CN107400406A - A kind of high temperature resistant wiring board UV ink and preparation method thereof - Google Patents
A kind of high temperature resistant wiring board UV ink and preparation method thereof Download PDFInfo
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- CN107400406A CN107400406A CN201710655426.4A CN201710655426A CN107400406A CN 107400406 A CN107400406 A CN 107400406A CN 201710655426 A CN201710655426 A CN 201710655426A CN 107400406 A CN107400406 A CN 107400406A
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- high temperature
- wiring board
- temperature resistant
- ink
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
The present invention provides a kind of high temperature resistant wiring board UV ink and preparation method thereof, and by weight, the high temperature resistant wiring board UV ink includes following components：10 20 parts of epoxy novolac acrylic resin, 5 15 parts of bisphenol-type epoxyacrylate, 1 1.5 parts of difunctional acidic methylene acrylate, 24 parts of hydroxyethyl methacrylate, 0.1 0.5 parts of solid, 30 40 parts of talcum powder, 2 0.5 3 parts of EAQs, 1 10 parts of aerosil, 0.1 0.5 parts of defoamer, 3 10 parts of mill base.The ink of the present invention has the performances such as excellent adhesive force, anti-corrosion, weather-proof, high temperature resistant, good printing adaptability, and raw material is easy to get, and cost is cheap, is adapted to large-scale industrial production and popularization and application.
Description
Technical field
The present invention relates to technical field of ink, and in particular to a kind of high temperature resistant wiring board UV ink and preparation method thereof.
Background technology
Printing ink of circuit board industry is in electronics and information industry chain front end, in electronics and IT products in the form of functional material
Played an important role in process.Printing ink of circuit board production is related to chemistry, physics, material science, electrical engineering etc.
Multiple subjects, it is technology-intensive industries, its technological level and product quality situation directly influence printed substrate and use effect
Fruit, the final performance for influenceing electronic product, therefore the research and development of printing ink of circuit board new product are to the cross-cutting research and innovation ability of enterprise
With at a relatively high requirement.
UV solder masks are a kind of photo-curing materials that dosage is maximum in single sided board production, the country develop and manufacturing enterprise compared with
It is more, using bisphenol A epoxy acrylate as matrix resin, solve the problems, such as ink welding resistance, but domestic prior art is asked in the presence of some
Topic, mainly UV energy are not enough, UV machine temperature is too high, ink adhesion is not strong, ink viscosity is higher or relatively low.Wherein ink is attached
Put forth effort and resistance to elevated temperatures it is bad be most common technical disadvantages.
The content of the invention
The problem of existing for prior art, the invention provides a kind of high temperature resistant wiring board UV ink and its preparation side
Method.
The present invention is raw material using resin, filler, auxiliary agent and activated monomer, is prepared by steps such as scattered, grindings resistance to
The wiring board UV ink of high temperature, scientific formulation, technique is simple, can prepare all types of high temperature resistants by user's requirement and base material condition
Ink.High temperature resistant wiring board UV ink prepared by this method has excellent adhesive force, anti-corrosion, weather-proof, high temperature resistant, good print
The performances such as brush adaptability, solving the adhesive force that domestic same type ink is run at present, strong, resistance to elevated temperatures difference etc. be not common
Technical problem.
A kind of high temperature resistant wiring board UV ink, by weight, it includes following components：
Further, the monomer of the epoxy novolac acrylic resin is trimethylolpropane trimethacrylate, methyl-prop
Olefin(e) acid hydroxyl ethyl ester and double pentaerythritol C5 methacrylate.
The bisphenol-type epoxyacrylate is bisphenol A diglycidyl ether diacrylate.
The difunctional acidic methylene acrylate can be alkoxylated bis-phenol A dimethylacrylates.
Further, the number of the trimethylolpropane trimethacrylate is 5-15 parts, the hydroxyethyl methacrylate second
The number of ester is 5-15 parts, and the number of the double pentaerythritol C5 methacrylate is 3-8 parts.
Further, the granularity of the talcum powder is 5000 mesh.
Further, the defoamer is free of organosilicon.
A kind of preparation method of high temperature resistant wiring board UV ink, comprises the following steps：
(1) number is pressed by epoxy novolac acrylic resin, bisphenol-type epoxyacrylate, solid, 2- EAQs, color
Slurry is added in stainless steel, 2~3h of high-speed stirred, is completely dissolved it, is obtained mixture A, while controls the temperature of this process
Degree；
(2) talcum powder is added in mixture A, 0.5~3h is stirred, is then slowly added to gas phase titanium dioxide while stirring
Silicon, mixture B is obtained after being uniformly dispersed, while control the temperature of this process；
(3) mixture B is ground to fineness≤40um, then stands 10~20h, obtain semi-finished product A；
(4) difunctional acidic methylene acrylate is added in semi-finished product A while stirring, continues stirring 1 after adding
~3h, semi-finished product B is obtained, while control the temperature of this process；
(5) defoamer is added in semi-finished product B while stirring, continues 1~3h of stirring after adding, obtain semi-finished product C, together
When control the temperature of this process；
(6) hydroxyethyl methacrylate is added in semi-finished product C and adjusts ink viscosity, be uniformly mixing to obtain the resistance to height
Warm wiring board UV ink.
Further, temperature≤50 DEG C described in step (1).
Further, temperature≤65 DEG C described in step (2).
Further, temperature≤65 DEG C described in step (4), temperature≤65 DEG C described in step (5).
Further, the viscosity of the ink is 150 ± 20dPa.s.
Beneficial effects of the present invention：
(1) ink of the invention has the property such as excellent adhesive force, anti-corrosion, weather-proof, high temperature resistant, good printing adaptability
Energy；
(2) ink formulations science of the invention, technique are simple；
(3) ink of the invention is applied widely, can prepare all types of high temperature resistants by the needs and base material condition of user
Ink；
(4) ink raw materials of the invention are easy to get, and cost is cheap, are adapted to large-scale industrial production and popularization and application.
Embodiment
In order to preferably explain the present invention, it is described further in conjunction with specific examples below, but the present invention is unlimited
In specific embodiment.
Embodiment 1
A kind of high temperature resistant wiring board UV ink, by weight, including following components：
A kind of preparation method of high temperature resistant wiring board UV ink, comprises the following steps：
(1) number is pressed by epoxy novolac acrylic resin, bisphenol A diglycidyl ether diacrylate, solid, 2- second
Base anthraquinone, mill base are added in stainless steel, 2~3h of high-speed stirred, are completely dissolved it, obtain mixture A, while control this
Temperature≤50 DEG C of process；
(2) talcum powder is added in mixture A, 0.5~3h is stirred, is then slowly added to gas phase titanium dioxide while stirring
Silicon, mixture B is obtained after being uniformly dispersed, while control temperature≤65 DEG C of this process；
(3) mixture B is ground to fineness≤40um, then stands 10~20h, obtain semi-finished product A；
(4) difunctional acidic methylene acrylate is added in semi-finished product A while stirring, continues stirring 1 after adding
~3h, semi-finished product B is obtained, while control temperature≤65 DEG C of this process；
(5) defoamer is added in semi-finished product B while stirring, continues 1~3h of stirring after adding, obtain semi-finished product C, together
When control temperature≤65 DEG C of this process；
(6) hydroxyethyl methacrylate is added in semi-finished product C and adjusts ink viscosity, be uniformly mixing to obtain the resistance to height
Warm wiring board UV ink.
Embodiment 2
A kind of high temperature resistant wiring board UV ink, by weight, including following components：
A kind of preparation method of high temperature resistant wiring board UV ink, comprises the following steps：
(1) number is pressed by epoxy novolac acrylic resin, bisphenol A diglycidyl ether diacrylate, solid, 2- second
Base anthraquinone, mill base are added in stainless steel, 2~3h of high-speed stirred, are completely dissolved it, obtain mixture A, while control this
Temperature≤50 DEG C of process；
(2) talcum powder is added in mixture A, 0.5~3h is stirred, is then slowly added to gas phase titanium dioxide while stirring
Silicon, mixture B is obtained after being uniformly dispersed, while control temperature≤65 DEG C of this process；
(3) mixture B is ground to fineness≤40um, then stands 10~20h, obtain semi-finished product A；
(4) difunctional acidic methylene acrylate is added in semi-finished product A while stirring, continues stirring 1 after adding
~3h, semi-finished product B is obtained, while control temperature≤65 DEG C of this process；
(5) defoamer is added in semi-finished product B while stirring, continues 1~3h of stirring after adding, obtain semi-finished product C, together
When control temperature≤65 DEG C of this process；
(6) hydroxyethyl methacrylate is added in semi-finished product C and adjusts ink viscosity, be uniformly mixing to obtain the resistance to height
Warm wiring board UV ink.
Embodiment 3
A kind of high temperature resistant wiring board UV ink, by weight, including following components：
A kind of preparation method of high temperature resistant wiring board UV ink, comprises the following steps：
(1) number is pressed by epoxy novolac acrylic resin, bisphenol A diglycidyl ether diacrylate, solid, 2- second
Base anthraquinone, mill base are added in stainless steel, 2~3h of high-speed stirred, are completely dissolved it, obtain mixture A, while control this
Temperature≤50 DEG C of process；
(2) talcum powder is added in mixture A, 0.5~3h is stirred, is then slowly added to gas phase titanium dioxide while stirring
Silicon, mixture B is obtained after being uniformly dispersed, while control temperature≤65 DEG C of this process；
(3) mixture B is ground to fineness≤40um, then stands 10~20h, obtain semi-finished product A；
(4) difunctional acidic methylene acrylate is added in semi-finished product A while stirring, continues stirring 1 after adding
~3h, semi-finished product B is obtained, while control temperature≤65 DEG C of this process；
(5) defoamer is added in semi-finished product B while stirring, continues 1~3h of stirring after adding, obtain semi-finished product C, together
When control temperature≤65 DEG C of this process；
(6) hydroxyethyl methacrylate is added in semi-finished product C and adjusts ink viscosity, be uniformly mixing to obtain the resistance to height
Warm wiring board UV ink.
It is as a result 5 grades using the adhesive force of the cross-cut methods testing example 1-3 ink prepared, it is resistance in 265 ± 5 DEG C of progress
High temperature test, the ink film of preparation is unchanged, illustrates that the ink adhesion for preparing of the present invention is strong, high temperature resistant.Through experimental test sheet
High temperature resistant wiring board UV ink prepared by the method for invention has excellent adhesive force, anti-corrosion, weather-proof, high temperature resistant, good print
The performances such as brush adaptability.
The specific embodiment of the present invention is the foregoing is only, is not intended to limit the scope of the invention, every utilization
The equivalent transformation that the present invention makees, or other related technical fields are directly or indirectly used in, similarly it is included in the present invention's
Among scope of patent protection.
Claims (10)
1. a kind of high temperature resistant wiring board UV ink, it is characterised in that by weight, it includes following components：
2. high temperature resistant wiring board UV ink according to claim 1, it is characterised in that the epoxy novolac acrylic resin
Monomer be trimethylolpropane trimethacrylate, hydroxyethyl methacrylate and double pentaerythritol C5 methacrylate.
3. high temperature resistant wiring board UV ink according to claim 2, it is characterised in that the trimethylolpropane tris propylene
The number of acid esters is 5-15 parts, and the number of the hydroxyethyl methacrylate is 5-15 parts, the acrylic acid of bipentaerythrite five
The number of ester is 3-8 parts.
4. high temperature resistant wiring board UV ink according to claim 1, it is characterised in that the granularity of the talcum powder is 5000
Mesh.
5. high temperature resistant wiring board UV ink according to claim 1, it is characterised in that the defoamer is free of organosilicon.
6. a kind of preparation method of high temperature resistant wiring board UV ink according to any one of the claims, its feature exist
In comprising the following steps：
(1) epoxy novolac acrylic resin, bisphenol-type epoxyacrylate, solid, 2- EAQs, mill base are added by number
Enter into stainless steel, 2~3h of high-speed stirred, be completely dissolved it, obtain mixture A, while control the temperature of this process；
(2) talcum powder is added in mixture A, 0.5~3h is stirred, is then slowly added to aerosil while stirring, point
Mixture B is obtained after dissipating uniformly, while controls the temperature of this process；
(3) mixture B is ground to fineness≤40um, then stands 10~20h, obtain semi-finished product A；
(4) difunctional acidic methylene acrylate is added in semi-finished product A while stirring, continues 1~3h of stirring after adding,
Semi-finished product B is obtained, while controls the temperature of this process；
(5) defoamer is added in semi-finished product B while stirring, continues 1~3h of stirring after adding, obtain semi-finished product C, same to time control
Make the temperature of this process；
(6) hydroxyethyl methacrylate is added in semi-finished product C and adjusts ink viscosity, be uniformly mixing to obtain the high temperature resistant line
Road plate UV ink.
7. the preparation method of high temperature resistant wiring board UV ink according to claim 6, it is characterised in that institute in step (1)
State temperature≤50 DEG C.
8. the preparation method of high temperature resistant wiring board UV ink according to claim 6, it is characterised in that institute in step (2)
State temperature≤65 DEG C.
9. the preparation method of high temperature resistant wiring board UV ink according to claim 6, it is characterised in that institute in step (4)
State temperature≤65 DEG C, temperature≤65 DEG C described in step (5).
10. the preparation method of high temperature resistant wiring board UV ink according to claim 6, it is characterised in that the ink
Viscosity is 150 ± 20dPa.s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710655426.4A CN107400406A (en) | 2017-08-02 | 2017-08-02 | A kind of high temperature resistant wiring board UV ink and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710655426.4A CN107400406A (en) | 2017-08-02 | 2017-08-02 | A kind of high temperature resistant wiring board UV ink and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN107400406A true CN107400406A (en) | 2017-11-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710655426.4A Pending CN107400406A (en) | 2017-08-02 | 2017-08-02 | A kind of high temperature resistant wiring board UV ink and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111454607A (en) * | 2019-01-18 | 2020-07-28 | 北京铂阳顶荣光伏科技有限公司 | Ultraviolet curing ink and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104086701A (en) * | 2014-05-08 | 2014-10-08 | 华南理工大学 | Preparation method of high temperature and yellowing resistant alkali-soluble epoxy acrylate UV resin |
| CN106854394A (en) * | 2016-12-28 | 2017-06-16 | 江苏广信感光新材料股份有限公司 | A kind of heat-resistant water-soluble alkali developable UV photosensitive etch resistant ink high |
-
2017
- 2017-08-02 CN CN201710655426.4A patent/CN107400406A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104086701A (en) * | 2014-05-08 | 2014-10-08 | 华南理工大学 | Preparation method of high temperature and yellowing resistant alkali-soluble epoxy acrylate UV resin |
| CN106854394A (en) * | 2016-12-28 | 2017-06-16 | 江苏广信感光新材料股份有限公司 | A kind of heat-resistant water-soluble alkali developable UV photosensitive etch resistant ink high |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111454607A (en) * | 2019-01-18 | 2020-07-28 | 北京铂阳顶荣光伏科技有限公司 | Ultraviolet curing ink and preparation method thereof |
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Application publication date: 20171128 |