence of two processes of polarization and bonding in the existing process, namely, the silver-coated product is bonded on the metal sheet, and polarization treatment is carried out after curing, so that the piezoelectric ceramic piece is prevented from cracking in the polarization process. Research shows that the small-size thin buzzer sheet manufactured by the manufacturing process is thicker than that of the conventional process on the premise of not influencing the performance of the small-size thin buzzer sheet, so that the process difficulty for producing the small-size thin buzzer sheet is greatly reduced, the qualified rate is greatly improved, and waste is avoided; the polarization voltage after bonding is 0.8-1.0 times of the existing polarization voltage, and the polarization can not be broken after multiple times of polarization, and the performance of the ceramic wafer before bonding does not need to be tested and sorted, thereby reducing the labor cost.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any inventive exercise.
Fig. 1 is a schematic flow chart of a manufacturing process of a small-sized thin buzzer piece according to an embodiment of the present invention;
FIG. 2A is a logarithmic graph of a small-sized thin buzzer diaphragm (12.5T7.8-100T-184) made in accordance with the prior art;
FIG. 2B is a logarithmic graph of a small-sized thin buzzer piece (12.5T7.8-106T-198) manufactured by the manufacturing process provided by the embodiment of the invention;
FIG. 3A is a logarithmic graph of a small size thin buzzer piece (FT15T-4.5A1) made using the prior art;
fig. 3B is a logarithmic graph of a small-sized thin buzzer piece (FT15T-4.5a1) manufactured by the manufacturing process provided by the embodiment of the invention.
Detailed Description
Referring to fig. 1, a flow chart of a manufacturing process of a small-sized thin buzzer piece according to an embodiment of the present invention is shown.
S100: and (3) putting the raw materials for manufacturing the buzzer into a ball mill for mixing and grinding, discharging after 24 hours, and drying.
Particularly, the main raw material for manufacturing the piezoelectric ceramic buzzer piece is Pb3O4、TiO2、ZrO2、SrCO3The auxiliary material is Nb2O5、Sb2O3、MnO2、Ni2O3The purity, fineness and activity of the raw materials should be paid attention to, the purity is based on the principle that no harmful impurities are introduced, the alkaline earth metal oxide is easier to absorb moisture, and the activity of the oxide generated by decomposing the carbonate during pre-sintering is high, which is related to the whole preparation process and the performance of the final product. After selecting raw materials, carrying out pretreatment on the raw materials, removing impurities and moisture, weighing various raw materials according to a formula proportion, and paying attention to the fact that a small amount of additives are placed in the middle of a large material.
The raw materials are required to be uniformly mixed after burdening, the purpose of mixing is to mix and grind various raw materials, and conditions are prepared for carrying out complete solid phase reaction for pre-sintering. In operation, will be configuredThe raw materials are put into a ball mill, and water with a corresponding ratio is added into the ball mill, for example, the weight ratio of the raw materials to the water is 1:0.7, namely 35kg of water is added into 50kg of the raw materials. And then starting the ball mill, rotating the cylinder of the ball mill, carrying the raw materials and the zirconium balls in the cylinder to a certain height under the action of friction force and centrifugal force when the cylinder rotates, then throwing and leaking the raw materials under the action of gravity, gradually crushing the raw materials under the action of impact and grinding, discharging the crushed raw materials out of the cylinder through a discharging part after grinding for 24 hours, and finally drying. Preferably, to ensure the coarse-ground particle size of the raw material, the zirconium balls in the ball mill
And
the weight ratio of the components is 2:1:1: 2.
S200: pre-burning the mixed and ground raw materials at 1040 ℃ for 2h, putting the pre-burned powder into a ball mill for fine grinding, discharging after 24h, and drying.
Specifically, after raw materials are mixed and coarsely ground, the raw materials need to be pre-sintered, which is important and directly affects sintering conditions and properties of final products. The pre-firing process is a process in which a chemical reaction between raw materials occurs to produce a desired product, and is also called a solid phase reaction because the reaction is performed by atomic diffusion at a temperature lower than a melting point. The solid phase method utilizes various solid state reactions occurring between solid substances to prepare powder.
When applied to the preparation of lead zirconate titanate (PZT) powder, the solid phase method is also called a mixed oxide synthesis method, namely a conventional solid phase sintering method. PZT is obtained by a solid reaction between oxides, in which first the constituent oxides react with each other to form PbTiO3And ZrO2Then uniformly converted into a PZT phase. When sintering, if the selected pre-sintering temperature is too low, the chemical reaction is insufficient; if the temperature is too high, the hardness of the powder after pre-sintering is high, and the powder is difficult to crush, so the pre-sintering process provided by the application comprises coarse grindingThe resulting material was calcined at 1040 ℃ for 2 hours.
It should be noted that, during the pre-burning process, part of the lead oxide will volatilize, so in order to ensure the product quality, the alumina crucible should be covered and sealed during the pre-burning process.
The solid-state reactions commonly used in the preparation of ceramic powder raw materials include a combination reaction, a thermal decomposition reaction and an oxide reduction reaction, but these reactions often occur simultaneously in the actual process, and the powder prepared by the solid-state method sometimes cannot be directly used as a molding raw material and needs to be further pulverized.
And putting the pre-sintered piezoelectric ceramic powder into a ball mill for fine grinding, and laying a good foundation for the uniformity of the finished ceramic. The larger the granularity of the raw materials is, the slower the synthesis or sintering rate is, the higher the synthesis or sintering temperature is, the poorer the compactness of the obtained ceramic chip is, the electromechanical properties of the piezoelectric ceramic chip are deteriorated, and the performance of the piezoelectric ceramic buzzer chip is influenced, so the pre-sintered powder is put into a ball mill to be finely ground for 24 hours until the granularity D97 is less than or equal to 2.0, and then the finely ground powder is dried.
S300: adding the fine ground powder, the adhesive and the organic solvent into a ball milling tank, mixing for 23 hours on a roller mill, and preparing into a blank through a casting machine and a sheet punching machine.
Specifically, the finely ground powder, the adhesive, a xylene solution, an absolute ethyl alcohol solution and other organic solvents are mixed according to a proper proportion to prepare slurry with certain viscosity, the slurry flows down from a container, a slurry layer with certain thickness is obtained by adjusting the gap of a scraper of a casting machine, and the film with the required thickness is obtained after subsequent drying. And then, according to the size and the shape of the product, carrying out process treatment such as punching, powder mixing and the like on the film, supporting a required blank body, and preparing for a subsequent process.
S400: and sequentially carrying out glue discharging, sintering and sorting treatment on the green body.
Specifically, the purpose of binder removal is to remove the binder added in the molding process from the sample, the binder only has the function of smooth molding, and a substance with strong reducibility is generated when the binder is burned at high temperature, so that the material performance is affected, and the binder needs to be heated and removed after molding. During operation, after the punched green body is mixed with powder, the green body is laminated and loaded in a furnace according to the process requirements, the temperature is raised and the glue is discharged, the glue discharging curve is gradually raised from 30 ℃ to 160 ℃ -450 ℃ but the temperature is slowly raised at 160 ℃ -450 ℃ for about 30 hours, and the whole glue discharging cycle needs about 40 hours.
And putting the green body with the glue discharged into a firing resistance furnace for sintering, wherein the piezoelectric ceramic is sintered in a sealing manner, the selected optimal sintering temperature is the sintering temperature when the piezoelectricity is the best, the optimal sintering temperature is 1300 ℃, and the temperature is kept for 2 hours. The piezoelectric ceramic sheet with high ceramic forming property and high density can be obtained by sintering.
The sintered ceramic plates are separated one by one, the appearance quality of the ceramic plates is checked under a lamp box, the ceramic plates with appearance defects are removed, inferior products are prevented from being processed, and the processing cost is increased.
S500: and coating silver paste on the sorted product, and carrying out silver firing treatment.
Specifically, silver paste is uniformly coated on the surface of the ceramic chip by using screen printing, and then the product is placed in an oven to dry the silver paste, so that part of solvent is slowly volatilized, and the silver layer is prevented from skinning when the silver is burnt. Preferably, the drying temperature is 100-130 ℃, and the drying time is 30-45 min.
And after finishing silver coating, carrying out silver firing treatment on the silver coated product through a mesh belt furnace. The mesh-belt silver burning furnace is divided into 5 temperature zones, the silver burning period is 2 hours, and the silver burning curve is 200-450-650-800-600 ℃.
S600: and adhering the silver-fired product to a metal sheet, and drying and curing the silver-fired product.
Specifically, the metal sheet is loaded into a left trough of the bonding machine, the silver-fired ceramic sheet is loaded onto a platform of a bidirectional turnover mechanism of the bonding machine, and the platform of the turnover mechanism corresponds to the left trough and the right trough of the bonding machine. The metal sheet is adsorbed on the platform of the turnover mechanism in a vacuum suction mode, glue is evenly coated on the metal sheet through screen printing, the platform of the turnover mechanism is turned over, the ceramic sheet is bonded on the metal sheet through the glue, and finally the ceramic sheet is taken down and placed into a curing tool to be dried and cured in an oven, wherein the drying temperature is 80 ℃, and the drying time is 4 hours.
S700: and carrying out polarization treatment on the cured product to obtain the piezoelectric ceramic buzzer piece.
Specifically, the piezoelectric ceramic has piezoelectric properties after being polarized, i.e., a strong dc electric field is applied to the piezoelectric ceramic to align the electric domains in the ceramic along the direction of the electric field, which is also called artificial polarization or single domain polarization.
Whether the polarization process is carried out sufficiently or not has great influence on the material performance, so the polarization mode and the polarization condition are reasonably selected. The point polarization mode is simple and flexible, and the whole process does not need high-pressure and high-temperature operation and can be carried out at room temperature. The polarization voltage is set according to the thickness of the ceramic plate, and is generally 3 kv/mm.
This application polarization process adopts the point polarization mode to carry out polarization treatment to the potsherd after burning silver, and 2671 type withstand voltage tester is connected to the polarization pen, sets for polarization voltage through 2671 type withstand voltage tester, and the polarization pen is anodal, and the withstand voltage tester is connected to the copper is the negative pole. And (3) flatly placing the cured product on the copper plate, and enabling the polarization pen to contact the ceramic surface of the product to form a polarization electric field on the product, so that polarization treatment is completed, and the piezoelectric ceramic buzzer sheet is obtained. The buzzer sheet is made of a ceramic sheet which is soft and thin, so that the buzzer sheet does not need to be heated and only needs to be heated at room temperature. Also the polarization time is very short, around 1 s.
After the polarization is completed, the performance of the piezoelectric buzzer needs to be tested, for example, parameters such as the capacity, the loss, the resonant frequency and the resistance of the buzzer are tested, and whether the piezoelectric performance of the buzzer meets the requirements or not is checked.
Fig. 2A is a logarithmic graph of a small-sized thin buzzer piece (12.5T7.8-100T-184) manufactured by adopting the prior art, and fig. 2B is a logarithmic graph of a small-sized thin buzzer piece (12.5T7.8-106T-198) manufactured by adopting the manufacturing process provided by the application. It can be seen from the figure that the two small-size thin buzzer pieces have the same performance, but the types of the piezoelectric pieces manufactured in the prior art are C9.5mmT78 μm, the total thickness is 184 μm, and the size of the copper piece is C12.5mmT100 μm, while the types of the piezoelectric pieces manufactured in the manufacturing process provided by the application are C9.5mmT92 μm, the total thickness is 198 μm, and the size of the copper piece is C12.5mmT100 μm, and the difference between the total thicknesses of the buzzer pieces obtained by adopting different processes is 14 μm, so that the same result is achieved, and therefore, the thickness of the piezoelectric piece manufactured by adopting the new process is thicker than that of the piezoelectric piece manufactured by adopting the normal process, so that the process difficulty of producing the small-size thin buzzer pieces is reduced, the qualification rate is greatly improved, and.
Fig. 3A is a logarithmic graph of a small-sized thin buzzer piece (FT15T-4.5a1) manufactured by using the conventional process, and fig. 3B is a logarithmic graph of a small-sized thin buzzer piece (FT15T-4.5a1) manufactured by using the manufacturing process provided by the present application, and it can be seen from the graph that the frequency of the buzzer piece manufactured by using the normal process is 4.7k, the frequency of the buzzer piece manufactured by using the manufacturing process provided by the present application is 4.5k, and the type of the buzzer piece required to be produced is R < 300 Ω, f: 4.5 +/-0.5K and 24 +/-30% of C, so that the product prepared by the preparation process provided by the application is more in line with the requirements.
To sum up, the manufacturing process of the small-size thin buzzer piece provided by the application is low in difficulty compared with the existing process, the qualification rate of the small-size thin buzzer piece is greatly improved, and the performance of the product manufactured by the small-size thin buzzer piece provided by the application is better compared with the product manufactured by the existing process, so that the product requirement is better met.
The small-size thin buzzer piece manufacturing process flow provided by the application is as follows: firstly, preparing ceramic powder required for molding according to the processes of proportioning and ball milling (mixing, pre-sintering and fine milling); calculating the thickness of the film during casting according to the requirement of the needed buzzer; then carrying out glue discharging, sintering, sorting and silver firing treatment on the formed ceramic wafer; then bonding the ceramic plate after silver burning to a metal plate, and drying and curing; and finally, polarizing the cured product to obtain the piezoelectric ceramic buzzer piece.
Research experiments show that the small-size thin buzzer piece manufacturing process comprises the steps of material preparation, ball milling (mixed milling, pre-burning, fine milling), forming, discharging and burning (binder removal, sintering), sorting, silver coating, bonding, polarization, testing, packaging and warehousing, wherein the sequence of the polarization and bonding processes is reversed, the thickness of the manufactured buzzer piece is increased by about 10 mu m, the process difficulty of producing the small-size thin buzzer piece is reduced, the qualification rate is greatly improved, and waste is avoided; compared with the product with the same specification, all parameters except the thickness increase meet the requirements; the polarization voltage is 0.8-1.0 times of the normal polarization voltage, and the polarization can not be broken after multiple times of polarization, and selection is not needed before bonding, so that the labor cost is reduced; after polarization, the performance consistency is good, and the reliability is not affected. The manufacturing method provided by the application solves the problems that the small-size thin buzzer is difficult in production process, easy to break during polarization and the like, obviously improves the qualification rate of the small-size thin buzzer, and reduces the production cost.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
The above-described embodiments of the present invention should not be construed as limiting the scope of the present invention.
Claims (7)
1. The manufacturing process of the small-size thin buzzer is characterized by comprising the following steps:
putting the prepared raw materials into a ball mill for mixed grinding, discharging after 24 hours, and drying;
pre-burning the mixed and ground raw materials at 1040 ℃ for 2h, putting the pre-burned powder into a ball mill for fine grinding, discharging after 24h, and drying;
adding the finely ground powder, the adhesive and the organic solvent into a ball milling tank, mixing for 23 hours on a roller mill, and preparing a blank by a casting machine and a sheet punching machine;
sequentially carrying out glue discharging, sintering and sorting treatment on the green body;
coating silver paste on the sorted product, and carrying out silver firing treatment;
adhering the silver-fired product to a metal sheet, and drying and curing the silver-fired product;
and placing a plurality of cured products on a copper plate for polarization of a voltage-withstanding tester, setting polarization voltage according to the thickness of the products, and carrying out polarization treatment on the products one by one to obtain the small-size thin buzzer.
2. The manufacturing process of claim 1, wherein the step of putting the prepared raw materials into a ball mill for ball milling and mixing comprises the following steps:
after the raw materials are put into a ball mill, adding water with a corresponding proportion into the ball mill;
the raw materials were ground by zirconium balls in a ball mill and mixed.
3. The manufacturing process of claim 2, wherein the weight ratio of the raw materials to the water is 1:0.7, and the weight ratio of the zirconium balls in the ball mill is phi 3: phi 5: phi 7: phi 10=2:1:1: 2.
4. The process of claim 1, wherein the finely ground powder, binder and organic solvent are added to a ball mill tank, mixed on a roller mill for 23 hours, and formed into a green body by a casting machine and a sheet punching machine, and the process comprises:
mixing the finely ground powder, the adhesive, a xylene solution and an absolute ethyl alcohol solution according to a proper ratio to prepare slurry;
preparing the slurry into a qualified film with required thickness by adjusting the scraper gap and the drying curve of a casting machine;
and punching the film to obtain a blank with the required size.
5. The manufacturing process of claim 1, wherein the green body is sequentially subjected to binder removal, sintering and sorting, and specifically comprises:
carrying out glue discharging treatment on the blank at the temperature of 30-800 ℃, wherein the glue discharging period is 40 h;
putting the green body with the glue discharged into a resistance furnace, and sintering for 2h at 1300 ℃;
and sorting the sintered product to obtain the ceramic chip.
6. The manufacturing process of claim 1, further comprising:
and testing the capacity, loss, resonant frequency and resistance parameters of the product by a testing machine after the polarization is finished.
7. The process of claim 1, wherein the poling voltage is 3 kv/mm.
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