CN107451576A - A kind of array base palte and preparation method thereof, display panel and display device - Google Patents
A kind of array base palte and preparation method thereof, display panel and display device Download PDFInfo
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- CN107451576A CN107451576A CN201710675294.1A CN201710675294A CN107451576A CN 107451576 A CN107451576 A CN 107451576A CN 201710675294 A CN201710675294 A CN 201710675294A CN 107451576 A CN107451576 A CN 107451576A
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- underlay substrate
- fingerprint identification
- identification unit
- array base
- base palte
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
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Abstract
The embodiment of the invention discloses a kind of array base palte and preparation method thereof, display panel and display device, wherein array base palte includes the first underlay substrate and fingerprint identification unit, fingerprint identification unit includes photodiode, and fingerprint identification unit is used to carry out fingerprint recognition according to the light for reflexing to fingerprint identification unit via touch main body；The drive circuit layer away from fingerprint identification unit side on the first underlay substrate, overlapping region be present with upright projection of the photodiode on the first underlay substrate formed with least one opening structure, upright projection of the hatch frame on the first underlay substrate in drive circuit layer and the first underlay substrate；Transparent film layer, at least fill in the hatch frame.In this way, transparent film layer above photodiode be present, the transmitance of film layer above photodiode is improved, fingerprint identification unit can receive the light that fingerprint identification unit is reflexed to via touch main body well, ensure fingerprint identification unit detection sensitivity.
Description
Technical field
The present embodiments relate to technical field of semiconductors, more particularly to a kind of array base palte and preparation method thereof, display
Panel and display device.
Background technology
Fingerprint is all come with body for everyone, is unique, with the development of science and technology, in the market goes out
A variety of display devices with fingerprint identification function, such as mobile phone, tablet personal computer and intelligent wearable device are showed.So,
User is before the display device with fingerprint identification function is operated, it is only necessary to the fingerprint recognition mould of finger touch display unit
Group, it is possible to carry out Authority Verification, simplify Authority Verification process.
In the existing display device with fingerprint identification function, in order to ensure that display device possesses larger open region,
Fingerprint identification device typically is set in the non-light emission side of display device, but fingerprint identification device is arranged on non-light emission side, such as
Multiple film layers are provided with above this fingerprint identification device, multiple film layers can weaken the light that screen reflection comes and reach fingerprint recognition dress
The light intensity put, reduce the accuracy of fingerprint recognition.
The content of the invention
In view of this, the embodiment of the present invention provides a kind of array base palte and preparation method thereof, display panel and display device,
The relatively low technology of fingerprint identification device sensitivity is asked during solving that fingerprint identification device is arranged on into non-light emission side in the prior art
Topic.
In a first aspect, the embodiments of the invention provide a kind of array base palte, including：
First underlay substrate and the fingerprint identification unit positioned at the first underlay substrate side, the fingerprint identification unit
Including photodiode, the fingerprint identification unit is used for according to the light that the fingerprint identification unit is reflexed to via touch main body
Line carries out fingerprint recognition；
The drive circuit layer away from the fingerprint identification unit side on first underlay substrate, the driving electricity
Formed with least one opening structure in road floor and first underlay substrate, the hatch frame is in the first substrate base
Overlapping region be present with upright projection of the photodiode on first underlay substrate in the upright projection on plate；
Transparent film layer, the transparent film layer are at least filled in the hatch frame.
Second aspect, the embodiment of the present invention additionally provide a kind of preparation method of array base palte, including：
One first underlay substrate is provided and fingerprint identification unit is formed in the first underlay substrate side, the fingerprint is known
Other unit includes photodiode, and the fingerprint identification unit is used to reflex to the fingerprint recognition list according to via touch main body
The light of member carries out fingerprint recognition；
The side away from the fingerprint identification unit forms drive circuit layer on first underlay substrate, and described
Hatch frame is formed in drive circuit layer and first underlay substrate, the hatch frame is on first underlay substrate
Overlapping region be present with upright projection of the photodiode on first underlay substrate in upright projection；
Transparent film layer is formed in side of the drive circuit layer away from first underlay substrate, the transparent film layer is extremely
It is filled in less in the hatch frame.
The third aspect, the embodiment of the present invention additionally provide a kind of display panel, including the array base palte described in first aspect,
Also include the counter substrate being arranged oppositely with the array base palte.
Fourth aspect, the embodiment of the present invention additionally provide a kind of display device, including the display panel described in the third aspect.
Array base palte provided in an embodiment of the present invention and preparation method thereof, display panel and display device, by driving
In circuit layer and the first underlay substrate formed at least one opening structure, and upright projection of the hatch frame on underlay substrate with
There is overlapping region in projection of the photodiode on underlay substrate in fingerprint identification unit, in this way, by hatch frame
Middle filling transparent film layer, ensure transparent film layer above photodiode be present, improve the transmitance of film layer above photodiode,
Ensure that fingerprint identification unit can receive the light that fingerprint identification unit is reflexed to via touch main body well, ensure that fingerprint is known
Other unit detection sensitivity.
Brief description of the drawings
In order to clearly illustrate the technical scheme of exemplary embodiment of the present, below to needed for description embodiment
The accompanying drawing to be used does a simple introduction.Obviously, the accompanying drawing introduced is the part of the embodiment of the invention to be described
Accompanying drawing, rather than whole accompanying drawings, for those of ordinary skill in the art, on the premise of not paying creative work, may be used also
To obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 a are a kind of overlooking the structure diagrams of array base palte provided in an embodiment of the present invention；
Fig. 1 b are along A-A ' cross-sectional view in Fig. 1 a；
Fig. 2 is the structural representation of another array base palte provided in an embodiment of the present invention；
Fig. 3 a are a kind of electrical block diagrams of fingerprint identification unit provided in an embodiment of the present invention；
Fig. 3 b are a kind of film layer structure schematic diagrames of fingerprint identification unit provided in an embodiment of the present invention；
Fig. 4 is the structural representation of another array base palte provided in an embodiment of the present invention；
Fig. 5 is the structural representation of another array base palte provided in an embodiment of the present invention；
Fig. 6 is a kind of schematic flow sheet of the preparation method of array base palte provided in an embodiment of the present invention；
Fig. 7 a are the structural representations provided in an embodiment of the present invention that fingerprint identification unit is formed in the first underlay substrate side
Figure；
Fig. 7 b are the structural representations of formation drive circuit layer provided in an embodiment of the present invention；
Fig. 7 c are showing for the formation hatch frame provided in an embodiment of the present invention in drive circuit layer and the first underlay substrate
Illustration；
Fig. 7 d are the structural representations of formation transparent film layer provided in an embodiment of the present invention；
Fig. 7 e are the structural representations of preparation organic light-emitting structure provided in an embodiment of the present invention；
Fig. 8 is the schematic flow sheet of the preparation method of another array base palte provided in an embodiment of the present invention；
Fig. 9 a are the structural representations provided in an embodiment of the present invention that the second underlay substrate is prepared in the first underlay substrate side
Figure；
Fig. 9 b are provided in an embodiment of the present invention in side formation fingerprint of second underlay substrate away from the first underlay substrate
The structural representation of recognition unit；
Figure 10 is the schematic flow sheet of the preparation method of another array base palte provided in an embodiment of the present invention；
Figure 11 is provided in an embodiment of the present invention in side formation second of the fingerprint identification unit away from the first underlay substrate
The structural representation of underlay substrate；
Figure 12 is a kind of structural representation of display panel provided in an embodiment of the present invention；
Figure 13 is a kind of structural representation of display device provided in an embodiment of the present invention.
Embodiment
To make the object, technical solutions and advantages of the present invention clearer, below with reference to attached in the embodiment of the present invention
Figure, by embodiment, is fully described by technical scheme.Obviously, described embodiment is of the invention
Part of the embodiment, rather than whole embodiments, based on embodiments of the invention, those of ordinary skill in the art are not doing
The every other embodiment obtained on the premise of going out creative work, each falls within protection scope of the present invention.
Everyone skin lines including fingerprint is different on pattern, breakpoint and crosspoint, and uniqueness is presented
It is and constant throughout one's life.Accordingly, we can be mapped a people with his fingerprint, by by his fingerprint and pre-saving
Finger print data is compared, and with his true identity of checking, here it is fingerprint identification technology.Have benefited from electronics Integrated-manufacturing Techniques
With quick and reliable algorithm research, optical fingerprint identification technology has begun to enter into our daily life in fingerprint identification technology
It is living, turn into and most deep, most widely used, the most ripe technology of development is studied in current biological detection.Optical finger print identifies skill
The operation principle of art, which is that the light that light source is sent in display panel is irradiated to, to be touched in main body (such as finger), handles digital reflex shape
Into reflected light, the reflected light formed (i.e. fingerprint signal light) is transmitted into fingerprint identification unit, and fingerprint identification unit is to incidence
It is acquired to optical signal thereon.Due to specific lines on fingerprint be present, intensity of reflected light is formed in finger position
Difference, finally make it that the optical signal that each fingerprint identification unit is collected is different, user real identification can be determined accordingly.
Fig. 1 a are a kind of overlooking the structure diagrams of array base palte provided in an embodiment of the present invention, and Fig. 1 b are along A- in Fig. 1 a
A ' cross-sectional view, refers to Fig. 1 a and Fig. 1 b, and array base palte provided in an embodiment of the present invention can include：
First underlay substrate 10 and the fingerprint identification unit 20 positioned at the side of the first underlay substrate 10, fingerprint identification unit 20
Including photodiode 201, fingerprint identification unit 20 is used for according to the light that fingerprint identification unit 20 is reflexed to via touch main body
Line carries out fingerprint recognition；
The drive circuit layer 30 away from the side of fingerprint identification unit 20, drive circuit layer 30 on the first underlay substrate 10
And first in underlay substrate 10 formed with least one opening structure 40, the hanging down on the first underlay substrate 10 of hatch frame 40
Deliver directly shadow and overlapping region be present with upright projection of the photodiode 201 on the first underlay substrate 10；
Transparent film layer 50, the transparent film layer 50 are at least filled in hatch frame 40.
Exemplary, fingerprint identification unit 20 can be used for reflexing to thereon according to via touch main body (such as finger)
Light carries out fingerprint recognition, due to being disposed with the first underlay substrate 10 and drive circuit layer 30 in fingerprint identification unit 20,
First underlay substrate 10 and drive circuit layer 30, which may stop, touches the light that main body is reflexed in fingerprint identification unit 20, makes
The light received into fingerprint identification unit 20 is reduced, and is in turn resulted in fingerprint identification unit 20 and is identified sensitivity decrease, therefore,
Formed with least one opening structure 40 in first underlay substrate 10 and drive circuit layer 30, and hatch frame 40 is in the first substrate
Vertical throwing of the upright projection with the photodiode 201 in fingerprint identification unit 20 on the first underlay substrate 10 on substrate 10
There is overlapping region in shadow, and transparent film layer 50 is filled with hatch frame 40, in this way, photosensitive two in fingerprint identification unit 20
The top of pole pipe 201 is formed with transparent film layer 50, positioned at the He of the first underlay substrate 10 of the place film layer of fingerprint identification unit 20
Drive circuit layer 30, which will not stop, touches the light that main body is reflexed in fingerprint identification unit 20, and fingerprint identification unit 20 can be with good
The light that fingerprint identification unit 20 is reflexed to via touch main body is received well, ensures the detection sensitivity of fingerprint identification unit 20.
Optionally, the first underlay substrate 10 can be flexible substrate substrate, and its material can include polyimides or receive
At least one of rice silver paste.And the side of the first underlay substrate 10 is being made formed with drive circuit layer 30, drive circuit layer 30
There may be amount of heat during standby, therefore the first underlay substrate 10 needs to bear to produce in the preparation process of drive circuit layer 30
Amount of heat, such as drive circuit layer 30 includes low-temperature polysilicon film transistor (LTPS-TFT), therefore the first substrate base
Plate 10 needs to be prepared by exotic material.In the prior art, due to flexible organic material of LTPS-TFT high temperature process can be born
Material is mostly low transmission material, therefore can weaken the intensity that the light that screen surface reflects back reaches fingerprint identification unit 20, drop
The signal to noise ratio of low light sense touch control.And if in order to improve LTPS-TFT performance, it is necessary to further improve LTPS-TFT techniques
Temperature, high-temperature-resistant flexible baseplate material transmitance is lower, therefore the degree of susceptibility of fingerprint identification unit 20 is bigger.In this way,
After the completion of prepared by drive circuit layer 30, shape in the first underlay substrate 10 and drive circuit layer 30 above fingerprint identification unit 20
Into there is at least one opening structure 40, transparent film layer 50 is filled with hatch frame 40, so can both ensure the first substrate
Substrate 10 can bear the LTPS-TFT high temperature process in drive circuit layer 30, ensure that the first underlay substrate 10 will not be damaged
Wound, while can also ensure that what is received in fingerprint identification unit 20 leads via touch by the transparent film layer 50 in hatch frame 40
The light that body is reflexed in fingerprint identification unit 20 will not be reduced, and ensure the detection sensitivity of fingerprint identification unit 20.
Optionally, fingerprint identification unit 20 is arranged at the first side of the underlay substrate 10 away from drive circuit layer 30, fingerprint
Recognition unit 20 is located at the non-light emission side of array base palte, is arranged such the hair for ensureing that fingerprint identification unit 20 does not influence array base palte
Light region, ensure possess larger display aperture opening ratio during array base palte display.
Optionally, the material of transparent film layer 50 can include ethylene glycol terephthalate, ethylene-vinyl acetate copolymer
And at least one of acrylic material, ensure to reach and refer to by transparent film layer 50 via the light for touching main body reflection
Line recognition unit 20.
Optionally, transparent film layer 50 is at least filled in hatch frame 40, and Fig. 1 a and Fig. 1 b are only opened with the filling of transparent film layer 50
Illustrated exemplified by mouth structure 40, the part that transparent film layer 50 can also include in drive circuit layer 30 (does not show in figure
Go out), because array base palte can also include other film layers away from the side of the first underlay substrate 10 in drive circuit layer 30,
Therefore the part of transparent film layer 50 in drive circuit layer 30 can be as between drive circuit layer 30 and its top film layer
Insulating barrier.
Optionally, hatch frame 40 be located at close to the bottom surface of the side of the first underlay substrate 10 in the first underlay substrate 10 or
Hatch frame 40 runs through the first underlay substrate 10.Fig. 1 b only carry out example so that hatch frame 40 runs through the first underlay substrate 10 as an example
Property explanation, as shown in Figure 1 b, because the first underlay substrate 10 is located at fingerprint identification unit 20 close to array base palte light extraction side, because
This, sets hatch frame 40, no matter the bottom surface of hatch frame 40 is located in the first underlay substrate 10 in the first underlay substrate 10
Or hatch frame 40 runs through the first underlay substrate 10, it can weaken the first underlay substrate 10 and reflex to fingerprint to touching main body
The influence of light on recognition unit 20, ensure that fingerprint identification unit 20 can receive the light for touching main body reflection well,
Ensure fingerprint recognition sensitivity.
Optionally, upright projection of the hatch frame 40 on the first underlay substrate 10 serves as a contrast with photodiode 201 first
There is overlapping region in the upright projection on substrate 10, ensure that via the light for touching main body reflection photodiode can be reached
201, and then fingerprint identification unit 20 can carry out fingerprint recognition.Optionally, hatch frame 40 is on the first underlay substrate 10
Upright projection of the upright projection with photodiode 201 on the first underlay substrate 10 is completely superposed, in this way, photodiode
201 whole surface can be received via the light for touching main body reflection, the fingerprint recognition high sensitivity of fingerprint identification unit 20.
With continued reference to Fig. 1 a and Fig. 1 b, array base palte provided in an embodiment of the present invention can also include organic light-emitting structure
60, organic light-emitting structure 60 is located at side of the driver circuit layer 30 away from the first underlay substrate 10, and organic light-emitting structure 60 is used for
Lighted according to the drive signal that drive circuit layer 30 provides.
Specifically, as shown in Figure 1 b, drive circuit layer 30 can include active layer 301, source electrode 302, gate electrode
303 and drain electrode 304, organic light-emitting structure 60 can include anode electrode 601, organic luminous layer 602 and cathode electrode
603, wherein, anode electrode 601 and drain electrode 304 are electrically connected by via, ensure that organic light-emitting structure 60 can be according to drive
The drive signal that dynamic circuit layer 30 provides is lighted.
Optionally, because the light that fingerprint identification unit 20 needs dependence light source to send carries out fingerprint recognition, thus it is organic
Ray structure 60 can be carried out fingerprint recognition for fingerprint identification unit 20 and provide light source as the light source of fingerprint identification unit 20,
Fingerprint identification unit 20 is used to reflex to fingerprint identification unit via main body is touched according to the light that organic light-emitting structure 60 lights
20 carry out fingerprint recognition.As shown in Figure 1 b, the light that organic light-emitting structure 60 is sent is irradiated to touch main body, and it is usual to touch main body
For finger, fingerprint is made up of the series of ridges 91 positioned at finger tip skin surface and paddy 92, because fingerprint identification unit 20 receives
The light intensity that reflects of ridge 91 and paddy 92 it is different so that by the reflected light formed in the opening position of ridge 91 and in the position of paddy 92
The current signal that the reflected light that place is formed is converted into is of different sizes, and then can carry out fingerprint recognition according to current signal size.
It should be noted that it can also be palm etc. to touch main body, fingerprint identification unit can realize the work(of detection and identification according to palmmprint
Energy.In this way, light source of the organic light-emitting structure 60 as fingerprint identification unit 20 is set, it is not necessary to individually set for fingerprint identification unit 20
Light source is put, not only ensures that the light source set-up mode of fingerprint identification unit 20 is simple, while whole array base palte film layer structure is simple,
Coincidence array substrate is thinned development trend.
Optionally, array base palte provided in an embodiment of the present invention can include multiple fingerprint identification units 20 and multiple organic
Ray structure 60, fingerprint identification unit 20 correspond with organic light-emitting structure 60, and each organic light-emitting structure 60 is right with it
The fingerprint identification unit 20 that should be set provides light source, ensures that fingerprint identification unit 20 can be normally carried out fingerprint recognition.Fig. 1 b are only
It is illustrative so that array base palte includes a fingerprint identification unit 20 and an organic light-emitting structure 60 as an example.
Optionally, can also be to refer in addition to light source of the multiplexing organic light-emitting structure 60 as fingerprint identification unit 20
Line recognition unit 20 is separately provided fingerprint recognition light source 70, as shown in Figure 2.Specifically, Fig. 2 be it is provided in an embodiment of the present invention again
A kind of structural representation of array base palte, the array base palte shown in Fig. 2 also include fingerprint recognition light source 70, fingerprint recognition light source 70
Positioned at side of the fingerprint identification unit 20 away from the first underlay substrate 10, fingerprint identification unit 20 is used for according to fingerprint recognition light source
70 light sent reflex to fingerprint identification unit 20 to carry out fingerprint recognition via main body is touched.In view of above-mentioned organic light emission
Structure 60 is used for the light for producing display image, using light source of the fingerprint recognition light source 70 as fingerprint identification unit 20, is showing
Stage, fingerprint recognition light source 70 do not light, and avoid influenceing display effect；In the fingerprint recognition stage, organic light-emitting structure 60 is not sent out
Light, the light spilt by organic light-emitting structure 60, and the light sent is avoided to reach fingerprint identification unit after touching main body reflection
20, fingerprint recognition is interfered.It should be noted that organic light-emitting structure 60 is multiplexed with to the light of fingerprint identification unit 20
Source is carried out, it is necessary to ensure that display process is synchronous with fingerprint identification process, and is separately provided fingerprint recognition light source 70, then will can be shown
Show that process is distinguished with fingerprint identification process, fingerprint identification process need not be restricted by display process, ensure fingerprint recognition mistake
Journey is flexible.
Optionally, Fig. 3 a are a kind of electrical block diagrams of fingerprint identification unit provided in an embodiment of the present invention, Fig. 3 b
It is a kind of film layer structure schematic diagram of fingerprint identification unit provided in an embodiment of the present invention, with reference to figure 3a and Fig. 3 b, fingerprint recognition
Unit 20 can include photodiode 201, storage capacitance 202 and driving thin film transistor (TFT) 203；Photodiode 201 is just
Pole D1 electrically connects with the first electrode C1 of storage capacitance 202, the negative pole D2 of photodiode 201 and the second of storage capacitance 202
Electrode C2 and the source electrode Ts electrical connections for driving thin film transistor (TFT) 203；The grid Tg and switch for driving thin film transistor (TFT) 203 are controlled
Line Gate is electrically connected, and the drain electrode Td of driving thin film transistor (TFT) 203 electrically connects with signal detection line Data；Photodiode 201 is used
Current signal is converted into the fingerprint signal light for reflecting touch main body；In the fingerprint recognition stage, driving thin film transistor (TFT) 203 is led
Logical, the current signal is through driving thin film transistor (TFT) 203 to transmit to signal detection line Data, to be carried out according to the current signal
Fingerprint recognition.
Specifically, photodiode 201 also includes the PIN junction D3 between positive pole D1 and negative pole D2.Wherein, negative pole D2
Formed by light tight metal, and PIN junction D3 border is no more than negative pole D2 border.The positive pole D1 of photodiode 201 is located at
Sides of the PIN section D3 away from negative pole D2.PIN junction D3 has light sensitive characteristic, and has unilateral conduction.During no light, PIN junction
D3 has the saturation reverse leakage current of very little, i.e. dark current, and now photodiode 201 ends；When by illumination, PIN junction D3
Saturation reverse leakage current greatly increase, form photoelectric current, photoelectric current changes with the change of incident intensity.
Optionally, Fig. 4 is the structural representation of another array base palte provided in an embodiment of the present invention, the battle array shown in Fig. 4
The difference of row substrate and the array base palte described in above-described embodiment is that the array base palte described in Fig. 4 can also include the second lining
Substrate 80, the second underlay substrate 80 is between the first underlay substrate 10 and fingerprint identification unit 20.
As shown in figure 4, the second underlay substrate 80 is set between the first underlay substrate 10 and fingerprint identification unit 20, due to
Second underlay substrate 80 is located at the first underlay substrate 10 away from the side of drive circuit layer 30, the second underlay substrate 80 and drive circuit
The first underlay substrate 10 is provided between layer 30, therefore, compared to the first underlay substrate 10, the second underlay substrate 80 bears to drive
Caused heat is less in the preparation process of circuit layer 30, and therefore, the resistance to elevated temperatures of the second underlay substrate 80 can be less than first
The resistance to elevated temperatures of underlay substrate 10, but because high-temperature-resistant flexible baseplate material transmitance is lower, therefore, the second underlay substrate
80 transmitance can be higher than the transmitance of the first underlay substrate 10, therefore opening can not be set on the second underlay substrate 80
Structure 40, it can equally ensure that fingerprint identification unit 20 is received via the light for touching main body reflection, ensure fingerprint recognition list
Member 20 can be normally carried out fingerprint recognition.
Optionally, the second underlay substrate 80, the first lining are set between the first underlay substrate 10 and fingerprint identification unit 20
Hatch frame 40 is provided with substrate 10, is not provided with hatch frame 40 in the second underlay substrate 80, it is ensured that first
When underlay substrate 10 prepares hatch frame 40, the fingerprint identification unit 20 that will not be pointed under it causes to damage, and ensures that fingerprint is known
The other function of unit 20 is intact.
Optionally, (can also not show in figure including inorganic layer between the first underlay substrate 10 and the second underlay substrate 80
Go out), when can so ensure to be formed hatch frame 40 in the first underlay substrate 10, due to the first underlay substrate 10 and inorganic layer
Material is different, it is ensured that terminated in during the preparation of hatch frame 40 in the first underlay substrate 10, will not be to the second underlay substrate 80
Cause to damage.
Optionally, the first underlay substrate 10 and the second underlay substrate 80 are set, it can also be ensured that the whole lining of array base palte
Substrate is thicker, avoids causing underlay substrate crimp.
Optionally, the second underlay substrate 80 equally can be flexible substrate substrate, its material can include polyimides or
At least one of person's nanometer silver paste.
Optionally, Fig. 5 is the structural representation of another array base palte provided in an embodiment of the present invention, the battle array shown in Fig. 5
The difference of row substrate and the array base palte described in above-described embodiment is that the array base palte described in Fig. 5 can also include the second lining
Substrate 80, the second underlay substrate 80 are located at side of the fingerprint identification unit 20 away from the first underlay substrate 10.
As shown in figure 5, side of the fingerprint identification unit 20 away from the first underlay substrate 10 is provided with the second underlay substrate
80, the second underlay substrate 80, which can be protected, refers to recognition unit 20, avoids external environment from causing to damage to fingerprint identification unit 20.Also
Should be noted any is, in the prior art, flexible array base palte prepare generally by the rigid substrate first deposit one layer
Flexible material (equivalent to the second underlay substrate 80 of the application), then prepares other display devices on flexible material, other
Display device peels off rigid substrates to obtain flexible array substrate after the completion of preparing, and swashs due to typically being used during stripping rigid substrates
Photospallation technology, flexible material (the second underlay substrate 80) may be caused to damage during rigid substrates are peeled off, therefore, this
The array base palte that inventive embodiments provide is in addition to including the first underlay substrate 10, in addition to the second underlay substrate 80, and fingerprint is known
Other unit 20 is arranged between the first underlay substrate 10 and the second underlay substrate 80, even if so the second underlay substrate 80 is in array
Sustained damage in the preparation process of substrate, then fingerprint identification unit 20 ensures that fingerprint identification function is intact without being damaged.Simultaneously
First underlay substrate 10 covers fingerprint identification unit 20, and fingerprint identification unit 20 is located at the non-light emission side of array base palte, so set
The light-emitting zone for ensureing that fingerprint identification unit 20 does not influence array base palte is put, ensures possess larger display during array base palte display
Aperture opening ratio.Fig. 6 is a kind of schematic flow sheet of the preparation method of array base palte provided in an embodiment of the present invention, as shown in fig. 6, this
The preparation method that inventive embodiments provide can include：
S110, one first underlay substrate is provided and forms fingerprint identification unit in the first underlay substrate side, it is described
Fingerprint identification unit includes photodiode, and the fingerprint identification unit is used to reflex to the fingerprint according to via touch main body
The light of recognition unit carries out fingerprint recognition.
Fig. 7 a are the structural representations provided in an embodiment of the present invention that fingerprint identification unit is formed in the first underlay substrate side
Figure, as shown in Figure 7a, fingerprint identification unit 20 can include photodiode 201.
Optionally, the first underlay substrate 10 can be flexible substrate substrate, and its material can include polyimides or receive
At least one of rice silver paste.
S120, the side away from the fingerprint identification unit forms drive circuit layer on first underlay substrate, and
Hatch frame is formed in the drive circuit layer and first underlay substrate, the hatch frame is in the first substrate base
Overlapping region be present with upright projection of the photodiode on first underlay substrate in the upright projection on plate.
Fig. 7 b are the structural representation of formation drive circuit layer provided in an embodiment of the present invention, as shown in Figure 7b, driving electricity
Road floor 30 can include thin film transistor (TFT), can specifically include active layer 301, source electrode 302, gate electrode 303 and drain electrode
Electrode 304, the thin film transistor (TFT) can be top-grate structure thin film transistor or bottom grating structure thin film transistor (TFT), Fig. 7 b only with
Top-grate structure thin film transistor is illustrative.
Fig. 7 c are showing for the formation hatch frame provided in an embodiment of the present invention in drive circuit layer and the first underlay substrate
Illustration, as shown in Figure 7 c, formed with hatch frame 40 on the underlay substrate 10 of drive circuit layer 30 and first, it can specifically pass through
The underlay substrate of drive circuit layer 30 and first is performed etching, forms hatch frame 40.As shown in Figure 7 c, hatch frame 40 is
Crossover region be present with upright projection of the photodiode 201 on the first underlay substrate 10 in the upright projection on one underlay substrate 10
Domain.
S130, in side of the drive circuit layer away from first underlay substrate transparent film layer is formed, it is described transparent
Film layer is at least filled in the hatch frame.
Fig. 7 d are the structural representations of formation transparent film layer provided in an embodiment of the present invention, as shown in figure 7d, in driving electricity
Side of the road floor 30 away from the first underlay substrate 10 forms transparent film layer 50, and transparent film layer 50 is at least filled in hatch frame 40,
Side of the drive circuit layer 30 away from the first underlay substrate 10 is may be located on, serves as drive circuit layer 30 and thereon between film layer
Insulating barrier.
Optionally, the material of transparent film layer 50 can include polyethylene terephthalate, ethene-vinyl acetate is copolymerized
At least one of thing and acrylic material.
S140, the side away from the drive circuit layer prepares organic light-emitting structure on the transparent film layer.
Fig. 7 e are the structural representations of preparation organic light-emitting structure provided in an embodiment of the present invention, as shown in figure 7e, organic
Ray structure 60 can include anode electrode 601, organic luminous layer 602 and cathode electrode 603, anode electrode and drain electrode
304 are connected by via.
To sum up, the preparation method of array base palte provided in an embodiment of the present invention, by drive circuit layer and the first substrate
At least one opening structure is formed in substrate, and in upright projection and fingerprint identification unit of the hatch frame on underlay substrate
Be present overlapping region in projection of the photodiode on underlay substrate, in this way, by filling transparent film layer in hatch frame, protect
Transparent film layer be present above card photodiode, improve the transmitance of film layer above photodiode, ensure fingerprint identification unit
The light that fingerprint identification unit is reflexed to via touch main body can be received well, ensure that fingerprint identification unit detection is sensitive
Degree.
Optionally, hatch frame 40 be located at close to the bottom surface of the side of the first underlay substrate 10 in the first underlay substrate 10 or
Hatch frame 40 runs through the first underlay substrate 10, in this way, preparing opening knot on the underlay substrate 10 of drive circuit layer 40 and first
Structure 40, it can include：
Etch the underlay substrate 10 of drive circuit layer 30 and first and form hatch frame 40, so that hatch frame 40 is close to first
The bottom surface of the side of underlay substrate 10 is located at 10 in the first underlay substrate；Or；
Etch the underlay substrate 10 of drive circuit layer 30 and first and form hatch frame 40, so that hatch frame 40 is through driving
The underlay substrate 10 of circuit layer 30 and first.
Fig. 8 is the schematic flow sheet of the preparation method of another array base palte provided in an embodiment of the present invention, the present embodiment
The difference of the preparation method of array base palte described in the preparation method and above-described embodiment of the array base palte of offer is also to include
The second underlay substrate is prepared, as shown in figure 8, the preparation method can include：
S210, one first underlay substrate is provided and prepares the second underlay substrate in the first underlay substrate side.
Fig. 9 a are the structural representations provided in an embodiment of the present invention that the second underlay substrate is prepared in the first underlay substrate side
Figure, the first underlay substrate 10 and the second underlay substrate 80 can be flexible substrate substrate, and its material can include polyimides
Or at least one of nanometer silver paste.
Optionally, (can also not show in figure including inorganic layer between the first underlay substrate 10 and the second underlay substrate 80
Go out).
S220, in side of the second underlay substrate side away from first underlay substrate form fingerprint recognition list
Member, the fingerprint identification unit include photodiode, and the fingerprint identification unit is used to reflex to according to via touch main body
The light of the fingerprint identification unit carries out fingerprint recognition.
Fig. 9 b are provided in an embodiment of the present invention in side formation fingerprint of second underlay substrate away from the first underlay substrate
The structural representation of recognition unit, as shown in figure 9b, fingerprint identification unit 20 can include photodiode 201.
S230, the side away from the fingerprint identification unit forms drive circuit layer on first underlay substrate, and
Hatch frame is formed in the drive circuit layer and first underlay substrate, the hatch frame is in the first substrate base
Overlapping region be present with upright projection of the photodiode on first underlay substrate in the upright projection on plate.
With continued reference to shown in Fig. 7 b and Fig. 7 c, the side away from fingerprint identification unit 20 is formed on the first underlay substrate 10
Drive circuit layer 30, and hatch frame 40 is formed on the underlay substrate 10 of drive circuit layer 30 and first, hatch frame 40 exists
Upright projection of the upright projection with photodiode 201 on the first underlay substrate 10 on first underlay substrate 10 exists overlapping
Region.
S240, in side of the drive circuit layer away from first underlay substrate transparent film layer is formed, it is described transparent
Film layer is at least filled in the hatch frame.
With continued reference to Fig. 7 d, transparent film layer 50 is formed in side of the drive circuit layer 30 away from the first underlay substrate 10, thoroughly
Bright film layer 50 is at least filled in hatch frame 40.
S250, the side away from the drive circuit layer prepares organic light-emitting structure on the transparent film layer.
To sum up, the preparation method of array base palte provided in an embodiment of the present invention, can not only improve above photodiode
The transmitance of film layer, ensure that fingerprint identification unit can receive the light that fingerprint identification unit is reflexed to via touch main body well
Line, ensure fingerprint identification unit detection sensitivity, also, by forming the between the first underlay substrate and fingerprint identification unit
Two underlay substrates, ensure that the fingerprint identification unit that will not be pointed under it causes when the first underlay substrate prepares hatch frame
Damage, ensure that fingerprint identification unit function is intact.
Figure 10 is the schematic flow sheet of the preparation method of another array base palte provided in an embodiment of the present invention, the present embodiment
The difference of the preparation method of array base palte described in the preparation method and above-described embodiment of the array base palte of offer is in fingerprint
Side of the recognition unit away from the first underlay substrate prepares the second underlay substrate, and as shown in Figure 10, the preparation method can wrap
Include：
S310, one first underlay substrate is provided and forms fingerprint identification unit in the first underlay substrate side, it is described
Fingerprint identification unit includes photodiode, and the fingerprint identification unit is used to reflex to the fingerprint according to via touch main body
The light of recognition unit carries out fingerprint recognition.
With continued reference to Fig. 7 a, fingerprint identification unit 20 can include photodiode 201.
S320, in side of the fingerprint identification unit away from first underlay substrate prepare the second underlay substrate.
Figure 11 is provided in an embodiment of the present invention in side formation second of the fingerprint identification unit away from the first underlay substrate
The structural representation of underlay substrate, the second underlay substrate 80 can be flexible substrate substrate.
S330, the side away from the fingerprint identification unit forms drive circuit layer on first underlay substrate, and
Hatch frame is formed in the drive circuit layer and first underlay substrate, the hatch frame is in the first substrate base
Overlapping region be present with upright projection of the photodiode on first underlay substrate in the upright projection on plate.
With continued reference to shown in Fig. 7 b and Fig. 7 c, the side away from fingerprint identification unit 20 is formed on the first underlay substrate 10
Drive circuit layer 30, and hatch frame 40 is formed on the underlay substrate 10 of drive circuit layer 30 and first, hatch frame 40 exists
Upright projection of the upright projection with photodiode 201 on the first underlay substrate 10 on first underlay substrate 10 exists overlapping
Region.
S340, in side of the drive circuit layer away from first underlay substrate transparent film layer is formed, it is described transparent
Film layer is at least filled in the hatch frame.
With continued reference to Fig. 7 d, transparent film layer 50 is formed in side of the drive circuit layer 30 away from the first underlay substrate 10, thoroughly
Bright film layer 50 is at least filled in hatch frame 40.
S350, the side away from the drive circuit layer prepares organic light-emitting structure on the transparent film layer.
To sum up, the preparation method of array base palte provided in an embodiment of the present invention, can not only improve above photodiode
The transmitance of film layer, ensure that fingerprint identification unit can receive the light that fingerprint identification unit is reflexed to via touch main body well
Line, ensure fingerprint identification unit detection sensitivity, also, by side system of the fingerprint identification unit away from the first underlay substrate
Standby second underlay substrate, fingerprint identification unit is protected by the second underlay substrate, avoids external environment from making fingerprint identification unit
Into damage, ensure that fingerprint identification unit function is intact.
Figure 12 is a kind of structural representation of display panel provided in an embodiment of the present invention, and with reference to figure 12, the present invention is implemented
The display panel that example provides includes the array base palte 1 described in above-described embodiment, can also include what is be oppositely arranged with array base palte 1
Opposite substrate 2, opposite substrate 2 can be cover plate or other encapsulated layers.
Figure 13 is a kind of structural representation of display device provided in an embodiment of the present invention, with reference to figure 13, display device 100
The display panel 101 described in any embodiment of the present invention can be included.Display device 100 can be the mobile phone shown in Figure 13,
Can be computer, television set, intelligence wearing display device etc., the embodiment of the present invention is not particularly limited to this.
Pay attention to, above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art various obvious changes,
Readjust, be combined with each other and substitute without departing from protection scope of the present invention.Therefore, although by above example to this
Invention is described in further detail, but the present invention is not limited only to above example, is not departing from present inventive concept
In the case of, other more equivalent embodiments can also be included, and the scope of the present invention is determined by scope of the appended claims.
Claims (16)
- A kind of 1. array base palte, it is characterised in that including：First underlay substrate and the fingerprint identification unit positioned at the first underlay substrate side, the fingerprint identification unit include Photodiode, the fingerprint identification unit are used to be entered according to the light for reflexing to the fingerprint identification unit via touch main body Row fingerprint recognition；The drive circuit layer away from the fingerprint identification unit side, the drive circuit layer on first underlay substrate And formed with least one opening structure in first underlay substrate, the hatch frame is on first underlay substrate Upright projection and upright projection of the photodiode on first underlay substrate overlapping region be present；Transparent film layer, the transparent film layer are at least filled in the hatch frame.
- 2. array base palte according to claim 1, it is characterised in that the hatch frame is close to first underlay substrate The bottom surface of side is located in first underlay substrate or the hatch frame runs through first underlay substrate.
- 3. array base palte according to claim 1, it is characterised in that the hatch frame is on first underlay substrate Upright projection of the upright projection with the photodiode on first underlay substrate overlap.
- 4. array base palte according to claim 1, it is characterised in that also including the second underlay substrate, second substrate Substrate is between first underlay substrate and the fingerprint identification unit, or second underlay substrate is located at the finger Side of the line recognition unit away from first underlay substrate.
- 5. array base palte according to claim 1, it is characterised in that the fingerprint identification unit includes photodiode；The fingerprint identification unit also includes storage capacitance and driving thin film transistor (TFT)；The positive pole of the photodiode electrically connects with the first electrode of the storage capacitance, the negative pole of the photodiode with The source electrode electrical connection of the second electrode of the storage capacitance and the driving thin film transistor (TFT)；The driving thin film transistor (TFT) Grid electrically connects with thread switching control, and the drain electrode of the driving thin film transistor (TFT) electrically connects with signal detection line；The photodiode is used to the fingerprint signal light changing into current signal；In fingerprint recognition stage, the driving thin film transistor (TFT) conducting, the current signal passes through the driving thin film transistor (TFT) The signal detection line is transported to, to carry out fingerprint recognition according to the current signal.
- 6. array base palte according to claim 1, it is characterised in that the array base palte also includes organic light-emitting structure, The organic light-emitting structure is located at side of the drive circuit layer away from first underlay substrate, according to the drive circuit The drive signal that layer provides is lighted.
- 7. array base palte according to claim 6, it is characterised in that the organic light-emitting structure is the fingerprint recognition list Member provides light source, and the fingerprint identification unit is used to be reflected via main body is touched according to the light that the organic light-emitting structure is sent To the fingerprint identification unit to carry out fingerprint recognition.
- 8. array base palte according to claim 1, it is characterised in that also including fingerprint recognition light source, the fingerprint recognition Light source is located at the fingerprint and knows side of the unit away from first underlay substrate；The fingerprint identification unit is used for according to The light that fingerprint recognition light source is sent reflexes to the fingerprint identification unit to carry out fingerprint recognition via main body is touched.
- 9. array base palte according to claim 6, it is characterised in that the array base palte includes multiple fingerprint identification units With multiple organic light-emitting structures, the fingerprint identification unit corresponds with the organic light-emitting structure.
- 10. array base palte according to claim 1, it is characterised in that the material of the transparent film layer includes poly- to benzene two At least one of formic acid glycol ester, ethylene-vinyl acetate copolymer and acrylic material.
- 11. array base palte according to claim 4, it is characterised in that first underlay substrate and second substrate Substrate is flexible substrate substrate.
- A kind of 12. preparation method of array base palte, it is characterised in that including：One first underlay substrate is provided and forms fingerprint identification unit, the fingerprint recognition list in the first underlay substrate side Member includes photodiode, and the fingerprint identification unit is used to reflex to the fingerprint identification unit according to via touch main body Light carries out fingerprint recognition；The side away from the fingerprint identification unit forms drive circuit layer on first underlay substrate, and in the driving Hatch frame is formed on circuit layer and first underlay substrate, the hatch frame is vertical on first underlay substrate Overlapping region be present with upright projection of the photodiode on first underlay substrate in projection；Transparent film layer is formed in side of the drive circuit layer away from first underlay substrate, the transparent film layer is at least filled out Fill in the hatch frame.
- 13. preparation method according to claim 12, it is characterised in that in the drive circuit layer and first substrate Hatch frame is prepared on substrate, including：Etch the drive circuit layer and first underlay substrate forms hatch frame, so that hatch frame is close to described first The bottom surface of underlay substrate side is located in first underlay substrate；Or；Etch the drive circuit layer and first underlay substrate forms hatch frame, so that hatch frame runs through the driving Circuit layer and first underlay substrate.
- 14. preparation method according to claim 12, it is characterised in that after one first underlay substrate is provided, in addition to：The second underlay substrate is prepared in the first underlay substrate side；Fingerprint identification unit is formed in side of second underlay substrate away from first underlay substrate；Or, there is provided one first underlay substrate and the first underlay substrate side formed fingerprint identification unit after, also wrap Include：The second underlay substrate is prepared in side of the fingerprint identification unit away from first underlay substrate.
- A kind of 15. display panel, it is characterised in that including the array base palte described in claim any one of 1-11, in addition to The counter substrate that the array base palte is arranged oppositely.
- 16. a kind of display device, it is characterised in that including the display panel described in claim 15.
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