CN107451576B - Array substrate, preparation method thereof, display panel and display device - Google Patents
Array substrate, preparation method thereof, display panel and display device Download PDFInfo
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- CN107451576B CN107451576B CN201710675294.1A CN201710675294A CN107451576B CN 107451576 B CN107451576 B CN 107451576B CN 201710675294 A CN201710675294 A CN 201710675294A CN 107451576 B CN107451576 B CN 107451576B
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- substrate
- fingerprint identification
- identification unit
- base plate
- opening structure
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
Abstract
The embodiment of the invention discloses an array substrate, a preparation method thereof, a display panel and a display device, wherein the array substrate comprises a first substrate and a fingerprint identification unit, the fingerprint identification unit comprises a photosensitive diode, and the fingerprint identification unit is used for carrying out fingerprint identification according to light rays reflected to the fingerprint identification unit by a touch main body; the driving circuit layer is positioned on one side, far away from the fingerprint identification unit, of the first substrate base plate, at least one opening structure is formed in the driving circuit layer and the first substrate base plate, and an overlapping area exists between the vertical projection of the opening structure on the first substrate base plate and the vertical projection of the photosensitive diode on the first substrate base plate; and the transparent film layer at least fills the opening structure. So, there is transparent rete in the photodiode top, improves the transmissivity of photodiode top rete, and fingerprint identification unit can well receive the light that reflects to the fingerprint identification unit via the touch main part, guarantees fingerprint identification unit detectivity.
Description
Technical Field
The embodiment of the invention relates to the technical field of semiconductors, in particular to an array substrate, a preparation method of the array substrate, a display panel and a display device.
Background
Fingerprints are unique for every person, and with the development of science and technology, various display devices with fingerprint identification functions, such as mobile phones, tablet computers, intelligent wearable devices and the like, appear in the market. Like this, the user just needs to touch display device's fingerprint identification module with the finger before the display device that the operation has the fingerprint identification function, just can carry out the authority and verify, has simplified the authority verification process.
Among the present display device who has the fingerprint identification function, for guaranteeing that display device possesses great open region, generally set up the fingerprint identification device in display device's non-light-emitting side, but set up the fingerprint identification device in non-light-emitting side, so fingerprint identification device top is provided with a plurality of retes, and a plurality of retes can weaken the light that the screen reflection was come and arrive the light intensity of fingerprint identification device, reduce fingerprint identification's accuracy.
Disclosure of Invention
In view of this, embodiments of the present invention provide an array substrate, a manufacturing method thereof, a display panel, and a display device, so as to solve the technical problem in the prior art that when a fingerprint identification device is disposed on a non-light-emitting side, the sensitivity of the fingerprint identification device is low.
In a first aspect, an embodiment of the present invention provides an array substrate, including:
the fingerprint identification device comprises a first substrate base plate and a fingerprint identification unit positioned on one side of the first substrate base plate, wherein the fingerprint identification unit comprises a photosensitive diode and is used for carrying out fingerprint identification according to light rays reflected to the fingerprint identification unit by a touch main body;
the driving circuit layer is positioned on one side, far away from the fingerprint identification unit, of the first substrate base plate, at least one opening structure is formed in the driving circuit layer and the first substrate base plate, and an overlapping area exists between the vertical projection of the opening structure on the first substrate base plate and the vertical projection of the photosensitive diode on the first substrate base plate;
a transparent film layer filling at least the opening structure.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing an array substrate, including:
providing a first substrate base plate and forming a fingerprint identification unit on one side of the first substrate base plate, wherein the fingerprint identification unit comprises a photosensitive diode and is used for carrying out fingerprint identification according to light rays reflected to the fingerprint identification unit by a touch main body;
forming a driving circuit layer on one side of the first substrate far away from the fingerprint identification unit, and forming an opening structure on the driving circuit layer and the first substrate, wherein an overlapping area exists between the vertical projection of the opening structure on the first substrate and the vertical projection of the photosensitive diode on the first substrate;
and forming a transparent film layer on one side of the driving circuit layer, which is far away from the first substrate base plate, wherein the transparent film layer is at least filled in the opening structure.
In a third aspect, an embodiment of the present invention further provides a display panel, including the array substrate of the first aspect, and further including an opposite substrate disposed opposite to the array substrate.
In a fourth aspect, an embodiment of the present invention further provides a display device, including the display panel described in the third aspect.
According to the array substrate and the preparation method thereof, the display panel and the display device provided by the embodiment of the invention, at least one opening structure is formed in the driving circuit layer and the first substrate, and the vertical projection of the opening structure on the substrate and the projection of the photosensitive diode in the fingerprint identification unit on the substrate have an overlapped area.
Drawings
In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, a brief description is given below of the drawings used in describing the embodiments. It should be clear that the described figures are only views of some of the embodiments of the invention to be described, not all, and that for a person skilled in the art, other figures can be derived from these figures without inventive effort.
Fig. 1a is a schematic top view of an array substrate according to an embodiment of the present invention;
FIG. 1b is a schematic cross-sectional view taken along line A-A' of FIG. 1 a;
fig. 2 is a schematic structural diagram of another array substrate according to an embodiment of the present invention;
FIG. 3a is a schematic diagram of a circuit structure of a fingerprint identification unit according to an embodiment of the present invention;
FIG. 3b is a schematic diagram of a film structure of a fingerprint identification unit according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another array substrate according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another array substrate according to an embodiment of the present invention;
fig. 6 is a schematic flow chart illustrating a method for manufacturing an array substrate according to an embodiment of the present invention;
FIG. 7a is a schematic structural diagram of a fingerprint identification unit formed on one side of a first substrate according to an embodiment of the present invention;
FIG. 7b is a schematic diagram of a structure for forming a driving circuit layer according to an embodiment of the present invention;
fig. 7c is an exemplary diagram of forming an opening structure on the driving circuit layer and the first substrate provided by the embodiment of the invention;
FIG. 7d is a schematic structural diagram of a transparent film formed according to an embodiment of the present invention;
fig. 7e is a schematic structural diagram of a method for preparing an organic light-emitting structure according to an embodiment of the present invention;
FIG. 8 is a schematic flow chart illustrating a method for fabricating an array substrate according to another embodiment of the present invention;
FIG. 9a is a schematic structural diagram of a second substrate prepared on one side of a first substrate according to an embodiment of the present invention;
FIG. 9b is a schematic structural diagram of a fingerprint identification unit formed on a side of the second substrate far from the first substrate according to an embodiment of the present invention;
fig. 10 is a schematic flow chart illustrating a method for manufacturing an array substrate according to another embodiment of the present invention;
FIG. 11 is a schematic structural diagram of a second substrate formed on a side of a fingerprint identification unit away from a first substrate according to an embodiment of the present invention;
fig. 12 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
fig. 13 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be fully described by the detailed description with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are a part of the embodiments of the present invention, not all embodiments, and all other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without inventive efforts fall within the scope of the present invention.
The skin lines including fingerprints of each person are different from pattern to pattern, break points and cross points, and are unique and invariable throughout the life. Accordingly, a person can be identified by associating his fingerprint with the person, and by comparing his fingerprint with the pre-stored fingerprint data, the person can verify his true identity, which is known as a fingerprint identification technique. Thanks to the electronic integrated manufacturing technology and the fast and reliable algorithm research, the optical fingerprint identification technology in the fingerprint identification technology has started to enter our daily life, and becomes the most deep, widely applied and mature technology in the current biological detection science. The optical fingerprint identification technology has the working principle that light rays emitted by a light source in a display panel irradiate a touch main body (such as a finger), reflected light is formed by the reflection of the finger, the formed reflected light (namely, fingerprint signal light) is transmitted to a fingerprint identification unit, and the fingerprint identification unit collects light signals incident on the fingerprint identification unit. Because the fingerprint has specific lines, reflected light formed at each position of the finger has different intensities, and finally, the light signals collected by each fingerprint identification unit are different, so that the real identity of the user can be determined.
Fig. 1a is a schematic top view illustrating an array substrate according to an embodiment of the present invention, and fig. 1b is a schematic cross-sectional view taken along a-a' in fig. 1a, and referring to fig. 1a and fig. 1b, the array substrate according to an embodiment of the present invention may include:
the fingerprint identification device comprises a first substrate base plate 10 and a fingerprint identification unit 20 positioned on one side of the first substrate base plate 10, wherein the fingerprint identification unit 20 comprises a photosensitive diode 201, and the fingerprint identification unit 20 is used for carrying out fingerprint identification according to light rays reflected to the fingerprint identification unit 20 through a touch body;
the driving circuit layer 30 is positioned on the first substrate 10 at a side far away from the fingerprint identification unit 20, at least one opening structure 40 is formed in the driving circuit layer 30 and the first substrate 10, and an overlapping area exists between the vertical projection of the opening structure 40 on the first substrate 10 and the vertical projection of the photodiode 201 on the first substrate 10;
a transparent film layer 50, the transparent film layer 50 filling at least the opening structure 40.
For example, the fingerprint identification unit 20 may be used for performing fingerprint identification according to light reflected onto the fingerprint identification unit via a touch subject (e.g. a finger), since the fingerprint identification unit 20 is sequentially provided with the first substrate 10 and the driving circuit layer 30, the first substrate 10 and the driving circuit layer 30 may block the light reflected onto the fingerprint identification unit 20 by the touch subject, which may reduce the light received by the fingerprint identification unit 20, and further reduce the identification sensitivity of the fingerprint identification unit 20, at least one opening structure 40 is formed in the first substrate 10 and the driving circuit layer 30, and a vertical projection of the opening structure 40 on the first substrate 10 and a vertical projection of the photodiode 201 in the fingerprint identification unit 20 on the first substrate 10 have an overlapping region, and the opening structure 40 is filled with the transparent film layer 50, such that, the transparent film layer 50 is formed above the photodiode 201 in the fingerprint identification unit 20, the first substrate 10 and the driving circuit layer 30 on the film layer on which the fingerprint identification unit 20 is located do not block light reflected to the fingerprint identification unit 20 by a touch subject, the fingerprint identification unit 20 can well receive light reflected to the fingerprint identification unit 20 by the touch subject, and the detection sensitivity of the fingerprint identification unit 20 is ensured.
Optionally, the first substrate 10 may be a flexible substrate, and the material thereof may include at least one of polyimide or nano silver paste. And the driving circuit layer 30 is formed on one side of the first substrate 10, and the driving circuit layer 30 may generate a large amount of heat during the manufacturing process, so that the first substrate 10 needs to withstand the large amount of heat generated during the manufacturing process of the driving circuit layer 30, for example, the driving circuit layer 30 includes a low temperature polysilicon thin film transistor (LTPS-TFT), and thus the first substrate 10 needs to be made of a high temperature resistant material. In the prior art, since most of the flexible organic materials that can withstand the LTPS-TFT high temperature process are low transmittance materials, the intensity of light reflected from the surface of the screen reaching the fingerprint identification unit 20 is reduced, and the signal-to-noise ratio of the light sensing touch is reduced. And if the LTPS-TFT process temperature needs to be further increased in order to improve the performance of the LTPS-TFT, the transmittance of the high-temperature-resistant flexible substrate material is lower, and therefore the fingerprint identification unit 20 is affected to a greater extent. Thus, after the preparation of the driving circuit layer 30 is completed, at least one opening structure 40 is formed in the first substrate base plate 10 and the driving circuit layer 30 above the fingerprint identification unit 20, and the opening structure 40 is filled with the transparent film layer 50, so that the first substrate base plate 10 can be ensured to bear the LTPS-TFT high-temperature process in the driving circuit layer 30, the first substrate base plate 10 is ensured not to be damaged, meanwhile, the transparent film layer 50 in the opening structure 40 can be used for ensuring that the light received in the fingerprint identification unit 20 and reflected to the fingerprint identification unit 20 through the touch subject is not reduced, and the detection sensitivity of the fingerprint identification unit 20 is ensured.
Optionally, the fingerprint identification unit 20 is disposed on one side of the first substrate 10 away from the driving circuit layer 30, and the fingerprint identification unit 20 is located on the non-light-emitting side of the array substrate, so that the arrangement ensures that the fingerprint identification unit 20 does not affect the light-emitting area of the array substrate, and ensures that the array substrate has a relatively large display aperture ratio when displaying.
Optionally, the material of the transparent film 50 may include at least one of ethylene terephthalate, ethylene-vinyl acetate copolymer, and acrylic material, so that the light reflected by the touch subject may reach the fingerprint recognition unit 20 through the transparent film 50.
Optionally, the transparent film layer 50 at least fills the opening structure 40, and fig. 1a and 1b only take the transparent film layer 50 filling the opening structure 40 as an example for illustration, the transparent film layer 50 may further include a portion (not shown in the figure) located on the driving circuit layer 30, and since the array substrate may further include other film layers located on the driving circuit layer 30 and away from the first substrate 10, the portion of the transparent film layer 50 located on the driving circuit layer 30 may serve as an insulating layer between the driving circuit layer 30 and the film layers above the driving circuit layer.
Alternatively, the bottom surface of the opening structure 40 near the first substrate 10 is located in the first substrate 10 or the opening structure 40 penetrates through the first substrate 10. Fig. 1b only exemplifies that the opening structure 40 penetrates through the first substrate 10, as shown in fig. 1b, because the first substrate 10 is located on the light emitting side of the fingerprint identification unit 20 close to the array substrate, the opening structure 40 is disposed in the first substrate 10, and no matter the bottom surface of the opening structure 40 is located in the first substrate 10 or the opening structure 40 penetrates through the first substrate 10, the influence of the first substrate 10 on the light reflected by the touch subject to the fingerprint identification unit 20 can be weakened, so that the fingerprint identification unit 20 can well receive the light reflected by the touch subject, and the fingerprint identification sensitivity can be ensured.
Optionally, there is an overlapping area between the vertical projection of the opening structure 40 on the first substrate 10 and the vertical projection of the photodiode 201 on the first substrate 10, so as to ensure that the light reflected by the touch subject can reach the photodiode 201, and the fingerprint identification unit 20 can perform fingerprint identification. Optionally, the vertical projection of the opening structure 40 on the first substrate 10 completely coincides with the vertical projection of the photodiode 201 on the first substrate 10, so that the entire surface of the photodiode 201 can receive the light reflected by the touch object, and the fingerprint recognition unit 20 has high fingerprint recognition sensitivity.
With continuing reference to fig. 1a and fig. 1b, the array substrate provided in the embodiment of the invention may further include an organic light emitting structure 60, where the organic light emitting structure 60 is located on a side of the driving circuit layer 30 away from the first substrate 10, and the organic light emitting structure 60 is configured to emit light according to a driving signal provided by the driving circuit layer 30.
Specifically, as shown in fig. 1b, the driving circuit layer 30 may include an active layer 301, a source electrode 302, a gate electrode 303, and a drain electrode 304, and the organic light emitting structure 60 may include an anode electrode 601, an organic light emitting layer 602, and a cathode electrode 603, wherein the anode electrode 601 and the drain electrode 304 are electrically connected through a via hole, so that the organic light emitting structure 60 can emit light according to a driving signal provided by the driving circuit layer 30.
Optionally, since the fingerprint identification unit 20 needs to perform fingerprint identification by relying on light emitted by the light source, the organic light emitting structure 60 may serve as the light source of the fingerprint identification unit 20 to provide a light source for the fingerprint identification unit 20 to perform fingerprint identification, and the fingerprint identification unit 20 is configured to reflect the light emitted by the organic light emitting structure 60 to the fingerprint identification unit 20 via the touch object to perform fingerprint identification. As shown in fig. 1b, the light emitted from the organic light emitting structure 60 is irradiated to the touch subject, which is usually a finger, and the fingerprint is composed of a series of ridges 91 and valleys 92 on the skin surface of the finger tip, and the intensity of the light reflected by the ridges 91 and the valleys 92 received by the fingerprint identification unit 20 is different, so that the magnitude of the current signal converted from the reflected light formed at the position of the ridges 91 and the reflected light formed at the position of the valleys 92 is different, and thus the fingerprint identification can be performed according to the magnitude of the current signal. The touch main body can also be a palm or the like, and the fingerprint identification unit can realize the functions of detection and identification according to the palm print. In this way, the organic light emitting structure 60 is used as the light source of the fingerprint identification unit 20, and it is not necessary to separately provide a light source for the fingerprint identification unit 20, which not only ensures that the light source of the fingerprint identification unit 20 is simply arranged, but also ensures that the whole array substrate film layer structure is simple, and conforms to the development trend of the array substrate thinning.
Optionally, the array substrate provided in the embodiment of the present invention may include a plurality of fingerprint identification units 20 and a plurality of organic light emitting structures 60, where the fingerprint identification units 20 correspond to the organic light emitting structures 60 one by one, and each organic light emitting structure 60 provides a light source for the fingerprint identification unit 20 corresponding to the organic light emitting structure, so as to ensure that the fingerprint identification unit 20 can perform fingerprint identification normally. Fig. 1b is only exemplarily illustrated that the array substrate includes one fingerprint identification unit 20 and one organic light emitting structure 60.
Alternatively, in addition to multiplexing the organic light emitting structure 60 as a light source of the fingerprint identification unit 20, a fingerprint identification light source 70 may be separately provided for the fingerprint identification unit 20, as shown in fig. 2. Specifically, fig. 2 is a schematic structural diagram of another array substrate according to an embodiment of the present invention, where the array substrate shown in fig. 2 further includes a fingerprint identification light source 70, the fingerprint identification light source 70 is located on a side of the fingerprint identification unit 20 away from the first substrate 10, and the fingerprint identification unit 20 is configured to reflect light emitted by the fingerprint identification light source 70 to the fingerprint identification unit 20 through a touch object for fingerprint identification. Considering that the organic light emitting structure 60 is used to generate light for displaying images, the fingerprint identification light source 70 is used as the light source of the fingerprint identification unit 20, and in the display stage, the fingerprint identification light source 70 does not emit light, so as to avoid affecting the display effect; in the fingerprint identification stage, the organic light emitting structure 60 does not emit light, so that light leaking from the organic light emitting structure 60 and emitted light reflected by the touch subject and reaching the fingerprint identification unit 20 are prevented from interfering with fingerprint identification. It should be noted that, the organic light emitting structure 60 is multiplexed as the light source of the fingerprint identification unit 20, it is required to ensure that the display process and the fingerprint identification process are performed synchronously, and the fingerprint identification light source 70 is separately provided, so that the display process and the fingerprint identification process can be distinguished, the fingerprint identification process is not limited by the display process, and the flexibility of the fingerprint identification process is ensured.
Optionally, fig. 3a is a schematic diagram of a circuit structure of a fingerprint identification unit according to an embodiment of the present invention, fig. 3b is a schematic diagram of a film structure of a fingerprint identification unit according to an embodiment of the present invention, and referring to fig. 3a and fig. 3b, the fingerprint identification unit 20 may include a photodiode 201, a storage capacitor 202, and a driving thin film transistor 203; the anode D1 of the photodiode 201 is electrically connected to the first electrode C1 of the storage capacitor 202, and the cathode D2 of the photodiode 201 is electrically connected to the second electrode C2 of the storage capacitor 202 and the source Ts of the driving tft 203; a Gate Tg of the driving thin film transistor 203 is electrically connected to the switch control line Gate, and a drain Td of the driving thin film transistor 203 is electrically connected to the signal detection line Data; the photodiode 201 is used for converting fingerprint signal light reflected by a touch subject into a current signal; in the fingerprint identification stage, the driving thin film transistor 203 is turned on, and the current signal is transmitted to the signal detection line Data through the driving thin film transistor 203, so as to perform fingerprint identification according to the current signal.
Specifically, the photodiode 201 further includes a PIN junction D3 between the positive electrode D1 and the negative electrode D2. The cathode D2 is made of opaque metal, and the boundary of the PIN junction D3 does not exceed the boundary of the cathode D2. The anode D1 of the photodiode 201 is located on the side of the PIN node D3 away from the cathode D2. PIN junction D3 has photosensitive properties and has unidirectional conductivity. When no light is emitted, the PIN junction D3 has very small saturation reverse leakage current, namely dark current, and the photodiode 201 is cut off; when the PIN junction D3 is illuminated, the saturation reverse leakage current of the PIN junction D3 is greatly increased, and a photocurrent is formed and changes along with the change of the incident light intensity.
Optionally, fig. 4 is a schematic structural diagram of another array substrate provided in an embodiment of the present invention, and the difference between the array substrate shown in fig. 4 and the array substrate described in the foregoing embodiment is that the array substrate described in fig. 4 may further include a second substrate 80, and the second substrate 80 is located between the first substrate 10 and the fingerprint identification unit 20.
As shown in fig. 4, a second substrate 80 is disposed between the first substrate 10 and the fingerprint identification unit 20, because the second substrate 80 is located at a side of the first substrate 10 away from the driving circuit layer 30, and the first substrate 10 is disposed between the second substrate 80 and the driving circuit layer 30, compared with the first substrate 10, the second substrate 80 is less exposed to heat generated during the manufacturing process of the driving circuit layer 30, therefore, the high temperature resistance of the second substrate 80 can be lower than that of the first substrate 10, and because the transmittance of the high temperature resistant flexible substrate material is lower, the transmittance of the second substrate 80 can be higher than that of the first substrate 10, so that the opening structure 40 can not be disposed on the second substrate 80, and the fingerprint identification unit 20 can also be ensured to receive light reflected by the touch body, it is ensured that the fingerprint recognition unit 20 can normally perform fingerprint recognition.
Optionally, the second substrate 80 is disposed between the first substrate 10 and the fingerprint identification unit 20, the opening structure 40 is disposed in the first substrate 10, and the opening structure 40 is not disposed in the second substrate 80, so that when the opening structure 40 is prepared on the first substrate 10, the fingerprint identification unit 20 under the opening structure is not damaged, and the fingerprint identification unit 20 is ensured to be in good function.
Optionally, an inorganic layer (not shown in the figure) may be further included between the first substrate 10 and the second substrate 80, so that when the opening structure 40 is formed in the first substrate 10, since the material of the first substrate 10 is different from that of the inorganic layer, it can be ensured that the opening structure 40 is stopped in the first substrate 10 during the preparation process, and the second substrate 80 is not damaged.
Optionally, the first substrate base plate 10 and the second substrate base plate 80 are arranged, so that the whole substrate base plate of the array base plate can be ensured to be thick, and the substrate base plate is prevented from being curled.
Optionally, the second substrate 80 may also be a flexible substrate, and the material thereof may include at least one of polyimide or nano silver paste.
Optionally, fig. 5 is a schematic structural diagram of another array substrate provided in an embodiment of the present invention, and the difference between the array substrate shown in fig. 5 and the array substrate described in the foregoing embodiment is that the array substrate described in fig. 5 may further include a second substrate 80, and the second substrate 80 is located on a side of the fingerprint identification unit 20 away from the first substrate 10.
As shown in fig. 5, a second substrate 80 is disposed on a side of the fingerprint identification unit 20 away from the first substrate 10, and the second substrate 80 can protect the fingerprint identification unit 20 and prevent the external environment from damaging the fingerprint identification unit 20. It should be noted that, in the prior art, a layer of flexible material (corresponding to the second substrate 80 of the present application) is generally deposited on a rigid substrate, then other display devices are prepared on the flexible material, and the rigid substrate is peeled off after the preparation of the other display devices is completed to obtain the flexible array substrate, since a laser peeling technique is generally adopted when the rigid substrate is peeled off, the flexible material (the second substrate 80) may be damaged during the peeling process of the rigid substrate, therefore, the array substrate provided in the embodiment of the present invention further includes the second substrate 80 in addition to the first substrate 10, the fingerprint identification unit 20 is disposed between the first substrate 10 and the second substrate 80, so that even if the second substrate 80 is damaged during the preparation process of the array substrate, the fingerprint identification unit 20 is not damaged, the fingerprint identification function is ensured to be intact. Meanwhile, the first substrate base plate 10 covers the fingerprint identification unit 20, the fingerprint identification unit 20 is located on the non-light-emitting side of the array base plate, and the arrangement ensures that the fingerprint identification unit 20 does not affect the light-emitting area of the array base plate, so that the array base plate has a large display aperture ratio when being displayed. Fig. 6 is a schematic flow chart of a method for manufacturing an array substrate according to an embodiment of the present invention, and as shown in fig. 6, the method for manufacturing an array substrate according to an embodiment of the present invention may include:
s110, providing a first substrate base plate and forming a fingerprint identification unit on one side of the first substrate base plate, wherein the fingerprint identification unit comprises a photosensitive diode and is used for carrying out fingerprint identification according to light rays reflected to the fingerprint identification unit through a touch main body.
Fig. 7a is a schematic structural diagram of a fingerprint identification unit formed on one side of a first substrate according to an embodiment of the present invention, and as shown in fig. 7a, the fingerprint identification unit 20 may include a photodiode 201.
Optionally, the first substrate 10 may be a flexible substrate, and the material thereof may include at least one of polyimide or nano silver paste.
And S120, forming a driving circuit layer on one side of the first substrate far away from the fingerprint identification unit, and forming an opening structure on the driving circuit layer and the first substrate, wherein an overlapping area exists between the vertical projection of the opening structure on the first substrate and the vertical projection of the photodiode on the first substrate.
Fig. 7b is a schematic structural diagram of forming a driving circuit layer according to an embodiment of the present invention, and as shown in fig. 7b, the driving circuit layer 30 may include a thin film transistor, and specifically may include an active layer 301, a source electrode 302, a gate electrode 303, and a drain electrode 304, where the thin film transistor may be a top-gate thin film transistor or a bottom-gate thin film transistor, and fig. 7b only illustrates the top-gate thin film transistor.
Fig. 7c is an exemplary diagram of forming an opening structure on the driving circuit layer and the first substrate according to an embodiment of the present invention, and as shown in fig. 7c, an opening structure 40 is formed on the driving circuit layer 30 and the first substrate 10, and specifically, the opening structure 40 may be formed by etching the driving circuit layer 30 and the first substrate. As shown in fig. 7c, there is an overlap region between the vertical projection of the opening structure 40 on the first substrate board 10 and the vertical projection of the photodiode 201 on the first substrate board 10.
And S130, forming a transparent film layer on one side, far away from the first substrate, of the driving circuit layer, wherein the transparent film layer is at least filled in the opening structure.
Fig. 7d is a schematic structural diagram of forming a transparent film layer according to an embodiment of the present invention, as shown in fig. 7d, the transparent film layer 50 is formed on a side of the driving circuit layer 30 away from the first substrate 10, and the transparent film layer 50 at least fills the opening structure 40, and may also be located on a side of the driving circuit layer 30 away from the first substrate 10 to serve as an insulating layer between the driving circuit layer 30 and a film layer thereon.
Optionally, the material of the transparent film layer 50 may include at least one of polyethylene terephthalate, ethylene-vinyl acetate copolymer, and acryl material.
S140, preparing an organic light-emitting structure on one side, far away from the driving circuit layer, of the transparent film layer.
Fig. 7e is a schematic structural diagram of preparing an organic light emitting structure according to an embodiment of the present invention, and as shown in fig. 7e, the organic light emitting structure 60 may include an anode electrode 601, an organic light emitting layer 602, and a cathode electrode 603, where the anode electrode and the drain electrode 304 are connected through a via hole.
In summary, according to the method for manufacturing the array substrate provided by the embodiment of the invention, at least one opening structure is formed in the driving circuit layer and the first substrate, and the vertical projection of the opening structure on the substrate and the projection of the photodiode in the fingerprint identification unit on the substrate have an overlapping region, so that the transparent film layer is filled in the opening structure, the transparent film layer is ensured to be arranged above the photodiode, the transmittance of the film layer above the photodiode is improved, the fingerprint identification unit is ensured to well receive the light reflected to the fingerprint identification unit through the touch main body, and the detection sensitivity of the fingerprint identification unit is ensured.
Alternatively, the bottom surface of the opening structure 40 near the first substrate 10 side is located in the first substrate 10 or the opening structure 40 penetrates through the first substrate 10, so that the preparation of the opening structure 40 on the driving circuit layer 40 and the first substrate 10 may include:
etching the driving circuit layer 30 and the first substrate 10 to form an opening structure 40, so that the bottom surface of the opening structure 40 close to one side of the first substrate 10 is located in the first substrate 10; or;
the driving circuit layer 30 and the first substrate 10 are etched to form an opening structure 40, so that the opening structure 40 penetrates through the driving circuit layer 30 and the first substrate 10.
Fig. 8 is a schematic flow chart of another method for manufacturing an array substrate according to an embodiment of the present invention, and the method for manufacturing an array substrate according to this embodiment is different from the method for manufacturing an array substrate according to the foregoing embodiment in that a second substrate is further prepared, and as shown in fig. 8, the method for manufacturing may include:
s210, providing a first substrate and preparing a second substrate on one side of the first substrate.
Fig. 9a is a schematic structural diagram of preparing a second substrate on one side of a first substrate according to an embodiment of the present invention, where the first substrate 10 and the second substrate 80 may both be flexible substrates, and the material thereof may include at least one of polyimide or nano silver paste.
Optionally, an inorganic layer (not shown) may be further included between the first substrate 10 and the second substrate 80.
S220, forming a fingerprint identification unit on one side of the second substrate base plate far away from one side of the first substrate base plate, wherein the fingerprint identification unit comprises a photosensitive diode and is used for carrying out fingerprint identification according to light rays reflected to the fingerprint identification unit through the touch body.
Fig. 9b is a schematic structural diagram of forming a fingerprint identification unit on a side of the second substrate far from the first substrate according to an embodiment of the present invention, and as shown in fig. 9b, the fingerprint identification unit 20 may include a photodiode 201.
And S230, forming a driving circuit layer on one side of the first substrate far away from the fingerprint identification unit, and forming an opening structure on the driving circuit layer and the first substrate, wherein an overlapped area exists between the vertical projection of the opening structure on the first substrate and the vertical projection of the photosensitive diode on the first substrate.
With continued reference to fig. 7b and 7c, a driving circuit layer 30 is formed on the first substrate 10 at a side away from the fingerprint identification unit 20, and an opening structure 40 is formed on the driving circuit layer 30 and the first substrate 10, wherein an overlapping region exists between a vertical projection of the opening structure 40 on the first substrate 10 and a vertical projection of the photodiode 201 on the first substrate 10.
And S240, forming a transparent film layer on one side of the driving circuit layer, which is far away from the first substrate base plate, wherein the transparent film layer is at least filled in the opening structure.
With continued reference to fig. 7d, a transparent film layer 50 is formed on the side of the driving circuit layer 30 away from the first substrate 10, and the transparent film layer 50 at least fills the opening structure 40.
And S250, preparing an organic light-emitting structure on one side of the transparent film layer far away from the driving circuit layer.
In summary, the method for manufacturing an array substrate according to the embodiment of the present invention can not only improve the transmittance of a film layer above a photodiode, ensure that a fingerprint identification unit can well receive light reflected to the fingerprint identification unit through a touch body, and ensure the detection sensitivity of the fingerprint identification unit, but also ensure that the fingerprint identification unit located below the first substrate is not damaged when the first substrate is used for manufacturing an opening structure, and ensure that the fingerprint identification unit is in a perfect function.
Fig. 10 is a schematic flow chart of another method for manufacturing an array substrate according to an embodiment of the present invention, and the method for manufacturing an array substrate according to this embodiment is different from the method for manufacturing an array substrate according to the previous embodiment in that a second substrate is manufactured on a side of a fingerprint identification unit away from a first substrate, as shown in fig. 10, the method for manufacturing may include:
s310, providing a first substrate base plate and forming a fingerprint identification unit on one side of the first substrate base plate, wherein the fingerprint identification unit comprises a photosensitive diode and is used for carrying out fingerprint identification according to light rays reflected to the fingerprint identification unit through a touch main body.
With continued reference to fig. 7a, the fingerprint recognition unit 20 may include a photodiode 201.
And S320, preparing a second substrate base plate on the side, away from the first substrate base plate, of the fingerprint identification unit.
Fig. 11 is a schematic structural diagram of forming a second substrate on a side of the fingerprint identification unit away from the first substrate according to the embodiment of the present invention, where the second substrate 80 may be a flexible substrate.
S330, forming a driving circuit layer on one side, far away from the fingerprint identification unit, of the first substrate, and forming an opening structure on the driving circuit layer and the first substrate, wherein an overlapping area exists between a vertical projection of the opening structure on the first substrate and a vertical projection of the photodiode on the first substrate.
With continued reference to fig. 7b and 7c, a driving circuit layer 30 is formed on the first substrate 10 at a side away from the fingerprint identification unit 20, and an opening structure 40 is formed on the driving circuit layer 30 and the first substrate 10, wherein an overlapping region exists between a vertical projection of the opening structure 40 on the first substrate 10 and a vertical projection of the photodiode 201 on the first substrate 10.
And S340, forming a transparent film layer on one side, far away from the first substrate, of the driving circuit layer, wherein the transparent film layer is at least filled in the opening structure.
With continued reference to fig. 7d, a transparent film layer 50 is formed on the side of the driving circuit layer 30 away from the first substrate 10, and the transparent film layer 50 at least fills the opening structure 40.
And S350, preparing an organic light-emitting structure on one side of the transparent film layer far away from the driving circuit layer.
In summary, the method for manufacturing the array substrate according to the embodiment of the present invention can not only improve the transmittance of the film layer above the photodiode, ensure that the fingerprint identification unit can well receive the light reflected to the fingerprint identification unit through the touch body, and ensure the detection sensitivity of the fingerprint identification unit, but also protect the fingerprint identification unit from being damaged by the external environment by manufacturing the second substrate on the side of the fingerprint identification unit away from the first substrate, and ensure the perfect function of the fingerprint identification unit.
Fig. 12 is a schematic structural diagram of a display panel according to an embodiment of the present invention, and referring to fig. 12, the display panel according to an embodiment of the present invention includes the array substrate 1 according to the above embodiment, and may further include an opposite substrate 2 disposed opposite to the array substrate 1, where the opposite substrate 2 may be a cover plate or other packaging layer.
Fig. 13 is a schematic structural diagram of a display device according to an embodiment of the present invention, and referring to fig. 13, the display device 100 may include the display panel 101 according to any embodiment of the present invention. The display device 100 may be a mobile phone as shown in fig. 13, or may be a computer, a television, an intelligent wearable display device, and the like, which is not particularly limited in this embodiment of the present invention.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (13)
1. An array substrate, comprising:
the fingerprint identification device comprises a first substrate base plate and a fingerprint identification unit positioned on one side of the first substrate base plate, wherein the fingerprint identification unit comprises a photosensitive diode and is used for carrying out fingerprint identification according to light rays reflected to the fingerprint identification unit by a touch main body;
the driving circuit layer is positioned on one side, far away from the fingerprint identification unit, of the first substrate base plate, at least one opening structure is formed in the driving circuit layer and the first substrate base plate, and an overlapping area exists between the vertical projection of the opening structure on the first substrate base plate and the vertical projection of the photosensitive diode on the first substrate base plate; the driving circuit layer comprises an active layer, a gate electrode and a film layer between the active layer and the gate electrode, the opening structure penetrates through the film layer between the active layer and the gate electrode, and the bottom surface of the opening structure close to one side of the first substrate is positioned in the first substrate or penetrates through the first substrate;
a transparent film layer at least filling the opening structure;
the material of the transparent film layer comprises at least one of polyethylene terephthalate, ethylene-vinyl acetate copolymer and acrylic material.
2. The array substrate of claim 1, wherein a vertical projection of the opening structure on the first substrate coincides with a vertical projection of the photodiode on the first substrate.
3. The array substrate of claim 1, further comprising a second substrate, wherein the second substrate is located between the first substrate and the fingerprint identification unit, or the second substrate is located on a side of the fingerprint identification unit away from the first substrate.
4. The array substrate of claim 1, wherein the fingerprint identification unit comprises a photodiode;
the fingerprint identification unit further comprises a storage capacitor and a driving thin film transistor;
the anode of the photosensitive diode is electrically connected with the first electrode of the storage capacitor, and the cathode of the photosensitive diode is electrically connected with the second electrode of the storage capacitor and the source electrode of the driving thin film transistor; the grid electrode of the driving thin film transistor is electrically connected with the switch control line, and the drain electrode of the driving thin film transistor is electrically connected with the signal detection line;
the photosensitive diode is used for converting the fingerprint signal into a current signal;
in the fingerprint identification stage, the driving thin film transistor is conducted, and the current signal is transmitted to the signal detection line through the driving thin film transistor so as to carry out fingerprint identification according to the current signal.
5. The array substrate of claim 1, further comprising an organic light emitting structure disposed on a side of the driving circuit layer away from the first substrate, wherein the organic light emitting structure emits light according to a driving signal provided by the driving circuit layer.
6. The array substrate of claim 5, wherein the organic light emitting structure provides a light source for the fingerprint identification unit, and the fingerprint identification unit is configured to reflect light emitted by the organic light emitting structure to the fingerprint identification unit via the touch body for fingerprint identification.
7. The array substrate of claim 1, further comprising a fingerprint identification light source located at a side of the fingerprint identification unit away from the first substrate; the fingerprint identification unit is used for reflecting light rays emitted by the fingerprint identification light source to the fingerprint identification unit through the touch main body so as to carry out fingerprint identification.
8. The array substrate of claim 5, wherein the array substrate comprises a plurality of fingerprint identification units and a plurality of organic light emitting structures, and the fingerprint identification units correspond to the organic light emitting structures one to one.
9. The array substrate of claim 3, wherein the first substrate and the second substrate are both flexible substrate substrates.
10. A preparation method of an array substrate is characterized by comprising the following steps:
providing a first substrate base plate and forming a fingerprint identification unit on one side of the first substrate base plate, wherein the fingerprint identification unit comprises a photosensitive diode and is used for carrying out fingerprint identification according to light rays reflected to the fingerprint identification unit by a touch main body;
forming a driving circuit layer on one side of the first substrate far away from the fingerprint identification unit, and forming an opening structure on the driving circuit layer and the first substrate, wherein an overlapping area exists between the vertical projection of the opening structure on the first substrate and the vertical projection of the photosensitive diode on the first substrate; the driving circuit layer comprises an active layer, a gate electrode and a film layer between the active layer and the gate electrode, and the opening structure penetrates through the film layer between the active layer and the gate electrode;
forming a transparent film layer on one side of the driving circuit layer, which is far away from the first substrate base plate, wherein the transparent film layer is at least filled in the opening structure;
the material of the transparent film layer comprises at least one of polyethylene terephthalate, ethylene-vinyl acetate copolymer and acrylic material;
preparing an opening structure on the driving circuit layer and the first substrate, including:
etching the driving circuit layer and the first substrate base plate to form an opening structure, so that the bottom surface of the opening structure close to one side of the first substrate base plate is positioned in the first substrate base plate; or;
and etching the driving circuit layer and the first substrate base plate to form an opening structure so that the opening structure penetrates through the driving circuit layer and the first substrate base plate.
11. The method of claim 10, wherein after providing a first substrate base plate, further comprising:
preparing a second substrate base plate on one side of the first substrate base plate;
forming a fingerprint identification unit on one side of the second substrate far away from the first substrate;
or, after providing a first substrate and forming a fingerprint identification unit on one side of the first substrate, the method further includes:
and preparing a second substrate base plate on one side of the fingerprint identification unit far away from the first substrate base plate.
12. A display panel comprising the array substrate according to any one of claims 1 to 9, and further comprising a counter substrate disposed opposite to the array substrate.
13. A display device characterized by comprising the display panel according to claim 12.
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| CN108073900B (en) * | 2017-12-14 | 2021-01-08 | 京东方科技集团股份有限公司 | Flexible display panel for fingerprint identification, display device and fingerprint identification method |
| CN108417603B (en) * | 2018-02-27 | 2021-01-12 | 上海天马微电子有限公司 | Display panel and display device |
| CN108446646B (en) * | 2018-03-26 | 2020-04-07 | 京东方科技集团股份有限公司 | Optical recognition panel, optical recognition method and display device |
| CN108596096B (en) * | 2018-04-24 | 2021-01-22 | 京东方科技集团股份有限公司 | Fingerprint identification device, display panel, manufacturing method of display panel and display device |
| CN108647606B (en) * | 2018-04-28 | 2020-07-14 | 武汉天马微电子有限公司 | Display panel and display device |
| CN108807487B (en) * | 2018-06-26 | 2021-03-30 | 武汉天马微电子有限公司 | Display panel and display device |
| CN109144311B (en) | 2018-07-26 | 2022-06-07 | 京东方科技集团股份有限公司 | Display substrate, fingerprint identification method and touch display device |
| CN108898955A (en) * | 2018-07-31 | 2018-11-27 | 武汉天马微电子有限公司 | A kind of display panel and display device |
| EP3637472A1 (en) | 2018-10-08 | 2020-04-15 | Samsung Electronics Co., Ltd. | Organic light emitting diode display panels and display devices including the same |
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| CN110265439A (en) | 2019-06-06 | 2019-09-20 | 武汉华星光电半导体显示技术有限公司 | Organic LED display panel and electronic equipment |
| CN110491910B (en) * | 2019-07-30 | 2022-04-26 | 武汉华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and display device |
| CN110556404A (en) * | 2019-08-09 | 2019-12-10 | 武汉华星光电半导体显示技术有限公司 | display panel, preparation method thereof and display device |
| CN110622318B (en) * | 2019-08-12 | 2023-01-10 | 京东方科技集团股份有限公司 | Display device and method of manufacturing the same |
| CN110610661A (en) * | 2019-08-29 | 2019-12-24 | 昆山工研院新型平板显示技术中心有限公司 | Display panel, electronic device, and method for manufacturing display panel |
| CN111192974B (en) * | 2020-01-07 | 2022-07-12 | 武汉华星光电半导体显示技术有限公司 | Array substrate and preparation method thereof |
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