CN107421379B - A kind of composite guide hot plate for heat exchanger - Google Patents
A kind of composite guide hot plate for heat exchanger Download PDFInfo
- Publication number
- CN107421379B CN107421379B CN201710337577.5A CN201710337577A CN107421379B CN 107421379 B CN107421379 B CN 107421379B CN 201710337577 A CN201710337577 A CN 201710337577A CN 107421379 B CN107421379 B CN 107421379B
- Authority
- CN
- China
- Prior art keywords
- parts
- conducting adhesive
- adhesive layer
- polycarbonate resin
- heat exchanger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000012790 adhesive layer Substances 0.000 claims abstract description 45
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000010410 layer Substances 0.000 claims abstract description 36
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 36
- 239000011733 molybdenum Substances 0.000 claims abstract description 36
- 229920005668 polycarbonate resin Polymers 0.000 claims abstract description 36
- 239000004431 polycarbonate resin Substances 0.000 claims abstract description 36
- 239000000853 adhesive Substances 0.000 claims abstract description 34
- 230000001070 adhesive effect Effects 0.000 claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 36
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 27
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 24
- 239000002041 carbon nanotube Substances 0.000 claims description 12
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 12
- 229910021389 graphene Inorganic materials 0.000 claims description 12
- 239000000395 magnesium oxide Substances 0.000 claims description 12
- 239000004925 Acrylic resin Substances 0.000 claims description 10
- 229920000178 Acrylic resin Polymers 0.000 claims description 10
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical class C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 claims description 10
- 239000003431 cross linking reagent Substances 0.000 claims description 10
- 239000002270 dispersing agent Substances 0.000 claims description 10
- 239000004094 surface-active agent Substances 0.000 claims description 10
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 239000002105 nanoparticle Substances 0.000 claims description 6
- -1 polypropylene Polymers 0.000 claims description 6
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 239000004793 Polystyrene Substances 0.000 claims description 5
- 239000011230 binding agent Substances 0.000 claims description 5
- 239000003365 glass fiber Substances 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- 229920001451 polypropylene glycol Polymers 0.000 claims description 5
- 229920002223 polystyrene Polymers 0.000 claims description 5
- RYAIMSPHUVXLQI-UHFFFAOYSA-N 4-(aminomethyl)-2-(benzotriazol-2-yl)phenol Chemical group NCC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 RYAIMSPHUVXLQI-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 4
- 239000000194 fatty acid Substances 0.000 claims description 4
- 229930195729 fatty acid Natural products 0.000 claims description 4
- 229910003472 fullerene Inorganic materials 0.000 claims description 4
- 150000002978 peroxides Chemical group 0.000 claims description 4
- 235000019832 sodium triphosphate Nutrition 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 4
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 claims description 3
- KNQFGKYCUMPAHP-UHFFFAOYSA-N 1-[3-(benzotriazol-2-yl)-5-pentylphenyl]pentan-2-ol Chemical compound CCCCCC1=CC(CC(O)CCC)=CC(N2N=C3C=CC=CC3=N2)=C1 KNQFGKYCUMPAHP-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 150000004665 fatty acids Chemical class 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- IUGYQRQAERSCNH-UHFFFAOYSA-N pivalic acid Chemical compound CC(C)(C)C(O)=O IUGYQRQAERSCNH-UHFFFAOYSA-N 0.000 claims description 3
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 claims description 3
- GCLGEJMYGQKIIW-UHFFFAOYSA-H sodium hexametaphosphate Chemical compound [Na]OP1(=O)OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])O1 GCLGEJMYGQKIIW-UHFFFAOYSA-H 0.000 claims description 3
- 229940048086 sodium pyrophosphate Drugs 0.000 claims description 3
- 235000019818 tetrasodium diphosphate Nutrition 0.000 claims description 3
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- GANNOFFDYMSBSZ-UHFFFAOYSA-N [AlH3].[Mg] Chemical compound [AlH3].[Mg] GANNOFFDYMSBSZ-UHFFFAOYSA-N 0.000 claims description 2
- HQPMKSGTIOYHJT-UHFFFAOYSA-N ethane-1,2-diol;propane-1,2-diol Chemical compound OCCO.CC(O)CO HQPMKSGTIOYHJT-UHFFFAOYSA-N 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 229920001993 poloxamer 188 Polymers 0.000 claims description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims 3
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 150000003851 azoles Chemical class 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000002023 wood Substances 0.000 claims 1
- 230000000536 complexating effect Effects 0.000 abstract description 13
- 229910052500 inorganic mineral Inorganic materials 0.000 abstract description 13
- 239000011707 mineral Substances 0.000 abstract description 13
- 150000001875 compounds Chemical group 0.000 abstract description 2
- 238000005253 cladding Methods 0.000 abstract 1
- 239000012530 fluid Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000003491 array Methods 0.000 description 3
- 125000005456 glyceride group Chemical group 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 235000019353 potassium silicate Nutrition 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VKMMHRFKCWQVQI-UHFFFAOYSA-N 1-(3-pentyl-5-phenylphenyl)pentan-2-ol Chemical compound OC(CC=1C=C(C=C(C=1)C1=CC=CC=C1)CCCCC)CCC VKMMHRFKCWQVQI-UHFFFAOYSA-N 0.000 description 1
- 241000790917 Dioxys <bee> Species 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- VNWKTOKETHGBQD-AKLPVKDBSA-N carbane Chemical group [15CH4] VNWKTOKETHGBQD-AKLPVKDBSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a kind of composite guide hot plates for heat exchanger, belong to technical field of heat exchangers, the organo-mineral complexing heat-conducting plate includes magnesia-alumina-selenizing molybdenum composite material layer, the first conducting adhesive layer, polycarbonate resin substrate, the second conducting adhesive layer, metal substrate stacked gradually, multiple through-holes through the polycarbonate resin substrate are wherein offered in the polycarbonate resin substrate, conducting adhesive column is filled in the through-hole, the conducting adhesive column connects the first conducting adhesive layer and the second conducting adhesive layer.Compared with prior art, the invention has the benefit that the present invention uses multi-layer compound structure, organo-mineral complexing heat-conducting plate of the invention, excellent thermal conductivity are formed using the Material cladding of different function.
Description
Technical field
The present invention relates to technical field of heat exchangers, and in particular to a kind of composite guide hot plate for heat exchanger.
Background technique
Heat exchanger is the equipment that the partial heat of hot fluid is passed to cold fluid, also known as heat exchanger.Heat exchanger is being changed
It is occupied an important position in work, petroleum, power, food and other many industrial productions, heat exchanger can be used as in Chemical Manufacture
Heater, cooler, condenser, evaporator and reboiler etc., are widely used.Heat exchanger be a kind of two kinds in different temperatures or
The energy-saving equipment that heat transfer between material is realized between two or more fluids, is that heat is made to pass to temperature by the higher fluid of temperature
Lower fluid is spent, fluid temperature (F.T.) is made to reach the index of flow specification, to meet the needs of process conditions, while being also to improve energy
One of capital equipment of source utilization rate.Heat exchanger industry is related to HVAC, pressure vessel, sewerage disposing equipment, and chemical industry, petroleum etc. is closely
30 multi industries, mutually form industry chain (supply chain).The composite plastic bellows for how designing a kind of excellent combination property, is industry
Urgent problem to be solved.However the heating conduction of existing heat exchanger is to be improved, therefore, it is excellent how to design a kind of heating conduction
The different composite guide hot plate for heat exchanger, is industry urgent problem to be solved.
Summary of the invention
The purpose of the present invention is overcoming above-mentioned the deficiencies in the prior art, a kind of composite guide hot plate for heat exchanger is provided.
To achieve the above object, a kind of composite guide hot plate for heat exchanger proposed by the present invention, the organic and inorganic compound
Closing heat-conducting plate includes magnesia-alumina-selenizing molybdenum composite material layer, the first conducting adhesive layer, polycarbonate stacked gradually
Resin substrate, the second conducting adhesive layer, metal substrate, wherein being offered in the polycarbonate resin substrate multiple through described
The through-hole of polycarbonate resin substrate is filled with conducting adhesive column, the conducting adhesive column connection described first in the through-hole
Conducting adhesive layer and the second conducting adhesive layer；
The magnesia-alumina-selenizing molybdenum composite material layer is mixed by the material composition warp calculated in percentage by weight
It closes, form, be sintered: 60-90 parts of magnesia；40-60 parts of aluminium oxide；20-40 parts of selenizing molybdenum；Unintentional doping graphite oxide
10-20 parts of alkene；10-20 parts of carbon nanotube；Perfluorinated fullerene 5-15 parts；5-10 parts of surfactant；Inorganic dispersant 5-10
Part；10-20 parts of acrylic resin type binder；
The first conducting adhesive layer, the second conducting adhesive layer and conducting adhesive column are compound using identical conducting adhesive
Material, the conducting adhesive composite material is by composed of the following components in percentage by weight: 100 parts of acrylic resin；
10-20 parts of POLYPROPYLENE GLYCOL；10-20 parts of polypropylene；10-30 parts of polystyrene；10-20 parts of unintentional doping graphene oxide；Carbon
10-20 parts of nanotube；Perfluorinated fullerene 5-15 parts；5-10 parts of glass fibre；5-10 parts of age resister；1-5 parts of crosslinking agent.
Preferably, the surfactant is fatty glyceride, fatty acid sorbitan and polyoxyethylene-polyoxy third
One of alkene copolymer.
Preferably, the inorganic dispersant is one in waterglass, sodium tripolyphosphate, calgon and sodium pyrophosphate
Kind.
Preferably, the magnesia-alumina-selenizing molybdenum composite material layer is with a thickness of 0.5-5 millimeters, described first
Conducting adhesive layer and the second conducting adhesive layer with a thickness of 300-800 microns, the thickness of the polycarbonate resin substrate
Be 1-5 millimeters, the metal substrate with a thickness of 0.5-3 millimeters.
Preferably, multiple through-holes through the polycarbonate resin substrate are arranged in arrays, the through-hole
Aperture is 2-8 millimeters.
Preferably, the partial size of the magnesia is 5-100 microns, the partial size of the aluminium oxide is 10-50 microns, described
The partial size of selenizing molybdenum is 20-80 microns.
Preferably, the age resister is 2- (2'- hydroxyl -5'- aminomethyl phenyl) benzotriazole, 2- (2'- hydroxyl -3'-
Tert-butyl -5'- aminomethyl phenyl) -5- chlorinated benzotriazole, 2- (2'- hydroxyl -3', 5'- diamyl phenyl) benzotriazole, dioxy
Change one or more of titanium nano particle, Zinc oxide nanoparticle, triphenyl phosphite, trisnonyl phenyl phosphite.
Preferably, the crosslinking agent is peroxidating -3,5,5- trimethylhexanoate, peroxidating -2- ethylhexyl
Carbonic acid tert-pentyl ester, 2,5- dimethyl -2,5- bis(t-butylperoxy) hexane, peroxide -2-ethyl hexanoic acid tert-butyl, peroxidating
One or more of pivalic acid tert-butyl ester.
Preferably, the material of the metal substrate is one of aluminium, copper, stainless steel and iron.
Beneficial effects of the present invention are as follows:
The present invention is by adding unintentional doping graphene oxide into magnesia-alumina-selenizing molybdenum composite material layer
And carbon nanotube effectively improves its thermal conductivity by the mating reaction of the two, and perfluorinated fullerene must add, and can be improved
Magnesia-alumina-selenizing molybdenum composite material layer thermal stability, and then improve magnesia-alumina-selenizing molybdenum composite material
The service life of layer, while using magnesia, aluminium oxide and selenizing molybdenum three as basis material, with material hardness
Height, the advantages such as thermal expansion coefficient is low, so that magnesia-alumina-selenizing molybdenum composite material layer application prospect is extensive.
The present invention is by adding unintentional doping graphene oxide, carbon nanotube and complete into conducting adhesive composite material
Fluorinated fullerene, while guaranteeing the caking property of conducting adhesive composite material, so that it is with excellent heating conduction and heat
Stability.
The present invention use base layer of the existing polycarbonate resin substrate as organo-mineral complexing heat-conducting plate, by
Setting runs through through-hole in polycarbonate resin substrate, so that the conducting adhesive layer of polycarbonate resin substrate two sides is glued by thermally conductive
Column connection is tied, using polycarbonate resin substrate as base layer, under conditions of reducing production cost, may insure simultaneously
Heat is conducted by the conducting adhesive column in through-hole so that the organo-mineral complexing heat-conducting plate have it is excellent thermally conductive
Performance.
The present invention forms organo-mineral complexing in such a way that inorganic material layer, organic material layer and metal layer are mutually laminated
Heat-conducting plate, excellent combination property, stability is strong, is a kind of novel organo-mineral complexing heat-conducting plate.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the composite guide hot plate for heat exchanger of the invention；
Fig. 2 is the top view of polycarbonate resin substrate of the invention.
Specific embodiment
Referring to Fig. 1-2, a kind of composite guide hot plate for heat exchanger proposed by the present invention, the organo-mineral complexing is thermally conductive
Plate includes magnesia-alumina-selenizing molybdenum composite material layer 1, the first conducting adhesive layer 2, polycarbonate resin stacked gradually
Substrate 3, the second conducting adhesive layer 5, metal substrate 6, wherein being offered in the polycarbonate resin substrate 3 multiple through described
The through-hole 31 of polycarbonate resin substrate 3, conducting adhesive column 4 is filled in the through-hole 31, and the conducting adhesive column 4 connects institute
State the first conducting adhesive layer 2 and the second conducting adhesive layer 5；
The magnesia-alumina-selenizing molybdenum composite material layer 1 is mixed by the material composition warp calculated in percentage by weight
It closes, form, be sintered: 60-90 parts of magnesia；40-60 parts of aluminium oxide；20-40 parts of selenizing molybdenum；Unintentional doping graphite oxide
10-20 parts of alkene；10-20 parts of carbon nanotube；Perfluorinated fullerene 5-15 parts；5-10 parts of surfactant；Inorganic dispersant 5-10
Part；10-20 parts of acrylic resin type binder；
The first conducting adhesive layer 2, the second conducting adhesive layer 5 and conducting adhesive column 4 use identical conducting adhesive
Composite material, the conducting adhesive composite material is by composed of the following components in percentage by weight: acrylic resin 100
Part；10-20 parts of POLYPROPYLENE GLYCOL；10-20 parts of polypropylene；10-30 parts of polystyrene；10-20 parts of unintentional doping graphene oxide；
10-20 parts of carbon nanotube；Perfluorinated fullerene 5-15 parts；5-10 parts of glass fibre；5-10 parts of age resister；Crosslinking agent 1-5
Part.
Wherein, the surfactant is that fatty glyceride, fatty acid sorbitan and PULLRONIC F68 are total
One of polymers.The inorganic dispersant is one of waterglass, sodium tripolyphosphate, calgon and sodium pyrophosphate.
The magnesia-alumina-selenizing molybdenum composite material layer 1 is with a thickness of 0.5-5 millimeters, the first conducting adhesive layer 2 and institute
State the second conducting adhesive layer 5 with a thickness of 300-800 microns, the polycarbonate resin substrate 3 with a thickness of 1-5 millimeters, institute
State metal substrate 6 with a thickness of 0.5-3 millimeters.Multiple through-holes 31 through the polycarbonate resin substrate 3 are in matrix
Arrangement, the matrix is specially 5 × 5, described logical, and 31 aperture is 2-8 millimeters, and the shape of the through-hole 31 is round, square
One of shape, rectangle.The partial size of the magnesia is 5-100 microns, and the partial size of the aluminium oxide is 10-50 microns, institute
The partial size for stating selenizing molybdenum is 20-80 microns.The age resister is 2- (2'- hydroxyl -5'- aminomethyl phenyl) benzotriazole, 2-
(2'- hydroxyl -3'- tert-butyl -5'- aminomethyl phenyl) -5- chlorinated benzotriazole, 2- (2'- hydroxyl -3', 5'- diamyl phenyl) benzene
And one of triazole, titania nanoparticles, Zinc oxide nanoparticle, triphenyl phosphite, trisnonyl phenyl phosphite
Or it is several.The crosslinking agent be peroxidating -3,5,5 Trimethylhexanoic acid tert-butyl ester, peroxidating -2- ethylhexyl carbonate tert-pentyl ester,
2,5- dimethyl -2,5- bis(t-butylperoxy) hexane, peroxide -2-ethyl hexanoic acid tert-butyl, the tertiary fourth of peroxidating pivalic acid
One or more of ester.The material of the metal substrate 6 is one of aluminium, copper, stainless steel and iron.
Embodiment 1
Referring to Fig. 1-2, a kind of composite guide hot plate for heat exchanger proposed by the present invention, the organo-mineral complexing is thermally conductive
Plate includes magnesia-alumina-selenizing molybdenum composite material layer 1, the first conducting adhesive layer 2, polycarbonate resin stacked gradually
Substrate 3, the second conducting adhesive layer 5, metal substrate 6, wherein being offered in the polycarbonate resin substrate 3 multiple through described
The through-hole 31 of polycarbonate resin substrate 3, conducting adhesive column 4 is filled in the through-hole 31, and the conducting adhesive column 4 connects institute
State the first conducting adhesive layer 2 and the second conducting adhesive layer 5；
The magnesia-alumina-selenizing molybdenum composite material layer 1 is mixed by the material composition warp calculated in percentage by weight
It closes, form, be sintered: 70 parts of magnesia；50 parts of aluminium oxide；30 parts of selenizing molybdenum；Unintentional 15 parts of doping graphene oxide；Carbon
15 parts of nanotube；10 parts of perfluorinated fullerene；7 parts of surfactant；7 parts of inorganic dispersant；Acrylic resin type binder 15
Part；
The first conducting adhesive layer 2, the second conducting adhesive layer 5 and conducting adhesive column 4 use identical conducting adhesive
Composite material, the conducting adhesive composite material is by composed of the following components in percentage by weight: acrylic resin 100
Part；15 parts of POLYPROPYLENE GLYCOL；16 parts of polypropylene；20 parts of polystyrene；Unintentional 15 parts of doping graphene oxide；Carbon nanotube 18
Part；15 parts of perfluorinated fullerene；8 parts of glass fibre；8 parts of age resister；3 parts of crosslinking agent.
Wherein, the surfactant is fatty glyceride.The inorganic dispersant is sodium tripolyphosphate.The oxygen
Change magnesium-aluminium oxide-selenizing molybdenum composite material layer 1 with a thickness of 2 millimeters, the first conducting adhesive layer 2 and described second thermally conductive
Adhesive layer 5 with a thickness of 500 microns, the polycarbonate resin substrate 3 with a thickness of 4 millimeters, the thickness of the metal substrate 6
It is 2 millimeters.Multiple through-holes 31 through the polycarbonate resin substrate 3 are arranged in arrays, and the matrix is specially 5 ×
5, described logical, 31 aperture is 5 millimeters, and the shape of the through-hole 31 is circle.The magnesia includes the oxidation of two kinds of partial sizes
Magnesium, a kind of partial size are 20 nanometers, and another kind is 80 microns, and the partial size of the aluminium oxide is 40 microns, the partial size of the selenizing molybdenum
It is 60 microns.The age resister is 2- (2'- hydroxyl -5'- aminomethyl phenyl) benzotriazole.The crosslinking agent is peroxidating -3,
5,5- trimethylhexanoate.The material of the metal substrate 6 is aluminium.
Embodiment 2
Referring to Fig. 1-2, a kind of composite guide hot plate for heat exchanger proposed by the present invention, the organo-mineral complexing is thermally conductive
Plate includes magnesia-alumina-selenizing molybdenum composite material layer 1, the first conducting adhesive layer 2, polycarbonate resin stacked gradually
Substrate 3, the second conducting adhesive layer 5, metal substrate 6, wherein being offered in the polycarbonate resin substrate 3 multiple through described
The through-hole 31 of polycarbonate resin substrate 3, conducting adhesive column 4 is filled in the through-hole 31, and the conducting adhesive column 4 connects institute
State the first conducting adhesive layer 2 and the second conducting adhesive layer 5；
The magnesia-alumina-selenizing molybdenum composite material layer 1 is mixed by the material composition warp calculated in percentage by weight
It closes, form, be sintered: 70 parts of magnesia；550 parts of aluminium oxide；35 parts of selenizing molybdenum；Unintentional 12 parts of doping graphene oxide；
18 parts of carbon nanotube；12 parts of perfluorinated fullerene；6 parts of surfactant；8 parts of inorganic dispersant；Acrylic resin type binder
19 parts；
The first conducting adhesive layer 2, the second conducting adhesive layer 5 and conducting adhesive column 4 use identical conducting adhesive
Composite material, the conducting adhesive composite material is by composed of the following components in percentage by weight: acrylic resin 100
Part；20 parts of POLYPROPYLENE GLYCOL；15 parts of polypropylene；20 parts of polystyrene；Unintentional 16 parts of doping graphene oxide；Carbon nanotube 18
Part；12 parts of perfluorinated fullerene；7 parts of glass fibre；7 parts of age resister；4 parts of crosslinking agent.
Wherein, the surfactant is Pluronic F68.The inorganic dispersant is six inclined phosphorus
Sour sodium.The magnesia-alumina-selenizing molybdenum composite material layer 1 is with a thickness of 4 millimeters, the first conducting adhesive layer 2 and institute
State the second conducting adhesive layer 5 with a thickness of 700 microns, the polycarbonate resin substrate 3 with a thickness of 4 millimeters, the metal
Substrate 6 with a thickness of 2.5 millimeters.Multiple through-holes 31 through the polycarbonate resin substrate 3 are arranged in arrays, described
Matrix is specially 5 × 5, described logical, and 31 aperture is 6 millimeters, and the shape of the through-hole 31 is in round, square, rectangle
One kind.The partial size of the magnesia is 90 microns, and the partial size of the aluminium oxide is 20 microns, and the partial size of the selenizing molybdenum is 70
Micron.The age resister is 2- (2'- hydroxyl -3', 5'- diamyl phenyl) benzotriazole.The crosslinking agent is 2,5- diformazan
Base -2,5- bis(t-butylperoxy) hexane.The material of the metal substrate 6 is stainless steel.
The present invention is by adding unintentional doping graphene oxide into magnesia-alumina-selenizing molybdenum composite material layer
And carbon nanotube effectively improves its thermal conductivity by the mating reaction of the two, and perfluorinated fullerene must add, and can be improved
Magnesia-alumina-selenizing molybdenum composite material layer thermal stability, and then improve magnesia-alumina-selenizing molybdenum composite material
The service life of layer, while using magnesia, aluminium oxide and selenizing molybdenum three as basis material, with material hardness
Height, the advantages such as thermal expansion coefficient is low, so that magnesia-alumina-selenizing molybdenum composite material layer application prospect is extensive.This hair
It is bright by adding unintentional doping graphene oxide, carbon nanotube and perfluorinated fullerene into conducting adhesive composite material,
While guaranteeing the caking property of conducting adhesive composite material, so that it is with excellent heating conduction and thermal stability.This hair
The bright base layer using existing polycarbonate resin substrate as organo-mineral complexing heat-conducting plate, by polycarbonate resin
Setting runs through through-hole in substrate, so that the conducting adhesive layer of polycarbonate resin substrate two sides is connected by conducting adhesive column, In
Using polycarbonate resin substrate as base layer, under conditions of reducing production cost, while it is logical to may insure that heat passes through
Conducting adhesive column in hole is conducted, so that the organo-mineral complexing heat-conducting plate has excellent heating conduction.This hair
It is bright that organo-mineral complexing heat-conducting plate, synthesis are formed in such a way that inorganic material layer, organic material layer and metal layer are mutually laminated
It has excellent performance, stability is strong, is a kind of novel organo-mineral complexing heat-conducting plate.
Finally, it should be noted that obviously, the above embodiment is merely an example for clearly illustrating the present invention, and simultaneously
The non-restriction to embodiment.For those of ordinary skill in the art, it can also do on the basis of the above description
Other various forms of variations or variation out.There is no necessity and possibility to exhaust all the enbodiments.And thus drawn
The obvious changes or variations that Shen goes out are still in the protection scope of this invention.
Claims (6)
1. a kind of composite guide hot plate for heat exchanger, it is characterised in that: the composite guide hot plate includes the oxidation stacked gradually
Magnesium-aluminium oxide-selenizing molybdenum composite material layer, the first conducting adhesive layer, polycarbonate resin substrate, the second conducting adhesive layer, gold
Belong to substrate, wherein offering multiple through-holes through the polycarbonate resin substrate, institute in the polycarbonate resin substrate
It states in through-hole filled with conducting adhesive column, the conducting adhesive column connects the first conducting adhesive layer and described second thermally conductive viscous
Tie layer；
The magnesia-alumina-selenizing molybdenum composite material layer in parts by weight by following components material composition through mixing,
It forms, be sintered: 60-90 parts of magnesia；40-60 parts of aluminium oxide；20-40 parts of selenizing molybdenum；Unintentional doping graphene oxide
10-20 parts；10-20 parts of carbon nanotube；Perfluorinated fullerene 5-15 parts；5-10 parts of surfactant；5-10 parts of inorganic dispersant；
10-20 parts of acrylic resin type binder；
The first conducting adhesive layer, the second conducting adhesive layer and conducting adhesive column use identical conducting adhesive composite wood
Material, the conducting adhesive composite material are composed of the following components in parts by weight: 100 parts of acrylic resin；POLYPROPYLENE GLYCOL
10-20 parts；10-20 parts of polypropylene；10-30 parts of polystyrene；10-20 parts of unintentional doping graphene oxide；Carbon nanotube 10-
20 parts；Perfluorinated fullerene 5-15 parts；5-10 parts of glass fibre；5-10 parts of age resister；1-5 parts of crosslinking agent；
Wherein, the magnesia-alumina-selenizing molybdenum composite material layer is with a thickness of 0.5-5 millimeters, first conducting adhesive
Layer and the second conducting adhesive layer with a thickness of 300-800 micron, the polycarbonate resin substrate with a thickness of 1-5 in the least
Rice, the metal substrate with a thickness of 0.5-3 millimeter, multiple through-holes through the polycarbonate resin substrate are in matrix
Arrangement, the aperture of the through-hole are 2-8 millimeters, and the partial size of the magnesia is 5-100 microns, and the partial size of the aluminium oxide is
10-50 microns, the partial size of the selenizing molybdenum is 20-80 microns.
2. the composite guide hot plate according to claim 1 for heat exchanger, it is characterised in that: the surfactant is rouge
One of fatty acid glyceride, fatty acid sorbitan and Pluronic F68.
3. the composite guide hot plate according to claim 1 for heat exchanger, it is characterised in that: the inorganic dispersant is water
One of glass, sodium tripolyphosphate, calgon and sodium pyrophosphate.
4. the composite guide hot plate according to claim 1 for heat exchanger, it is characterised in that: the age resister is 2-
(2'- hydroxyl -5'- aminomethyl phenyl) benzotriazole, 2- (2'- hydroxyl -3'- tert-butyl -5'- aminomethyl phenyl) -5- chloro benzo three
Azoles, 2- (2'- hydroxyl -3', 5'- diamyl phenyl) benzotriazole, titania nanoparticles, Zinc oxide nanoparticle, phosphorous
One or more of triphenyl phosphate ester, trisnonyl phenyl phosphite.
5. the composite guide hot plate according to claim 1 for heat exchanger, it is characterised in that: the crosslinking agent is peroxide
Change -3,5,5 Trimethylhexanoic acid the tert-butyl ester, peroxidating -2- ethylhexyl carbonate tert-pentyl ester, bis- (the tertiary fourths of 2,5- dimethyl -2,5-
Base peroxy) hexane, peroxide -2-ethyl hexanoic acid tert-butyl, one or more of the peroxidating pivalic acid tert-butyl ester.
6. the composite guide hot plate according to claim 1 for heat exchanger, it is characterised in that: the material of the metal substrate
For one of aluminium, copper, stainless steel and iron.
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| US6592696B1 (en) * | 1998-10-09 | 2003-07-15 | Motorola, Inc. | Method for fabricating a multilayered structure and the structures formed by the method |
| CN103148470A (en) * | 2013-03-07 | 2013-06-12 | 江苏尚恩合同能源管理有限公司 | Radiating device for LED lamp |
| CN103122075A (en) * | 2013-03-19 | 2013-05-29 | 苏州格瑞丰纳米科技有限公司 | High heat-conducting thin graphene-based composite material, as well as preparation method and application thereof |
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