CN105778096B - The manufacturing method and application of the silicone resin of alkenyl containing benzocyclobutane - Google Patents
The manufacturing method and application of the silicone resin of alkenyl containing benzocyclobutane Download PDFInfo
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Abstract
The present invention provides the manufacturing methods and application of a kind of silicone resin of alkenyl containing benzocyclobutane, specifically, the present invention passes through the silane monomer that will contain benzocyclobutane alkenyl and a variety of silane monomers hydrolyze copolyreaction, obtain organic siliconresin, then curable molding is heated, gained cured product is the new type high temperature cured silicone resin that a kind of temperature tolerance is good, electric property is excellent, can be used in the fields such as electric utility, aerospace being used as high-performance resin matrix or encapsulating material.
Description
Technical field
The present invention provides a kind of organic siliconresins, and in particular to a kind of alkenyl group containing benzocyclobutane can hot setting have
The manufacturing method and its application of machine silicone material.
Background technique
Organic siliconresin is the veriety earlier that comes out in organosilicon material, many superiority with organosilicon material
Can, such as excellent heat resistance, weatherability, cold-resistant thermal shock, easy processing and excellent optical property, the dielectric properties of silicone resin
It is excellent, it keeps stablizing in biggish temperature, humidity, frequency range.Organic siliconresin can be used for insullac, coating, molding
Material, laminated material, release agent, moistureproof and waterproof agent etc., aerospace, electronic apparatus, building, in terms of obtained extensively
Application.
Benzocyclobutene (Benzocyclobutene, BCB) resin is also a kind of multifunctional macromolecule material, molecule by
Heat can curing reaction formed figure high polymer, cured product have preferable temperature tolerance, chemical stability, excellent electrical property
Energy, low hydroscopicity and good mechanical property etc. are based on this, such as combine benzocyclobutene with organosilicon material and be expected to obtain
New type functional material, many relevant reports exactly utilize this feature, have developed a variety of organosilicons containing benzocyclobutene
Material.
The silane coupling agent that (U.S. patent Nos US4759847,1988) such as Gros has synthesized benzocyclobutene modification can
As adhesive.
The disiloxane monomer (3000 series of CYCLOTENE) containing benzocyclobutene of the Dow Chemical Company's exploitation has preferable
Dielectric properties, shown in formula specific as follows:
Yang Shiyong et al. reports the silane small molecule monomer that benzocyclobutene is introduced in phenyl siloxane
(J.Polym.Sci.Polym.Chem.2009,47,6246), formula specific as follows:
Poplar military school etc. reports the modified silicon oil (Chinese invention patent application number that benzocyclobutene is introduced by side chain
201110367893.X):
The performance for improving silane to a certain extent by the introducing of benzocyclobutene has widened its application, but these
Material is mostly small-molecular-weight monomer, and it is generally existing have that synthesis condition is harsh, starting material is difficult to obtain or higher cost, material
The problems such as fusing point is low, and film forming is poor, and when use needs pre-polymerization limits its application significantly.
In conclusion a kind of mild with synthesis condition there is an urgent need in the art to develop, preparation cost is low, and processing performance is good
The unit containing benzocyclobutene silicone resin material.
Summary of the invention
The object of the present invention is to provide one kind to have preferable temperature tolerance, close-burning organic siliconresin encapsulating material.
The first aspect of the present invention provides a kind of organic siliconresin of alkenyl containing benzocyclobutane, the organosilicon tree
Rouge is copolymerization preparation is hydrolyzed with following monomer shown in formula A and the optional monomer as shown in following formula B:
In formula, each R is each independently selected from the following group: hydrogen, C1~C4 alkyl, C1~C4 alkoxy, C1~C4 alkyl halide
Base, C2~C4 alkenyl, C6~C10 aryl, the heteroaryl of C1~C10, C8~C17 alkyl, halogen；Preferably, each R is respectively only
It is on the spot selected from the group: methyl, ethyl, propyl, trifluoro propyl, vinyl, phenyl, benzocyclobutane alkenyl, dodecyl, methoxy
Base, ethyoxyl, chlorine, bromine；
And in the formula A, at least one R is group selected from the group below: C1~C4 alkoxy, halogen；
And in the formula B, at least one R is group selected from the group below: C1~C4 alkoxy, halogen；
Preferably, at least one R (preferably 1,2 or 3) is not benzocyclobutane alkenyl in the formula A；
And in the formula B, each R is not benzocyclobutane alkenyl；
More preferably, the formula A monomer is the monomer for being selected from the group (a):
(a) benzocyclobutane alkenyl trimethoxy silane, benzocyclobutene ethyl triethoxy silicane alkane, benzocyclobutane alkenyl trichlorine
Silane, phenyl (benzocyclobutane alkenyl) dimethoxysilane, phenyl (benzocyclobutane alkenyl) diethoxy silane, phenyl (benzo
Cyclobutane base) dichlorosilane, dibenzo cyclobutane base dimethoxysilane, dimethyl (benzocyclobutane alkenyl) Ethoxysilane,
Methyl (benzocyclobutane alkenyl) dimethoxysilane, methyl (benzocyclobutane alkenyl) diethoxy silane, methyl (benzocyclobutene
Base) dichlorosilane, vinyl (benzocyclobutane alkenyl) dimethoxysilane, vinyl (benzocyclobutane alkenyl) diethoxy silicon
Alkane, vinyl (benzocyclobutane alkenyl) dichlorosilane, dimethylbiphenyl cyclobutane base methoxy silane, or combinations thereof；
And the formula B monomer is the monomer for being selected from the group (b):
(b) phenyl triethoxysilane, phenyltrimethoxysila,e, diphenyl diethoxy silane, diphenyl dimethoxy
Base silane, aminomethyl phenyl dimethoxysilane, dichloromethyl phenylsilane, aminomethyl phenyl diethoxy silane, trimethyl ethoxy
Base silane, methyl vinyl diethoxysilane, methyl trifluoro propyl diethoxy silane, dodecyltrimethoxysilane,
Ethyl orthosilicate, or combinations thereof.
In another preferred example, in the formula A, at least one (preferably 1-3) R is C1~C4 alkoxy.
In another preferred example, in the formula B, at least one (preferably 1-4) R is C1~C4 alkoxy.
In another preferred example, in the formula A, each R is each independently selected from the following group: C1~C4 alkyl, C2~C4 alkene
Base, C1~C4 alkoxy.
In another preferred example, in the formula B, each R is each independently selected from the following group: C1~C4 alkyl, C1~C4 alkane
Oxygroup, phenyl.
In another preferred example, the hydrolysis is copolymerized in used monomer:
The molfraction a of formula A1 monomer is 0≤a≤0.8, wherein the formula A1 monomer has structure shown in formula A,
And in the formula A, 2 R bases are groups selected from the group below: C1~C4 alkoxy, halogen；
The molfraction b of formula A2 monomer is 0≤b≤0.6, wherein the formula A2 monomer has structure shown in formula A,
And in the formula A, 3 R bases are groups selected from the group below: C1~C4 alkoxy, halogen；
The molfraction c of formula A3 monomer is 0≤c≤0.3, wherein the formula A3 monomer has structure shown in formula A,
And in the formula A, 1 R base is group selected from the group below: C1~C4 alkoxy, halogen；
The molfraction d of formula B1 monomer is 0≤d≤0.3, wherein the formula B1 monomer has structure shown in formula B,
And in the formula B, 1 R base is group selected from the group below: C1~C4 alkoxy, halogen；
The molfraction e of formula B2 monomer is 0≤e≤0.5, wherein the formula B2 monomer has structure shown in formula B,
And in the formula B, 2 R bases are groups selected from the group below: C1~C4 alkoxy, halogen；
The molfraction f of formula B3 monomer is 0≤f≤0.4, wherein the formula B3 monomer has structure shown in formula B,
And in the formula B, 3 R bases are groups selected from the group below: C1~C4 alkoxy, halogen；
The molfraction g of formula B4 monomer is 0 g≤0.3 <, wherein the formula B4 monomer has structure shown in formula B,
And in the formula B, 4 R bases are groups selected from the group below: C1~C4 alkoxy, halogen；
And a, b, c are not 0 simultaneously.
In another preferred example, the organic siliconresin has average composition formula shown in formula I:
Wherein, a+b+c+d+e+f+g=1, and R1、R2、R3、R4、R5、R6、R7、R8Or R9It is independently selected from the following group:
Hydrogen, C1~C4 alkyl, C2~C4 alkenyl, aromatic radical, C8~C15 alkyl；Preferably, R1、R2、R3、R4、R5、R6、R7、R8Or R9Respectively
It is selected from the group from independent: methyl, ethyl, propyl, trifluoro propyl, vinyl, phenyl, dodecyl；
And the value range of a, b, c, d, e, f, g are as follows: 0≤a≤0.8,0≤b≤0.6,0≤c≤0.3,0≤d≤
0.3,0≤e≤0.5,0≤f≤0.4,0 g≤0.3 <.
And a, b, c are not 0 simultaneously.
In another preferred example, the organic siliconresin molecular weight is 1000-20000.
The second aspect of the present invention provides a kind of preparation side of organic siliconresin as described in the first aspect of the invention
Method, the method includes the steps:
In atent solvent, it is hydrolyzed with following monomer shown in formula A and the optional monomer as shown in following formula B poly-
It closes, obtains the organic siliconresin:
In formula, each R is each independently selected from the following group: hydrogen, C1~C4 alkyl, C1~C4 alkoxy, C1~C4 alkyl halide
Base, C2~C4 alkenyl, C6~C10 aryl, the heteroaryl of C1~C10, C8~C17 alkyl, halogen；Preferably, each R is respectively only
It is on the spot selected from the group: methyl, ethyl, propyl, trifluoro propyl, vinyl, phenyl, benzocyclobutane alkenyl, dodecyl, methoxy
Base, ethyoxyl, chlorine, bromine；
And in the formula A, at least one R is group selected from the group below: C1~C4 alkoxy, halogen；
And in the formula B, at least one R is group selected from the group below: C1~C4 alkoxy, halogen；
Preferably, at least one R (preferably 1,2 or 3) is not benzocyclobutane alkenyl in the formula A；
And in the formula B, each R is not benzocyclobutane alkenyl.
Preferably, the method comprising steps of
In atent solvent, with the silane monomer of the alkenyl containing benzocyclobutane for being selected from the group (a) and it is selected from the group the silicon of (b)
Polymerization is hydrolyzed in alkane monomer, obtains organic siliconresin shown in formula I:
(a) benzocyclobutane alkenyl trimethoxy silane, benzocyclobutene ethyl triethoxy silicane alkane, benzocyclobutane alkenyl trichlorine
Silane, phenyl (benzocyclobutane alkenyl) dimethoxysilane, phenyl (benzocyclobutane alkenyl) diethoxy silane, phenyl (benzo
Cyclobutane base) dichlorosilane, dibenzo cyclobutane base dimethoxysilane, dimethyl (benzocyclobutane alkenyl) Ethoxysilane,
Methyl (benzocyclobutane alkenyl) dimethoxysilane, methyl (benzocyclobutane alkenyl) diethoxy silane, methyl (benzocyclobutene
Base) dichlorosilane, vinyl (benzocyclobutane alkenyl) dimethoxysilane, vinyl (benzocyclobutane alkenyl) diethoxy silicon
Alkane, vinyl (benzocyclobutane alkenyl) dichlorosilane, dimethylbiphenyl cyclobutane base methoxy silane, or combinations thereof；
(b) phenyl triethoxysilane, phenyltrimethoxysila,e, diphenyl diethoxy silane, diphenyl dimethoxy
Base silane, aminomethyl phenyl dimethoxysilane, dichloromethyl phenylsilane, aminomethyl phenyl diethoxy silane, methyl ethylene
Diethoxy silane, methyl trifluoro propyl diethoxy silane, trimethylethoxysilane, dodecyltrimethoxysilane,
Ethyl orthosilicate, or combinations thereof.
In another preferred example, the hydrolytic-polymeric reaction carries out in the presence of acidic catalyst and/or water.
In another preferred example, the acidic catalyst is selected from the group: hydrochloric acid, sulfuric acid, acetic acid, formic acid, or combinations thereof.
In another preferred example, the molar ratio of the monomer, acid catalyst and water is preferably 1:0.2~20:0~10.
In another preferred example, the atent solvent is selected from the group: benzene,toluene,xylene, trimethylbenzene, or combinations thereof.
In another preferred example, the reaction temperature is 0~130 DEG C.
In another preferred example, the reaction time is 3~35 hours.
In another preferred example, which comprises at 0~30 DEG C, dripped into the solvent dissolved with acidic catalyst
Add the mixed solution of formula A monomer and formula B monomer；
Solution after described be added dropwise is warming up at 70~130 DEG C, the reaction was continued.
In another preferred example, the method also includes: after being added dropwise, at 0~30 DEG C react a period of time after, rise
The reaction was continued to 70~130 DEG C.
In another preferred example, which comprises at 0~30 DEG C, toward the inertia for being dissolved with acidic catalyst and water
The mixed solution of formula A monomer and formula B monomer is added dropwise in solvent, then rises at 70~130 DEG C that the reaction was continued.
In another preferred example, the method also includes: heat up to the organic siliconresin, to slough small molecule
Compound.
In another preferred example, the heating is decompression heating.
In another preferred example, the described decompression heating is is decompressed to 9-11mba and/or is warming up to 140-160 DEG C
The third aspect of the present invention, provides a kind of cured product, and the cured product is with such as first party of the present invention
Organic siliconresin described in face individually or after being blended with other curable molding performed polymers carries out curing molding preparation.
In another preferred example, the curable molding performed polymer of other described is selected from the group: silicone oil, silicone resin, modification
Resin, or combinations thereof.
In another preferred example, the curing molding include: at 100~140 DEG C heat treatment make it is described preforming
Then body de-bubbled is heat-treated 1-5h at 160~200 DEG C, 0.5-3h is heat-treated at 210~250 DEG C, then it is warming up to 250~
Continue to be heat-treated 1-5h at 350 DEG C.
In another preferred example, refractive index >=1.50 of the cured product, preferably >=1.55.
In another preferred example, 5% thermal weight loss temperature of the cured product in nitrogen is >=450 DEG C, preferably
It is >=480 DEG C.
In another preferred example, 5% thermal weight loss temperature of the cured product in nitrogen is 475~600 DEG C, preferably
Ground is 480~550 DEG C.
In another preferred example, 1000 DEG C residual volumes of the cured product in nitrogen are >=60%, preferably
>=65%.
In another preferred example, 1000 DEG C residual volumes of the cured product in nitrogen are 60~85%, preferably
It is 65~80%.
In another preferred example, the dielectric constant < 3.0 of the cured product, preferably < 2.8；More preferably it is
2.5-2.8。
In another preferred example, the dielectric loss of the cured product is 2~8 × 10-3。
In another preferred example, the dielectric loss of the cured product is 2.5~3.6 × 10-3。
In another preferred example, the curing molding is the molding that is heating and curing；Preferably, the curing molding temperature
It is 100~350 DEG C.
In another preferred example, the method is comprising steps of with organic siliconresin as described in the first aspect of the invention
It is formed after being blended individually or with other optional curable molding performed polymers, obtains preform；
It is heating and curing to the preform, obtains the product.
In another preferred example, the curing molding include: at 100~140 DEG C heat treatment make it is described preforming
Then body de-bubbled is heat-treated 1-5h at 160~200 DEG C, 0.5-3h is heat-treated at 210~250 DEG C, then it is warming up to 250~
Continue to be heat-treated 1-5h at 350 DEG C.
In another preferred example, the molding is carried out by moulding process selected from the group below: filling mould, solution rotation
Painting or solution drop coating.
In another preferred example, the solution spin coating or solution drop coating are comprising steps of will as described in the first aspect of the invention
Organic siliconresin individually or be dissolved in wiring solution-forming in organic solvent with other optional curable molding performed polymers, then into
Row spin coating or drop coating；Preferably, the solvent is selected from the group: the organic solvent is toluene, dimethylbenzene, trimethylbenzene, two
Phenylate, cyclohexanone, chloroform, acetone, N,N-dimethylformamide, DMAC N,N' dimethyl acetamide, dimethyl sulfoxide, N- methyl
Pyrrolidones, or combinations thereof.
It should be understood that above-mentioned each technical characteristic of the invention and having in below (eg embodiment) within the scope of the present invention
It can be combined with each other between each technical characteristic of body description, to form a new or preferred technical solution.As space is limited, exist
This is no longer repeated one by one.
Specific embodiment
The present inventor's in-depth study by long-term, it has unexpectedly been found that, with the silane monomer containing benzocyclobutene with
Other silane monomers are copolymerized, available to have good thermal stability, the organosilicon of low-k and high refractive index
Material is used as high-performance resin matrix or encapsulating material.Based on above-mentioned discovery, inventor completes the present invention.
Term
Term " alkyl of C1~C4 " refers to the linear or branched alkyl group with 1~4 carbon atom, such as methyl, ethyl, positive third
Base, isopropyl, normal-butyl, tert-butyl, or similar group.
Term " C1~C4 halogenated alkyl " refers to 1~4 carbon atom, and at least one hydrogen atom be optionally substituted by halogen it is straight
Chain or branched alkyl, such as trifluoro propyl, or similar group.
Term " C2~C4 alkenyl " refers to the linear chain or branched chain alkenyl with 2~4 carbon atoms, such as vinyl, acrylic, alkene
Propyl, 1- cyclobutenyl, 2- cyclobutenyl, or similar group.
Term " C1~C4 alkoxy " refers to that the linear or branched alkyl group with 1~4 carbon atom takes with what oxygen was connected to form
Dai Ji, such as methoxyl group, ethyoxyl, positive propoxy, isopropoxy, n-butoxy, tert-butoxy, or similar group.
Term " alkyl of C8~C17 " refers to the linear or branched alkyl group with 8~17 carbon atoms, such as decyl, 2,2- bis-
Methyl Octyl, dodecyl, pentadecyl, or similar group.
Term " C6~C10 aryl " refers to the aryl with 6~10 carbon atoms, including monocycle or aryl bicyclic, such as benzene
Base, naphthalene, or similar group.
Term " heteroaryl of C1~C10 " refers to 1-10 carbon atom, and has one or more hetero atoms in ring system
Aryl, such as pyridyl group, thienyl, piperidyl, or similar group.
Term " halogen " refers to fluorine, chlorine, bromine or iodine.
The organic siliconresin of the alkenyl containing benzocyclobutane
A kind of organic siliconresin of the alkenyl containing benzocyclobutane, which is characterized in that the organic siliconresin is with such as following formula A
Shown in copolymerization preparation is hydrolyzed in monomer and the optional monomer as shown in following formula B:
In formula, each R is each independently selected from the following group: hydrogen, C1~C4 alkyl, C1~C4 alkoxy, C1~C4 alkyl halide
Base, C2~C4 alkenyl, C6~C10 aryl, the heteroaryl of C1~C10, C8~C17 alkyl, halogen；Preferably, each R is respectively only
On the spot be selected from the group: methyl, ethyl, propyl, trifluoro propyl, vinyl, phenyl, dodecyl, methoxyl group, ethyoxyl, chlorine,
Bromine；
And in the formula A, at least one R is group selected from the group below: C1~C4 alkoxy, halogen；
And in the formula B, at least one R is group selected from the group below: C1~C4 alkoxy, halogen；
More preferably, the formula A monomer is the monomer for being selected from the group (a):
(a) benzocyclobutane alkenyl trimethoxy silane, benzocyclobutene ethyl triethoxy silicane alkane, benzocyclobutane alkenyl trichlorine
Silane, phenyl (benzocyclobutane alkenyl) dimethoxysilane, phenyl (benzocyclobutane alkenyl) diethoxy silane, phenyl (benzo
Cyclobutane base) dichlorosilane, dibenzo cyclobutane base dimethoxysilane, dimethyl (benzocyclobutane alkenyl) Ethoxysilane,
Methyl (benzocyclobutane alkenyl) dimethoxysilane, methyl (benzocyclobutane alkenyl) diethoxy silane, methyl (benzocyclobutene
Base) dichlorosilane, vinyl (benzocyclobutane alkenyl) dimethoxysilane, vinyl (benzocyclobutane alkenyl) diethoxy silicon
Alkane, vinyl (benzocyclobutane alkenyl) dichlorosilane, dimethylbiphenyl cyclobutane base methoxy silane；
And the formula B monomer is the monomer for being selected from the group (b):
(b) phenyl triethoxysilane, phenyltrimethoxysila,e, diphenyl diethoxy silane, diphenyl dimethoxy
Base silane, aminomethyl phenyl dimethoxysilane, dichloromethyl phenylsilane, aminomethyl phenyl diethoxy silane, methyl ethylene
Diethoxy silane, methyl trifluoro propyl diethoxy silane, trimethylethoxysilane, dodecyltrimethoxysilane,
Ethyl orthosilicate, or combinations thereof.
Wherein, each monomer can be single functionality, bifunctionality or three-functionality-degree, in another preferred example, the formula A
In, at least one (preferably 1-3) R is C1~C4 alkoxy.
In another preferred example, in the formula B, at least one (preferably 1-4) R is C1~C4 alkoxy.
In another preferred example, in the formula A, each R is each independently selected from the following group: C1~C4 alkyl, C2~C4 alkene
Base, C1~C4 alkoxy.
In another preferred example, in the formula B, each R is each independently selected from the following group: C1~C4 alkyl, C1~C4 alkane
Oxygroup, phenyl.
The dosage of each monomer is not particularly limited, it is preferable that the hydrolysis is copolymerized in used monomer:
The molfraction a of formula A1 monomer is 0≤a≤0.8, wherein the formula A1 monomer has structure shown in formula A,
And in the formula A, 2 R bases are groups selected from the group below: C1~C4 alkoxy, halogen；
The molfraction b of formula A2 monomer is 0≤b≤0.6, wherein the formula A2 monomer has structure shown in formula A,
And in the formula A, 3 R bases are groups selected from the group below: C1~C4 alkoxy, halogen；
The molfraction c of formula A3 monomer is 0≤c≤0.3, wherein the formula A3 monomer has structure shown in formula A,
And in the formula A, 1 R base is group selected from the group below: C1~C4 alkoxy, halogen；
The molfraction d of formula B1 monomer is 0≤d≤0.3, wherein the formula B1 monomer has structure shown in formula B,
And in the formula B, 1 R base is group selected from the group below: C1~C4 alkoxy, halogen；
The molfraction e of formula B2 monomer is 0≤e≤0.5, wherein the formula B2 monomer has structure shown in formula B,
And in the formula B, 2 R bases are groups selected from the group below: C1~C4 alkoxy, halogen；
The molfraction f of formula B3 monomer is 0≤f≤0.4, wherein the formula B3 monomer has structure shown in formula B,
And in the formula B, 3 R bases are groups selected from the group below: C1~C4 alkoxy, halogen；
The molfraction g of formula B4 monomer is 0 g≤0.3 <, wherein the formula B4 monomer has structure shown in formula B,
And in the formula B, 4 R bases are groups selected from the group below: C1~C4 alkoxy, halogen；
And a, b, c are not 0 simultaneously.
In another preferred example, the organic siliconresin has average composition formula shown in formula I:
Wherein, a+b+c+d+e+f+g=1, and R1、R2、R3、R4、R5、R6、R7、R8Or R9It is independently selected from the following group:
Hydrogen, C1~C4 alkyl, C1~C4 halogenated alkyl, C2~C4 alkenyl, aromatic radical, C8~C17 alkyl；Preferably, R1、R2、R3、R4、
R5、R6、R7、R8Or R9It is independently selected from the following group: methyl, ethyl, propyl, trifluoro propyl, vinyl, phenyl, dodecyl；
And the value range of a, b, c, d, e, f, g are as follows: 0≤a≤0.8,0≤b≤0.6,0≤c≤0.3,0≤d≤
0.3,0≤e≤0.5,0≤f≤0.4,0 g≤0.3 <.
And a, b, c are not 0 simultaneously.
In another preferred example, the organic siliconresin molecular weight is 1000-20000.
In atent solvent, it is hydrolyzed with following monomer shown in formula A and the optional monomer as shown in following formula B poly-
It closes, obtains the organic siliconresin:
In formula, each R is each independently selected from the following group: hydrogen, C1~C4 alkyl, C1~C4 alkoxy, C1~C4 alkyl halide
Base, C2~C4 alkenyl, C6~C10 aryl, the heteroaryl of C1~C10, C8~C17 alkyl, halogen；Preferably, each R is respectively only
It is on the spot selected from the group: methyl, ethyl, propyl, trifluoro propyl, vinyl, phenyl, benzocyclobutane alkenyl, dodecyl, methoxy
Base, ethyoxyl, chlorine, bromine；
And in the formula A, at least one R is group selected from the group below: C1~C4 alkoxy, halogen；
And in the formula B, at least one R is group selected from the group below: C1~C4 alkoxy, halogen；
Preferably, at least one R (preferably 1,2 or 3) is not benzocyclobutane alkenyl in the formula A；
And in the formula B, each R is not benzocyclobutane alkenyl.
Preferably, the method comprising steps of
In atent solvent, with the silane monomer of the alkenyl containing benzocyclobutane for being selected from the group (a) and it is selected from the group the silicon of (b)
Polymerization is hydrolyzed in alkane monomer, obtains organic siliconresin shown in formula I:
Wherein, X is independently selected from methoxyl group, ethyoxyl, chlorine, bromine；R1、R2、R3、R4、R5、R6、R7、R8Or R9Respectively
It is independent to be selected from the group: hydrogen, C1~C4 alkyl, C1~C4 halogenated alkyl, C2~C4 alkenyl, aromatic radical, C8~C17 alkyl；Compared with
Goodly, R1、R2、R3、R4、R5、R6、R7、R8Or R9It is independently selected from the following group: methyl, ethyl, propyl, trifluoro propyl, ethylene
Base, phenyl, dodecyl；
Group (a) is the combination of a kind of silane containing benzocyclobutene or a variety of silane containing benzocyclobutene；
Group (b) is the combination of one or more silane.
The hydrolytic-polymeric reaction preferably carries out in the presence of acidic catalyst and/or water；Preferably, the acid
Property catalyst is selected from the group: hydrochloric acid, sulfuric acid, acetic acid, formic acid, or combinations thereof.
The molar ratio of monomer, acid catalyst and water is preferably 1:0.2~20:0~10.
The atent solvent is not particularly limited, and is better selected from the following group: benzene,toluene,xylene, trimethylbenzene, or
A combination thereof.
In another preferred example, the reaction temperature is 0~130 DEG C.
In another preferred example, the reaction time is 3~35 hours.
The specific method of the hydrolytic polymerization is not particularly limited, in a preferred embodiment of the invention, the side
Method includes: dropwise addition group (a) monomer and group (b) monomer into the atent solvent dissolved with acidic catalyst and water at 0~30 DEG C
Mixed solution, then rise at 70~130 DEG C that the reaction was continued.
In another preferred example, the method also includes: after being added dropwise, at 10~30 DEG C react a period of time after,
Rise at 70~130 DEG C that the reaction was continued.
In another preferred example, the method also includes: after being added dropwise, at 10~30 DEG C react 1-5h after, rise to
The reaction was continued at 70~130 DEG C 3-24h.
The cured product of the unit of alkenyl containing benzocyclobutane
The present invention also provides a kind of cured product, the cured product is with the alkenyl of the invention containing benzocyclobutane
Organic siliconresin individually or after being blended with other curable molding performed polymers carries out curing molding preparation.
Wherein, the curable molding performed polymer of other described is not particularly limited, can be selected it is any can with it is described
Organic siliconresin carry out cured resin or small organic molecule, such as the resin containing unsaturated bond (not including aromatic ring) jointly
Or small organic molecule.In a preferred embodiment of the invention, the curable molding performed polymer of other described is selected from the group: silicon
Oil, silicone resin or other modified resins.
The curing molding is not particularly limited, and can be the resin solidification forming method of this field routine, for example,
In a preference of the invention, the curing molding is the molding that is heating and curing.Preferably, the curing molding temperature
It is 100~350 DEG C.
In another preferred example, the cured product is prepared using the following method:
With the organic siliconresin of the alkenyl of the invention containing benzocyclobutane individually or with optional other are curable molding pre-
Aggressiveness is formed after being blended, and obtains preform；
It is heating and curing to the preform, obtains the product.
In another preferred example, the curing molding include: at 100~140 DEG C heat treatment make it is described preforming
Then body de-bubbled is heat-treated 1-5h at 160~200 DEG C, 0.5-3h is heat-treated at 210~250 DEG C, then it is warming up to 250~
Continue to be heat-treated 1-5h at 350 DEG C.
In another preferred example, the molding is carried out by moulding process selected from the group below: filling mould, solution rotation
Painting or solution drop coating.
In another preferred example, the solution spin coating or solution drop coating are comprising steps of will as described in the first aspect of the invention
Organic siliconresin and other optional curable molding performed polymers be dissolved in wiring solution-forming in organic solvent, then carry out spin coating
Or drop coating；Preferably, the solvent is selected from the group: the organic solvent is toluene, dimethylbenzene, trimethylbenzene, diphenyl ether, ring
Hexanone, chloroform, acetone, N,N-dimethylformamide, DMAC N,N' dimethyl acetamide, dimethyl sulfoxide, N- crassitude
Ketone, or combinations thereof.
Main advantages of the present invention:
(1) the organic silicon monomer preparation process provided by the present invention containing benzocyclobutene is simple, and in the prior art
The organosiloxane monomer containing benzocyclobutene reported is compared, and system can be completed only with simple grignard reaction in synthesis
It is standby, and used raw material sources are extensive, silane and halogenated benzocyclobutene are marketable material, and reaction yield is higher.
(2) organic siliconresin of the invention just can be carried out preparation using hydrolytic polymerization, compared with the existing technology in, monomer
The preparation of prepolymer needs to carry out at relatively high temperatures, and preparation method is simple, mild condition, and reaction is controllable, and the pre-polymerization obtained
The molecular weight of object --- viscosity can efficiently control, and have preferable film forming, caking property and processability.
(3) organic siliconresin of the invention is prepared without using noble metal catalyst such as platinum etc., is significantly reduced
The cost of preparation.
(4) preparation method of the invention is simple, and equipment requirement is low, is suitble to industrialized production.
(5) organic siliconresin provided by the present invention is used to prepare with good electric property, heat resistance and mechanics
The cured product of performance, thermal stability are significantly improved.There is high temperature tolerance (5% thermal weight loss after thermally treated solidification
Temperature is up to 496 DEG C), good dielectric properties (dielectric constant is up to 2.71) and higher index of refraction (n 1.56) etc. are
A kind of new type high temperature cured silicone resin has and is applied to large scale integrated circuit, microelectronics industry, electric appliance and aerospace
It is used as the prospect of high-performance resin matrix or encapsulating material in equal fields.
Present invention will be further explained below with reference to specific examples.It should be understood that these embodiments are merely to illustrate the present invention
Rather than it limits the scope of the invention.In the following examples, the experimental methods for specific conditions are not specified, usually according to conventional strip
Part, or according to the normal condition proposed by manufacturer.Unless otherwise stated, otherwise percentage and number are calculated by weight.
The preparation of 1 phenyl cyclobutane triethoxysilane of embodiment
Under argon gas protection, magnesium chips (10.8g, 0.45mol) is added into the dry three-necked bottle of 500mL, ethyl orthosilicate
4- bromine benzocyclobutene (36.6g, 0.2mol) is slowly added dropwise at room temperature in (104g, 0.5mol), anhydrous tetrahydro furan 50mL
40mL anhydrous tetrahydrofuran solution injects 100mL dry toluene after dripping complete be stirred at room temperature 3 hours, and a large amount of solids are precipitated, filter off
Salt, revolving remove the vacuum distillation of low boiling point solvent rear pump or output pump: collecting 155-165 DEG C of (1.5mmHg) fraction, obtain colorless and transparent liquid
Body 32.45g, yield 61%.
Hydrogen stave sign1H NMR(CDCl3, 400MHz): 1.26~1.30 (t, 9H), 3.23 (s, 6H), 3.82~3.88 (m,
4H), 7.11~7.13 (d, 1H), 7.38 (s, 1H), 7.52~7.54 (d, 2H)
The preparation of 2 methyl of embodiment (benzocyclobutane alkenyl) dichlorosilane
Under argon gas protection, magnesium chips (9.6g, 0.4mol) is added into the dry three-necked bottle of 500mL, methyl trichlorosilane (75g,
0.5mol), anhydrous tetrahydro furan 50mL, the 40mL that 4- bromine benzocyclobutene (36.6g, 0.2mol) is slowly added dropwise at room temperature are anhydrous
Tetrahydrofuran solution injects 80mL dry toluene after dripping complete be stirred at room temperature 3 hours, and a large amount of solids are precipitated, and filtering is desalted, and revolving is removed
It goes low boiling point solvent rear pump or output pump to be evaporated under reduced pressure: collecting 96-106 DEG C of (1.5mmHg) fraction, obtain colorless and transparent liquid 22.46g,
Yield 52%.
Hydrogen stave sign1H NMR(CDCl3, 400MHz): 0.38 (s, 3H), 3.82~3.88 (m, 4H), 7.11~7.13 (d,
1H), 7.38 (s, 1H), 7.52~7.54 (d, 2H)
The preparation of 3 organic siliconresin of cyclobutane base containing phenyl I of embodiment
60 milliliters of water, 60 milliliters of concentrated hydrochloric acids and 30 milliliters of toluene are added in 500 milliliters of clean there-necked flasks, are vigorously stirred
5.2 grams of ethyl orthosilicates, 39.6 grams of phenyltrimethoxysila,es, 18.2 grams of aminomethyl phenyls two are added dropwise by constant pressure funnel down
Methoxy silane, 22.0 grams of vinyl (benzocyclobutane alkenyl) dimethoxysilanes, 22.4 grams of benzocyclobutane alkenyl trimethoxies
The mixed solution of silane and 30 milliliters of toluene, reaction temperature control at 20 DEG C hereinafter, the reaction was continued after being added dropwise 3h, then plus
Heat is cooled to room temperature to 80 DEG C of the reaction was continued 3h, is washed to neutrality, organic layer removes first after being dried, filtered with anhydrous sodium sulfate
Benzene, decompression are warming up to 150 DEG C/10mba and slough small molecule compound, obtain 26.2 grams of organic siliconresins of alkenyl containing benzocyclobutane I.
The preparation of 4 organic siliconresin of alkenyl containing benzocyclobutane II of embodiment
80 milliliters of acetic acid and 30 milliliters of toluene are added in 500 milliliters of clean there-necked flasks, is vigorously stirred down and passes through constant pressure
5.0 grams of ethyl orthosilicates, 42.5 grams of phenyl triethoxysilanes, 19.8 grams of methyl (benzocyclobutane alkenyl) two are added dropwise in dropping funel
Ethoxysilane, 12.5 grams of benzocyclobutane alkenyl trimethoxy silanes, 3.6 grams of dimethyl (benzocyclobutane alkenyl) Ethoxysilanes
And the mixed solution of 20 milliliters of toluene, at 20 DEG C, hereinafter, being heated to 100 DEG C after being added dropwise, the reaction was continued for reaction temperature control
16h is cooled to room temperature, and is washed to neutrality, and organic layer removes toluene after being dried, filtered with anhydrous sodium sulfate, decompression is warming up to 150
DEG C/10mba sloughs small molecule compound, obtain 22.7 grams of organic siliconresins of alkenyl containing benzocyclobutane II.
The preparation of 5 organic siliconresin of alkenyl containing benzocyclobutane III of embodiment
15 milliliters of water, 50 milliliters of acetic acid and 30 milliliters of toluene are added in 500 milliliters of clean there-necked flasks, are vigorously stirred down
3.8 grams of ethyl orthosilicates, 33.2 grams of phenyl triethoxysilanes, 21.8 grams of aminomethyl phenyl diformazans are added dropwise by constant pressure funnel
The mixed solution of oxysilane, 11.2 grams of benzocyclobutene ethyl triethoxy silicane alkane and 20 milliliters of toluene, reaction temperature control exist
20 DEG C hereinafter, be heated to 110 DEG C after being added dropwise the reaction was continued 15h, are cooled to room temperature, and are washed to neutrality, and organic layer is with anhydrous
Sodium sulphate removes toluene after drying, filtering, decompression is warming up to 150 DEG C/10mba and sloughs small molecule compound, obtains 19.1 grams and contain
Benzocyclobutane alkenyl organic siliconresin III.
The preparation of the organic siliconresin IV of 6 alkenyl containing benzocyclobutane of embodiment
25 milliliters of water, 25 milliliters of concentrated hydrochloric acids and 30 milliliters of toluene are added in 250 milliliters of clean there-necked flasks, are vigorously stirred
4.0 grams of ethyl orthosilicates, 42.5 grams of phenyl triethoxysilanes, 29.8 grams of phenyl (benzos are added dropwise by constant pressure funnel down
Cyclobutane base) dimethoxysilane, 11.8 grams of methyl (benzocyclobutane alkenyl) dimethoxysilanes, 16.2 grams of benzocyclobutane alkenyls
The mixed solution of trimethoxy silane and 20 milliliters of toluene, reaction temperature control is at 20 DEG C hereinafter, the reaction was continued after being added dropwise
3h is then heated to 80 DEG C the reaction was continued 5h, is cooled to room temperature, is washed to neutrality, organic layer is dried, filtered with anhydrous sodium sulfate
After remove toluene, decompression is warming up to 150 DEG C/10mba and sloughs small molecule compound, and it is organic to obtain 21.3 grams of alkenyls containing benzocyclobutane
Silicone resin IV.
The preparation of the organic siliconresin V of 7 alkenyl containing benzocyclobutane of embodiment
80 milliliters of acetic acid and 20 milliliters of dimethylbenzene are added in 250 milliliters of clean there-necked flasks, is vigorously stirred down and passes through perseverance
Press dropping funel that 4.0 grams of ethyl orthosilicates, 24.1 grams of phenyl triethoxysilanes, 11.32 grams of diphenyl diethoxy silicon are added dropwise
Alkane, 1.2 grams of trimethylethoxysilanes, 35.4 grams of methyl (benzocyclobutane alkenyl) dimethoxysilanes, 11.5 grams of benzocyclobutanes
The mixed solution of alkenyl trimethoxy silane and 20 milliliters of dimethylbenzene, reaction temperature control is at 20 DEG C hereinafter, adding after being added dropwise
Heat is cooled to room temperature to 130 DEG C of the reaction was continued 16h, is washed to neutrality, organic layer is removed after being dried, filtered with anhydrous sodium sulfate
Toluene, decompression are warming up to 150 DEG C/10mba and slough small molecule compound, obtain 19.6 grams of organic siliconresins of alkenyl containing benzocyclobutane
Ⅴ。
The preparation of the organic siliconresin VI of 8 alkenyl containing benzocyclobutane of embodiment
25 milliliters of water, 25 milliliters of concentrated hydrochloric acids and 20 milliliters of toluene are added in 250 milliliters of clean there-necked flasks, are vigorously stirred
4.0 grams of ethyl orthosilicates, 29.2 grams of dodecyltrimethoxysilanes, 18.2 grams of methylbenzenes are added dropwise by constant pressure funnel down
Base dimethoxysilane, 22.0 grams of vinyl (benzocyclobutane alkenyl) dimethoxysilanes, 11.2 grams of benzocyclobutane alkenyl front threes
The mixed solution of oxysilane, 4.8 grams of dimethylbiphenyl cyclobutane base methoxy silanes and 20 milliliters of toluene, reaction temperature control
At 20 DEG C hereinafter, the reaction was continued after being added dropwise 3h, 80 DEG C are then heated to the reaction was continued 5h, be cooled to room temperature, is washed to
Property, organic layer removes toluene after being dried, filtered with anhydrous sodium sulfate, decompression is warming up to 150 DEG C/10mba and sloughs small molecule chemical combination
Object obtains 23.3 grams of organic siliconresins of alkenyl containing benzocyclobutane VI.
The solidification of the organic siliconresin I of 9 alkenyl containing benzocyclobutane of embodiment
The organic siliconresin I for the alkenyl containing benzocyclobutane for taking 2.0 grams of embodiments 3 to prepare is cast in mold, at 120 DEG C of heat
Reason 1 hour, vacuum outgas bubble then proceed to heating and are heat-treated at 180 DEG C 3 hours, and 230 DEG C are heat-treated 1 hour, at 300 DEG C of heat
Reason can obtain highly cross-linked organic siliconresin in 2 hours.
Gained sample tests its thermal stability with TGA, and carrier gas used is nitrogen, and heating rate is 10 DEG C/min；Agilent
Impedance instrument 4294A tests its dielectric properties；Ellipsometer tests its index of refraction.
All references mentioned in the present invention is incorporated herein by reference, independent just as each document
It is incorporated as with reference to such.In addition, it should also be understood that, after reading the above teachings of the present invention, those skilled in the art can
To make various changes or modifications to the present invention, such equivalent forms equally fall within model defined by the application the appended claims
It encloses.
Claims (15)
1. a kind of organic siliconresin of alkenyl containing benzocyclobutane, which is characterized in that the organic siliconresin is with such as following formula A institute
Copolymerization preparation is hydrolyzed in monomer shown in the monomer and following formula B shown:
In formula, each R is each independently selected from the following group: hydrogen, C1~C4 alkyl, C1~C4 alkoxy, C1~C4 halogenated alkyl, C2
~C4 alkenyl, C6~C10 aryl, the heteroaryl of C1~C10, C8~C17 alkyl, benzocyclobutane alkenyl, halogen；
And in the formula A, at least one R is group selected from the group below: C1~C4 alkoxy, halogen；
And in the formula B, at least one R is group selected from the group below: C1~C4 alkoxy, halogen；
And in the formula A, at least one R is not benzocyclobutane alkenyl；And in the formula B, each R is not benzo ring
Cyclobutenyl；
The molfraction a of formula A1 monomer is 0≤a≤0.8, wherein the formula A1 monomer has structure shown in formula A, and institute
It states in formula A, 2 R bases are groups selected from the group below: C1~C4 alkoxy, halogen；
The molfraction b of formula A2 monomer is 0≤b≤0.6, wherein the formula A2 monomer has structure shown in formula A, and institute
It states in formula A, 3 R bases are groups selected from the group below: C1~C4 alkoxy, halogen；
The molfraction c of formula A3 monomer is 0≤c≤0.3, wherein the formula A3 monomer has structure shown in formula A, and institute
It states in formula A, 1 R base is group selected from the group below: C1~C4 alkoxy, halogen；
The molfraction d of formula B1 monomer is 0≤d≤0.3, wherein the formula B1 monomer has structure shown in formula B, and institute
It states in formula B, 1 R base is group selected from the group below: C1~C4 alkoxy, halogen；
The molfraction e of formula B2 monomer is 0≤e≤0.5, wherein the formula B2 monomer has structure shown in formula B, and institute
It states in formula B, 2 R bases are groups selected from the group below: C1~C4 alkoxy, halogen；
The molfraction f of formula B3 monomer is 0≤f≤0.4, wherein the formula B3 monomer has structure shown in formula B, and institute
It states in formula B, 3 R bases are groups selected from the group below: C1~C4 alkoxy, halogen；
The molfraction g of formula B4 monomer is 0 g≤0.3 <, wherein the formula B4 monomer has structure shown in formula B, and institute
It states in formula B, 4 R bases are groups selected from the group below: C1~C4 alkoxy, halogen；
And a, b, c are not 0 simultaneously.
2. organic siliconresin as described in claim 1, which is characterized in that each R is each independently selected from the following group: first
Base, ethyl, propyl, trifluoro propyl, vinyl, phenyl, benzocyclobutane alkenyl, dodecyl, methoxyl group, ethyoxyl, chlorine, bromine.
3. organic siliconresin as described in claim 1, which is characterized in that the organic siliconresin molecular weight is 1000-
20000。
4. organic siliconresin as described in claim 1, which is characterized in that the formula A monomer is the list for being selected from the group (a)
Body:
(a) benzocyclobutane alkenyl trimethoxy silane, benzocyclobutene ethyl triethoxy silicane alkane, benzocyclobutane alkenyl trichlorine silicon
Alkane, phenyl (benzocyclobutane alkenyl) dimethoxysilane, phenyl (benzocyclobutane alkenyl) diethoxy silane, phenyl (benzo ring
Cyclobutenyl) dichlorosilane, dibenzo cyclobutane base dimethoxysilane, dimethyl (benzocyclobutane alkenyl) Ethoxysilane, first
Base (benzocyclobutane alkenyl) dimethoxysilane, methyl (benzocyclobutane alkenyl) diethoxy silane, methyl (benzocyclobutene
Base) dichlorosilane, vinyl (benzocyclobutane alkenyl) dimethoxysilane, vinyl (benzocyclobutane alkenyl) diethoxy silicon
Alkane, vinyl (benzocyclobutane alkenyl) dichlorosilane, dimethylbiphenyl cyclobutane base methoxy silane, or combinations thereof；
And the formula B monomer is the monomer for being selected from the group (b):
(b) phenyl triethoxysilane, phenyltrimethoxysila,e, diphenyl diethoxy silane, diphenyl dimethoxy silicon
Alkane, aminomethyl phenyl dimethoxysilane, dichloromethyl phenylsilane, aminomethyl phenyl diethoxy silane, front three base oxethyl silicon
Alkane, methyl vinyl diethoxysilane, methyl trifluoro propyl diethoxy silane, dodecyltrimethoxysilane, positive silicon
Acetoacetic ester, or combinations thereof.
5. the preparation method of organic siliconresin as described in claim 1, which is characterized in that comprising steps of
In atent solvent, polymerization is hydrolyzed with following monomer shown in formula A and the monomer as shown in following formula B, obtains described
Organic siliconresin:
In formula, each R is each independently selected from the following group: hydrogen, C1~C4 alkyl, C1~C4 alkoxy, C1~C4 halogenated alkyl, C2
~C4 alkenyl, C6~C10 aryl, the heteroaryl of C1~C10, C8~C17 alkyl, halogen；
And in the formula A, at least one R is group selected from the group below: C1~C4 alkoxy, halogen；
And in the formula B, at least one R is group selected from the group below: C1~C4 alkoxy, halogen；
In the formula A, at least one R is not benzocyclobutane alkenyl；And in the formula B, each R is not benzocyclobutane
Alkenyl.
6. method as claimed in claim 5, which is characterized in that each R is each independently selected from the following group: methyl, ethyl, third
Base, trifluoro propyl, vinyl, phenyl, benzocyclobutane alkenyl, dodecyl, methoxyl group, ethyoxyl, chlorine, bromine.
7. method as claimed in claim 5, which is characterized in that the method comprising steps of
In atent solvent, with the silane monomer of the alkenyl containing benzocyclobutane for being selected from the group (a) and it is selected from the group the silane list of (b)
Polymerization is hydrolyzed in body, obtains organic siliconresin as claimed in claim 4:
(a) benzocyclobutane alkenyl trimethoxy silane, benzocyclobutene ethyl triethoxy silicane alkane, benzocyclobutane alkenyl trichlorine silicon
Alkane, phenyl (benzocyclobutane alkenyl) dimethoxysilane, phenyl (benzocyclobutane alkenyl) diethoxy silane, phenyl (benzo ring
Cyclobutenyl) dichlorosilane, dibenzo cyclobutane base dimethoxysilane, dimethyl (benzocyclobutane alkenyl) Ethoxysilane, first
Base (benzocyclobutane alkenyl) dimethoxysilane, methyl (benzocyclobutane alkenyl) diethoxy silane, methyl (benzocyclobutene
Base) dichlorosilane, vinyl (benzocyclobutane alkenyl) dimethoxysilane, vinyl (benzocyclobutane alkenyl) diethoxy silicon
Alkane, vinyl (benzocyclobutane alkenyl) dichlorosilane, dimethylbiphenyl cyclobutane base methoxy silane, or combinations thereof；
(b) phenyl triethoxysilane, phenyltrimethoxysila,e, diphenyl diethoxy silane, diphenyl dimethoxy silicon
Alkane, aminomethyl phenyl dimethoxysilane, dichloromethyl phenylsilane, aminomethyl phenyl diethoxy silane, methyl ethylene diethyl
Oxysilane, methyl trifluoro propyl diethoxy silane, trimethylethoxysilane, dodecyltrimethoxysilane, positive silicon
Acetoacetic ester, or combinations thereof.
8. method as claimed in claim 5, which is characterized in that the hydrolytic-polymeric reaction is in acidic catalyst and/or water
In the presence of carry out.
9. method according to claim 8, which is characterized in that the acidic catalyst is selected from the group: hydrochloric acid, sulfuric acid, second
Acid, formic acid, or combinations thereof.
10. method as claimed in claim 5, which is characterized in that the atent solvent is selected from the group: benzene, toluene, diformazan
Benzene, trimethylbenzene, or combinations thereof.
11. method as claimed in claim 5, which is characterized in that the described method includes: at 0~30 DEG C, toward dissolved with acidity
The mixed solution of formula A monomer and formula B monomer is added dropwise in the solvent of catalyst；
Solution after described be added dropwise is warming up at 70~130 DEG C, the reaction was continued.
12. a kind of cured product, which is characterized in that the cured product is with organic siliconresin as described in claim 1
Curing molding preparation is carried out after being blended individually or with other curable molding performed polymers.
13. cured product as claimed in claim 12, which is characterized in that the curing molding is the molding that is heating and curing.
14. cured product as claimed in claim 12, which is characterized in that the curing molding temperature is 100~350 DEG C.
15. the preparation method of cured product as claimed in claim 12, which is characterized in that the method comprising steps of with
Organic siliconresin as described in claim 1 individually or after being blended with other optional curable molding performed polymers progress at
Type obtains preform；
It is heating and curing to the preform, obtains the product.
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| CN106866722B (en) * | 2017-01-12 | 2020-05-12 | 复旦大学 | Benzocyclobutene-containing functionalized organosilicon compound and preparation method thereof |
| CN108586748B (en) * | 2018-04-23 | 2021-09-17 | 复旦大学 | Benzocyclobutene functionalized organic silicon polymer and preparation method and application thereof |
| CN114479087B (en) * | 2022-03-14 | 2023-01-20 | 中国科学院化学研究所 | Benzocyclobutene functionalized polysiloxane and preparation method thereof |
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| CN1793150A (en) * | 2005-12-30 | 2006-06-28 | 四川大学 | Diene silicoxyane linking disbenzocyclobutylene monomer and process for preparing prepolymer |
| CN101265270A (en) * | 2008-04-11 | 2008-09-17 | 西南科技大学 | 4-(1',1'-dimethyl-1'-vinyl)siliconbenzocyclobutene and preparation method thereof |
| CN104356390A (en) * | 2014-11-07 | 2015-02-18 | 中国科学院上海有机化学研究所 | Organosiloxane containing benzocyclobutene group as well as preparation method and application thereof |
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| CN1793150A (en) * | 2005-12-30 | 2006-06-28 | 四川大学 | Diene silicoxyane linking disbenzocyclobutylene monomer and process for preparing prepolymer |
| CN101265270A (en) * | 2008-04-11 | 2008-09-17 | 西南科技大学 | 4-(1',1'-dimethyl-1'-vinyl)siliconbenzocyclobutene and preparation method thereof |
| CN104356390A (en) * | 2014-11-07 | 2015-02-18 | 中国科学院上海有机化学研究所 | Organosiloxane containing benzocyclobutene group as well as preparation method and application thereof |
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