CN107449455A - A kind of ultrasonic sensor - Google Patents
A kind of ultrasonic sensor Download PDFInfo
- Publication number
- CN107449455A CN107449455A CN201710840689.2A CN201710840689A CN107449455A CN 107449455 A CN107449455 A CN 107449455A CN 201710840689 A CN201710840689 A CN 201710840689A CN 107449455 A CN107449455 A CN 107449455A
- Authority
- CN
- China
- Prior art keywords
- ultrasonic sensor
- matching layer
- piezoelectric chip
- epoxy
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/48—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using wave or particle radiation means
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
The invention discloses a kind of ultrasonic sensor, including housing and the piezoelectric chip that is placed in housing, the shell one end are provided with base, and the side of the piezoelectric chip towards base is fixed with flexible glue, and opposite side is fixed with matching layer.The paste matching layer after stirring is fixed on piezoelectric chip by the method for dispensing or brush coating, table plane gapless bonds therewith, then matching layer material is fully solidified so that matching layer is integrally formed with piezoelectric chip by heating.The ultrasonic sensor of the present invention, remained shock are greatly reduced, and reduce measurement blind area.The matching layer material of the present invention and the method for bonding wafer one make echo sensitivity get a promotion.The present invention is simple in construction, cost increases low and performance and significantly lifted.
Description
Technical field
The present invention relates to electronic component, more particularly to a kind of ultrasonic sensor of new structure.
Background technology
At present, utilization of the ultrasonic sensor of 0.08 meter of testing blind zone in equipment, determine that equipment must provide
Sufficiently large space can differentiate remained shock so as to ultrasonic sensor（Clutter）With an echo（Useful feedback）, such equipment
Would have to be designed to bigger and heavy.Existing ultrasonic sensor structure is as shown in figure 1, including matching layer material 1, crystalline substance
Piece 2 and rubber parts 3, wherein chip 2 are fabricated separately, and are then reduced with epoxy and bonding wafer, performance, and the damping of rubber parts 3 is made
With being influenceed by structure, effect is poor.
The content of the invention
The present invention seeks to：There is provided a kind of ultrasonic sensor of new structure so that equipment can minimize, more than reduction
Shake, increase echo sensitivity to improve sensor performance.
The technical scheme is that：
A kind of ultrasonic sensor, including housing and the piezoelectric chip that is placed in housing, the shell one end are provided with base,
The side of the piezoelectric chip towards base is fixed with flexible glue, and opposite side is fixed with matching layer.
Preferably, the matching layer is using the epoxy of density 1.16 as carrier, by epoxy：Glass microballoon：Curing agent=1：
（0.65~0.75）：（0.4~0.5）Ratio addition glass microballoon and curing agent, then by epoxy：Epoxy silane coupling agent=1：
（0.010~0.013）Epoxy silane coupling agent and vacuum uniform stirring are added, respectively at 40 DEG C ± 5 DEG C through 7~8 hours, 70 DEG C
± 5 DEG C formed through solidification in 8~10 hours.
Preferably, the paste matching layer after stirring is fixed on piezoelectric chip by the method for dispensing or brush coating, made
Side table plane gapless with layer and piezoelectric chip bonds, then matching layer material is fully solidified so that matching by heating
Layer is integrally formed with piezoelectric chip.
Preferably, the housing is used but is not limited to cylindrical or square.
Preferably, the shore hardness scope after the flexible adhesive curing is A15~A40.
Preferably, the flexible glue is one kind in UV glue, silica gel or epoxy glue.
The present invention has following advantages compared with prior art：
1st, ultrasonic sensor of the invention, remained shock are greatly reduced, and reduce measurement blind area.
2nd, matching layer material of the invention and the method for bonding wafer one make echo sensitivity get a promotion.
3rd, simple in construction, cost of the invention increases low and performance and significantly lifted.
Brief description of the drawings
Below in conjunction with the accompanying drawings and embodiment the invention will be further described：
Fig. 1 is existing ultrasonic sensor structural representation；
The ultrasonic sensor structural representation of Fig. 2 present invention；
Fig. 3 is measurement effect schematic diagram of the existing ultrasonic sensor at 0.04 meter；
Fig. 4 is measurement effect schematic diagram of the ultrasonic sensor of the present invention at 0.04 meter.
Embodiment
As shown in Fig. 2 the ultrasonic sensor of the present invention, including housing 1 and the piezoelectric chip 2 that is placed in housing, institute
State shell one end and base 3 is installed, the side of the piezoelectric chip towards base is fixed with flexible glue 5, and opposite side is fixed with
With layer 4.When it is implemented, comprise the following steps.
The first step, using the epoxy of density 1.16 as carrier, by epoxy：Glass microballoon：Curing agent=1：（0.65~
0.75）：（0.4~0.5）Ratio addition glass microballoon and curing agent, then by epoxy：Epoxy silane coupling agent=1：（0.010~
0.013）Addition epoxy silane coupling agent simultaneously vacuumizes stirring until uniformly, forming the matching layer material of paste.
Second step, housing and chip are fixed with special frock clamp.Ensure that chip is placed among housing, and shrinking away from theshell body end
Mouth distance is 2.4+mm, to ensure matching layer thickness.
3rd step, the paste that is stirred is matched layer material and fixes chip in the housing with the method for dispensing or brush coating
On, then solidified respectively at 40 DEG C ± 5 DEG C through 7~8 hours, 70 DEG C ± 5 DEG C through 8~10 hours.
4th step, by the method for grinding make the matching layer material thicknesses of the semi-finished product after above-mentioned solidification for 2.4+/-
0.2mm, and working face is smooth.
5th step, the semi-finished product after grinding are taken out, flexible glue is put on chip and is solidified.
6th step, mounting seat are simultaneously welded with the extraction wire of chip.
7th step, cavity and solidification of the flexible glue between base and shell are again filled with, base is fixed with shell.
As shown in Figures 3 and 4, respectively existing ultrasonic sensor and the ultrasonic sensor of the present invention, at 0.04 meter
When measurement effect schematic diagram.It can be seen that existing ultrasonic sensor（Remained shock is mingled in one with an echo
Rise, be not easily distinguishable；The ultrasonic sensor of the present invention, remained shock and an echo are very clear, are very easy to distinguish.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Present disclosure can be understood and implemented according to this, it is not intended to limit the scope of the present invention.It is all main according to the present invention
The modification for wanting the Spirit Essence of technical scheme to be done, it should all be included within the scope of the present invention.
Claims (6)
1. a kind of ultrasonic sensor, including housing and the piezoelectric chip that is placed in housing, it is characterised in that：The housing one
End is provided with base, and the side of the piezoelectric chip towards base is fixed with flexible glue, and opposite side is fixed with matching layer.
2. ultrasonic sensor according to claim 1, it is characterised in that：The matching layer is made with the epoxy of density 1.16
For carrier, by epoxy：Glass microballoon：Curing agent=1：（0.65~0.75）：（0.4~0.5）Ratio addition glass microballoon and solid
Agent, then by epoxy：Epoxy silane coupling agent=1：（0.010~0.013）Addition epoxy silane coupling agent simultaneously uniformly stir by vacuum
Mix, formed respectively at 40 DEG C ± 5 DEG C through 7~8 hours, 70 DEG C ± 5 DEG C through solidification in 8~10 hours.
3. ultrasonic sensor according to claim 2, it is characterised in that：By the method for dispensing or brush coating after stirring
Paste matching layer be fixed on piezoelectric chip, therewith table plane gapless bond, then by heating make matching layer material abundant
Solidification, so that matching layer is integrally formed with piezoelectric chip.
4. ultrasonic sensor according to claim 1, it is characterised in that：The housing use but be not limited to cylinder or
It is square.
5. ultrasonic sensor according to claim 1, it is characterised in that：Shore hardness model after the flexible adhesive curing
Enclose for A15~A40.
6. ultrasonic sensor according to claim 1, it is characterised in that：The flexible glue is UV glue, silica gel or epoxy
One kind in glue.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710840689.2A CN107449455A (en) | 2017-09-18 | 2017-09-18 | A kind of ultrasonic sensor |
| PCT/CN2017/106970 WO2019051921A1 (en) | 2017-09-18 | 2017-10-20 | Ultrasonic sensor |
| JP2020600092U JP3229362U (en) | 2017-09-18 | 2017-10-20 | Ultrasonic sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710840689.2A CN107449455A (en) | 2017-09-18 | 2017-09-18 | A kind of ultrasonic sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107449455A true CN107449455A (en) | 2017-12-08 |
Family
ID=60495701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710840689.2A Pending CN107449455A (en) | 2017-09-18 | 2017-09-18 | A kind of ultrasonic sensor |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3229362U (en) |
| CN (1) | CN107449455A (en) |
| WO (1) | WO2019051921A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109124574A (en) * | 2018-06-26 | 2019-01-04 | 深圳迈瑞生物医疗电子股份有限公司 | Optoacoustic-ultrasonic probe, the production method of acoustic lens, optoacoustic-supersonic imaging apparatus |
| CN115825963A (en) * | 2022-12-14 | 2023-03-21 | 成都汇通西电电子有限公司 | Ultrasonic sensor |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201408266Y (en) * | 2009-04-30 | 2010-02-17 | 中国船舶重工集团公司第七一五研究所 | Ultrasonic distance measuring probe |
| CN201692927U (en) * | 2010-04-12 | 2011-01-05 | 杨宝君 | Ultrasonic transducer |
| US20110303013A1 (en) * | 2010-06-11 | 2011-12-15 | Daniel Stephen Kass | removable wear-plate assembly for acoustic probes |
| CN102288782A (en) * | 2011-07-19 | 2011-12-21 | 江苏物联网研究发展中心 | High-precision ultrasonic transducer |
| CN102873018A (en) * | 2012-09-18 | 2013-01-16 | 浙江大学 | Ultrasonic transducer with matching layer being solidified asynchronously |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3857170B2 (en) * | 2002-03-29 | 2006-12-13 | 日本電波工業株式会社 | Ultrasonic probe |
| CN201611266U (en) * | 2010-03-16 | 2010-10-20 | 山东力创科技有限公司 | Ultrasonic transducer of heat meter |
| CN202171478U (en) * | 2011-08-17 | 2012-03-21 | 李志慧 | Probe of ultrasonic flowmeter |
| CN103230866A (en) * | 2013-04-11 | 2013-08-07 | 镇江畅信超声电子有限公司 | Ultrasonic transducer and manufacturing process thereof |
| CN103743423A (en) * | 2013-12-20 | 2014-04-23 | 常州波速传感器有限公司 | Novel high-frequency ultrasonic sensor |
-
2017
- 2017-09-18 CN CN201710840689.2A patent/CN107449455A/en active Pending
- 2017-10-20 WO PCT/CN2017/106970 patent/WO2019051921A1/en active Application Filing
- 2017-10-20 JP JP2020600092U patent/JP3229362U/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201408266Y (en) * | 2009-04-30 | 2010-02-17 | 中国船舶重工集团公司第七一五研究所 | Ultrasonic distance measuring probe |
| CN201692927U (en) * | 2010-04-12 | 2011-01-05 | 杨宝君 | Ultrasonic transducer |
| US20110303013A1 (en) * | 2010-06-11 | 2011-12-15 | Daniel Stephen Kass | removable wear-plate assembly for acoustic probes |
| CN102288782A (en) * | 2011-07-19 | 2011-12-21 | 江苏物联网研究发展中心 | High-precision ultrasonic transducer |
| CN102873018A (en) * | 2012-09-18 | 2013-01-16 | 浙江大学 | Ultrasonic transducer with matching layer being solidified asynchronously |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109124574A (en) * | 2018-06-26 | 2019-01-04 | 深圳迈瑞生物医疗电子股份有限公司 | Optoacoustic-ultrasonic probe, the production method of acoustic lens, optoacoustic-supersonic imaging apparatus |
| CN109124574B (en) * | 2018-06-26 | 2021-10-08 | 深圳迈瑞生物医疗电子股份有限公司 | Photoacoustic-ultrasonic probe, method for manufacturing acoustic lens, and photoacoustic-ultrasonic imaging apparatus |
| CN115825963A (en) * | 2022-12-14 | 2023-03-21 | 成都汇通西电电子有限公司 | Ultrasonic sensor |
| CN115825963B (en) * | 2022-12-14 | 2024-03-15 | 成都汇通西电电子有限公司 | Ultrasonic sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019051921A1 (en) | 2019-03-21 |
| JP3229362U (en) | 2020-12-03 |
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171208 |
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| RJ01 | Rejection of invention patent application after publication |