CN107418505A - Ultraviolet light solidification sulfydryl/alkene organosilicon adhesive and preparation method thereof - Google Patents
Ultraviolet light solidification sulfydryl/alkene organosilicon adhesive and preparation method thereof Download PDFInfo
- Publication number
- CN107418505A CN107418505A CN201710583882.2A CN201710583882A CN107418505A CN 107418505 A CN107418505 A CN 107418505A CN 201710583882 A CN201710583882 A CN 201710583882A CN 107418505 A CN107418505 A CN 107418505A
- Authority
- CN
- China
- Prior art keywords
- sulfydryl
- alkene
- ultraviolet light
- silicone oil
- vinyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 25
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 25
- 150000001336 alkenes Chemical class 0.000 title claims abstract description 23
- 238000007711 solidification Methods 0.000 title claims description 14
- 230000008023 solidification Effects 0.000 title claims description 14
- 238000002360 preparation method Methods 0.000 title claims description 6
- 229920002545 silicone oil Polymers 0.000 claims abstract description 24
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 22
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 22
- 239000000178 monomer Substances 0.000 claims abstract description 13
- 239000003054 catalyst Substances 0.000 claims abstract description 12
- 239000000126 substance Substances 0.000 claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 9
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 7
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 7
- 238000006482 condensation reaction Methods 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 claims description 12
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical group [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 239000002585 base Substances 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims description 5
- YBHBEZSZXFLQMW-UHFFFAOYSA-N [dimethoxy(phenyl)silyl]methanamine Chemical compound CO[Si](CN)(OC)C1=CC=CC=C1 YBHBEZSZXFLQMW-UHFFFAOYSA-N 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 5
- FSIJKGMIQTVTNP-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C=C)C=C FSIJKGMIQTVTNP-UHFFFAOYSA-N 0.000 claims description 5
- -1 silicane alkane Chemical class 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 229910000030 sodium bicarbonate Inorganic materials 0.000 claims description 5
- 235000017557 sodium bicarbonate Nutrition 0.000 claims description 5
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 4
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims description 4
- IGQLTMLBFFIKBR-UHFFFAOYSA-N SCO[Si](OC)(C)CCCO Chemical group SCO[Si](OC)(C)CCCO IGQLTMLBFFIKBR-UHFFFAOYSA-N 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- ZPCHCIABIAQKQB-UHFFFAOYSA-M [OH-].C(CCC)[N+](CCCC)(CCCC)CCCC.[P] Chemical compound [OH-].C(CCC)[N+](CCCC)(CCCC)CCCC.[P] ZPCHCIABIAQKQB-UHFFFAOYSA-M 0.000 claims description 4
- 239000003513 alkali Substances 0.000 claims description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 4
- 239000012965 benzophenone Substances 0.000 claims description 4
- 238000009833 condensation Methods 0.000 claims description 4
- 230000005494 condensation Effects 0.000 claims description 4
- 230000003301 hydrolyzing effect Effects 0.000 claims description 4
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 125000003396 thiol group Chemical class [H]S* 0.000 claims description 3
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 claims description 3
- WXPWZZHELZEVPO-UHFFFAOYSA-N (4-methylphenyl)-phenylmethanone Chemical class C1=CC(C)=CC=C1C(=O)C1=CC=CC=C1 WXPWZZHELZEVPO-UHFFFAOYSA-N 0.000 claims description 2
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 claims description 2
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 claims description 2
- UGVRJVHOJNYEHR-UHFFFAOYSA-N 4-chlorobenzophenone Chemical class C1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 UGVRJVHOJNYEHR-UHFFFAOYSA-N 0.000 claims description 2
- 229910002012 Aerosil® Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004594 Masterbatch (MB) Substances 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- WGKSJIPIXCVOON-UHFFFAOYSA-N SC(CC[Si](OCC)(OCC)C)O Chemical class SC(CC[Si](OCC)(OCC)C)O WGKSJIPIXCVOON-UHFFFAOYSA-N 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 244000028419 Styrax benzoin Species 0.000 claims description 2
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 2
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical group CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 claims description 2
- XFBXDGLHUSUNMG-UHFFFAOYSA-N alumane;hydrate Chemical compound O.[AlH3] XFBXDGLHUSUNMG-UHFFFAOYSA-N 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 239000000440 bentonite Substances 0.000 claims description 2
- 229910000278 bentonite Inorganic materials 0.000 claims description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N benzoic acid ethyl ester Natural products CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 claims description 2
- 229960002130 benzoin Drugs 0.000 claims description 2
- 239000004305 biphenyl Substances 0.000 claims description 2
- 238000007334 copolymerization reaction Methods 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 claims description 2
- ZZNQQQWFKKTOSD-UHFFFAOYSA-N diethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)C1=CC=CC=C1 ZZNQQQWFKKTOSD-UHFFFAOYSA-N 0.000 claims description 2
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 claims description 2
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical group CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 2
- MBGQQKKTDDNCSG-UHFFFAOYSA-N ethenyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(C=C)OCC MBGQQKKTDDNCSG-UHFFFAOYSA-N 0.000 claims description 2
- 235000013312 flour Nutrition 0.000 claims description 2
- 235000019382 gum benzoic Nutrition 0.000 claims description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 238000002454 metastable transfer emission spectrometry Methods 0.000 claims description 2
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical group C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 claims description 2
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical class C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 claims description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 claims description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 2
- PEJQKHLWXHKKGS-UHFFFAOYSA-N 2,2,4,4,6,6,8,8-octachloro-1,3,5,7-tetraza-2$l^{5},4$l^{5},6$l^{5},8$l^{5}-tetraphosphacycloocta-1,3,5,7-tetraene Chemical compound ClP1(Cl)=NP(Cl)(Cl)=NP(Cl)(Cl)=NP(Cl)(Cl)=N1 PEJQKHLWXHKKGS-UHFFFAOYSA-N 0.000 claims 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 claims 1
- 239000005711 Benzoic acid Substances 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 claims 1
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 235000010233 benzoic acid Nutrition 0.000 claims 1
- 239000006227 byproduct Substances 0.000 claims 1
- 238000006555 catalytic reaction Methods 0.000 claims 1
- 229940008099 dimethicone Drugs 0.000 claims 1
- 239000004205 dimethyl polysiloxane Substances 0.000 claims 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical compound [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 1
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 claims 1
- HOCOIDRZLNGZMV-UHFFFAOYSA-N ethoxy(oxido)phosphanium Chemical compound CCO[PH2]=O HOCOIDRZLNGZMV-UHFFFAOYSA-N 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- 239000003921 oil Substances 0.000 claims 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims 1
- 230000035935 pregnancy Effects 0.000 claims 1
- 239000000047 product Substances 0.000 claims 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
- 230000008602 contraction Effects 0.000 abstract description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052760 oxygen Inorganic materials 0.000 abstract description 3
- 239000001301 oxygen Substances 0.000 abstract description 3
- 238000006116 polymerization reaction Methods 0.000 abstract description 3
- 230000002401 inhibitory effect Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 11
- 230000032683 aging Effects 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000000354 decomposition reaction Methods 0.000 description 4
- 230000006750 UV protection Effects 0.000 description 3
- 230000018044 dehydration Effects 0.000 description 3
- 238000006297 dehydration reaction Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 238000003847 radiation curing Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- AIDLAEPHWROGFI-UHFFFAOYSA-N 2-methylbenzene-1,3-dicarboxylic acid Chemical class CC1=C(C(O)=O)C=CC=C1C(O)=O AIDLAEPHWROGFI-UHFFFAOYSA-N 0.000 description 1
- 241000256844 Apis mellifera Species 0.000 description 1
- RXIDILMEBPXVFB-UHFFFAOYSA-N C1(=CC=CC=C1)C(=O)C1=CC=CC=C1.C(=O)OC Chemical compound C1(=CC=CC=C1)C(=O)C1=CC=CC=C1.C(=O)OC RXIDILMEBPXVFB-UHFFFAOYSA-N 0.000 description 1
- AHJKRLASYNVKDZ-UHFFFAOYSA-N DDD Chemical compound C=1C=C(Cl)C=CC=1C(C(Cl)Cl)C1=CC=C(Cl)C=C1 AHJKRLASYNVKDZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- RBIILJCATVGHHI-UHFFFAOYSA-N [diethoxy(phenyl)silyl]methanamine Chemical compound NC[Si](OCC)(OCC)C1=CC=CC=C1 RBIILJCATVGHHI-UHFFFAOYSA-N 0.000 description 1
- BGNAJQRJXQBCDF-UHFFFAOYSA-N [ethoxy-(2,3,4-trimethylphenyl)phosphoryl]-phenylmethanone Chemical compound C=1C=C(C)C(C)=C(C)C=1P(=O)(OCC)C(=O)C1=CC=CC=C1 BGNAJQRJXQBCDF-UHFFFAOYSA-N 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- ZSTLPJLUQNQBDQ-UHFFFAOYSA-N azanylidyne(dihydroxy)-$l^{5}-phosphane Chemical class OP(O)#N ZSTLPJLUQNQBDQ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical class COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/28—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen sulfur-containing groups
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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Abstract
The invention discloses a kind of ultraviolet light to solidify sulfydryl/alkene organosilicon adhesive, includes the raw material of following parts by weight:50 80 parts of vinyl silicone oil, 10 50 parts of sulfydryl silicone oil, 0.1 2 parts of light trigger, 15 parts of auxiliary agent;The silicone oil that the vinyl silicone oil is molecular chain-end position or side base contains vinyl, after being mixed by vinyl monomer with comonomer in the presence of catalyst, by hydrolysis-condensation reaction, then product is washed, dry, and toast 2 5h removing low-boiling-point substances at 130 200 DEG C and be made;The present invention has resistance to the oxygen inhibiting polymerization, and volume contraction is small, the advantages that being not likely to produce internal stress.
Description
Technical field
The present invention relates to a kind of ultraviolet light solidification sulfydryl/alkene organosilicon adhesive and preparation method thereof.
Background technology
Ultraviolet light solidification is one kind of radiation curing, and radiation curing is to utilize electromagnetic radiation, such as ultraviolet(UV)Or electronics
Beam(EB)Coating is irradiated, produces the reaction such as radiation polymerization, crosslinking with radiation and radiation grafting.Low molecular weight substance is transformed into rapidly
The chemical process of high molecular weight product, solidification are directly to be carried out on the ground not heated, without solvent or containing pole in system
A small amount of solvent, liquid film almost 100% solidification after irradiation, thus VOC(VOC)Discharge capacity is very low.Therefore, 60 years
Since generation is last, this technology is developed rapidly in the world, and its product is all used widely in many industries
Since UV curable adhesives are reported, people carried out that substantial amounts of research and achieving attracts people's attention to it into
Just.Nowadays UV glue is applied successfully in many industry assembling fields, especially needs the high-tech industry field of quick assembling, example
Such as LCD manufacturing industry, camera optical articles manufacturing industry, CD manufacturing industry(CD、VCD、DVD、DVD-R), wrist-watch manufacturing industry, honeybee
The electronic unit system for the optoelectronic information industries such as device, the assembling of mobile phone key, the manufacture of electronic circuit board, the manufacture of optical deflecting component of ringing
Make.On daily necessities field, such as the assembling of ornament such as the manufacture of glass furniture, the assembling of Glass Craft, toy, jewelry
Also UV glue is generally used.Even conventional industries are also assembled a large amount of using UV glue, such as the assembling of magneto.It can obtain fast
Fast, efficient production efficiency.
Traditional UV adhesives be by(Methyl)Acrylate monomer and(Methyl)Acrylate, light trigger and its
He forms filler, under the irradiation of ultraviolet light, by the effect of free radical caused by light trigger, carries out photopolymerization and forms densification
The tridimensional network material with certain physicochemical property.From being born from it, the life to people brings very big
It is convenient so that production space diminishes, and production efficiency improves, the pollution of non-volatility solvent, but there is also some limitations, exists
Oxygen inhibition, volume contraction is serious, produce internal stress the problems such as.
The content of the invention
The technical problems to be solved by the invention are the shortcomings that overcoming above prior art:A kind of resistance to the oxygen inhibiting polymerization, body are provided
Product contraction is small, is not likely to produce ultraviolet light solidification sulfydryl/alkene organosilicon adhesive of internal stress and preparation method thereof.
The technical solution of the present invention is as follows:A kind of ultraviolet light solidifies sulfydryl/alkene organosilicon adhesive, including following heavy
Measure the raw material of number:Vinyl silicone oil 50-80 parts, sulfydryl silicone oil 10-50 parts, light trigger 0.1-2 parts, auxiliary agent 1-5 parts.
The silicone oil that the vinyl silicone oil is molecular chain-end position or side base contains vinyl, by vinyl monomer and copolymerization
After monomer mixing in the presence of catalyst, by hydrolysis-condensation reaction 2-6h at a temperature of 60-120 DEG C of hydrolytic condensation, so
Use mass percent to be washed 2-4 times for 1-5% sodium bicarbonate aqueous solution product afterwards, then cleaned 2-4 times with clear water, filtered off
Clear water, addition anhydrous calcium chloride are dried, and are filtered and are removed drier, and are toasted 2-5h removing low-boiling-point substances at 130-200 DEG C and be made.
The vinyl monomer is VTES, vinyltrimethoxy silane, vinyl methyl diformazan
TMOS, vinyl methyl diethoxy silane, t etram-ethyltetravinylcyclotetrasiloxane, the silica of divinyl tetramethyl two
One or more kinds of mixtures in alkane.
The silicone oil that the sulfydryl silicone oil is molecular chain-end position or side base contains sulfydryl, is mixed by mercapto monomers and comonomer
, then will production by hydrolysis-condensation reaction 2-6h at a temperature of 60-120 DEG C of hydrolytic condensation after conjunction in the presence of catalyst
Thing uses mass percent to be washed 2-4 times for 1-5% sodium bicarbonate aqueous solution, then is cleaned 2-4 times with clear water, filters off clear water, adds
Enter anhydrous calcium chloride drying, filter and remove drier, and toast 2-5h removing low-boiling-point substances at 130-200 DEG C and be made.
The mercapto monomers are mercapto hydroxypropyl methyl dimethoxysilane, 3- mercapto hydroxypropyl methyl diethoxy silanes, γ-mercapto third
One or more kinds of mixtures in the monomers such as base trimethoxy silane, gamma-mercaptopropyltriethoxysilane.
The comonomer is octamethylcy-clotetrasiloxane, MTES, MTMS, phenyl
Triethoxysilane, phenyl triethoxysilane, dimethyldimethoxysil,ne, dimethyldiethoxysilane, aminomethyl phenyl
Dimethoxysilane, aminomethyl phenyl diethoxy silane, dimethoxydiphenylsilane, diphenyl diethoxy silane, diformazan
Cyclosiloxane, one or more kinds of mixtures in HMDO.
The catalyst is TMAH, TMAH alkali glue, trifluoromethane sulfonic acid, potassium hydroxide,
Tetrabutylammonium hydroxide phosphorus, one or more mixture in modified chlorinated phosphonitrile.
The light trigger be 2- hydroxy-2-methyl -1- phenyl -1- acetone, 1- hydroxy-cyciohexyls benzophenone, 2- methyl isophthalic acids -
(4- methyl mercaptos phenyl) -2- morpholinyl -1- acetone, benzoin dimethylether, the oxidation of 2,4,6- trimethyl benzoyl diphenyls base
Phosphine, isopropyl thioxanthone, 4- (N, N- dimethylamino) ethyl benzoate, benzophenone, 4- chlorobenzophenones, o-benzoyl benzene
Methyl formate, diphenyl iodnium hexafluorophosphate, contraposition N, the different monooctyl ester of N- dimethylaminobenzoic acids, 4- methyl benzophenones,
O-benzoyl yl benzoic acid methyl esters, 4- phenyl benzophenones, 2,4,6- trimethylbenzoy-diphenies phosphine oxide, 2,4,6-
One or more kinds of mixtures in trimethylbenzoyl phenyl phosphinic acid ethyl ester.
The auxiliary agent is that acryloxypropyl trimethoxy silane, γ-aminopropyl triethoxysilane, trimethoxy are different
Cyanurate silane, epoxypropyl trimethoxy silane, alumina powder, aluminium powder, type silica powder, magnesium hydroxide powder, copper powder, stone
Ink, silica flour, silver powder, carborundum powder, aluminum nitride powder, aerosil, aluminium hydrate powder, red phosphor masterbatch, nanometer titanium dioxide
One or more mixtures in titanium, deca-BDE, TDE, bentonite, Tissuemat E.
The preparation method of ultraviolet light solidification sulfydryl/alkene organosilicon adhesive is:By vinyl silicone oil, sulfydryl silicone oil,
Light trigger and auxiliary agent mix under conditions of 10-25 DEG C and lucifuge are dried, stirred, packaging into products.
The beneficial effects of the invention are as follows:
(1)Ultraviolet light of the present invention solidification sulfydryl/alkene organosilicon adhesive have stronger wet and heat ageing resistant, ultraviolet resistance aging,
Cold-hot alternating temperature-changing performance.
(2)It is quickly solid in the 20-30 seconds under ultraviolet light that ultraviolet light of the present invention solidifies sulfydryl/alkene organosilicon adhesive
Change, and without volume contraction, the advantages that internal stress is small, also there is prominent thermo-oxidative stability, excellent electrical insulating property, weatherability,
Low surface tension, low-surface-energy, biologically inert, salt spray proof characteristic.
Embodiment
The present invention is described in further details with specific embodiment below, but the present invention is not only limited in detail below in fact
Apply example.
Embodiment 1
By 400g octamethylcy-clotetrasiloxanes, the mixing of 2.1g divinyl tetramethyl disiloxanes, 90 DEG C are heated under stirring,
Logical nitrogen dehydration 1h, then, adds catalyst TMAH 0.2g, and reaction about 3h is balanced at 100-110 DEG C, then
160-180 DEG C of decomposition catalyst 2h is warming up to, then uses mass percent to be washed for 1-5% sodium bicarbonate aqueous solution product
Wash 2-4 times, then cleaned 2-4 times with clear water, filter off clear water, add anhydrous calcium chloride and dry, filter and remove drier, finally,
2-5h is toasted at 200 DEG C and removes low-boiling-point substance, obtains 387g viscosity(25℃)4895cps, index of refraction 1.40, vinyl mass fraction are
0.16% vinyl silicone oil(Ⅰ).
By 860g octamethylcy-clotetrasiloxanes, 160g D4Vi, 1.86g tetramethyl divinyl disiloxanes, stirring is lower to be added
Heat is dehydrated 1h to 90 DEG C under logical nitrogen.Then, tetrabutylammonium hydroxide phosphorus 0.3g is added, reaction is balanced at 100-110 DEG C about
3h, then it is warming up to 160-180 DEG C of decomposition catalyst 2h.Finally, baking removes low-boiling-point substance at 200 DEG C, obtains about 990g viscosity(25
℃)50638cps, index of refraction 1.40, the vinyl silicone oil of vinyl mass fraction 4.93%(Ⅱ).
129g mercapto hydroxypropyl methyl dimethoxysilanes, 296g D4,3g hexamethyls, are heated to 90 DEG C under stirring, lead to nitrogen
Lower dehydration 1h.Then, 0.2g trifluoromethane sulfonic acids are added, reaction about 3h are balanced at 100-110 DEG C, with 1% sodium acid carbonate
Alkali lye is washed three times, then is washed three times with distillation, and resulting solution is poured into beaker and adds appropriate drier stirring standing water removal.
Drier is finally filtered off, low-boiling-point substance is removed in 150 DEG C of bakings, obtains about 380g viscosity(25℃)80cps, index of refraction 1.40, sulfydryl
The sulfydryl silicone oil of mass fraction 6.02%(Ⅲ).
Each raw material is weighed according to following parts by weight:
Raw material | Proportioning(Parts by weight) |
Ⅰ | 70 parts |
Ⅱ | 10 parts |
Ⅲ | 20 parts |
γ-aminopropyl triethoxysilane | 1 part |
2- hydroxy-2-methyl -1- phenyl -1- acetone | 1 part |
Above-mentioned each raw material is mixed under conditions of 10-25 DEG C and lucifuge are dried, stirred, packs and produces sulfydryl/alkene system
Ultraviolet curing organic silicon glue.
Measure the viscosity of ultraviolet light solidification sulfydryl/alkene organosilicon adhesive:5500cps, index of refraction:1.40, after photocuring,
Elongation:100%, tensile strength:0.5MPa, hardness:23A, to glass adhesive strength:1MPa, light transmittance:100%, salt spray resistance examination
200 hours are tested without significant changes, discolouration and printing opacity after 1000h wet and heat ageing resistants, ultraviolet resistance aging, resistance to alternating temperature-changing aging
Rate is unaffected.
Embodiment 2
984g aminomethyl phenyl dimethoxysilanes, 2.1g tetramethyl divinyl disiloxanes, are heated to 90 DEG C under stirring, lead to N2
Lower dehydration 1h.Then, catalyst TMAH 0.2g is added, reaction about 3h is balanced at 100 DEG C ~ 110 DEG C, then rise
160 DEG C ~ 180 DEG C decomposition catalyst 2h of temperature.Finally, baking removes low-boiling-point substance at 200 DEG C, obtains about 692g viscosity(25℃)
5100cps, index of refraction 1.52, the vinyl-polymethylsiloxane of vinyl mass fraction 0.17%(Ⅳ).
2115g aminomethyl phenyl dimethoxysilanes, 160g D4Vi, 1.86g tetramethyl divinyl disiloxanes, stirring
Under be heated to 90 DEG C, be dehydrated 1h under logical N2.Then, tetrabutylammonium hydroxide phosphorus 0.3g is added, is balanced at 100 DEG C ~ 110 DEG C anti-
Should about 3h, then 160 DEG C ~ 180 DEG C decomposition catalyst 2h that heat up.Finally, low-boiling-point substance is removed in 200 DEG C of bakings, obtains about 1690g viscosity
(25℃)52300cps, index of refraction 1.51, the vinyl silicone oil of vinyl mass fraction 4.93%(Ⅴ).
129g mercapto hydroxypropyl methyl dimethoxysilanes, 728g aminomethyl phenyl dimethoxysilanes, 3g hexamethyls, stirring
Under be heated to 90 DEG C, be dehydrated 1h under logical N2.Then, 0.2g trifluoromethane sulfonic acids are added, reaction is balanced at 100 DEG C ~ 110 DEG C
About 3h, washed three times with 1% sodium acid carbonate alkali lye, then washed three times with distillation, resulting solution is poured into beaker and added in right amount
Drier stirring stands water removal.Drier is finally filtered off, the stripping low-boiling-point substance under 200 DEG C and 80mmHg, obtains about 608g viscosity(25
℃)100cps, index of refraction 1.52, the sulfydryl silicone oil of sulfydryl mass fraction 3.26%(Ⅵ).
Each raw material is weighed according to following parts by weight:
Raw material | Proportioning(Parts by weight) |
Ⅳ | 70 parts |
Ⅴ | 10 parts |
Ⅵ | 40 parts |
γ-aminopropyl triethoxysilane | 1 part |
2- hydroxy-2-methyl -1- phenyl -1- acetone | 1 part |
Above-mentioned each raw material is mixed under conditions of 10-25 DEG C and lucifuge are dried, stirred, packs and produces sulfydryl/alkene system
Ultraviolet curing organic silicon glue.
Measure ultraviolet light solidification sulfydryl/alkene organosilicon adhesive viscosity:4800cps, index of refraction:1.51, after photocuring, stretch
Long rate:120%, tensile strength:0.4MPa, hardness:18A, to glass adhesive strength:1MPa, light transmittance:100%, salt-fog resistant test
200 hours without significant changes, discolouration and light transmittance after 1000h wet and heat ageing resistants, ultraviolet resistance aging, resistance to alternating temperature-changing aging
It is unaffected.
It the above is only the feature implementation example of the present invention, the scope of the present invention be not limited in any way.It is all to use together
The technical scheme formed Deng exchange or equivalence replacement, all falls within rights protection scope of the present invention.
Claims (10)
1. a kind of ultraviolet light solidifies sulfydryl/alkene organosilicon adhesive, it is characterised in that:Include the raw material of following parts by weight:Second
Alkenyl silicone oil 50-80 parts, sulfydryl silicone oil 10-50 parts, light trigger 0.1-2 parts, auxiliary agent 1-5 parts.
2. ultraviolet light according to claim 1 solidifies sulfydryl/alkene organosilicon adhesive, it is characterised in that:The vinyl
The silicone oil that silicone oil is molecular chain-end position or side base contains vinyl, in catalyst after being mixed by vinyl monomer with comonomer
In the presence of, by hydrolysis-condensation reaction 2-6h at a temperature of 60-120 DEG C of hydrolytic condensation, product is then used into quality hundred
Divide and washed 2-4 times than the sodium bicarbonate aqueous solution for being 1-5%, then cleaned 2-4 times with clear water, filter off clear water, addition anhydrous calcium chloride
Dry, filter and remove drier, and toast 2-5h removing low-boiling-point substances at 130-200 DEG C and be made.
3. ultraviolet light according to claim 2 solidifies sulfydryl/alkene organosilicon adhesive, it is characterised in that:The vinyl
Monomer is VTES, vinyltrimethoxy silane, vinyl methyl dimethoxysilane, vinyl methyl
Diethoxy silane, t etram-ethyltetravinylcyclotetrasiloxane, the one or more in divinyl tetramethyl disiloxane
Mixture.
4. ultraviolet light according to claim 1 solidifies sulfydryl/alkene organosilicon adhesive, it is characterised in that:The sulfydryl silicon
Oil contains the silicone oil of sulfydryl for molecular chain-end position or side base, in the effect of catalyst after being mixed by mercapto monomers with comonomer
Under, by hydrolysis-condensation reaction 2-6h at a temperature of 60-120 DEG C of hydrolytic condensation, then by product use mass percent for
1-5% sodium bicarbonate aqueous solution washs 2-4 times, then is cleaned 2-4 times with clear water, filters off clear water, adds anhydrous calcium chloride and dries,
Filter and remove drier, and toast 2-5h removing low-boiling-point substances at 130-200 DEG C and be made.
5. ultraviolet light according to claim 4 solidifies sulfydryl/alkene organosilicon adhesive, it is characterised in that:The sulfydryl list
Body is mercapto hydroxypropyl methyl dimethoxysilane, 3- mercapto hydroxypropyl methyl diethoxy silanes, γ-mercaptopropyl trimethoxysilane, γ-
One or more kinds of mixtures in the monomers such as mercaptopropyltriethoxysilane.
6. ultraviolet light solidification sulfydryl/alkene organosilicon adhesive according to claim 2 or 4, it is characterised in that:The copolymerization
Monomer is octamethylcy-clotetrasiloxane, MTES, MTMS, phenyl triethoxysilane, benzene
Ethyl triethoxy silicane alkane, dimethyldimethoxysil,ne, dimethyldiethoxysilane, aminomethyl phenyl dimethoxysilane, first
Base diethylamino phenyl TMOS, dimethoxydiphenylsilane, diphenyl diethoxy silane, dimethicone, pregnancy
One or more kinds of mixtures in base disiloxane.
7. ultraviolet light solidification sulfydryl/alkene organosilicon adhesive according to claim 2 or 4, it is characterised in that:The catalysis
Agent is TMAH, TMAH alkali glue, trifluoromethane sulfonic acid, potassium hydroxide, tetrabutylammonium hydroxide phosphorus, is changed
One or more mixture in property phosphonitrilic chloride.
8. ultraviolet light according to claim 1 solidifies sulfydryl/alkene organosilicon adhesive, it is characterised in that:It is described light-initiated
Agent is 2- hydroxy-2-methyl -1- phenyl -1- acetone, 1- hydroxy-cyciohexyls benzophenone, 2- methyl isophthalic acids-(4- methyl mercaptos phenyl) -2-
Morpholinyl -1- acetone, benzoin dimethylether, 2,4,6- trimethyl benzoyl diphenyl bases phosphine oxide, isopropyl thioxanthone, 4-
(N, N- dimethylamino) ethyl benzoate, benzophenone, 4- chlorobenzophenones, methyl o-benzoylbenzoate, diphenyl iodine
Hexafluorophosphate salt, contraposition N, the different monooctyl ester of N- dimethylaminobenzoic acids, 4- methyl benzophenones, o-benzoyl yl benzoic acid first
Ester, 4- phenyl benzophenones, 2,4,6- trimethylbenzoy-diphenies phosphine oxide, 2,4,6- trimethylbenzoyl phenyls
One or more kinds of mixtures in phosphinic acid ethyl ester.
9. ultraviolet light according to claim 1 solidifies sulfydryl/alkene organosilicon adhesive, it is characterised in that:The auxiliary agent is
Acryloxypropyl trimethoxy silane, γ-aminopropyl triethoxysilane, trimethoxy isocyanurate silane, epoxy radicals
Propyl trimethoxy silicane, alumina powder, aluminium powder, type silica powder, magnesium hydroxide powder, copper powder, graphite, silica flour, silver powder, carborundum
Powder, aluminum nitride powder, aerosil, aluminium hydrate powder, red phosphor masterbatch, nano titanium oxide, deca-BDE, decabrominated dipheny
One or more mixtures in ethane, bentonite, Tissuemat E.
10. a kind of preparation method of ultraviolet light solidification sulfydryl/alkene organosilicon adhesive described in claim 1 is:By vinyl
Silicone oil, sulfydryl silicone oil, light trigger and auxiliary agent mix under conditions of 10-25 DEG C and lucifuge are dried, stirred, you can.
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