CN107409477A8 - 背板式电子板和相关电子控制单元 - Google Patents

背板式电子板和相关电子控制单元 Download PDF

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Publication number
CN107409477A8
CN107409477A8 CN201680017248.6A CN201680017248A CN107409477A8 CN 107409477 A8 CN107409477 A8 CN 107409477A8 CN 201680017248 A CN201680017248 A CN 201680017248A CN 107409477 A8 CN107409477 A8 CN 107409477A8
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China
Prior art keywords
back plate
plate type
type electron
control unit
electrical control
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
CN201680017248.6A
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English (en)
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CN107409477B (zh
CN107409477A (zh
Inventor
F·古洛特
帕斯卡尔·斯普尔
帕特里斯·切坦内奥
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Safran Electronics and Defense SAS
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Safran Electronics and Defense SAS
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Publication of CN107409477A publication Critical patent/CN107409477A/zh
Publication of CN107409477A8 publication Critical patent/CN107409477A8/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1439—Back panel mother boards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/184—Mounting of motherboards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/7064—Press fitting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1411—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting box-type drawers
    • H05K7/1412—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting box-type drawers hold down mechanisms, e.g. avionic racks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1439—Back panel mother boards
    • H05K7/1445—Back panel mother boards with double-sided connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1452—Mounting of connectors; Switching; Reinforcing of back panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1459—Circuit configuration, e.g. routing signals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09545—Plated through-holes or blind vias without lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Electron Tubes For Measurement (AREA)

Abstract

本发明涉及一种背板式电子板(20)，该背板式电子板具有内表面(142)和外表面(143)，该内表面(142)适用于被连接至电子板连接器(12)，该外表面(143)适用于被连接至外部连接器(15)，背板式板(20)的特征在于，该背板式板(20)具有开设在其内表面(142)上的盲孔和开设在其外表面(143)上的孔，该孔适用于接收压力配合连接元件并与压力配合连接元件形成电连接点。
CN201680017248.6A 2015-03-23 2016-03-23 背板式电子板和相关电子控制单元 Active CN107409477B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1552398 2015-03-23
FR1552398A FR3034219B1 (fr) 2015-03-23 2015-03-23 Carte electronique de fond de panier et calculateur electronique associe
PCT/EP2016/056462 WO2016151053A1 (fr) 2015-03-23 2016-03-23 Carte électronique de fond de panier et calculateur électronique associé

Publications (3)

Publication Number Publication Date
CN107409477A CN107409477A (zh) 2017-11-28
CN107409477A8 true CN107409477A8 (zh) 2018-01-12
CN107409477B CN107409477B (zh) 2020-01-21

Family

ID=54014916

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680017248.6A Active CN107409477B (zh) 2015-03-23 2016-03-23 背板式电子板和相关电子控制单元

Country Status (5)

Country Link
US (1) US10375849B2 (zh)
EP (1) EP3275292B1 (zh)
CN (1) CN107409477B (zh)
FR (1) FR3034219B1 (zh)
WO (1) WO2016151053A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10575382B2 (en) * 2017-04-06 2020-02-25 Hisense Broadband Multimedia Technologies Co., Ltd. Optical module
CN107896418B (zh) * 2017-10-10 2020-11-06 青岛海信宽带多媒体技术有限公司 一种光模块
FR3091136B1 (fr) 2018-12-21 2022-01-21 Safran Electronics & Defense procédé de fabrication d'une carte électronique de fond de panier
US20210066827A1 (en) * 2019-08-26 2021-03-04 Lockheed Martin Corporation Pin side edge mount connector and systems and methods thereof
US11483942B2 (en) * 2019-12-18 2022-10-25 SpinLaunch Inc. Ruggedized avionics for use on kinetically launched vehicles
CN111447779B (zh) * 2020-04-28 2024-04-12 依米康软件技术(深圳)有限责任公司 一种智能数据采集器

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5397861A (en) * 1992-10-21 1995-03-14 Mupac Corporation Electrical interconnection board
US6483719B1 (en) * 2000-03-21 2002-11-19 Spraylat Corporation Conforming shielded form for electronic component assemblies
US6822876B2 (en) * 2002-02-05 2004-11-23 Force10 Networks, Inc. High-speed electrical router backplane with noise-isolated power distribution
CN100475012C (zh) * 2003-07-08 2009-04-01 通道系统集团公司 中间板的制造方法
JP4676238B2 (ja) * 2005-04-18 2011-04-27 株式会社日立製作所 バックプレーンバス用メインボード、および、それを用いたルータシステム、ストレージシステム
US20080025007A1 (en) * 2006-07-27 2008-01-31 Liquid Computing Corporation Partially plated through-holes and achieving high connectivity in multilayer circuit boards using the same
EP2140741B1 (en) * 2007-04-20 2013-02-27 Telefonaktiebolaget LM Ericsson (publ) A printed board assembly and a method
DE102009001461A1 (de) * 2009-03-11 2010-09-16 Robert Bosch Gmbh Verfahren zur Herstellung einer elektronischen Baugruppe
US8841560B1 (en) * 2010-11-17 2014-09-23 Dawn VME Products Backplane slot interconnection system, method and apparatus
US20140035301A1 (en) * 2012-07-31 2014-02-06 Southern Folger Detention Equipment Company Strike with Ejector Plate
JP5931799B2 (ja) * 2013-05-28 2016-06-08 株式会社日立製作所 層間接続基板およびその製造方法

Also Published As

Publication number Publication date
EP3275292A1 (fr) 2018-01-31
CN107409477B (zh) 2020-01-21
FR3034219B1 (fr) 2018-04-06
US10375849B2 (en) 2019-08-06
US20180110149A1 (en) 2018-04-19
EP3275292B1 (fr) 2022-03-02
WO2016151053A1 (fr) 2016-09-29
CN107409477A (zh) 2017-11-28
FR3034219A1 (fr) 2016-09-30

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Legal Events

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SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CI02 Correction of invention patent application
CI02 Correction of invention patent application

Correction item: Classification number

Correct: H05K 7/14(2006.01)|H05K 3/42(2006.01)|H05K 3/00(2006.01)|H05K 1/11(2006.01)

False: A99Z 99/00(2006.01)

Number: 48-01

Page: The title page

Volume: 33

GR01 Patent grant
GR01 Patent grant