CN107418141A - Resin composition for cleaning mold - Google Patents
Resin composition for cleaning mold Download PDFInfo
- Publication number
- CN107418141A CN107418141A CN201710156947.5A CN201710156947A CN107418141A CN 107418141 A CN107418141 A CN 107418141A CN 201710156947 A CN201710156947 A CN 201710156947A CN 107418141 A CN107418141 A CN 107418141A
- Authority
- CN
- China
- Prior art keywords
- resin composition
- cleaning
- cleaning mold
- resin
- fatty acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C08L61/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
- C08L61/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
- B29C33/722—Compositions for cleaning moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1753—Cleaning or purging, e.g. of the injection unit
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
- C08K5/31—Guanidine; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
The present invention relates to a kind of resin composition for cleaning mold, it contains melamine series resin, fatty acid zinc and organic base (wherein, the salt that strong acid and weak base are formed is not included), the content of above-mentioned fatty acid zinc is relative to the mass parts of all solids composition 100 of resin composition for cleaning mold to be more than 1 mass parts, and the content of above-mentioned organic base is calculated as 1/100~1/2 relative to the ratio of the content of above-mentioned fatty acid zinc with quality criteria.
Description
Technical field
The present invention, which discloses, is related to resin composition for cleaning mold.
Background technology
If use encapsulated moulding material over time continuous integrating circuit, LED (Light containing thermosetting resin
Emitting Diode) the encapsulated moulding thing such as element forming operation, then the dirt from encapsulated moulding material is attached to shaping
The interior surface of mould.If the dirt that will attach to the interior surface of mould is let go unchecked, can produce integrated circuit,
The problem of surface attachment dirt of the encapsulated moulding thing such as LED element is such.In order to prevent this problem, it is necessary to regularly clean into
Pattern has.As the method for cleaning mould, it is known to use the method for resin composition for cleaning mold.
For example, disclosing a kind of resin composition for cleaning mold in International Publication No. 2002/030648, it contains three
Paracyanogen amine system resin and the fibrous inorganic compound with specific average fiber length, avarage fiber diameter and length-width ratio.
A kind of mould containing melamine series resin and guanidine derivatives disclosed in Japanese Unexamined Patent Publication 1-139649 publications
Resin composition for cleaning.
The content of the invention
In recent years, for response environment problem, it is referred to as green compounds using without halogen-system fire retardant etc. always
Encapsulated moulding material.For the shaping using the green compounds, mould easily pollutes, in addition, the dirt of attachment is difficult to
Remove, therefore the cleaning performance of conventional resin composition for cleaning mold can not be tackled fully.Therefore, it is desirable to develop with than with
Toward the resin composition for cleaning mold of high cleaning performance.
The present invention disclose in view of described above situation and complete, its problem is to provide a kind of excellent mould of cleaning performance
Has resin composition for cleaning.
In the following manner is included for solving the specific method of problem.
A kind of resin composition for cleaning mold of the ＞ of ＜ 1, it contains melamine series resin, fatty acid zinc and organic base
(salt wherein, not formed including strong acid and weak base), the content of above-mentioned fatty acid zinc is relative to resin composition for cleaning mold
The mass parts of all solids composition 100 to be more than 1 mass parts, and the content of above-mentioned organic base containing relative to above-mentioned fatty acid zinc
The ratio of amount is calculated as 1/100~1/2 with quality criteria.
Resin composition for cleaning mold of the ＞ of ＜ 2 as described in the ＞ of ＜ 1, wherein, above-mentioned organic base is to be selected from guanidine compound
With at least one kind of compound in amidine compound.
Resin composition for cleaning mold of the ＞ of ＜ 3 as described in the ＞ of ＜ 1 or the ＞ of ＜ 2, wherein, above-mentioned fatty acid zinc contains choosing
From at least one in Zinc tetradecanoate and zinc stearate.
Resin composition for cleaning mold of the ＞ of ＜ 4 as any one of the ＞ of 1 ＞ of ＜~＜ 3, wherein, above-mentioned melamine
Amine system resin contains melamine formaldehyde resin.
Disclosed according to the present invention, can provide a kind of cleaning performance excellent resin composition for cleaning mold.
Embodiment
Hereinafter, embodiment disclosed by the invention is described in detail, but the present invention is disclosed and is not limited to
Implementation below, appropriate change can be applied in the range of purpose disclosed by the invention and implemented.
In this specification, the number range for using "~" to represent refers to that the front and rear described numerical value comprising "~" is made respectively
For minimum value and the scope of maximum.
In this specification, the amount of each composition in resin combination exists multiple equivalent to each composition in resin combination
Material in the case of, unless otherwise specified, then refer to the total amount of multiple materials present in resin combination.
In this specification, " interior surface of mould " refers to be formed what thing contacted with what is be molded using mould
Region.
[resin composition for cleaning mold]
Resin composition for cleaning mold disclosed by the invention contains melamine series resin, fatty acid zinc and organic base
(the salt wherein, not formed including strong acid and weak base.Hereinafter also referred to as " organic base "), the content of above-mentioned fatty acid zinc relative to
The mass parts of all solids composition 100 of resin composition for cleaning mold are more than 1 mass parts and content phases of above-mentioned organic base
For the ratio of the content of above-mentioned fatty acid zinc 1/100~1/2 is calculated as with quality criteria.
Resin composition for cleaning mold disclosed by the invention cleans compared with conventional resin composition for cleaning mold
Excellent performance.
The reasons why can obtaining this effect for resin composition for cleaning mold disclosed by the invention, is unclear, but
The present inventor etc. is presumed as follows.
In general, in the resin composition for cleaning mold containing melamine series resin, to improve mould
Cleaning performance, for the purpose of the release property in the mould after cleaning, tabletting etc., contain zinc stearate, myristic acid
The fatty acid zincs such as zinc.For example, in above-mentioned International Publication No. 2002/030648 and Japanese Unexamined Patent Publication 1-139649 publications
Also disclose that the example of the resin composition for cleaning mold containing zinc stearate.
From the further cleaning performance for improving mould, from the release property in the mould after cleaning, tabletting etc.
From the viewpoint of, the resin composition for cleaning mold for preferably comprising melamine series resin contains aliphatic acid as much as possible
Zinc.
However, the fatty acid zinc as acid compound can be urged as the acidity of the curing reaction of melamine series resin
Agent play function, if therefore the resin composition for cleaning mold containing melamine series resin excessively contain aliphatic acid
Zinc, then show that the curing reaction of melamine series resin accelerates, the cleaning performance of mould downward trend on the contrary.
Resin composition for cleaning mold disclosed by the invention contains melamine series resin, fatty acid zinc and organic base
(salt wherein, not formed including strong acid and weak base), the content of organic base is relative to the ratio of the content of fatty acid zinc with quality
Benchmark is calculated as 1/100~1/2, therefore can be by organic base control using the curing reaction of the melamine series resin of fatty acid zinc
Appropriate speed.Then, it is appropriate to be controlled by using the curing reaction of the melamine series resin of fatty acid zinc by organic base
Speed, resin composition for cleaning mold can contain the enough amount of cleaning performance to improving mould, i.e. contain phase
The mass parts of all solids composition 100 for resin composition for cleaning mold are fatty acid zincs more than 1 mass parts.It is tied
Fruit, it is believed that resin composition for cleaning mold disclosed by the invention can obtain excellent cleaning performance.
In addition, as described above, resin composition for cleaning mold disclosed by the invention can contain to improving after cleaning
Mould in the enough amount of release property, i.e. contain all solids composition relative to resin composition for cleaning mold
100 mass parts are fatty acid zincs more than 1 mass parts, therefore from mould by the resin composition for cleaning mold after cleaning
Article shaped remove when operability it is also excellent.
(melamine series resin)
Resin composition for cleaning mold disclosed by the invention contains melamine series resin.
Resin composition for cleaning mold disclosed by the invention, can be to mould by containing melamine series resin
The dirt of interior surface plays excellent cleaning performance.
Thinking melamine series resin has a high methylol of polarity, and the methylol is to from containing the thermosettings such as epoxy resin
The dirt of the encapsulated moulding material of property resin combination plays a role, so as to obtain excellent cleaning performance effect.In addition, trimerization
Cyanamide system resin is to thermostabilization, it is taken as that resin composition for cleaning mold disclosed by the invention cleans as mould
When 160 DEG C~190 DEG C of the common temperature cleaning performances nearby also played stably.
The present invention discloses, " melamine series resin " refer to melmac, melamine-phenol cocondensation,
Or melamine-urea cocondensation.
During the present invention discloses, selection uses more than a kind in them.
Melmac is the condensation product of triaizine compounds and aldehyde compound.
As triaizine compounds, melamine, benzoguanamine, methyl guanamines etc. can be enumerated.
As aldehyde compound, formaldehyde, paraformaldehyde, acetaldehyde etc. can be enumerated.
Melmac is preferred from the repeat unit of triaizine compounds and rubbing for the repeat unit from aldehyde compound
You are than being 1：1.2~1：4.
It should illustrate, in this specification, the condensation product of melamine and formaldehyde is referred to as melamine formaldehyde resin.
Melamine-phenol cocondensation is the cocondensation of triaizine compounds and phenolic compounds and aldehyde compound.
As phenolic compounds, phenol, cresols, xylenol, ethyl -phenol, butylphenol etc. can be enumerated.
Melamine-phenol cocondensation is preferred from the repeat unit of triaizine compounds and the weight from phenolic compounds
The mol ratio of multiple unit and the repeat unit from aldehyde compound is 1：0.3：1~1：1：3.
Melamine-urea cocondensation is the cocondensation of triaizine compounds and urea compounds and aldehyde compound.
As urea compounds, urea, thiocarbamide, ethylidene-urea etc. can be enumerated.
In melamine-phenol cocondensation resin and melamine-urea cocondensation resin, triazine in the feed
In the total amount of compound and phenolic compounds or triaizine compounds and the total amount of urea compounds in the feed, triazine
Compound is, for example, more than 30 mass %, more than 40 mass %, more than 50 mass %, more than 60 mass %, more than 70 mass %, 80
More than quality % or more than 90 mass %, and it is less than 100 mass %.
Resin composition for cleaning mold disclosed by the invention can also not damage in addition to containing melamine series resin
Contain the resin of other species in the range of the effect of the evil present invention, for example, selected from alkyd resin, polyester resin, acrylic acid series
More than one in resin, epoxy resin and rubber-like.
Melamine series resin during the present invention discloses can be manufactured by known method.
For example, melmac is with mol ratio 1 by melamine crystallization with formaldehyde：1.2~1：4 in reaction temperature 80
DEG C~90 DEG C, stir under conditions of pH7~7.5 after, in 60 DEG C of reactions until the 3 mass % aqueous solution of reactant for gonorrhoea untill
Time.Next, being put into sodium hydroxide, cooled down, so as to can obtain melmac.
As melamine series resin, the commercially available product listed can be used.
As the example of commercially available product, Nikaresin (registration mark) S- of Nippon Carbide Industries Co., Ltd can be enumerated
166th, S-176, S-260, S-305 etc..
Resin composition for cleaning mold disclosed by the invention can only contain a kind of melamine series resin, can also contain
There is two or more.
The content of melamine series resin in resin composition for cleaning mold disclosed by the invention is not particularly limited.
For example, the content of the melamine series resin in resin composition for cleaning mold is relative to resin composition for cleaning mold
The mass parts of all solids composition 100 are preferably the mass parts of 55 mass parts~85, the mass parts of more preferably 60 mass parts~80, enter one
Step is preferably the mass parts of 65 mass parts~75.
(fatty acid zinc)
Resin composition for cleaning mold disclosed by the invention is consolidated relative to the whole of the resin composition for cleaning mold
The mass parts of body composition 100 contain fatty acid zincs more than 1 mass parts.
Fatty acid zinc contributes to improve the cleaning of mould in resin composition for cleaning mold disclosed by the invention
Performance, from the release property in the mould after cleaning, tabletting etc..
As fatty acid zinc, it is not particularly limited.
The aliphatic acid for forming fatty acid zinc can be any one of saturated fatty acid and unrighted acid, preferably satisfy
And aliphatic acid.
As the saturated fatty acid for the aliphatic acid, preferably carbon number 12~20 for forming fatty acid zinc, more preferably carbon
The saturated fatty acid of atomicity 14~18.
As the saturated fatty acid of carbon number 12~20, specifically, the laurate of carbon number 12 can be enumerated
(IUPAC names：Dodecylic acid), myristic acid (the IUPAC names of carbon number 14：Tetradecanoic acid), the palmitic acid of carbon number 16
(IUPAC names：Hexadecanoic acid), stearic acid (the IUPAC names of carbon number 18：Octadecanoid acid), the arachidic acid of carbon number 20
(IUPAC names：Arachic acid) etc..
As fatty acid zinc, be preferably selected from the Zinc tetradecanoate that is made up of the saturated fatty acid and zinc of carbon number 14 with
And at least one kind of in the zinc stearate being made up of the saturated fatty acid and zinc of carbon number 18, particularly preferably Zinc tetradecanoate.
Resin composition for cleaning mold disclosed by the invention can only contain a kind of fatty acid zinc, can also contain 2 kinds with
On.
The content of fatty acid zinc in resin composition for cleaning mold disclosed by the invention is relative to cleaning mold tree
The mass parts of all solids composition 100 of oil/fat composition be 1 mass parts more than, preferably more than 1.2 mass parts, more preferably 1.5
It is more than mass parts.
If the content of fatty acid zinc is 1 relative to the mass parts of all solids composition 100 of resin composition for cleaning mold
More than mass parts, then excellent cleaning performance is played to the dirt of the interior surface of mould.In addition, the mould after cleaning is clear
Sweeping the demoulding of the interior surface with the article shaped of resin combination and mould becomes good, and article shaped is clear from mould
Except when operability improve.And then cleaning mold disclosed by the invention is improved with tabletting during composition compression molding.
As described above, fatty acid zinc not only facilitate improve mould cleaning performance, and also contribute to improve from
Release property in mould, tabletting after cleaning etc..But the if cleaning mold resin containing melamine series resin
Composition excessively contains fatty acid zinc, then tabletting declines on the contrary sometimes, or unnecessary fatty acid zinc residues in mould
And pollute mould.Even if additionally it is believed that from the release property resin composition for cleaning mold in the mould after cleaning
In the content of fatty acid zinc do not changed much more than certain a certain amount yet, therefore the advantages of excessively contain fatty acid zinc compared with
It is few.
The upper limit of the content of fatty acid zinc in resin composition for cleaning mold disclosed by the invention is not particularly limited,
For example, from the viewpoint of the decline and the pollution of mould for preventing tabletting, relative to resin composition for cleaning mold
The mass parts of all solids composition 100, preferably below 5 mass parts, more preferably below 4 mass parts.
(organic base)
Resin composition for cleaning mold disclosed by the invention contains organic base and (wherein, not formed including strong acid and weak base
Salt).In addition, in resin composition for cleaning mold disclosed by the invention, content containing relative to fatty acid zinc of organic base
The ratio of amount is calculated as 1/100~1/2 with quality criteria.
In resin composition for cleaning mold disclosed by the invention, organic base helps to control already described utilization fatty acid zinc
Melamine series resin curing reaction speed.
As organic base, the salt formed so long as not strong acid and weak base, it is not particularly limited.
As organic base, guanidine compound (guanidine carbonate, aminoguanidin carbonate, phosphoguanidine, 1,1,3,3- tetramethyl can be enumerated
Base guanidine, guanidines etc.), amidine compound (1,8- diazabicyclos [5.4.0] -7- endecatylenes, 1,5- diazabicyclos
[4.3.0] -5- nonenes etc.) etc..
Among these, as organic base, for example, from can effectively suppress the already described melamine using fatty acid zinc
Be resin the rising of curing reaction speed from the aspect of, be preferably selected from least one kind of in guanidine compound and amidine compound
Compound, more preferably selected from guanidine carbonate, aminoguanidin carbonate and 1,8- diazabicyclo [5.4.0] -7- endecatylenes
In at least one kind of compound, more preferably guanidine carbonate.
It should illustrate, the salt that strong acid and weak base are formed is at 25 DEG C of the acid and temperature that the pKa at 25 DEG C of temperature is less than 2.0
PKb be 3.0~11.0 alkali formed salt.Here, " Ka " be acid dissociation constant, " Kb " be alkali dissociation constant, pKa
=-logKa, pKb=-logKb.
The salt that strong acid is formed with weak base can be illustrated using hydrochloric acid, sulfuric acid and nitric acid as the strong acid of representative and with ammonia, diethanol
The salt that amine, triethanolamine and aniline are formed for the weak base of representative.
Resin composition for cleaning mold disclosed by the invention can only contain a kind of organic base, can also contain 2 kinds with
On.
The content of organic base in resin composition for cleaning mold disclosed by the invention is relative to cleaning mold resin
The mass parts of all solids composition 100 of composition, the mass parts of preferably 0.01 mass parts~2.5, more preferably 0.012 mass parts
The mass parts of~2.0 mass parts, more preferably 0.015 mass parts~1.5.
In addition, in resin composition for cleaning mold disclosed by the invention, the content of organic base is relative to fatty acid zinc
The ratio of content 1/100~1/2, preferably 1/80~1/3, more preferably 1/40~1/4 are calculated as with quality criteria.
If the content of organic base is calculated as more than 1/100 relative to the ratio of the content of fatty acid zinc with quality criteria, can
To utilize the rising of the curing reaction speed of the melamine series resin of fatty acid zinc, therefore cleaning mold using organic base control
The enough amount of cleaning performance to improving mould can be contained with resin combination, i.e. containing being used relative to cleaning mold
The mass parts of all solids composition 100 of resin combination are fatty acid zincs more than 1 mass parts.It is as a result, disclosed by the invention
Resin composition for cleaning mold can obtain excellent cleaning performance.
If the content of organic base is calculated as less than 1/2 relative to the ratio of the content of fatty acid zinc with quality criteria, fat
Sour zinc moderately plays function as the acidic catalyst of melamine series resin, thus resin composition for cleaning mold into
Type becomes good.
(other compositions)
Resin composition for cleaning mold disclosed by the invention is except containing melamine series resin, fatty acid zinc and organic
, can also be in the range of effect disclosed by the invention not be damaged beyond alkali (salt wherein, not formed including strong acid and weak base)
As needed containing additives such as packing material, lubricant, colouring agent, antioxidants.
＜ packing materials ＞
Resin composition for cleaning mold disclosed by the invention preferably comprises packing material.
If resin composition for cleaning mold contains packing material, cleaning mold resin is suitably kept in shaping
The intensity of composition, therefore, after cleaning, by the article shaped of resin composition for cleaning mold from mould remove when behaviour
Become more good as property, and the cleaning performance of the interior surface of mould also becomes better.
Can be any one of organic filler material and inorganic filling material as packing material.
(organic filler material)
As organic filler material, paper pulp, wood powder, synthetic fibers etc. can be enumerated.
Among these, as organic filler material, particularly preferably paper pulp.
As paper pulp, can enumerate wood pulp (coniferous tree paper pulp, broad leaf tree paper pulp etc.), non-wood pulp (straw, bamboo,
Bagasse, cotton etc.) etc..These paper pulp can also be any one of chemical pulp and mechanical pulp.
The size of paper pulp is not particularly limited, for example, being preferably 5 μm~1000 μm, more preferably 10 μm in terms of fiber length
~200 μm.The fiber length of paper pulp can for example pass through the defined side according to the JIS P8226-2 corresponding to ISO16065-2
Method is measured.
If the size of paper pulp is in above range, the mobility of resin composition for cleaning mold becomes good, therefore
Can fully it clean to the corner part of the chamber of mould.In addition, if the size of paper pulp is in above range, in shaping
The appropriate intensity for keeping resin composition for cleaning mold, therefore, after cleaning, by the shaping of resin composition for cleaning mold
Thing from mould remove when operability become more good, and the cleaning performance of the interior surface of mould also becomes more
Add good.
, can be only organic containing a kind when resin composition for cleaning mold disclosed by the invention contains organic filler material
Packing material, two or more can also be contained.
When resin composition for cleaning mold disclosed by the invention contains organic filler material, cleaning mold resin combination
The content of organic filler material in thing relative to resin composition for cleaning mold the mass parts of all solids composition 100, it is excellent
Elect the mass parts of 3 mass parts~20 as.
If the content of organic filler material is in above range, the mobility of resin composition for cleaning mold is more suitable
When.In addition, if the content of organic filler material is in above range, cleaning mold resin can be suitably kept in shaping
The intensity of composition, therefore, after cleaning, by the article shaped of resin composition for cleaning mold from mould remove when behaviour
Become more good as property, and the cleaning performance of the interior surface of mould also becomes better.
(inorganic filling material)
As inorganic filling material, can enumerate carborundum, silica (silica), titanium carbide, titanium oxide, boron carbide,
Boron oxide, aluminum oxide, magnesia, calcium oxide, calcium carbonate etc..
Among these, as inorganic filling material, when preparing resin composition for cleaning mold, from can be with melamine
From the viewpoint of amine system resin mixes well, be preferably selected from carborundum, silica (silica), titanium carbide, titanium oxide,
It is at least one kind of in boron carbide, boron oxide, aluminum oxide, magnesia and calcium oxide.
In addition, as inorganic filling material, more preferably at least 1 in silica (silica) and titanium oxide
Kind, particularly preferably silica (silica).
Due to also depending on the material and state of mould, therefore cannot treat different things as the same, but silica (silica) and oxygen
It is appropriate to change the hardness of titanium, can suppress the abrasion of the interior surface and gate portions of mould and abrasive generation, and
160 DEG C~190 DEG C also thermostabilizations nearby of common temperature during cleaning as mould, therefore be preferred.
In addition, for the hardness (new Mohs' hardness) of foregoing illustrative inorganic filling material, carborundum 13, silica
(silica) is 8, titanium carbide 9, titanium oxide 8, boron carbide 14, boron oxide 3, aluminum oxide 12, magnesia 4,
And calcium oxide is 3.
As inorganic filling material, the commercially available product of listing can be used.
As the example of commercially available product, can enumerate ICRON companies of Zhu Jin materials M Co., Ltd. of Nippon Steel " S440-4 ",
The amorphous silica such as " HS-202 ", " HS-204 ", " UF-320 " (being trade name), rapids family ceramic industry raw material Co., Ltd.
The crystalline silica such as pure silicon stone flour (trade name) etc..
, can be only inorganic containing a kind when resin composition for cleaning mold disclosed by the invention contains inorganic filling material
Packing material, two or more can also be contained.
When resin composition for cleaning mold disclosed by the invention contains inorganic filling material, cleaning mold resin combination
The content of inorganic filling material in thing relative to resin composition for cleaning mold the mass parts of all solids composition 100, it is excellent
Elect the mass parts of 10 mass parts~30 as, the mass parts of more preferably 15 mass parts~25.
If the content of inorganic filling material is in above range, cleaning mold resin can be suitably kept in shaping
The intensity of composition, therefore, after cleaning, by the article shaped of resin composition for cleaning mold from mould remove when behaviour
Become more good as property, and the cleaning performance of the interior surface of mould also becomes better.
＜ lubricants ＞
Resin composition for cleaning mold disclosed by the invention preferably comprises lubricant.
If resin composition for cleaning mold contains lubricant, when preparing resin composition for cleaning mold, respectively into
The dispersiveness raising divided.
As lubricant, fatty acid amide base lubricant can be enumerated, specifically, lauric amide, nutmeg can be enumerated
The saturations such as sour acid amides, erucyl amide, oleamide, stearic amide or unsaturated monoamides type lubricant, di-2-ethylhexylphosphine oxide are stearic
The saturations such as sour acid amides, ethylenebis stearic amide, ethylenebisoleaamide or unsaturated bisamide type lubricant etc..
When resin composition for cleaning mold disclosed by the invention contains lubricant, it can only contain a kind of lubricant, also may be used
To contain two or more.
When resin composition for cleaning mold disclosed by the invention contains lubricant, in resin composition for cleaning mold
The content of lubricant is relative to the mass parts of all solids composition 100 of resin composition for cleaning mold, preferably 0.1 mass parts
The mass parts of~0.6 mass parts, more preferably 0.2 mass parts~0.5.
(preparation method of resin composition for cleaning mold)
Resin composition for cleaning mold disclosed by the invention for example can be by by melamine series resin, fatty acid zinc
Mixed with organic base (salt wherein, not formed including strong acid and weak base) and already described other compositions as needed
And prepare.
As mixed method, it is not particularly limited, can enumerates using kneader, ribbon blender, nauta mixer, prosperous house
The mixed method of mixer known to your mixer, ball mill, roll-type kneading machine, mixing and kneading machine, roller etc..
(purposes)
Resin composition for cleaning mold disclosed by the invention can perform well in from containing epoxy resin, organosilicon
The encapsulated moulding material of the thermosetting resins such as resin, melmac, urea resin, phenolic resin, polyimide resin
Dirt is removed from the interior surface of mould.
Resin composition for cleaning mold disclosed by the invention cleans shaping mould particularly preferable as by transfer molding
The resin composition for cleaning mold of interior surface, the so-called transmission type of tool.
(cleaning mold method)
Resin composition for cleaning mold disclosed by the invention is generally processed into tablet shape and is used for the inside of mould
The cleaning operation on surface.Specifically, after configuring lead frame on mould, by the cleaning mold resin combination of tablet shape
After thing inserts kettle portion and carries out matched moulds, with plunger punching press.Now, the resin composition for cleaning mold in kettle portion is via flow path portion,
Chamber interior is flowed into by gate part.After defined molding time, mould is opened, removes what is be integrally formed with lead frame
Article shaped, i.e. the article shaped of the resin composition for cleaning mold comprising dirt.
Embodiment
Hereinafter, the present invention is further specifically described by embodiment to disclose.As long as the present invention, which discloses, is no more than its purport,
Then it is not limited to following examples.
[preparation of the melamine formaldehyde resin containing paper pulp]
(Production Example 1)
Make the mass parts of melamine 346 and formaldehyde (the 37 mass % aqueous solution) 522 mass parts in heating-up temperature 70 DEG C~100
DEG C, heating response 90 minutes under conditions of pH8~10, obtain melamine formaldehyde resin.To melamine-first of gained
Urea formaldehyde adds the broad leaf tree paper pulp (trade name as organic filler material：LDPT, Jujo Paper Co., Ltd) 95 mass parts
And after being kneaded, it is dried under reduced pressure it, carry out powdered and obtain the melamine containing paper pulp that paper pulp containing ratio is 15 mass %
Amine-for-aldehyde resin.
[preparation of resin composition for cleaning mold]
(embodiment 1)
Using as melamine formaldehyde resin 30 mass parts obtained above containing paper pulp of melamine series resin and
Nikaresin (registration mark) S-166 (trade name, melamine formaldehyde resin, Nippon Carbide Industries Co., Ltd) 50 matter
Measure part, the silica (trade name as inorganic filling material：Pure silicon stone flour, crystalline silica, rapids family ceramic industry raw material strain formula meeting
Society) 20 mass parts, the Zinc tetradecanoate (trade name as fatty acid zinc：Powder base M, Japan Oil Co) 1 mass
Part and the guanidine carbonate (trade name as organic base：GC, Sanwa Co., Ltd.'s chemistry) 0.025 mass parts loading ball mill, enters
Row crushes.Next, ethylenebis stearic amide (trade name is added with nauta mixer：ALFLOW (registration mark) H50T,
Japan Oil Co) 0.4 mass parts as lubricant and are stirred, so as to obtain the cleaning mold of embodiment 1 resin group
Compound.
(2~embodiment of embodiment 8)
The composition of resin composition for cleaning mold is changed to the composition shown in table 1 below in embodiment 1, except this with
Outside, the resin composition for cleaning mold of 2~embodiment of embodiment 8 is obtained similarly to Example 1.
(1~comparative example of comparative example 6)
The composition of resin composition for cleaning mold is changed to the composition shown in table 2 below in embodiment 1, except this with
Outside, the resin composition for cleaning mold of 1~comparative example of comparative example 6 is obtained similarly to Example 1.
[evaluation]
The cleaning mold that 1~embodiment of embodiment 8 and 1~comparative example of comparative example 6 are evaluated by method as shown below is used
The cleaning of resin combination and mouldability.
(1) cleaning property
Resin composition for cleaning mold is shaped to tablet shape, sample for evaluation is made.
Use commercially available epoxy resin molding material (trade name：CEL-9240HF10, green compounds, Hitachi's chemical conversion strain
Formula commercial firm), with transmission type automatic moulding machine 175 DEG C of mold temperature, transmit pressure 9.5MPa, passing time 10.5 seconds, solidification when
Between under the condition of molding of 80 seconds, will be provided with width be 800 μm, be highly 300 μm gate part QFP (Quad Flat
Package 600 injection (shot) shapings) are carried out, produce dirt in the interior surface of mould.
, will under condition of molding similar to the above using the mould that polluter on surface internally be present
The resin combination of each embodiment or each comparative example is molded repeatedly, so as to carry out cleaning mold.Then, pair can remove completely into
Injection number needed for untill polluter present on the interior surface of pattern tool is measured.Using the injection number as use
In the index of the cleaning of evaluation resin composition for cleaning mold.Visually to confirm and judge whether that pollutant can be removed completely
Matter.
When evaluating cleaning performance, especially concern as to whether that gate part and the turning of the chamber for being attached to mould can be removed
The polluter in portion.It is smaller to be molded number, represents that cleaning performance is more excellent.In this evaluation, the resin combination that number is 1 will be molded
Thing is determined as " qualified ".
(2) mouldability
With by the cleaning mold resin after the shaping of the 1st injection in the evaluation of above-mentioned 1. cleaning property (after cleaning)
Composition from mould remove when operability be for the index for the mouldability for evaluating resin composition for cleaning mold.
Resin composition for cleaning mold after shaping fully solidifies, and does not occur to come from cleaning mold due to solidifying bad
The phenomenon of the interior surface of mould is partly attached at the polluter of resin combination, can be from mould after cleaning
In the case of easily removing resin composition for cleaning mold, the mouldability of resin composition for cleaning mold is evaluated as
" good ".In addition, the resin composition for cleaning mold after shaping is not sufficiently cured, one part is unformed, therefore is attached
In interior surface of mould etc. resin composition for cleaning mold can not be easily removed after cleaning from mould
In the case of, the mouldability of resin composition for cleaning mold is evaluated as " bad ".
By the composition of 1~embodiment of embodiment 8 and the resin composition for cleaning mold of 1~comparative example of comparative example 6 and
Each evaluation result is shown in Tables 1 and 2.
In Tables 1 and 2, "-" refers to not form accordingly.
The detailed content of zinc stearate and potassium stearate in Tables 1 and 2 is as described below.
Zinc stearate (trade name：ZINC STEARATE GF200, Japan Oil Co)
Potassium stearate (trade name：Nonsoul (registration mark) SK-1, Japan Oil Co)
It is clear and definite by the result of Tables 1 and 2, resin composition for cleaning mold and the comparative example 1 of 1~embodiment of embodiment 8
The resin composition for cleaning mold of~comparative example 6 is compared, and has excellent cleaning performance.In addition, also specify that embodiment 1~
The good forming ability of the resin composition for cleaning mold of embodiment 8.If the good forming ability of resin composition for cleaning mold,
Resin composition for cleaning mold then can be easily removed from mould after cleaning, therefore operability becomes good.
On the other hand, it specify that the content of fatty acid zinc relative to all solids composition of resin composition for cleaning mold
The cleaning that 100 mass parts are less than the resin composition for cleaning mold of the comparative example 1 of 1 mass parts is poor.In addition, it also specify that ratio
Compared with the insufficient formability of the resin composition for cleaning mold of example 1.
It specify that ratio of the content of organic base relative to the ratio of the content of fatty acid zinc in terms of quality criteria less than 1/100
Cleaning compared with the resin composition for cleaning mold of example 2 is poor.
It specify that comparison of the content of organic base relative to the ratio of the content of fatty acid zinc in terms of quality criteria more than 1/2
The cleaning of the resin composition for cleaning mold of example 3 is poor.In addition, it also specify that the cleaning mold resin combination of comparative example 3
The insufficient formability of thing.
It specify that the resin composition for cleaning mold for 4~comparative example of comparative example 6 that organic base is replaced containing inorganic base
Cleaning property is poor.
Among these, it specify that contain sodium hydroxide replaces the cleaning mold of the comparative example 4 of organic base to use as inorganic base
The cleaning of resin combination is worse.Such as it is molded in addition, specify that using the resin composition for cleaning mold of comparative example 4
The cleaning of mould, then adhere to the pollutant from resin composition for cleaning mold on mould due to being molded bad
Matter, mould are contaminated on the contrary.
Claims (4)
1. a kind of resin composition for cleaning mold, it contains melamine series resin, fatty acid zinc and organic base, wherein,
The organic base does not include the salt that strong acid and weak base are formed,
The content of the fatty acid zinc is 1 matter relative to the mass parts of all solids composition 100 of resin composition for cleaning mold
Measure more than part, and the content of the organic base is calculated as 1/100 relative to the ratio of the content of the fatty acid zinc with quality criteria
~1/2.
2. resin composition for cleaning mold as claimed in claim 1, wherein, the organic base contain selected from guanidine compound and
At least one kind of compound in amidine compound.
3. resin composition for cleaning mold as claimed in claim 1 or 2, wherein, the fatty acid zinc contains selected from Pork and beans
It is at least one in cool sour zinc and zinc stearate.
4. resin composition for cleaning mold as claimed in claim 1 or 2, wherein, the melamine series resin contains three
Poly cyanamid-formaldehyde resin.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-055785 | 2016-03-18 | ||
| JP2016055785A JP6715627B2 (en) | 2016-03-18 | 2016-03-18 | Mold cleaning resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107418141A true CN107418141A (en) | 2017-12-01 |
| CN107418141B CN107418141B (en) | 2021-06-15 |
Family
ID=59973682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710156947.5A Active CN107418141B (en) | 2016-03-18 | 2017-03-16 | Resin composition for cleaning mold |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6715627B2 (en) |
| KR (1) | KR102291077B1 (en) |
| CN (1) | CN107418141B (en) |
| SG (1) | SG10201702085RA (en) |
| TW (1) | TWI725136B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0742409B2 (en) * | 1987-11-27 | 1995-05-10 | 株式会社東芝 | Mold cleaning body and mold cleaning method |
| CN1134129A (en) * | 1994-08-24 | 1996-10-23 | 日本电石工业株式会社 | Amino resin composition for mold cleaning |
| JPH0957762A (en) * | 1995-08-23 | 1997-03-04 | Nippon Carbide Ind Co Inc | Resin composition for cleaning mold |
| CN1156657A (en) * | 1995-10-24 | 1997-08-13 | 日本电石工业株式会社 | Resin composition tablet for cleaning mold |
| JP2002128988A (en) * | 2000-10-18 | 2002-05-09 | Choshun Jinzo Jushisho Kofun Yugenkoshi | Amino resin composition for metal mold cleaning |
| CN101955858A (en) * | 2009-07-17 | 2011-01-26 | 日东电工株式会社 | Die cleaning agent composition and mould cleaning material and the mould cleaning method that uses it |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3270315B2 (en) * | 1995-10-31 | 2002-04-02 | 日本カーバイド工業株式会社 | Mold cleaning resin composition tablet |
| JP5604822B2 (en) * | 2009-07-17 | 2014-10-15 | 日立化成株式会社 | Semiconductor device molding die cleaning composition, semiconductor device molding die cleaning material, and semiconductor device molding die cleaning method using the same |
| WO2013011876A1 (en) * | 2011-07-15 | 2013-01-24 | 日本カーバイド工業株式会社 | Mold-cleaning resin composition |
| CN104985903B (en) * | 2015-07-31 | 2017-01-25 | 北京新福润达绝缘材料有限责任公司 | Preparation method for high anti-tracking halogen-free flame-retardant glass-cloth laminate |
| JP7042409B2 (en) * | 2018-03-27 | 2022-03-28 | 株式会社サム技研 | Selective collating system |
-
2016
- 2016-03-18 JP JP2016055785A patent/JP6715627B2/en active Active
-
2017
- 2017-03-14 KR KR1020170031915A patent/KR102291077B1/en active IP Right Grant
- 2017-03-15 SG SG10201702085RA patent/SG10201702085RA/en unknown
- 2017-03-16 TW TW106108630A patent/TWI725136B/en active
- 2017-03-16 CN CN201710156947.5A patent/CN107418141B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0742409B2 (en) * | 1987-11-27 | 1995-05-10 | 株式会社東芝 | Mold cleaning body and mold cleaning method |
| CN1134129A (en) * | 1994-08-24 | 1996-10-23 | 日本电石工业株式会社 | Amino resin composition for mold cleaning |
| JPH0957762A (en) * | 1995-08-23 | 1997-03-04 | Nippon Carbide Ind Co Inc | Resin composition for cleaning mold |
| CN1156657A (en) * | 1995-10-24 | 1997-08-13 | 日本电石工业株式会社 | Resin composition tablet for cleaning mold |
| JP2002128988A (en) * | 2000-10-18 | 2002-05-09 | Choshun Jinzo Jushisho Kofun Yugenkoshi | Amino resin composition for metal mold cleaning |
| CN101955858A (en) * | 2009-07-17 | 2011-01-26 | 日东电工株式会社 | Die cleaning agent composition and mould cleaning material and the mould cleaning method that uses it |
Also Published As
| Publication number | Publication date |
|---|---|
| SG10201702085RA (en) | 2017-10-30 |
| KR20170108855A (en) | 2017-09-27 |
| JP2017170632A (en) | 2017-09-28 |
| KR102291077B1 (en) | 2021-08-18 |
| TW201800203A (en) | 2018-01-01 |
| JP6715627B2 (en) | 2020-07-01 |
| TWI725136B (en) | 2021-04-21 |
| CN107418141B (en) | 2021-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103702813B (en) | Resin composition for cleaning mold | |
| KR100305180B1 (en) | Amino resin composition for mold cleaning | |
| CN107418141A (en) | Resin composition for cleaning mold | |
| CN104066563B (en) | Resin composition for cleaning mold | |
| US20020077261A1 (en) | Amino resin composition for mold cleaning | |
| TW537956B (en) | Mold cleaning resin composition | |
| CN107286572A (en) | Resin composition for cleaning mold | |
| CN100366411C (en) | Resin composition for cleaning mold | |
| JP7265495B2 (en) | Mold cleaning resin composition | |
| KR101395818B1 (en) | Resin composition for cleaning molds and recovering the release properties of molds and method for cleaning molds and recovering the release properties of molds | |
| JP6913038B2 (en) | Resin composition for mold cleaning | |
| KR20150056189A (en) | Environment-friendly phenol free mold cleaning compound | |
| JP2021112860A (en) | Resin composition for die cleaning | |
| JPH09123184A (en) | Resin composition for cleaning mold | |
| KR100291764B1 (en) | Resin composition tablet for mold cleaning | |
| JPH07292262A (en) | Resin composition for cleaning mold | |
| JP4452916B2 (en) | Thermosetting resin composition | |
| CN106433021B (en) | Resin composition for cleaning mold | |
| JP3809781B2 (en) | Mold cleaning resin composition and transfer press mold cleaning molding material | |
| CN1351093A (en) | Amino resin compositions for cleaning mould | |
| JP2016049693A (en) | Resin composition for cleaning mold |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |