CN107427943A - The manufacture method of consolidation abrasive saw silk with metal alloy fixed bed and manufactured saw silk - Google Patents
The manufacture method of consolidation abrasive saw silk with metal alloy fixed bed and manufactured saw silk Download PDFInfo
- Publication number
- CN107427943A CN107427943A CN201680015477.4A CN201680015477A CN107427943A CN 107427943 A CN107427943 A CN 107427943A CN 201680015477 A CN201680015477 A CN 201680015477A CN 107427943 A CN107427943 A CN 107427943A
- Authority
- CN
- China
- Prior art keywords
- metal
- silk
- abrasive grains
- fixed bed
- abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The method for disclosing a kind of electrolytic deposition manufacture consolidation abrasive saw silk (104) of abrasive grains by being pre-coated with the first metal on elongated substrate silk (104,202).This method is characterized in particular in initial fixation bath (110) of the addition different from the abrasive grains activated metal ion of the first metal.Activated metal ion is deposited on together with the first metal ion in the fixed bed on metallic substrates silk (104,202), and enhances the activity of the abrasive grains only partly coated.Then, the deposition bonded layer from the deposition bath (108) of the metal bonding layer without addition.In the silk (104) of formation, all activated metals are present near metallic substrates silk (104,202) more than 70% in fixed bed and 30% width of the gross thickness of bonded layer.
Description
Technical field
The present invention relates to a kind of method for manufacturing consolidation abrasive saw silk and the consolidation abrasive saw silk formed by this method.Consolidation
Abrasive saw silk can be used for cutting such as sapphire, silicon, GaAs, quartz, carborundum, natural stone or artificial stone or similar material
Hard brittle material.
Background technology
In semiconductor and solar wafer manufacturing field, the exploitation of polycyclic monofilament sawing machine causes in a single cycle
Carry out the parallel of multiple wafers (more than 100) and be cut into possibility.In such sawing machine, the silk of single length is in band
Several rings are wound on the capstan winch of groove, wherein capstan winch keeps these rings while workpiece is sunk in the thread net being thusly-formed
In equal distance.Capstan winch driving silk moves forward and backward, and so as to which silk new step by step is fed at the entrance ring of net, and uses
The silk crossed is extracted at the discharge ring of net.
Now, substantially two distinct types of sawing process is conventional.In the presence of loose grinding sawing, wherein containing
The slurry of abrasive grit (silicon carbide powder mainly in polythylene binder carrier) is dragged in cutting by saw silk.Sawing is to pass through
Abrasive grains grind to complete what is sawed adhesion and rolling between the surface of silk and workpiece and carry out by three bodies.Saw silk
Typically there is the high tensile steel wire of smooth surface and circular cross section.Recently, existed by using wavy saw silk
Improved cutting result is obtained in terms of speed and surface quality.In this saw silk, tiny bending is made in silk, so as to change
The kind resistance being dragged in slurry in cutting (referring to WO2014/036714A1, WO2012/2069314A1 of the applicant).
Because not only workpiece is worn, and Steel Wire Surface is also worn, so needing the high supplementary rate of steel wire.In addition,
Slurry management adds the complexity of technique in terms of process control and auxiliary equipment, and whole process is not environmentally friendly.
Therefore, the use for consolidating abrasive saw silk achieves bigger success in the past few years, is applied not only to cut the sun
Can apply or semiconductor application silicon, but also for cut as blue led substrate, camera lens, transparent button even intelligence
The sapphire wafer of energy mobile phone screen substrate.
In abrasive saw silk is consolidated, abrasive grains are fixedly arranged at by bonded layer on the surface of saw silk.In this way, grind
Relative velocity between abrasive particle and carrier silk is zero, and in the absence of the abrasion of saw silk, that is, saws the silk life-span and ground now
The limitation of the wear-out life of particle.Cooling agent is only needed just to remove sawdust, but this management more preferable than ground slurry from cutting.
Bonded layer can be organic resin bonded layer (US6070570) or metal bonding layer.Metal bonding layer can pass through pricker
Weldering or soldering (WO99/46077) are applied by non-electrolytic deposition or electrolytic deposition (previous patent is DE916143).At present
Application be related to the consolidation abrasive saw silk of latter type, i.e., abrasive grains are maintained in the metal level of electrolytic deposition.
Electrolysis co-deposition of the abrasive grains in bonded layer is a challenge.Due to abrasive grains (mainly artificial gold
Hard rock sand grains) it is electrically inert, so particle will not coat in this process.Therefore, such as non-electrolytic Ni-P or Co- is used first
P conductive layer (GB1198479) or such as TiC or SiC semi-conductive layer (US7704127) covering abrasive grains.Need not be
Abrasive grains periphery seal conductive layer (JP2010036298A, JP2010120116A2).
Generally, deposition is a two benches process：
A. in first " fixing step ", particle is temporarily anchored into base wire.Preferably, this is in individual particle layer
Complete, and particle is not adhered to cluster together.This fixation is too weak, silk can not be made to be adapted to sawing, but need sufficiently solid
At least temporarily to be held the particles in during from a to b on silk；
B. second " bonding steps ", wherein being bonded particle in place by the further electrolytic deposition of metal " bonded layer ".
Abrasive grains are held in place by bonded layer.
The non-exhaustive inventory of the alternative solution of " fixing step " is as follows：
Use heat-fusible metal extra play (US2012/167482, US 2013/032129A)；
Use organic bond (JP2010/120116)；
Use the intermediate layer (US2011/263187) that particle is kept by Van der Waals force；
Electroless plating is fixed (JP1271117A2)；
The abrasive grains and the electrolysis co-deposition of metal coating coated by least part metal be fixed (such as
WO2011/042931A1)。
In present applications ' the tail must be taken, fixing step is carried out by being electrolysed co-deposited plating.
Being electrolysed the problem of fixing step occurs is：
Particle tends to assemble before the cluster with the surface of substrate or substrate sheet is reached；
Conductive coating dissolving on abrasive grains is in the electrolyte.
First problem causes the undesirable big projection for forming kerf during use.Second Problem cause with
Because conductive coating with the dissolving of time becomes electrically inert, the deposition of abrasive grains reduces particle.Therefore, particle loses solid
The ability being scheduled on base wire, and the particle coverage on silk reduces with the time.
It is it has been found that especially relevant with the present invention below with reference to document：
TW2013/25780 describes a kind of consolidation abrasive saw silk, and it includes " empty coating 2 ", i.e., wherein without gold
The coating of hard rock abrasive material.In addition, " thick-layer " is the Ni of the about 70% percentage by weight and Co of about 30% percentage by weight
Deposition layer.Empty coating and thick-layer have identical totality component.There is no indication that diamond particles is precoating.It is known
Cobalt is added into nickel dam to improve wearability and reduce friction.
KR101222061B1 solves by sputtering nickel cobalt or other metal parts diamond coated (that is, metal
Coating does not have phosphorus or boron) and hereafter it is electrolytically fixed to combing (dressing) problem of wire." combing " is logical
Cross the top of the diamond of deposition materials is free, to cause what they cuts since the first stroke to make what the preparation of saw silk used
Action.With metal, " additional coating 220 " is fixed, and metal adds coating 220 further by " fastening coating " electricity first for diamond
Solution ground thickeies.
KR20090026490A and KR20090026498A describe coated with diamond saw silk manufacturing process and
Equipment.This method comprises the following steps：Cleaning saw silk (' washing tube 120'), by copper or the nickel shock layer side of being placed on it (
Bath ' in 130'), then bath ' co-deposited diamond and nickel in 140', further then bath ' become nickel dam in 150'
Thick and is finally the deposition (bath ' 160') of cobalt layers to strengthen the coherence of diamond, to reduce saw silk and by between sawing part
Rub and increase saw silk wearability.
WO2011/042931A1 describes a kind of method for manufacturing consolidation abrasive saw silk and the consolidation abrasive saw formed
Silk, wherein by having the metal of the ionization tendency lower than silver to the coating of the outer surface of particle, the gold for solving abrasive grains
The problems of dissolution and adjoint particle for belonging to precoated shet are deposited with leeway.
WO2014/184457A1 describes a kind of abrasive saw silk, and wherein abrasive grains are maintained in nickel cobalt layer, nickel cobalt layer
Then deposit one above the other.All layers all include cobalt.The method for also describing manufacture saw silk.
The content of the invention
Therefore, first purpose of the invention is to provide a kind of method for manufacturing consolidation abrasive saw silk.It this method solve
The cluster and loss problem that particle deposits during the life-span of deposition bath.Another purpose is to provide one kind substantially free of grinding
The consolidation abrasive saw silk of cluster of particle.
According to the first aspect of the invention, there is provided a kind of method for manufacturing consolidation abrasive saw silk.Step is as follows：
- by continuously unclamping from supply spool saw silk provide elongated metallic substrates silk；
- abrasive grains covered at least in part by the alloy coat of the first metal and phosphorus or boron are provided；
- guiding fixation bath of the metallic substrates silk by the ion including abrasive grains and the first metal, in the gold
Co-deposited abrasive grains are electrolysed in metal anchoring layer on category base wire.This results in intermediate filament；
- guiding the intermediate filament passes through one or more baths containing one or more bond wire ionic species, is used for
The abrasive grains are electrolytically bonded in metal bonding layer, so as to form most filum terminale；
- most filum terminale is continuously wrapped on a carrier.
The present invention distinguished with prior art because fixation bath also including the activated metal different from the first metal ion from
Son.Activated metal ion co-deposition is in metal anchoring layer and abrasive grains.
Metallic substrates silk can be stainless steel monofilament.Stainless steel contains the Cr of at least 12% percentage by weight and substantial amounts of
Nickel.Preferred stainless steel constituent is austenitic stainless steel, because they can be stretched to tiny diameter.Example has AISI
302nd, AISI 301, AISI 304 and AISI 314.
Alternately, base wire can be the deep-draw ordinary carbon steel silk for being capable of high elongation.Within the scope of the invention, it is general
The minimum carbon content of logical carbon steel is 0.65%, and manganese content is 0.40% to 0.70%, and silicone content is 0.15% to 0.30%, maximum
Sulfur content is 0.03%, and maximum phosphorus content is 0.30%, and all percentages are weight percentage.Only micro copper, nickel and/
Or chromium.
Preferably, metallic substrates silk is made up of steel core and is coated with metal coating.Illustrative metal coating is brass (copper
Kirsite), copper, silver, aluminium, zinc, cobalt or nickel.Particularly preferably there is the alloy of the electric conductivity higher than stainless steel or ordinary steel
The thicker metal coating of (such as copper, silver, aluminium, zinc or cobalt).The thick preferable metal coating of electric conductivity makes electricity in deposition process
Flow the place flowing in needs：At the covering of silk.It it is also especially preferred to the first metal or activated metal or both gold
The coating of the alloy of category, so as to which there is compatible grain growth with fixed bed.
The cross section of silk can be polygon, and this provides more preferable surface to keep on a surface for abrasive grains,
Or can be circular.The diameter (including metal coating, if present) of elongated metal wire 60 μm to 300 μm it
Between, even more preferably still between 60 μm to 120 μm, such as between 60 μm to 100 μm.Typical sizes be 120 μm, 110 μm,
100 μm, 90 μm, 80 μm or 70 μm.
Abrasive grains can be superabrasive grain, such as diamond (natural or artificial), cubic boron nitride or it is mixed
Compound.For requiring relatively low application, such as tungsten carbide (WC), carborundum (SiC), alundum (Al2O3) (Al can be used2O3) or
Silicon nitride (Si3N4) particle：Although they are softer, than diamond considerably cheaper.Most preferably diamond.For
Cutting sapphire, it has been found that the use of the unbroken diamond with cuboctahedron shape is beneficial.
The size of abrasive grains depends on the desired use and diameter of silk.The size of abrasive grains refers to except being set on particle
Size beyond any coating put, i.e., the size of naked particle.For example, the sawing for silicon, usually using 80 μm to 120 μm it
Between silk diameter.Therefore, the silk diameter for 80 μm, particle have the size between 6 μm to 12 μm or between 8 μm to 16 μm,
For 120 μm of silk diameter, particle is with the size between up to 12 μm to 15 μm.
For sapphire sawing, using the somewhat greater silk diameter between 120 μm to 180 μm, and for smaller
The silk of diameter, particle then has the size between 15 μm to 25 μm, and has up to 35 μm for bigger silk size, particle
Size between 45 μm.
The limit represents 5% and 95% dimension limit of the accumulated size distribution of particle.Therefore, the 90% of abrasive grains has
Size between the above-mentioned limit.The median size of abrasive grains refer to the 50% of particle with reduced size and 50% with compared with
Large-sized size.Dimensional measurement is carried out according to ANSI B74.20-2004 by " low angle laser light scattering ".
Abrasive grains are at least in part by the alloy coat of the first metal and boron or phosphorus as expectation alloying element covering.Boron
Or the presence of phosphorus make it that coating is amorphous, and help to resist the dissolving of alloy coat in the electrolyte.First metal is nickel
Or cobalt.Most preferably nickel.The non-electrolytic coating of particle, the particularly diamond particles with Ni-B, Ni-P, Co-P, Co-B
Non-electrolytic coating be known, such as be described in GB1198479.
The initial average thickness of alloy coat be 20nm to 800nm, or in 50nm between 200nm.Generally, with about
100nm is that the relatively low average coating thicknesses of intermediate value are preferable.The average thickness of coating drawn by dual weigh, wherein
The quality of coating is divided to the quality of uncoated abrasive grains.Assuming that particle be diameter be equal to its measure size it is spherical,
And consider the relative density of abrasive grains and alloy coat, average thickness can be exported.
The mass percent of phosphorus or boron in coating gross mass is more than 6.5% but less than 14%.
Abrasive grains are to float, or are made into swimming in the fixation bath of the electrolyte including the ion with the first metal
In.Generally this will be acid bath, the sulfamic acid of the sulfate comprising the first metal, the chloride of the first metal or the first metal
Salt or its mixture, boric acid may be supplemented with as cathode buffer or organic or inorganic brightening agent.
The quality of the first metal alloy coating on abrasive grains is resided in abrasive grains in the electrolyte of fixation bath
Period and gradually go to zero.Abrasive grains " being covered at least in part " have the first metal and boron or the alloy coat of phosphorus.It is right
In " covering at least in part ", also covered completely by alloy coat including particle, this is situation in its initial state.In electricity
During plating, the thickness of alloy coat will not equably reduce：Some parts of alloy coat will be dissolved earlier than other parts,
So as to expose the surface of abrasive grains.As long as certain alloy coat on particle be present, particle, which just has, is electrolytically attached to gold
Belong to the possibility on base wire, although this possibility gradually dies down with the reduction of alloy coat.With abrasive grains by
Gradually add, in order to supplement：
- be already fixed on metallic substrates silk and subsequently depart from those particles of fixation bath, and
- no longer it is those electroactive particles,
The covering state of any active abrasive grains will 100% and just above 0% between.
Now, by the way that the ion of activated metal is added in fixation bath, inventor has found the activity of abrasive grains
It can be significantly extended.As a result, the deposition of abrasive grains can longer in the period of in keep stable, and because alloy applies
Being completely dissolved for layer and have less abrasive grains loss.Activated metal co-deposition is into fixed bed., it is surprising that hair
A person of good sense also found that the cluster of abrasive grains greatly reduces.
Seem to improve the electrophoresis of abrasive grains on the abrasive grains that activated metal coats by being preferentially adsorbed on part
Effect, but never assume the limitation present invention with this.In other words：When a certain surface on the abrasive grains of coating becomes not having
During the first metal coating, activated metal becomes effective.The present inventor speculates activated metal ionic adsorption in the surface of the release, from
And keep and improve the activity of electrophoretic particles.As long as particle is completely covered, activated metal does not just help because particle no matter
How to be activity.
This causes more preferable overall use of the abrasive grains in bath, and with the feelings of activated metal are not present in fixation bath
Condition is compared, and the abrasive grains co-deposition of more part coverings is in fixed bed.In the absence of activated metal in fixation bath
In the case of, more abrasive grains will not be bonded in fixed bed, and are lost.
Inventor also speculates, due in positively charged activated metal ionic adsorption to abrasive grains, so abrasive grains
Tend to repel each other in fixation bath.In this way, activated metal prevents the particle group of being polymerized to before the deposition, because
This prevents cluster.
At the end of the service life of abrasive grains, i.e., when whole first metal coating with phosphorus or boron has been dissolved
When, covering of first metal to particle is more difficult in fixation bath, although activated metal still contributes to particle being moved to
Base wire.However, due to coating being not present on particle, so particle is kept as poorly in fixed bed.
Concentration of the activated metal ion in fixation bath necessarily can not be high.When the metal ion total amount in bath 0.5%
During through being activated metal ion, it is observed that positive effect.When since 100% of the activated metal ion in fixation bath
When, the dilution carried out by dissolving the first metal ion from abrasive grains will reduce the concentration during use.It is in fact, solid
Being no more than for all metal ions in bath 50% needs to be activated metal ion.Activated metal in fixation bath it is lower dense
Spend (such as between 0.5% to 30%, either between 0.5% to 20% or even between 0.5% to 10%) performance
Go out the same good activity function of abrasive grains.Metallic substrates silk is preferentially bonded to due to activated metal ion and is also bonded
To the abrasive grains of part covering, so activated metal atom accounts for the ratio of total metallic atom of metal anchoring layer in fixed bed
Will be higher than in bath in itself.Therefore, the consumption of activated metal is significantly higher than the consumption of the first metal in bath.
In the embodiment of the further improvements in methods of the present invention, by changing the activated metal ion in fixation bath
Concentration, to control the amount for the abrasive grains being attached on the surface of intermediate filament or most filum terminale.In being bathed due to activated metal ion ratio
The first metal ion consume soon, and because existing response of the abrasive grains to activated metal ion is relatively fast, institute
The adding rate that can be bathed with the amount of attaching particles by increasing or decreasing activated metal ion to stationary electrolyte is and reasonable
Time range in control.
Can by using the complicated optical inspection techniques such as disclosed in JP2005074599A come measure intermediate filament or
The amount of abrasive grains at the surface of most filum terminale.The output can be used as the input of the addition scheme to activated metal.
In bath after fixation bath, intermediate filament is efficiently coated metal bonding layer, and the metal bonding layer is by containing one kind
Or one or more electrobaths deposition of the ion of a variety of bond wires.Each bath in there may be different bond wires from
Son.Alternately, there can be the ion of more than one bond wire in single or multiple baths.Bonded layer than fixed thickness,
And effectively particle " original position " is bonded.Bonded layer can not become too thick, because abrasive grains then will be complete at that rate
Immerse in bonded layer, and do not protrude past outside surface.On the other hand, if bonded layer is too thin, it can not fully be protected
Hold particle.
After bonded layer deposition, silk is final, and is wrapped in client's I-beam wheel and is used for further.
In a preferred embodiment, in the bond wire ionic type in one or more baths for depositing bonded layer
It is activated metal ionic without one kind.In another preferred embodiment, one or more bond wire ions are
The ion of first metal, without deliberately existing for any boron or phosphorus.Advantage be coating on abrasive grains and fixed bed all with
Bonded layer is mutually compatible, and is not in that interlayer attachment is difficult.All in all：Bonded layer preferably not boracic, phosphorus and activated metal.
As the first metal and the first metal ion, the atom and ion of nickel are preferable.This is best so far
It metal, because its is firm and tough and tensile, will not corrode, and easily can be deposited from electrobath.
As activated metal, one kind in the group being preferably made up of cobalt, iron, manganese and tin.They all trigger what part covered
The increased activity of abrasive grains.Most preferably cobalt.
According to the second aspect of the invention, the consolidation abrasive saw silk of the result as said process is described.Consolidation grinding
Saw silk includes metallic substrates silk and abrasive grains.Abrasive grains are at least partly covered by the alloy coat of the first metal and phosphorus or boron
Lid.Held the particles in by the bonded layer above fixed bed and fixed bed on base wire.Fixed bed comprises at least the first metal
And cover abrasive grains and base wire.Fixed bed is then capped the bonded layer of bond wire or bond wire alloy again.Fixed bed
With bonded layer all by electrolytic deposition.
It is characterised by that fixed bed contains and including the activated metal different from the first metal on silk.
The type of metallic substrates silk and the type of abrasive grains are as described in the explanation of methods described.Preferably by without electricity
Solution is deposited to deposit at least part coating of the abrasive grains of the first metal alloy with boron or phosphorus.It has been recognised by the inventors that phosphorus and
Running of the presence of boron for the present invention is favourable, because phosphorus and boron are also the composition of electrobath.Preferably, there is phosphorus and boron
The first metal alloy coating be amorphous.This is to prevent and magnetic field and/or (may match and thereby form cluster)
Any interference of magnetic dipolar interaction between particle.By making by the abrasive grains and magnet contact of alloy-coated, energy
Enough it is readily determined the presence of magnetic phase：As fruit granule is attracted, then they are magnetic.
In a preferred embodiment, bond wire or bond wire alloy are substantially free of activated metal.Another preferred real
Apply in example, bond wire or metal bonding alloy are and the first metal identical element.It is optimal if bond wire is nickel
Choosing.
Activated metal is one kind in the group being made up of cobalt, iron, manganese and tin.It has been found that these metals are as fixation bath
Additive is particularly useful, because they have reactivated the abrasive grains of part covering, is existed so as to extend abrasive grains
Service life in bath.Therefore, return in fixed bed it can be found that the activated metal.Presence band of the activated metal in fixation bath
Carry out improved products, because less cluster on the surface be present, cause the preferable sawing quality with less kerf.
Concentration of the activated metal in fixed bed can be in the weight percent of the 1% to 100% of the gross weight for accounting for fixed bed
Than between, between 1% to 90% percentage by weight, or between 1% to 80% percentage by weight.To the positive of distribution of particles
(i.e. less cluster) is influenceed to occur in the case of the concentration of activated metal is low-down.Therefore, weight of the activated metal in fixed bed
In amount between 1% to 30% or even between 1% to 20% or such as 2% to 10% between 1% to 10%
Between low concentration scope have shown that consolidation abrasive saw silk surface on cluster reduction.
" the total thickness degree " of " gross thickness of bonded layer and fixed bed " or abbreviation refers in the circumferential area of no abrasive grains
The radial thickness that can be measured in domain on the cross section of saw silk.Preferably, the gross thickness of bonded layer and fixed bed and grinding
The median size of grain is relevant.Preferably, total thickness degree is between the 25% to 75% of the median size of abrasive grains, more preferably
Between the 25% to 50% of the median size of particle, such as between the 25% to 33% of the median size of particle.Therefore, example
Such as, for the particle that median size is 9 μm, total thickness degree is preferably between 2.25 μm to 6.75 μm；It is 12 μ for median size
M particle, total thickness degree is preferably between 3 μm to 9 μm.
Under any circumstance, fixed bed is all than bonded layer much thinner, and its thickness is relative to fixed and bonded layer total
Thickness is less than 40%, is, for example, less than 30%, and all such as less than 20%, or even less than 10%.Fixed bed is fixed and bonded layer
At least the 1% of gross thickness, otherwise particle can not fully be kept.Fixed bed refers to such as lower floor：Wherein with scanning electron microscopy
The energy dispersion X of mirror (EDX-SEM) coupling is penetrated in mercerising spectrometer it can be seen that the percentage by weight of activated metal minimum is 1%
It is or higher.
In a preferred embodiment, activated metal is concentrated near metallic substrates silk.It is all in fixed bed and bonded layer
Activated metal atom is present near metallic substrates more than 70% in the 30% of fixed bed and total thickness degree of bonded layer.Gu
Even more than the 80% of all activated metal atoms fixed and in bonded layer can be in fixed and bonded layer total thickness degree
It is present in 20% near metallic substrates.Equally, this can be by carrying out EDX-SEM scannings come really on the cross section of saw silk
It is fixed.
Activated metal is existed in around abrasive grains.When activated metal is adsorbed onto the abrasive grains of part coating, its
It is integrated near the abrasive grains being maintained in fixed and bonded layer.Activation equally can be detected in EDX-SEM scannings
Metal.
In fact, the thickness of fixed bed will be between 0.2 μm to 2.0 μm, such as between 0.3 μm to 2.0 μm, or 0.3 μm
To between 1.5 μm, or between 0.3 μm to 1 μm.
In fact, making every effort to every kilometer of silk has 0.1 to 1.0 gram of abrasive grains, but this can change with application.
Brief description of the drawings
Fig. 1 shows the implementation of method；
Fig. 2 shows the following concentration measured by EDX-SEM：
A.SEM photos：Fig. 2 a；
B. nickel：Fig. 2 b；
C. phosphorus：Fig. 2 c
D. cobalt：Fig. 2 d
Fig. 3 shows the cumulative distribution of activated metal (Co) and the first metal (Ni) in whole coating.
Embodiment
Methods described will be illustrated based on particular example now.
Fig. 1 illustrates how to realize methods described.Implementation includes some conventional preparation process, such as from I-beam wheel 102
Steel wire is unclamped, the cleaning wire in alkaline degreasing bath, then carries out pickling 106.Alternatively, silk can apply in advance in bath 108
It is covered with flash metal luster coating.These optional steps are well known by persons skilled in the art.Resulting silk 104 is used as the side
The long and thin metal base wire of method starting products.Steel wire is that to scribble the tensile strength of brass be about 120 μm of 3950N/mm2 common
Carbon steel wire (carbon of 0.80% percentage by weight).Before abrasive grains are deposited, with 700nm nickel dam coated wire, so as to
There is mutually compatible surface in fixation bath.
Base wire 104 is introduced in fixation bath 110, and fixation bath 110 includes：
A. the abrasive grains at least partly covered by the alloy coat of the first metal and phosphorus or boron.In this special circumstances
Under, abrasive grains are pulverized and are sized to diamond sand grains of the size range at 12 μm to 15 μm.They are coated
There is nickel phosphor coating, the ratio of its floating coat and diamond weight is 18% (by weight percentage).Phosphorus in nickel-alloy coating
Concentration be total coating weight 10% (by weight percentage).The concentration of diamond particles in fixation bath is with wanting in silk
The amount of the particle of upper deposition is related.
B. abrasive grains are to float or swim in it mainly to include the first metal (being in this case nickel)
In the electrolyte of metal ion.The typical combination of nickel deposition bath is：
| Sulfamate nickel electrolytic matter | Measure (unit) |
| Nickel sulfamic acid (Ni (SO3NH2)2·4H2O) | 440g/l |
| NiCl2·6H2O | 20g/l |
| H3BO3 | 30–40g/l |
| pH | 3.2–3.80 |
| Temperature | 45℃ |
C. a small amount of about 20g/l CoCl is added into the bath2·6H2O salt.The salt and the other compositions bathed are mutually simultaneous well
Hold, and obtain the Co of the about 5g/l in the total concentration of cobalt and nickel2+With 85g/l Ni2+Or 5.6% percentage by weight Co2+'s
Concentration.Cobalt is used as activated metal in the present embodiment.
When leaving fixation bath, the surface distribution of the intermediate filament has a diamond particles, and diamond particles are only very slight
Ground adheres on the surface.In subsequent bonding bath 114, silk and abrasive grains are as one man coated with thicker bonding metal layer
Or bond wire alloy-layer.For convenience's sake, nickel is for the purpose.The quantity of bath, current density, concentration etc. are this area skills
Known to art personnel, and for adjusting the thickness of bonded layer.
Although describing this method in a horizontal manner, i.e. the motion of silk is horizontal, is not precluded within some of implementation
In part, silk substantially vertically extends.
In fig. 2, the Elemental redistribution obtained by EDX-SEM technologies shows that active metal actually arrives in the transversal of silk
In face.Fig. 2 a are the SEM photographs in region interested.Fig. 2 b are shown through the transversal of diamond particles 204 and base wire 202
The distribution of nickel in face.Nickel dam 204 is complete and as one man surrounds diamond particles.Fig. 2 c are shown only near diamond particles
It was found that phosphorus distribution.Coating is thinner than 1 μm.Fig. 2 d show the distribution of activated metal cobalt.Cobalt is primarily present on the surface of silk
In thin skin layer less than 1 μ m-thick.In addition, it can be seen that even more thin cobalt layers on the surface of wear particle.Exactly should
Layer has activated abrasive grains and has improved the active lifetime of abrasive grains.
Fig. 3 shows that most of cobalt (i.e. activated metal) is deposited near metallic substrates silk.Here, along with base wire
The vertical silk detection " relative accumulation counts (RCC) " in surface.The amount of cobalt atom of the quantity of counting to detecting is proportional.To base
The distance of bottom silk is represented with T (unit is μm).Accumulation is outwards taken since base wire surface and then accumulates and divided by amounts to
Number, and as a percentage.The amount that nickel counts also cumulatively represents (empty silk) in same figure.
At about 5.11 μm, nickle atom is no longer detected, and nickel curve flattens.Therefore, the thickness of total coating is about
5.11 μ m-thick.The 90% of all cobalt atoms have been counted at about 1 μm.Therefore, all cobalts more than 90% are present in 1 μm
In layer, i.e., in the 19.6% of thickness degree.Therefore, cobalt layers are very thin.It further indicates two restricted situations, i.e., all cobalt atoms
(L80/20) is found in 20% layer of total coating layer thickness that can be more than base wire more than 80%, and all cobalt atoms
It can be found more than 70% in the layer of the 30% of total coating layer thickness.Pay attention to, it is necessary to enterprising in the silk for not including diamond particles
Row tracking, wherein also with the presence of some cobalts.
When running this method in the case of cobalt is not present in fixation bath, diamond deposition undergoes strong Peak Activity,
A large amount of diamonds are wherein deposited, subsequent deposition efficiency drastically drops to zero, because the coating on abrasive grains is corroded.This
Cause the unmanageable diamond deposition with cluster and cause nonuniform deposition of the diamond particles in the length of silk.When making
During with method of the invention, deposition is also started with Peak Activity, but fall time is more much longer than the method for prior art, and is subtracted
It is few slowlyer.As a result, deposition of the diamond in length is more uniform, and observes less cluster.
Claims (14)
1. a kind of method for manufacturing consolidation abrasive saw silk, comprises the following steps：
- continuously unclamp elongated metallic substrates silk；
- abrasive grains covered at least in part by the alloy coat of the first metal and phosphorus or boron are provided；
- fixation bath of the metallic substrates silk by the ion including the abrasive grains and first metal is guided, to
The co-deposited abrasive grains are electrolysed in metal anchoring layer on the metallic substrates silk, are consequently formed intermediate filament；
- guide the intermediate filament to pass through the one or more of the ion containing one or more bond wires to bathe, to by described in
Abrasive grains are electrolytically bonded in metal bonding layer, so as to form most filum terminale；
- the most filum terminale is continuously wrapped on a carrier；
Characterized in that,
The fixation bath also includes the ion of activated metal, and the activated metal is different from first metal ion, the work
Change metal ion co-deposition in the metal anchoring layer and on the abrasive grains, the activated metal ion is used to activate
The surface of the abrasive grains covered at least in part, and it is each in wherein one or more of bond wire ions
It is individual to be different from the activated metal ion.
2. according to the method for claim 1, wherein, one or more of bond wire ions are the first metal ions.
3. method according to any one of claim 1 to 2, wherein, first metal ion is nickel.
4. according to the method in any one of claims 1 to 3, wherein, the activated metal is by cobalt, tin, manganese and iron structure
Into group in one kind.
5. method according to any one of claim 1 to 4, wherein, the concentration of the activated metal ion is higher than described
Total 0.5% of metal ion in fixation bath but less than 100%.
6. method according to any one of claim 1 to 5, wherein, by changing the activation in the fixation bath
The concentration of metal ion, to control the amount of abrasive grains present on the surface of the intermediate filament or most filum terminale.
7. one kind consolidation abrasive saw silk, including metallic substrates silk and abrasive grains, the abrasive grains are at least in part by first
Metal covers with the alloy coat of phosphorus or boron, and the abrasive grains are maintained at institute by the fixed bed including first metal
State on metallic substrates silk, the fixed bed covers the abrasive grains and the base wire, the fixed bed are further bonded
The bonded layer of metal or bond wire alloy is covered, and the fixed bed and bonded layer are electrolytically deposited,
Characterized in that,
The fixed bed also includes the activated metal different from first metal, and wherein described bonded layer or bond wire
Alloy there is no the activated metal.
8. consolidation abrasive saw silk according to claim 7, wherein, bond wire or the bond wire alloy is equal to described
First metal.
9. consolidation abrasive saw silk according to claim 8, wherein, first metal, the bond wire or bonding gold
It is nickel to belong to alloy.
10. the consolidation abrasive saw silk according to any one of claim 7 to 9, wherein, the activated metal be by cobalt, tin,
One kind in the group that manganese and iron are formed.
11. the consolidation abrasive saw silk according to any one of claim 7 to 10, wherein, the activated metal is described solid
Between the 1% to 90% of the gross weight of metal of the weight percent concentration in the fixed bed in given layer.
12. the consolidation abrasive saw silk according to any one of claim 7 to 11, wherein, the fixed bed and the bonding
The gross thickness of layer is between the 25% to 75% of the median size of the abrasive grains.
13. the consolidation abrasive saw silk according to any one of claim 7 to 12, wherein, the thickness of the fixed bed is less than
The 40% of the gross thickness of the fixed bed and bonded layer.
14. the consolidation abrasive saw silk according to any one of claim 7 to 13, wherein, the activated metal atom surpasses
70% is crossed in the 30% of the fixed bed and the gross thickness of bonded layer to be present near the metallic substrates silk.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15158993 | 2015-03-13 | ||
| EP15158993.4 | 2015-03-13 | ||
| PCT/EP2016/053626 WO2016146343A1 (en) | 2015-03-13 | 2016-02-22 | Method to produce a fixed abrasive saw wire with a metal alloy fixation layer and the wire resulting therefrom |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107427943A true CN107427943A (en) | 2017-12-01 |
| CN107427943B CN107427943B (en) | 2019-07-05 |
Family
ID=52736850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680015477.4A Active CN107427943B (en) | 2015-03-13 | 2016-02-22 | The manufacturing method of consolidation abrasive saw silk with metal alloy fixing layer and manufactured saw silk |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6698682B2 (en) |
| CN (1) | CN107427943B (en) |
| WO (1) | WO2016146343A1 (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102292185A (en) * | 2009-02-13 | 2011-12-21 | 贝卡尔特公司 | Fixed abrasive sawing wire |
| CN202097468U (en) * | 2011-04-29 | 2012-01-04 | 贝卡尔特公司 | Gold steel wire |
| CN102413982A (en) * | 2009-04-29 | 2012-04-11 | 贝卡尔特公司 | A fixed abrasive sawing wire with a rough interface between core and outer sheath |
| CN102528940A (en) * | 2010-11-22 | 2012-07-04 | 贝卡尔特公司 | A structured sawing wire |
| CN202640582U (en) * | 2010-10-28 | 2013-01-02 | 贝卡尔特公司 | A fixed abrasive sawing wire |
| CN103189158A (en) * | 2010-10-29 | 2013-07-03 | 贝卡尔特公司 | A sawing wire with abrasive particles electrodeposited onto a substrate wire |
| CN104411436A (en) * | 2012-07-05 | 2015-03-11 | 贝卡尔特公司 | Fixed abrasive sawing wire with cubo-octahedral diamond particles |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE916143C (en) | 1951-11-29 | 1954-08-05 | Winter & Sohn Ernst | Sawing tools, in particular jigsaws, and processes for their manufacture |
| US3556839A (en) | 1966-11-01 | 1971-01-19 | Ind Distributors 1946 Ltd | Electroless metal coating |
| JPH01271117A (en) | 1988-04-22 | 1989-10-30 | Kanai Hiroyuki | Wire for wire saw |
| WO1998035784A1 (en) | 1997-02-14 | 1998-08-20 | Sumitomo Electric Industries, Ltd. | Wire-saw and its manufacturing method |
| TW431924B (en) | 1998-03-11 | 2001-05-01 | Norton Co | Superabrasive wire saw and method for making the saw |
| JP4236540B2 (en) | 2003-09-02 | 2009-03-11 | 株式会社ノリタケスーパーアブレーシブ | Wire saw |
| JP4139810B2 (en) | 2004-12-28 | 2008-08-27 | 旭ダイヤモンド工業株式会社 | Electrodeposition wire tool |
| KR20090026490A (en) | 2007-09-10 | 2009-03-13 | 김정묵 | A device for wire saw coated with diamond |
| KR20090026498A (en) | 2007-09-10 | 2009-03-13 | 김정묵 | A manufacturing process for wire saw coated with diamond |
| JP5390138B2 (en) | 2008-08-05 | 2014-01-15 | 旭ダイヤモンド工業株式会社 | Abrasive grain, electrodeposition tool, method for producing abrasive grain, and method for producing electrodeposition tool |
| JP5066508B2 (en) | 2008-11-19 | 2012-11-07 | 株式会社リード | Fixed abrasive wire saw |
| KR101322529B1 (en) | 2009-10-06 | 2013-10-28 | 재팬 파인 스틸 컴퍼니 리미티드 | Fixed abrasive grain wire, process for producing the fixed abrasive grain wire, and abrasive grains for use in fixed abrasive grain wire |
| WO2011055692A1 (en) | 2009-11-05 | 2011-05-12 | 株式会社中村超硬 | Super-abrasive grain fixed type wire saw, and method of manufacturing super-abrasive grain fixed type wire saw |
| TWI461249B (en) | 2010-04-27 | 2014-11-21 | Kinik Co | Wire saw and method for fabricating the same |
| TWI466990B (en) | 2010-12-30 | 2015-01-01 | Saint Gobain Abrasives Inc | Abrasive article and method of forming |
| TW201325780A (en) | 2011-12-16 | 2013-07-01 | pei-song Zhou | Diamond nickel-cobalt jigsaw and production method |
| KR101222061B1 (en) | 2012-07-19 | 2013-01-14 | 이화다이아몬드공업 주식회사 | Diamond tool and method of fabricating the same |
| WO2014036714A1 (en) | 2012-09-07 | 2014-03-13 | Nv Bekaert Sa | A shaped sawing wire with subsurface tensile residual stresses |
| WO2014063910A1 (en) * | 2012-10-24 | 2014-05-01 | Nv Bekaert Sa | A flat fixed abrasive sawing wire |
| FR3005592B1 (en) | 2013-05-14 | 2015-04-24 | Commissariat Energie Atomique | ABRASIVE SAWING WIRE |
-
2016
- 2016-02-22 JP JP2017548002A patent/JP6698682B2/en active Active
- 2016-02-22 WO PCT/EP2016/053626 patent/WO2016146343A1/en active Application Filing
- 2016-02-22 CN CN201680015477.4A patent/CN107427943B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102292185A (en) * | 2009-02-13 | 2011-12-21 | 贝卡尔特公司 | Fixed abrasive sawing wire |
| CN102413982A (en) * | 2009-04-29 | 2012-04-11 | 贝卡尔特公司 | A fixed abrasive sawing wire with a rough interface between core and outer sheath |
| CN202640582U (en) * | 2010-10-28 | 2013-01-02 | 贝卡尔特公司 | A fixed abrasive sawing wire |
| CN103189158A (en) * | 2010-10-29 | 2013-07-03 | 贝卡尔特公司 | A sawing wire with abrasive particles electrodeposited onto a substrate wire |
| CN102528940A (en) * | 2010-11-22 | 2012-07-04 | 贝卡尔特公司 | A structured sawing wire |
| CN202097468U (en) * | 2011-04-29 | 2012-01-04 | 贝卡尔特公司 | Gold steel wire |
| CN104411436A (en) * | 2012-07-05 | 2015-03-11 | 贝卡尔特公司 | Fixed abrasive sawing wire with cubo-octahedral diamond particles |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107427943B (en) | 2019-07-05 |
| JP6698682B2 (en) | 2020-05-27 |
| WO2016146343A1 (en) | 2016-09-22 |
| JP2018507788A (en) | 2018-03-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI291389B (en) | Fixed abrasive-grain wire | |
| CA2768826C (en) | Precision wire including surface modified abrasive particles | |
| TWI507269B (en) | Abrasive articles including abrasive particles bonded to an elongated substrate body having a barrier layer, and methods of forming thereof | |
| RU2516318C2 (en) | Abrasive article (versions) and method of sapphire cutting therewith | |
| EP2075092B1 (en) | Cutting wheels, their manufacture and use | |
| CN103266341B (en) | Preparation method for producing diamond cutting line through steel wire magnetization | |
| JP6352176B2 (en) | Fixed abrasive wire saw, manufacturing method thereof, and work cutting method using the same | |
| JP2012525263A (en) | Fixed abrasive sawing wire with rough interface between core and outer sheath | |
| KR101734454B1 (en) | Nickel plating liquid, and method for manufacturing wire coated with solid microparticles | |
| US20130008422A1 (en) | Cemented carbide base outer blade cutting wheel and making method | |
| TWI605113B (en) | Fixed abrasive sawing wire with cubo-octahedral diamond particles | |
| KR102135652B1 (en) | Diamond abrasive and wire tools for wire tools | |
| JP5802275B2 (en) | Solid particulate adhering wire and method for producing the solid particulate adhering wire | |
| CN107427943B (en) | The manufacturing method of consolidation abrasive saw silk with metal alloy fixing layer and manufactured saw silk | |
| CN110438550B (en) | Preparation method of ultra-sharp diamond wire saw and diamond wire saw | |
| JP2013144352A (en) | Method for manufacturing saw wire and manufacturing apparatus therefor | |
| CN209851339U (en) | Novel composite diamond wire | |
| TWI533960B (en) | A fixed abrasive sawing wire and a method to produce such wire | |
| CN104955601B (en) | There is the fixed abrasive sawline at nickel oxide interface between nickel subgrade | |
| JP2011079929A (en) | Double coating diamond polishing agent particle and production method thereof | |
| JP3019593B2 (en) | Electroplated whetstone and method of manufacturing the same | |
| JP2013500170A (en) | Wire saw | |
| KR101277468B1 (en) | Wire cutting tool and method of fabricating the same | |
| CN109352545A (en) | A kind of electro-deposition diamond rope saw and manufacturing method | |
| JP2019126878A (en) | Abrasive grain for electrodeposited wire tool |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |