CN107421379A - A kind of composite guide hot plate for heat exchanger - Google Patents

A kind of composite guide hot plate for heat exchanger Download PDF

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Publication number
CN107421379A
CN107421379A CN201710337577.5A CN201710337577A CN107421379A CN 107421379 A CN107421379 A CN 107421379A CN 201710337577 A CN201710337577 A CN 201710337577A CN 107421379 A CN107421379 A CN 107421379A
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China
Prior art keywords
parts
conducting adhesive
heat
conducting
organo
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Granted
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CN201710337577.5A
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CN107421379B (en
Inventor
颜开红
赵桂锋
邓玉明
赵建军
谢勇军
王嫣
杨海龙
张�荣
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NANTONG SHUGUANG ELECTROMECHINCAL ENGINEERING Co Ltd
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NANTONG SHUGUANG ELECTROMECHINCAL ENGINEERING Co Ltd
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Abstract

The present invention relates to a kind of composite guide hot plate for heat exchanger, belong to technical field of heat exchangers, the organo-mineral complexing heat-conducting plate includes magnesia alumina selenizing molybdenum composite material layer, the first conducting adhesive layer, polycarbonate resin substrate, the second conducting adhesive layer, the metal substrate stacked gradually, multiple through holes through the polycarbonate resin substrate are offered in wherein described polycarbonate resin substrate, conducting adhesive post is filled with the through hole, the conducting adhesive post connects the first conducting adhesive layer and the second conducting adhesive layer.Compared with prior art, beneficial effects of the present invention are：The present invention uses multi-layer compound structure, and the organo-mineral complexing heat-conducting plate of the present invention, excellent thermal conductivity are formed using the Material cladding of difference in functionality.

Description

A kind of composite guide hot plate for heat exchanger
Technical field
The present invention relates to technical field of heat exchangers, and in particular to a kind of composite guide hot plate for heat exchanger.
Background technology
Heat exchanger is the equipment that the partial heat of hot fluid is passed to cold fluid, also known as heat exchanger.Heat exchanger is being changed Occupy critical role in work, oil, power, food and other many industrial productions, heat exchanger can conduct in Chemical Manufacture for it Heater, cooler, condenser, evaporator and reboiler etc., are widely used.Heat exchanger be a kind of two kinds in different temperatures or The energy-saving equipment of heat transfer between material is realized between two or more fluids, is heat is passed to temperature by the higher fluid of temperature Relatively low fluid is spent, fluid temperature (F.T.) is reached the index of flow specification, to meet the needs of process conditions, while is also to improve energy One of capital equipment of source utilization rate.It is near that heat exchanger industry is related to HVAC, pressure vessel, sewerage disposing equipment, chemical industry, oil etc. 30 multi industries, mutually form industry chain (supply chain).A kind of composite plastic bellows of excellent combination property how is designed, is industry Urgent problem to be solved.But the heat conductivility of existing heat exchanger is to be improved, therefore, it is excellent how to design a kind of heat conductivility The different composite guide hot plate for heat exchanger, is industry urgent problem to be solved.
The content of the invention
The purpose of the present invention is to overcome above-mentioned the deficiencies in the prior art, there is provided a kind of composite guide hot plate for heat exchanger.
To achieve the above object, a kind of composite guide hot plate for heat exchanger proposed by the present invention, the organic and inorganic compound Close magnesia-alumina-selenizing molybdenum composite material layer, the first conducting adhesive layer, makrolon that heat-conducting plate includes stacking gradually Resin substrate, the second conducting adhesive layer, metal substrate, wherein being offered in the polycarbonate resin substrate multiple through described The through hole of polycarbonate resin substrate, conducting adhesive post, the conducting adhesive post connection described first are filled with the through hole Conducting adhesive layer and the second conducting adhesive layer；
The magnesia-alumina-selenizing molybdenum composite material layer by the material composition calculated in percentage by weight it is blended, into Type, sintering form：Magnesia 60-90 parts；Aluminum oxide 40-60 parts；Selenizing molybdenum 20-40 parts；Unintentional doping graphene oxide 10- 20 parts；CNT 10-20 parts；Perfluorinate fullerene 5-15 parts；Surfactant 5-10 parts；Inorganic dispersant 5-10 parts；Third Olefin(e) acid resin type binding agent 10-20 parts；
The first conducting adhesive layer, the second conducting adhesive layer and conducting adhesive post use identical conducting adhesive composite wood Material, the conducting adhesive composite is by composed of the following components in percentage by weight：100 parts of acrylic resin；It is poly- Propenyl 10-20 parts；Polypropylene 10-20 parts；Polystyrene 10-30 parts；Unintentional doping graphene oxide 10-20 parts；Carbon is received Mitron 10-20 parts；Perfluorinate fullerene 5-15 parts；Glass fibre 5-10 parts；Age resister 5-10 parts；Crosslinking agent 1-5 parts.
Preferably, the surfactant is fatty glyceride, fatty acid sorbitan and polyoxyethylene-polyoxy third One kind in alkene copolymer.
Preferably, the inorganic dispersant is one in waterglass, sodium tripolyphosphate, calgon and sodium pyrophosphate Kind.
Preferably, the thickness of the magnesia-alumina-selenizing molybdenum composite material layer is 0.5-5 millimeters, described first The thickness of conducting adhesive layer and the second conducting adhesive layer is 300-800 microns, the thickness of the polycarbonate resin substrate For 1-5 millimeters, the thickness of the metal substrate is 0.5-3 millimeters.
Preferably, multiple through holes through the polycarbonate resin substrate are arranged in arrays, the through hole Aperture is 2-8 millimeters.
Preferably, the particle diameter of the magnesia is 5-100 microns, the particle diameter of the aluminum oxide is 10-50 microns, described The particle diameter of selenizing molybdenum is 20-80 microns.
Preferably, the age resister is 2- (2'- hydroxyl -5'- aminomethyl phenyls) BTA, 2- (2'- hydroxyls -3'- The tert-butyl group -5'- aminomethyl phenyls) -5- chlorinated benzotriazoles, 2- (2'- hydroxyls -3', 5'- diamyl phenyl) BTA, dioxy Change the one or more in titanium nano particle, Zinc oxide nanoparticle, triphenyl phosphite, trisnonyl phenyl phosphite.
Preferably, the crosslinking agent is peroxidating -3,5,5- trimethylhexanoates, peroxidating -2- ethylhexyls Carbonic acid tert-pentyl ester, 2,5- dimethyl -2,5- bis(t-butylperoxy)s hexane, peroxide -2-ethyl hexanoic acid tert-butyl, peroxidating One or more in the pivalic acid tert-butyl ester.
Preferably, the material of the metal substrate is one kind in aluminium, copper, stainless steel and iron.
Beneficial effects of the present invention are as follows：
The present invention is by adding unintentional doping graphene oxide and carbon into magnesia-alumina-selenizing molybdenum composite material layer Nanotube, by both mating reactions, its thermal conductivity is effectively improved, and perfluorinate fullerene must add, and can improve oxidation The heat endurance of magnesium-aluminum oxide-selenizing molybdenum composite material layer, and then improve magnesia-alumina-selenizing molybdenum composite material layer Service life, while using magnesia, aluminum oxide and selenizing molybdenum three as matrix material, it has, and material hardness is high, heat The advantages such as the coefficient of expansion is low, and then make it that magnesia-alumina-selenizing molybdenum composite material layer application prospect is extensive.
The present invention is by adding unintentional doping graphene oxide, CNT and complete into conducting adhesive composite Fluorinated fullerene, while the caking property of conducting adhesive composite is ensured so that it has excellent heat conductivility and heat Stability.
The present invention using base layer of the existing polycarbonate resin substrate as organo-mineral complexing heat-conducting plate, by Set in polycarbonate resin substrate and run through through hole so that the conducting adhesive layer of polycarbonate resin substrate both sides is glued by heat conduction Post connection is tied, by the use of polycarbonate resin substrate as base layer, under conditions of reducing production cost, may insure simultaneously Heat is conducted by the conducting adhesive post in through hole, and then causes the organo-mineral complexing heat-conducting plate to have excellent heat conduction Performance.
The present invention forms organo-mineral complexing by the way of inorganic material layer, organic material layer and metal level are mutually laminated Heat-conducting plate, excellent combination property, stability is strong, is a kind of new organo-mineral complexing heat-conducting plate.
Brief description of the drawings
Fig. 1 is the structural representation of the composite guide hot plate for heat exchanger of the present invention；
Fig. 2 is the top view of the polycarbonate resin substrate of the present invention.
Embodiment
Referring to Fig. 1-2, a kind of composite guide hot plate for heat exchanger proposed by the present invention, the organo-mineral complexing heat conduction Plate includes magnesia-alumina-selenizing molybdenum composite material layer 1, the first conducting adhesive layer 2, the polycarbonate resin stacked gradually Substrate 3, the second conducting adhesive layer 5, metal substrate 6, wherein being offered in the polycarbonate resin substrate 3 multiple through described The through hole 31 of polycarbonate resin substrate 3, conducting adhesive post 4 is filled with the through hole 31, and the conducting adhesive post 4 connects institute State the first conducting adhesive layer 2 and the second conducting adhesive layer 5；
The magnesia-alumina-selenizing molybdenum composite material layer 1 by the material composition calculated in percentage by weight it is blended, Shaping, sintering form：Magnesia 60-90 parts；Aluminum oxide 40-60 parts；Selenizing molybdenum 20-40 parts；Unintentional doping graphene oxide 10-20 parts；CNT 10-20 parts；Perfluorinate fullerene 5-15 parts；Surfactant 5-10 parts；Inorganic dispersant 5-10 parts； Acrylic resin type binding agent 10-20 parts；
The first conducting adhesive layer 2, the second conducting adhesive layer 5 and conducting adhesive post 4 are compound using identical conducting adhesive Material, the conducting adhesive composite is by composed of the following components in percentage by weight：100 parts of acrylic resin； POLYPROPYLENE GLYCOL 10-20 parts；Polypropylene 10-20 parts；Polystyrene 10-30 parts；Unintentional doping graphene oxide 10-20 parts；Carbon Nanotube 10-20 parts；Perfluorinate fullerene 5-15 parts；Glass fibre 5-10 parts；Age resister 5-10 parts；Crosslinking agent 1-5 parts.
Wherein, the surfactant is that fatty glyceride, fatty acid sorbitan and PULLRONIC F68 are total to One kind in polymers.The inorganic dispersant is one kind in waterglass, sodium tripolyphosphate, calgon and sodium pyrophosphate. The thickness of the magnesia-alumina-selenizing molybdenum composite material layer 1 is 0.5-5 millimeters, the first conducting adhesive layer 2 and institute The thickness for stating the second conducting adhesive layer 5 is 300-800 microns, and the thickness of the polycarbonate resin substrate 3 is 1-5 millimeters, institute The thickness for stating metal substrate 6 is 0.5-3 millimeters.Multiple through holes 31 through the polycarbonate resin substrate 3 are in matrix Arrangement, the matrix is specially 5 × 5, described logical, and 31 aperture is 2-8 millimeters, and being shaped as the through hole 31 is circular, square One kind in shape, rectangle.The particle diameter of the magnesia is 5-100 microns, and the particle diameter of the aluminum oxide is 10-50 microns, institute The particle diameter for stating selenizing molybdenum is 20-80 microns.The age resister is 2- (2'- hydroxyl -5'- aminomethyl phenyls) BTA, 2- (the 2'- hydroxyl -3'- tert-butyl group -5'- aminomethyl phenyls) -5- chlorinated benzotriazoles, 2- (2'- hydroxyls -3', 5'- diamyl phenyl) benzene And one kind in triazole, titania nanoparticles, Zinc oxide nanoparticle, triphenyl phosphite, trisnonyl phenyl phosphite It is or several.The crosslinking agent be peroxidating -3,5,5 Trimethylhexanoic acid tert-butyl ester, peroxidating -2- ethylhexyl carbonates tert-pentyl ester, 2,5- dimethyl -2,5- bis(t-butylperoxy)s hexane, peroxide -2-ethyl hexanoic acid tert-butyl, the tertiary fourth of peroxidating pivalic acid One or more in ester.The material of the metal substrate 6 is one kind in aluminium, copper, stainless steel and iron.
Embodiment 1
Referring to Fig. 1-2, a kind of composite guide hot plate for heat exchanger proposed by the present invention, the organo-mineral complexing heat-conducting plate bag Include magnesia-alumina-selenizing molybdenum composite material layer 1, the first conducting adhesive layer 2, the polycarbonate resin substrate stacked gradually 3rd, the second conducting adhesive layer 5, metal substrate 6, multiple the poly- carbon is run through wherein being offered in the polycarbonate resin substrate 3 The through hole 31 of acid ester resin substrate 3, conducting adhesive post 4 is filled with the through hole 31, the conducting adhesive post 4 connects described One conducting adhesive layer 2 and the second conducting adhesive layer 5；
The magnesia-alumina-selenizing molybdenum composite material layer 1 by the material composition calculated in percentage by weight it is blended, Shaping, sintering form：70 parts of magnesia；50 parts of aluminum oxide；30 parts of selenizing molybdenum；Unintentional 15 parts of graphene oxide of doping；Carbon is received 15 parts of mitron；10 parts of perfluorinate fullerene；7 parts of surfactant；7 parts of inorganic dispersant；15 parts of acrylic resin type binding agent；
The first conducting adhesive layer 2, the second conducting adhesive layer 5 and conducting adhesive post 4 are compound using identical conducting adhesive Material, the conducting adhesive composite is by composed of the following components in percentage by weight：100 parts of acrylic resin； 15 parts of POLYPROPYLENE GLYCOL；16 parts of polypropylene；20 parts of polystyrene；Unintentional 15 parts of graphene oxide of doping；18 parts of CNT；Entirely 15 parts of fluorinated fullerene；8 parts of glass fibre；8 parts of age resister；3 parts of crosslinking agent.
Wherein, the surfactant is fatty glyceride.The inorganic dispersant is sodium tripolyphosphate.The oxygen The thickness for changing magnesium-aluminum oxide-selenizing molybdenum composite material layer 1 is 2 millimeters, the first conducting adhesive layer 2 and second heat conduction The thickness of tack coat 5 is 500 microns, and the thickness of the polycarbonate resin substrate 3 is 4 millimeters, the thickness of the metal substrate 6 For 2 millimeters.Multiple through holes 31 through the polycarbonate resin substrate 3 are arranged in arrays, and the matrix is specially 5 × 5, described logical, 31 aperture is 5 millimeters, and the through hole 31 is shaped as circle.The magnesia includes the oxidation of two kinds of particle diameters Magnesium, a kind of particle diameter are 20 nanometers, and another kind is 80 microns, and the particle diameter of the aluminum oxide is 40 microns, the particle diameter of the selenizing molybdenum For 60 microns.The age resister is 2- (2'- hydroxyl -5'- aminomethyl phenyls) BTA.The crosslinking agent is peroxidating -3, 5,5- trimethylhexanoates.The material of the metal substrate 6 is aluminium.
Embodiment 2
Referring to Fig. 1-2, a kind of composite guide hot plate for heat exchanger proposed by the present invention, the organo-mineral complexing heat-conducting plate bag Include magnesia-alumina-selenizing molybdenum composite material layer 1, the first conducting adhesive layer 2, the polycarbonate resin substrate stacked gradually 3rd, the second conducting adhesive layer 5, metal substrate 6, multiple the poly- carbon is run through wherein being offered in the polycarbonate resin substrate 3 The through hole 31 of acid ester resin substrate 3, conducting adhesive post 4 is filled with the through hole 31, the conducting adhesive post 4 connects described One conducting adhesive layer 2 and the second conducting adhesive layer 5；
The magnesia-alumina-selenizing molybdenum composite material layer 1 by the material composition calculated in percentage by weight it is blended, Shaping, sintering form：70 parts of magnesia；550 parts of aluminum oxide；35 parts of selenizing molybdenum；Unintentional 12 parts of graphene oxide of doping；Carbon is received 18 parts of mitron；12 parts of perfluorinate fullerene；6 parts of surfactant；8 parts of inorganic dispersant；19 parts of acrylic resin type binding agent；
The first conducting adhesive layer 2, the second conducting adhesive layer 5 and conducting adhesive post 4 are compound using identical conducting adhesive Material, the conducting adhesive composite is by composed of the following components in percentage by weight：100 parts of acrylic resin； 20 parts of POLYPROPYLENE GLYCOL；15 parts of polypropylene；20 parts of polystyrene；Unintentional 16 parts of graphene oxide of doping；18 parts of CNT；Entirely 12 parts of fluorinated fullerene；7 parts of glass fibre；7 parts of age resister；4 parts of crosslinking agent.
Wherein, the surfactant is Pluronic F68.The inorganic dispersant is six inclined phosphorus Sour sodium.The thickness of the magnesia-alumina-selenizing molybdenum composite material layer 1 is 4 millimeters, the first conducting adhesive layer 2 and institute The thickness for stating the second conducting adhesive layer 5 is 700 microns, and the thickness of the polycarbonate resin substrate 3 is 4 millimeters, the metal The thickness of substrate 6 is 2.5 millimeters.Multiple through holes 31 through the polycarbonate resin substrate 3 are arranged in arrays, described Matrix is specially 5 × 5, described logical, and 31 aperture is 6 millimeters, and being shaped as the through hole 31 is circular, in square, rectangle One kind.The particle diameter of the magnesia is 90 microns, and the particle diameter of the aluminum oxide is 20 microns, and the particle diameter of the selenizing molybdenum is 70 Micron.The age resister is 2- (2'- hydroxyls -3', 5'- diamyl phenyl) BTA.The crosslinking agent is 2,5- diformazans Base -2,5- bis(t-butylperoxy) hexanes.The material of the metal substrate 6 is stainless steel.
The present invention into magnesia-alumina-selenizing molybdenum composite material layer by adding unintentional doping graphene oxide And CNT, by both mating reactions, its thermal conductivity is effectively improved, and perfluorinate fullerene must add, and can improve The heat endurance of magnesia-alumina-selenizing molybdenum composite material layer, and then improve magnesia-alumina-selenizing molybdenum composite material The service life of layer, while using magnesia, aluminum oxide and selenizing molybdenum three as matrix material, it has material hardness Height, the advantages such as thermal coefficient of expansion is low, and then make it that magnesia-alumina-selenizing molybdenum composite material layer application prospect is extensive.This hair It is bright by adding unintentional doping graphene oxide, CNT and perfluorinate fullerene into conducting adhesive composite, While the caking property of conducting adhesive composite is ensured so that it has excellent heat conductivility and heat endurance.This hair It is bright using base layer of the existing polycarbonate resin substrate as organo-mineral complexing heat-conducting plate, by polycarbonate resin Being set in substrate and run through through hole so that the conducting adhesive layer of polycarbonate resin substrate both sides is connected by conducting adhesive post, By the use of polycarbonate resin substrate as base layer, under conditions of reducing production cost, while it is logical to may insure that heat passes through Conducting adhesive post in hole is conducted, and then causes the organo-mineral complexing heat-conducting plate to have excellent heat conductivility.This hair It is bright that organo-mineral complexing heat-conducting plate, synthesis are formed by the way of inorganic material layer, organic material layer and metal level are mutually laminated Excellent performance, stability is strong, is a kind of new organo-mineral complexing heat-conducting plate.
Finally it should be noted that：Obviously, above-described embodiment is only intended to clearly illustrate example of the present invention, and simultaneously The non-restriction to embodiment.For those of ordinary skill in the field, can also do on the basis of the above description Go out other various forms of changes or variation.There is no necessity and possibility to exhaust all the enbodiments.And thus drawn Among the obvious changes or variations that Shen goes out is still in protection scope of the present invention.

Claims (9)

  1. A kind of 1. composite guide hot plate for heat exchanger, it is characterised in that：The organo-mineral complexing heat-conducting plate includes layer successively Folded magnesia-alumina-selenizing molybdenum composite material layer, the first conducting adhesive layer, polycarbonate resin substrate, the second heat conduction are glued Layer, metal substrate are tied, wherein being offered in the polycarbonate resin substrate multiple through the polycarbonate resin substrate Through hole, is filled with conducting adhesive post in the through hole, and the conducting adhesive post connects the first conducting adhesive layer and described the Two conducting adhesive layers；
    The magnesia-alumina-selenizing molybdenum composite material layer by the material composition calculated in percentage by weight it is blended, into Type, sintering form：Magnesia 60-90 parts；Aluminum oxide 40-60 parts；Selenizing molybdenum 20-40 parts；Unintentional doping graphene oxide 10- 20 parts；CNT 10-20 parts；Perfluorinate fullerene 5-15 parts；Surfactant 5-10 parts；Inorganic dispersant 5-10 parts；Third Olefin(e) acid resin type binding agent 10-20 parts；
    The first conducting adhesive layer, the second conducting adhesive layer and conducting adhesive post use identical conducting adhesive composite wood Material, the conducting adhesive composite is by composed of the following components in percentage by weight：100 parts of acrylic resin；It is poly- Propenyl 10-20 parts；Polypropylene 10-20 parts；Polystyrene 10-30 parts；Unintentional doping graphene oxide 10-20 parts；Carbon is received Mitron 10-20 parts；Perfluorinate fullerene 5-15 parts；Glass fibre 5-10 parts；Age resister 5-10 parts；Crosslinking agent 1-5 parts.
  2. 2. the organo-mineral complexing heat-conducting plate according to claim 1 for heat exchanger, it is characterised in that：Live on the surface Property agent be fatty glyceride, fatty acid sorbitan and Pluronic F68 in one kind.
  3. 3. the organo-mineral complexing heat-conducting plate according to claim 1 for heat exchanger, it is characterised in that：Described inorganic point Powder is one kind in waterglass, sodium tripolyphosphate, calgon and sodium pyrophosphate.
  4. 4. the organo-mineral complexing heat-conducting plate according to claim 1 for heat exchanger, it is characterised in that：The oxidation The thickness of magnesium-aluminum oxide-selenizing molybdenum composite material layer is 0.5-5 millimeters, the first conducting adhesive layer and second heat conduction The thickness of tack coat is 300-800 microns, and the thickness of the polycarbonate resin substrate is 1-5 millimeters, the metal substrate Thickness is 0.5-3 millimeters.
  5. 5. the organo-mineral complexing heat-conducting plate according to claim 1 for heat exchanger, it is characterised in that：It is multiple to run through institute State that the through hole of polycarbonate resin substrate is arranged in arrays, the aperture of the through hole is 2-8 millimeters.
  6. 6. the organo-mineral complexing heat-conducting plate according to claim 1 for heat exchanger, it is characterised in that：The magnesia Particle diameter be 5-100 microns, the particle diameter of the aluminum oxide is 10-50 microns, and the particle diameter of the selenizing molybdenum is 20-80 microns.
  7. 7. the organo-mineral complexing heat-conducting plate according to claim 1 for heat exchanger, it is characterised in that：It is described anti-aging Agent is 2- (2'- hydroxyl -5'- aminomethyl phenyls) BTA, 2- (the 2'- hydroxyl -3'- tert-butyl group -5'- aminomethyl phenyls) -5- chloros BTA, 2- (2'- hydroxyls -3', 5'- diamyl phenyl) BTA, titania nanoparticles, zinc-oxide nano One or more in grain, triphenyl phosphite, trisnonyl phenyl phosphite.
  8. 8. the organo-mineral complexing heat-conducting plate according to claim 1 for heat exchanger, it is characterised in that：The crosslinking agent It is double for peroxidating -3,5,5 Trimethylhexanoic acid tert-butyl ester, peroxidating -2- ethylhexyl carbonates tert-pentyl ester, 2,5- dimethyl -2,5- One or more in (t-butylperoxy) hexane, peroxide -2-ethyl hexanoic acid tert-butyl, the peroxidating pivalic acid tert-butyl ester.
  9. 9. the organo-mineral complexing heat-conducting plate according to claim 1 for heat exchanger, it is characterised in that：The Metal Substrate The material of plate is one kind in aluminium, copper, stainless steel and iron.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6592696B1 (en) * 1998-10-09 2003-07-15 Motorola, Inc. Method for fabricating a multilayered structure and the structures formed by the method
CN103122075A (en) * 2013-03-19 2013-05-29 苏州格瑞丰纳米科技有限公司 High heat-conducting thin graphene-based composite material, as well as preparation method and application thereof
CN103148470A (en) * 2013-03-07 2013-06-12 江苏尚恩合同能源管理有限公司 Radiating device for LED lamp
CN104553105A (en) * 2015-02-03 2015-04-29 哈尔滨工业大学 Heat-conducting polymer-base composite material and preparation method thereof
CN105514066A (en) * 2016-01-19 2016-04-20 合肥微晶材料科技有限公司 Composite graphene infrared radiation and heat conduction film and manufacturing method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6592696B1 (en) * 1998-10-09 2003-07-15 Motorola, Inc. Method for fabricating a multilayered structure and the structures formed by the method
CN103148470A (en) * 2013-03-07 2013-06-12 江苏尚恩合同能源管理有限公司 Radiating device for LED lamp
CN103122075A (en) * 2013-03-19 2013-05-29 苏州格瑞丰纳米科技有限公司 High heat-conducting thin graphene-based composite material, as well as preparation method and application thereof
CN104553105A (en) * 2015-02-03 2015-04-29 哈尔滨工业大学 Heat-conducting polymer-base composite material and preparation method thereof
CN105514066A (en) * 2016-01-19 2016-04-20 合肥微晶材料科技有限公司 Composite graphene infrared radiation and heat conduction film and manufacturing method thereof

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