CN107405649B - 一种包括声学窗口层的cmut阵列 - Google Patents

一种包括声学窗口层的cmut阵列 Download PDF

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Publication number
CN107405649B
CN107405649B CN201680013307.2A CN201680013307A CN107405649B CN 107405649 B CN107405649 B CN 107405649B CN 201680013307 A CN201680013307 A CN 201680013307A CN 107405649 B CN107405649 B CN 107405649B
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CN
China
Prior art keywords
layer
cmut
acoustic
membrane
cell
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Expired - Fee Related
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CN201680013307.2A
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English (en)
Chinese (zh)
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CN107405649A (zh
Inventor
L·J·A·M·贝克尔斯
F·J·G·哈肯斯
P·迪克森
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Koninklijke Philips NV
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Koninklijke Philips NV
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Publication of CN107405649A publication Critical patent/CN107405649A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
    • B06B1/067—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface which is used as, or combined with, an impedance matching layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/02—Mechanical acoustic impedances; Impedance matching, e.g. by horns; Acoustic resonators
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/18—Methods or devices for transmitting, conducting or directing sound
    • G10K11/26—Sound-focusing or directing, e.g. scanning
    • G10K11/30—Sound-focusing or directing, e.g. scanning using refraction, e.g. acoustic lenses
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/42—Details of probe positioning or probe attachment to the patient
    • A61B8/4209—Details of probe positioning or probe attachment to the patient by using holders, e.g. positioning frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Multimedia (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
CN201680013307.2A 2015-03-03 2016-02-25 一种包括声学窗口层的cmut阵列 Expired - Fee Related CN107405649B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP15157280.7 2015-03-03
EP15157280 2015-03-03
PCT/EP2016/053899 WO2016139103A1 (en) 2015-03-03 2016-02-25 A cmut array comprising an acoustic window layer

Publications (2)

Publication Number Publication Date
CN107405649A CN107405649A (zh) 2017-11-28
CN107405649B true CN107405649B (zh) 2021-06-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680013307.2A Expired - Fee Related CN107405649B (zh) 2015-03-03 2016-02-25 一种包括声学窗口层的cmut阵列

Country Status (5)

Country Link
US (1) US20180021813A1 (enExample)
EP (1) EP3265243B1 (enExample)
JP (1) JP2018512769A (enExample)
CN (1) CN107405649B (enExample)
WO (1) WO2016139103A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018041658A2 (en) * 2016-08-30 2018-03-08 Koninklijke Philips N.V. Imaging device with ultrasound transducer array
IT201800002952A1 (it) 2018-02-22 2019-08-22 St Microelectronics Srl Trasduttore ultrasonico microlavorato (mut) perfezionato, metodo di fabbricazione del mut, e metodo di progettazione del mut
EP3590437A1 (en) 2018-07-02 2020-01-08 Koninklijke Philips N.V. Acoustically transparent window for intraluminal ultrasound imaging device
DE102018122557A1 (de) * 2018-09-14 2020-03-19 Echovista Gmbh Vorrichtung zur Beseitigung von Ablagerungen und/oder Niederschlag auf einem Substrat
US10645497B1 (en) * 2019-05-28 2020-05-05 Bose Corporation Surface treatments for silicone acoustic diaphragms
FR3110834B1 (fr) * 2020-05-28 2022-04-22 Moduleus Dispositif d'imagerie ultrasonore à adressage ligne-colonne
CN114157966B (zh) * 2021-11-23 2023-09-26 苏州清听声学科技有限公司 一种基于压电薄膜的声音发射、接收及收发装置
KR102630328B1 (ko) * 2022-10-19 2024-01-31 한국과학기술원 습도센서 모듈과 이를 구비하는 습도 측정장치 및 이를 이용하는 습도측정 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1483557A (zh) * 2003-07-24 2004-03-24 上海交通大学 无机陶瓷分级结构/有机复合材料的制备方法
CN101513352A (zh) * 2008-02-18 2009-08-26 株式会社东芝 二维阵列超声波探头
CN104226577A (zh) * 2013-03-15 2014-12-24 富士胶片索诺声公司 用于微加工的超声换能器的声学镜片

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Publication number Priority date Publication date Assignee Title
JPS62233149A (ja) * 1986-04-02 1987-10-13 松下電器産業株式会社 超音波探触子
EP0239999B1 (en) * 1986-04-02 1993-10-13 Matsushita Electric Industrial Co., Ltd. Ultrasonic probe having an ultrasonic propagation medium
JP3251328B2 (ja) * 1992-05-13 2002-01-28 株式会社日立メディコ 超音波探触子
JPH08205290A (ja) * 1995-01-24 1996-08-09 Olympus Optical Co Ltd 超音波探触子
US7303530B2 (en) * 2003-05-22 2007-12-04 Siemens Medical Solutions Usa, Inc. Transducer arrays with an integrated sensor and methods of use
JP4373982B2 (ja) * 2006-01-11 2009-11-25 株式会社東芝 アレイ式超音波プローブおよび超音波診断装置
US7750536B2 (en) * 2006-03-02 2010-07-06 Visualsonics Inc. High frequency ultrasonic transducer and matching layer comprising cyanoacrylate
US8203912B2 (en) * 2007-07-31 2012-06-19 Koninklijke Philips Electronics N.V. CMUTs with a high-k dielectric
WO2010097729A1 (en) * 2009-02-27 2010-09-02 Koninklijke Philips Electronics, N.V. Pre-collapsed cmut with mechanical collapse retention
JP2009153675A (ja) * 2007-12-26 2009-07-16 Ge Medical Systems Global Technology Co Llc 超音波探触子および超音波撮像装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1483557A (zh) * 2003-07-24 2004-03-24 上海交通大学 无机陶瓷分级结构/有机复合材料的制备方法
CN101513352A (zh) * 2008-02-18 2009-08-26 株式会社东芝 二维阵列超声波探头
CN104226577A (zh) * 2013-03-15 2014-12-24 富士胶片索诺声公司 用于微加工的超声换能器的声学镜片

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Publication number Publication date
US20180021813A1 (en) 2018-01-25
WO2016139103A1 (en) 2016-09-09
EP3265243A1 (en) 2018-01-10
EP3265243B1 (en) 2022-04-06
JP2018512769A (ja) 2018-05-17
CN107405649A (zh) 2017-11-28

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