CN107473773A - A kind of manufacture craft of the thin piezo of small size - Google Patents
A kind of manufacture craft of the thin piezo of small size Download PDFInfo
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- CN107473773A CN107473773A CN201710693111.9A CN201710693111A CN107473773A CN 107473773 A CN107473773 A CN 107473773A CN 201710693111 A CN201710693111 A CN 201710693111A CN 107473773 A CN107473773 A CN 107473773A
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- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5116—Ag or Au
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/6261—Milling
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
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- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
- H10N30/045—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
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- H—ELECTRICITY
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- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/089—Shaping or machining of piezoelectric or electrostrictive bodies by machining by punching
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
- C04B2235/661—Multi-step sintering
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Abstract
This application discloses a kind of manufacture craft of the thin piezo of small size, the technique includes：It will make in the raw material input ball mill of piezo and carry out mix grinding, be discharged after 24h, drying；By the raw material after mix grinding at 1040 DEG C pre-burning 2h, by the fine grinding 24h again of the powder after pre-burning；Base substrate is made by casting machine and sheet-punching machine in powder after fine grinding, adhesive and organic solvent mixing barreling 23h, obtained slurry；Base substrate is carried out to dumping, sintering and burst processing successively；By silver paste brushing on the product after burst, silver ink firing processing is carried out；Product after silver ink firing is adhered on sheet metal, baking and curing；Product after solidification is polarized, obtains piezoelectric ceramics piezo.The manufacture craft that the application provides has overturned polarization and technique for sticking order in existing process, the piezoelectricity singing piece produced is partially thicker than existing process, product reliability do not have not only it is impacted, also reduce production the thin piezo of small size technology difficulty, qualification rate greatly improved, avoid waste.
Description
Technical field
The present invention relates to piezo manufacture technology field, more particularly to a kind of manufacture craft of the thin piezo of small size.
Background technology
Piezoelectricity singing piece is that one kind utilizes piezo-electric effect, under electric signal effect, excites the piezoelectric element of flexural vibrations,
Referred to as piezoelectric vibrating plate, it because with it is low in energy consumption, reliability is high, resistance to severe working environment, be not easy it is excellent by electromagnetic interference etc.
Point, so it is widely used in the career fields such as household electrical appliance, machinery equipment, vehicle anti-theft, home security.
Common piezoelectric ceramics piezo is piezoelectric ceramic piece made of sintering after being prepared with the oxide of zirconium, titanium, lead
(PZT), the technique of making PZT piezoelectric ceramics piezo is at present：Dispensing-ball milling (mix grinding-pre-burning-fine grinding)-shaping (stream
Prolonging-isostatic pressed-punching)-row burns (dumping, sintering)-burst-by silver-polarization-bonding-test-packaging-storage, this
Technological process is adapted to the piezo of all specifications substantially.
But it is less than 20mm making diameter, and during the thin piezo of the small size below 300 μm of total thickness, because piezoelectric patches is thinner,
Requirement to manufacture craft is higher, and it is unmanageable to polarize, and piezoelectric patches is easily broken during polarization so that makes the thin honeybee of small size
The qualification rate of ring piece is relatively low, causes greatly to waste.
The content of the invention
The invention provides a kind of manufacture craft of the thin piezo of small size, to solve the system of the thin piezo of current small size
Make that qualification rate is relatively low, the problem of causing significant wastage.
The invention provides a kind of manufacture craft of the thin piezo of small size, this method includes：
The raw material prepared are put into ball mill and carry out mix grinding, discharging, drying after 24h；
By the raw material after mix grinding at 1040 DEG C pre-burning 2h, will be carried out in the powder input ball mill after pre-burning thin
Grind, discharging, drying after 24h；
Powder after fine grinding, adhesive and organic solvent are added in ball grinder, 23h is mixed on tumbling mill, passes through stream
Prolong machine and base substrate is made in sheet-punching machine；
The base substrate is subjected to dumping, sintering and sorting process successively；
By silver paste brushing on the product after sorting, silver ink firing processing is carried out；
Product after silver ink firing is adhered on sheet metal, and carries out baking and curing processing；
Polarization process is carried out to the product after solidification, obtains piezoelectric ceramics piezo.
Optionally, described put into the raw material prepared in ball mill carries out ball milling mixing, specifically includes：
After the raw material are put into ball mill, the water accordingly matched is added into the ball mill；
The raw material are ground mixing by the zirconium ball grinding raw material in ball mill.
Optionally, the weight proportion of the raw material and water is 1:0.7, zirconium ball weight proportioning in ball mill
Optionally, powder, adhesive and the organic solvent by after fine grinding is added in ball grinder, is mixed on tumbling mill
23h, base substrate is made by casting machine and sheet-punching machine, specifically included：
Powder after fine grinding, adhesive and xylene solution and ethanol solution are mixed and made into material by appropriate proportioning
Slurry；
By adjust casting machine scraper gap and dry curve by the slurry be made needed for thickness qualified film；
The film is subjected to punching, the base substrate of size needed for acquisition.
Optionally, it is described that the base substrate is subjected to dumping, sintering and sorting process successively, specifically include：
The base substrate is subjected to dumping processing at 30 DEG C~800 DEG C, the dumping cycle is 40h；
The base substrate for being drained through glue is put into resistance furnace, 2h is sintered at 1300 DEG C；
The product sintered is subjected to sorting process, obtains potsherd.
Optionally, the product after described pair of solidification carries out polarization process, specifically includes：
Product after some solidifications is placed on Hi-pot Tester polarization copper coin, polarization electricity is set according to product thickness
Pressure, polarization process is carried out to product one by one；
Pass through the capacity of test machine test product, loss, resonant frequency and resistance parameter after the completion of polarization.
Optionally, the polarizing voltage is 3kv/mm.
Technical scheme provided by the invention can include the following benefits：
The present invention provides a kind of manufacture craft of the thin piezo of small size, and the manufacture craft includes：The raw material that will be prepared
Mix grinding is carried out in input ball mill, is discharged after 24h, drying；By the raw material after mix grinding at 1040 DEG C pre-burning 2h, pre-burning will be passed through
Fine grinding is carried out in powder input ball mill afterwards, is discharged after 24h, drying；Powder after fine grinding, adhesive and organic solvent are added
Enter in ball grinder, 23h is mixed on tumbling mill, base substrate is made by casting machine and sheet-punching machine；The base substrate is arranged successively
Glue, sintering and sorting process；By silver paste brushing on the product after sorting, silver ink firing processing is carried out；Product after solidification is carried out
Polarization process, obtain piezoelectric ceramics piezo.The manufacture craft that the application provides improves the manufacture craft of existing piezo, top
The orders of two processes of polarization and bonding in existing process is fallen, i.e., will be first adhered on sheet metal, solidify by the product after silver
Carry out polarization process again afterwards, avoid piezoelectric ceramic piece and ruptured in polarization process.Also it has been investigated that, using the making work
The thin piezo of small size made of skill, on the premise of its performance is not influenceed, piezoelectric patches thickness is thicker than existing process so that
The technology difficulty of the production thin piezo of small size substantially reduces, and qualification rate greatly improved, avoid waste；It is bonded after-polarization electricity
Press as 0.8-1.0 times of existing polarizing voltage, and repeatedly polarization will not rupture, the performance of bonding pre-ceramic piece does not have to test point
Choosing, reduces cost of labor.
It should be appreciated that the general description and following detailed description of the above are only exemplary and explanatory, not
Can the limitation present invention.
Brief description of the drawings
In order to illustrate more clearly of technical scheme, letter will be made to the required accompanying drawing used in embodiment below
Singly introduce, it should be apparent that, for those of ordinary skills, without having to pay creative labor,
Other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of schematic flow sheet of the manufacture craft of the thin piezo of small size provided in an embodiment of the present invention；
Fig. 2A is the logarithmic coordinates of the thin piezo of small size (12.5T7.8-100T-184) made using prior art
Figure；
Fig. 2 B are using the thin piezo (12.5T7.8- of small size made of manufacture craft provided in an embodiment of the present invention
Logarithmic plot 106T-198)；
Fig. 3 A are the logarithmic plot of the thin piezo of small size (FT15T-4.5A1) made using prior art；
Fig. 3 B are using the thin piezo of small size (FT15T-4.5A1) made of manufacture craft provided in an embodiment of the present invention
Logarithmic plot.
Embodiment
Referring to Fig. 1, for the flow chart of the manufacture craft of the thin piezo of small size provided in an embodiment of the present invention.
S100：It will make in the raw material input ball mill of piezo and carry out mix grinding, be discharged after 24h, drying.
Specifically, the main raw material(s) for making piezoelectric ceramics piezo is Pb3O4、TiO2、ZrO2、SrCO3, auxiliary material is
Nb2O5、Sb2O3、MnO2、Ni2O3, select to should be noted that purity, fineness and activity during raw material, purity using do not introduce objectionable impurities as
Principle, alkaline earth oxide is more easy to the moisture absorption, and the oxide active that carbonate decomposition generates during pre-burning is big, and this is related to entirely
The performance of preparation process and final product.After choosing raw material, material pre-treatment is carried out, removal of impurities removes moisture, then according to formula rate
Various raw material are weighed, notice that a small amount of additive will be placed on the centre of aniseed.
Need raw material being well mixed after dispensing, the purpose of mixing is to be mixed and finely ground various raw material, to burn into advance
The complete solid phase reaction preparatory condition of row.During operation, the raw material configured are put into ball mill, and is added into ball mill
The water accordingly matched, if the weight proportion of raw material and water is 1:0.7, i.e., add 35kg water in 50kg raw materials.Start ball milling afterwards
Machine, the cylinder of ball mill are turned round, and the raw material and zirconium ball in cylinder are served as a contrast when cylinder turns round by frictional force and centrifugal action
Strip to due to Action of Gravity Field, just producing and leave and let out after certain altitude, raw material impact and abrasive action under progressively by
Crush, after grinding 24h, pulverized raw material are discharged outside cylinder through discharge portion, finally carry out drying and processing.Preferably, it is guarantor
Demonstrate,prove the particle diameter after raw material corase grind, zirconium ball in ball millWithWeight proportion be 2:1:1:2.
S200：By the raw material after mix grinding at 1040 DEG C pre-burning 2h, by after pre-burning powder input ball mill in enter
Row fine grinding, discharging, drying after 24h.
Specifically, raw material are mixed after roughly grinding, it is necessary to carry out pre-burning to raw material, the process is critically important, can directly affect
The performance of sintering condition and final products.Burn-in process is to make chemical reaction occurs to generate the process of required product between raw material,
Because reaction is to be completed at a temperature of less than fusing point by atoms permeating, also referred to as solid phase reaction.Solid phase method is using admittedly
The various solid-state reactions that are occurred between state material produce powder.
Solid phase method applied to lead zirconate titanate (PZT) powder when preparing, also referred to as mixed oxide synthetic method, i.e. people
Usually said conventional solid sintering process.PZT is obtained by the solid reaction between oxide, in oxide course of reaction,
React to each other generation PbTiO between composition oxide first3And ZrO2Solid solution, then uniform conversion is PZT phases.Sintering
When, if the calcined temperature of selection is too low, chemically react insufficient；If temperature is too high, the powder hardness after pre-burning is very big, difficult
To crush, therefore the pre-sinter process that the application provides is pre-burning 2 hours at 1040 DEG C of the raw material after corase grind.
It should be noted that in burn-in process, partial oxidation lead can volatilize, therefore, in order to ensure product quality, pre-burning
When, alumina crucible will seal.
The solid-state reaction commonly used in ceramic powder raw material is prepared includes combination reaction, pyrolysis and oxide reduction
Reaction, but this several reaction often occurs simultaneously during actual process, and the powder prepared using solid state process sometimes can not be straight
Connect and used as shaping raw material, need to further be crushed.
Fine grinding will be carried out in the ceramic powder input ball mill of pre-burning, be unanimously to accomplish fluently base into the uniform performance of porcelain
Plinth.The granularity of raw material is bigger, and synthesis or sintering rate are slower, causes synthesis or sintering temperature higher, and the ceramics of gained causes
Density is poorer, deteriorates piezoelectric ceramic piece electromechanical properties, so as to influence the performance of piezoelectric ceramics piezo, therefore by after pre-burning
Fine grinding 24h in powder input ball mill, until granularity D97≤2.0, are afterwards dried the powder after fine grinding.
S300：Powder after fine grinding, adhesive and organic solvent are added in ball grinder, 23h is mixed on tumbling mill, is led to
Cross casting machine and base substrate is made in sheet-punching machine.
Specifically, by organic solvents such as the powder after fine grinding, adhesive and xylene solution and ethanol solutions by suitable
When proportioning is mixed and made into the slurry with certain viscosity, slurry flows down from container, by adjusting casting machine scraper gap, obtains one
Determine the feed pulp layer of thickness, the film of required thickness is obtained after follow-up drying.Then film is entered according to the size and dimension of product
The PROCESS FOR TREATMENTs such as row punching, breading, required base substrate is supported, is ready for subsequent technique.
S400：The base substrate is subjected to dumping, sintering and sorting process successively.
Specifically, the purpose of dumping is that the adhesive that will be added in moulding process is discharged from sample, the effect of adhesive
It is intended merely to smoothly be molded, it may generate a kind of strong material of reproducibility in high temperature sintering, influence material property, so into
Type needs heating to discharge it later.During operation, after made base substrate breading, by technological requirement lamination, shove charge, heated up
Dumping, dumping curve are heated up slowly by 30 DEG C~160 DEG C~450 DEG C~800 DEG C gradually heatings at 160 DEG C~450 DEG C,
30h or so is needed, completing the whole dumping cycle needs 40h or so.
The base substrate for being drained through glue is put into burn till and is sintered with resistance furnace, piezoelectric ceramics uses sealed sintering, selection
Optimal sintering temperature be using piezoelectricity as preferably when sintering temperature, optimal sintering temperature be 1300 DEG C, be incubated 2h.Pass through sintering
The higher piezoelectric ceramic piece of porcelain, consistency can be obtained into.
The potsherd sintered slices are separated, and the presentation quality of potsherd is checked under lamp box, are removed outside existing
The potsherd of defect is seen, avoids processing the product of inferior quality, increases processing cost.
S500：By silver paste brushing on the product after sorting, silver ink firing processing is carried out.
Specifically, silver paste is uniformly brushed using silk-screen printing on potsherd surface, product is put in an oven will afterwards
Silver paste is dried, and partial solvent is volatilized slowly, in order to avoid silver layer peeling during silver ink firing.Preferably, drying temperature is 100~130 DEG C, is dried
The dry time is 30~45min.
Complete by after silver, by meshbeltfurnace to carrying out silver ink firing processing by the product after silver.Guipure silver ink firing stove is divided into 5 temperature
Area, silver ink firing cycle are 2h, and silver ink firing curve is 200 DEG C -450 DEG C -650 DEG C -800 DEG C -600 DEG C.
S600：Product after silver ink firing is adhered on sheet metal, and carries out baking and curing processing.
Specifically, sheet metal is fitted into the left hopper of splicing machine, the good potsherd of silver ink firing loads splicing machine bidirectional turning
On the platform of mechanism, the platform of switching mechanism is corresponding with the left and right hopper of splicing machine.Vacuum suction mode is first passed through by metal
Piece is adsorbed on the platform of switching mechanism, adopts silk-screen printing by glue even application on sheet metal, then putting down switching mechanism
Platform is turned so that potsherd is adhered on sheet metal by glue, is finally removed and is fitted into solidification frock, put together
Enter baking and curing in baking oven, drying temperature is 80 DEG C, drying time 4h.
S700：Polarization process is carried out to the product after solidification, obtains piezoelectric ceramics piezo.
Specifically, piezoelectric ceramics just has piezoelectric property after having to pass through polarization, so-called polarization, is exactly in piezoelectric ceramics
A upper plus strong dc electric field, the electricdomain in ceramics is set to be handled along direction of an electric field orientations, also known as artificial polarization, or at poling
Reason.
Polarization process is made whether fully, very big on material property influence, therefore wants reasonable selection polarization mode and polarization
Condition.Point polarization mode simple and flexible, whole process is without high pressure, high-temperature operation, room temperature.Polarizing voltage is set according to potsherd thickness
It is fixed, generally 3kv/mm.
The application polarization process carries out polarization process to the potsherd after silver ink firing using point polarization mode, and polarization pen connects
2671 type Hi-pot Testers, polarizing voltage is set by 2671 type Hi-pot Testers, polarization pen is positive pole, and copper coin connects pressure-resistant survey
Examination instrument is negative pole.The product being cured is lain on copper coin, the ceramic plane for a contact product that polarizes, polarization is formed on product
Electric field, so as to complete polarization process, obtain piezoelectric ceramics piezo.Because piezo potsherd is soft material and very thin thickness,
Therefore it is not required to heat it, need to only carries out at room temperature.Also the polarization time is very short, about in 1s or so.
Need to test the performance of piezoelectricity singing piece after the completion of polarization, such as test capacity, loss, the resonance of piezo
The parameter such as frequency and resistance, examines whether the piezoelectric property of piezo meets the requirements.
Fig. 2A is the logarithmic coordinates of the thin piezo of small size (12.5T7.8-100T-184) made using existing process
Figure, Fig. 2 B are pair for the thin piezo of small size (12.5T7.8-106T-198) that the manufacture craft provided using the application is made
Number coordinate diagram.By can be seen that in figure, the performance of two kinds of thin piezo of small size is identical, but the piezoelectric patches class made in existing process
Type is C9.5mmT78 μm, 184 μm of total thickness, C12.5mmT100 μm of copper sheet size, and is made in the manufacture craft that the application provides
Piezoelectricity sheet type be C9.5mmT92 μm, 198 μm of total thickness, C12.5mmT100 μm of copper sheet size, using different process obtain
Piezo total thickness differs 14 μm, reaches identical result, it can be seen that, the piezoelectric patches thickness for making of adopting new technology is than normal
The thickness of technique, so as to reduce the technology difficulty of the production thin piezo of small size, qualification rate greatly improved, avoid waste.
Fig. 3 A are using the logarithmic plot of the thin piezo of small size (FT15T-4.5A1) of existing process making, Fig. 3 B
The logarithmic plot of the thin piezo of small size (FT15T-4.5A1) made for the manufacture craft provided using the application, by scheming
In can be seen that, the piezo frequency that normal process makes be 4.7k, the piezo frequency for the manufacture craft making that the application provides
For 4.5k, and require that the buzzing sheet type of production is the Ω of R ＜ 300, f：4.5 ± 0.5K, C:24 ± 30%, it can be seen that, this Shen
The product that the manufacture craft that please be provided makes more meets the requirements.
In summary, the manufacture craft for the thin piezo of small size that the application provides is low compared to existing process difficulty, significantly
The qualification rate of the thin piezo of small size is improved, and the manufacture craft of the thin piezo of small size of the application offer compares existing work
The properties of product that skill makes are more preferable, more meet product requirement.
The fabrication processing of the thin piezo of small size that the application provides is：It is (mix grinding, pre- to be first according to dispensing, ball milling
Burn, fine grinding) the required ceramic powder of technique preparation shaping；The thickness of stream retarder film is calculated according to the requirement of required piezo；
Then dumping, sintering, sorting and silver ink firing is carried out to the potsherd after shaping to handle；The potsherd after silver ink firing is adhered to metal again
Piece, carry out baking and curing processing；Finally the product after solidification is polarized, obtains piezoelectric ceramics piezo.
Show through development test, the application provide the thin piezo of small size manufacture craft for dispensing-ball milling (mix grinding-
Pre-burning-fine grinding)-shaping-row burn (dumping-sintering)-sorting-by silver-bonding-polarization-test-packaging-storage, will polarization and viscous
The reversed order of process is connect, the piezo thickness as a result made increases by 10 μm or so, reduces the production thin piezo of small size
Technology difficulty, qualification rate greatly improved, avoid waste；Same specification product is compared, except the outer parameters of thickness increase are full
Foot requires；Polarizing voltage is 0.8-1.0 times of normal polarization voltage, and repeatedly polarization will not rupture, and does not have to select before bonding, drops
Low cost of labor；After polarization, consistency of performance is good, and reliability is unaffected.The preparation method that the application provides solves
The production technology of the thin piezo of small size is difficult, polarization when it is easily rupturable the problems such as, hence it is evident that improve the qualified of the thin piezo of small size
Rate, reduce production cost.
Those skilled in the art will readily occur to the present invention its after considering specification and putting into practice the disclosure invented here
Its embodiment.The application be intended to the present invention any modification, purposes or adaptations, these modifications, purposes or
Person's adaptations follow the general principle of the present invention and including undocumented common knowledges in the art of the invention
Or conventional techniques.Description and embodiments are considered only as exemplary, and true scope and spirit of the invention are by following
Claim is pointed out.
Invention described above embodiment is not intended to limit the scope of the present invention..
Claims (7)
1. a kind of manufacture craft of the thin piezo of small size, it is characterised in that the manufacture craft comprises the steps：
The raw material prepared are put into ball mill and carry out mix grinding, discharging, drying after 24h；
By the raw material after mix grinding at 1040 DEG C pre-burning 2h, by after pre-burning powder input ball mill in carry out fine grinding, 24h
Discharge, dry afterwards；
Powder after fine grinding, adhesive and organic solvent are added in ball grinder, 23h is mixed on tumbling mill, passes through casting machine
Base substrate is made with sheet-punching machine；
The base substrate is subjected to dumping, sintering and sorting process successively；
By silver paste brushing on the product after sorting, silver ink firing processing is carried out；
Product after silver ink firing is adhered on sheet metal, and carries out baking and curing processing；
Polarization process is carried out to the product after solidification, obtains piezoelectric ceramics piezo.
2. manufacture craft as claimed in claim 1, it is characterised in that described put into the raw material prepared in ball mill is carried out
Ball milling mixing, specifically include：
After the raw material are put into ball mill, the water accordingly matched is added into the ball mill；
The raw material are ground mixing by the zirconium ball grinding raw material in ball mill.
3. manufacture craft as claimed in claim 2, it is characterised in that the weight proportion of the raw material and water is 1:0.7, ball
Zirconium ball weight matches in grinding machine
4. manufacture craft as claimed in claim 1, it is characterised in that the powder by after fine grinding, adhesive and organic molten
Agent is added in ball grinder, and 23h is mixed on tumbling mill, base substrate is made by casting machine and sheet-punching machine, specifically includes：
Powder after fine grinding, adhesive and xylene solution and ethanol solution are mixed and made into slurry by appropriate proportioning；
By adjust casting machine scraper gap and dry curve by the slurry be made needed for thickness qualified film；
The film is subjected to punching, the base substrate of size needed for acquisition.
5. manufacture craft as claimed in claim 1, it is characterised in that it is described the base substrate is carried out successively dumping, sintering and
Sorting process, specifically include：
The base substrate is subjected to dumping processing at 30 DEG C~800 DEG C, the dumping cycle is 40h；
The base substrate for being drained through glue is put into resistance furnace, 2h is sintered at 1300 DEG C；
The product sintered is subjected to sorting process, obtains potsherd.
6. manufacture craft as claimed in claim 1, it is characterised in that the product after described pair of solidification carries out polarization process, tool
Body includes：
Product after some solidifications is placed on Hi-pot Tester polarization copper coin, polarizing voltage is set according to product thickness,
Polarization process is carried out one by one to product；
Pass through the capacity of test machine test product, loss, resonant frequency and resistance parameter after the completion of polarization.
7. manufacture craft as claimed in claim 6, it is characterised in that the polarizing voltage is 3kv/mm.
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