CN105111989A - Anaerobic thermal conductive adhesive and preparation method thereof - Google Patents
Anaerobic thermal conductive adhesive and preparation method thereof Download PDFInfo
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- CN105111989A CN105111989A CN201510587145.0A CN201510587145A CN105111989A CN 105111989 A CN105111989 A CN 105111989A CN 201510587145 A CN201510587145 A CN 201510587145A CN 105111989 A CN105111989 A CN 105111989A
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Abstract
The invention belongs to the field of thermal conductive adhesives and particularly relates to an anaerobic thermal conductive adhesive and a preparation method thereof. The anaerobic thermal conductive adhesive comprises a binder and a heat conduction packing, wherein the binder is anaerobic and can be cured. The binder which is anaerobic and can be cured comprises, by weight parts, 65-95 parts of one or more monomers and/or oligomers containing vinyl groups, 0.1-10 parts of organic peroxides, 0.05-5 parts of accelerator, 0.1-10 parts of organic acid, 0.005-0.5 part of inhibitor and 0.01-5 parts of activating accelerator. The heat conduction packing undergoes surface treatment through a surface treating agent. The anaerobic thermal conductive adhesive is a single-component anaerobic thermal conductive adhesive and is convenient to use, short in curing time, good in viscosity stability during normal temperature storage and excellent in thermal conductivity.
Description
Technical field
The present invention relates to a kind of thermal conductive adhesive, be specifically related to a kind of anaerobic type thermal conductive adhesive, also relate to its preparation method.
Background technology
Along with the development of microelectronics industry, it is extensive until super large-scale integration integrated level is more and more higher, famous law a---number for open ended components and parts on unicircuit is had in IT industry, about just can double every 18 ~ 24 months, performance also by lifting one times i.e. " Moore's Law ".Along with the increase of the components and parts of integrated chip, the heat effect of chip also increases thereupon, needs some means this heat effect to be derived, and chip and scatterer is linked and what derive heat is exactly thermal conducting agent.
What widely apply at IT and electron trade at present be a kind of thermal conducting agent is heat-conducting silicone grease, and this silicone grease does not have bonding force, needs extra device to fix, as screw or jump ring etc., uses inconvenience, also reduce production efficiency.A kind of thermal conducting agent is a kind of heat-conducting glue of two-pack in addition, and main component is epoxy resin and solidifying agent, needs first pre-mixing, also need heating cure before using, and curing speed is slow, uses also inconvenient.
Summary of the invention
Technical problem to be solved by this invention be to provide a kind of can the quick-setting thermal conductive adhesive that chip and scatterer are bonded together of normal temperature, can in IT and electron trade widespread use.Anaerobic type thermal conductive adhesive of the present invention can be made single component thermal conductive adhesive and use, compared with existing two-pack thermal conductive adhesive or heat-conducting silicone grease, have easy to use, solidification fast, bonding strength is high, heat conductivility is excellent, storage at normal temperature stability high.
Technical problem to be solved by this invention is achieved by the following technical programs:
A kind of anaerobic type thermal conductive adhesive, comprises the component of following parts by weight:
The binding agent of (a) anaerobically curable 100 parts;
(b) heat conductive filler 100 ~ 500 parts.
The binding agent of described anaerobically curable, that is the anaerobic glue that people are usually said, this kind of anaerobic oxygen rubber composition is known technology, and a lot of document monograph has discussion.Patent CN101328395A disclosed in Guangdong Hengda New Materials Technology Co., Ltd addresses a kind of environment-friendly type anaerobic oxygen rubber composition.Be and for example that Guangdong Hengda New Materials Technology Co., Ltd discloses equally and the patent CN101735734B obtained the authorization provides a kind of highly active anaerobic oxygen rubber composition.These patent contents can be cited as this patent content.
The binding agent of described anaerobically curable is made up of the component of following weight part:
A kind of to several monomers containing vinyl and/or oligopolymer 65 ~ 95 parts;
Organo-peroxide 0.1 ~ 10 part;
Promotor 0.05 ~ 5 part;
Organic acid 0.1 ~ 10 part;
Stopper 0.005 ~ 0.5 part;
Secondary accelerator 0.01 ~ 5 part.
Further, the described monomer containing vinyl is at least one in mono acrylic ester, diacrylate, many acrylate, monomethacrylates, dimethacrylate, many methacrylic esters.As Hydroxyethyl acrylate, diethylene glycol diacrylate, 2-(2-ethoxy ethoxy) ethyl propylene acid esters, pentaerythritol triacrylate, hydroxyethyl methylacrylate, Rocryl 410, Ethylene glycol dimethacrylate, TEGDMA, tripropylene glycol dimethacrylate, polyethylene glycol dimethacrylate, ethoxylated bisphenol dimethacrylate, trimethylolpropane trimethacrylate, ethoxyquin trimethylolpropane trimethacrylate.The methacrylic ester of the present invention preferably with methyl, as Rocryl 410, Ethylene glycol dimethacrylate, TEGDMA, tripropylene glycol dimethacrylate, the binding agent of the anaerobically curable of this compounds is selected easily to obtain balance between stability in storage and curing performance.
Oligopolymer containing vinyl can be at least one in epoxy acrylate, urethane acrylate, polyester acrylate, polyether acrylate.Wherein epoxy acrylate is obtained by epoxy resin and the Esterification reaction of acrylic or methacrylic, has bisphenol-a epoxy acrylate, Epoxy Phenolic Acrylates, modified epoxy acrylic ester and epoxidized oil acrylate according to structure type.And urethane acrylate is containing several Urethylane chain links in its molecule, and at least containing more than two acrylate or methacrylate end-groups, this kind of material is synthesized by isocyanic ester, long-chain polyhydric alcohol, hydroxy functional acrylate, its performance can be in very large range regulated according to selected raw material and technique, as hardness, flexibility, tolerance etc.Polyester acrylate is obtained by diprotic acid, dibasic alcohol, acrylic or methacrylic acid-respons.
The described monomer containing vinyl and/or oligopolymer, can comprise one or more combinations of above-mentioned monomer and oligopolymer.Preferably comprise a kind of to several monomeric and a kind of to several oligopolymers, its total amount counts 65 ~ 95 parts by weight, and its ratio and quantity can adjust according to viscosity and adhesiveproperties.
Further, described organo-peroxide be containing one to multiple peroxy-O-O-compound.Can be dialkyl peroxide, alkyl peroxide, acyl peroxide, alkyl peroxy acids and peracid ester etc.; such as dicumyl peroxide, t-butylperoxyisopropyl benzene, isopropyl benzene hydroperoxide, tertbutyl peroxide, benzoyl peroxide, peroxidized t-butyl perbenzoate, 2; 5-dimethyl-2; 5-(di-tert-butyl peroxide) hexane etc., can select wherein one or two or more kinds with the use of.
Further, described promotor is at least one in organic hydrazides, tertiary amine.Organic hydrazides, optional example as benzoyl hydrazine, N-pyrodin, para hydroxybenzene formyl hydrazine, 4-tert-butyl benzoyl hydrazine etc., preferably benzoyl hydrazine and N-pyrodin.Tertiary amine can be aliphatic tertiary amine or aromatic nitrile base, such as tri-n-butylamine, triethylamine, trolamine, DMA etc.Two kinds of promotor can be used alone, also can two kinds with the use of, suitable proportioning more easily reaches solidification rate and stable storing sexual balance.
Further, described organic acid is at least one in organic carboxyl acid, chlorinated carboxylic acid, sulfonic compound.As acetic acid, Mono Chloro Acetic Acid, dichloro acetic acid, trichoroacetic acid(TCA), Phenylsulfonic acid etc., the organic carboxyl acid containing vinyl in preferred molecule, as vinylformic acid, methacrylic acid, toxilic acid, methylene-succinic acid.
Further, described stopper is at least one in phenols or quinones.Stopper is a Type of Collective inhibitor, can select in Resorcinol, p-tert-butylphenol, p methoxy phenol, para benzoquinone, naphthoquinones one or more with the use of.
Further, described secondary accelerator is at least one in saccharin, saccharin salt, xitix, ascorbate salt.Wherein saccharin salt is the metal-salt of saccharin, as sodium, potassium, calcium salt etc.; Ascorbate salt is the metal-salt of xitix, as sodium, potassium, calcium salt etc.The binding agent activity that with the addition of the anaerobically curable of secondary accelerator is higher, and curing speed is faster.
Described heat conductive filler is carry out the heat conductive filler after surface treatment through surface treatment agent.
Further, described heat conductive filler is at least one in aluminum oxide, magnesium oxide, zinc oxide, aluminium nitride, boron nitride, silicon carbide, silicon-dioxide, aluminium hydroxide, magnesium hydroxide.Heat conductive filler need have certain stability and consistency, and has high thermal conductivity, preferred micron order aluminum oxide, alumina in Nano level, aluminium nitride, boron nitride.Described heat conductive filler particle size range is with 0.5 ~ 50
umbe advisable, higher with the thermal conductive adhesive thermal conductivity that the filler of Large stone is obtained, can be added to more filler with suitable small particle size collocation Large stone, thus make thermal conductivity higher, the heat conductive filler that therefore the present invention uses is advisable with multiple particle diameter collocation use.
Further, described surface treatment agent is sequestrant and silane coupling agent, can improve stability and the consistency of thermal conductive adhesive through the heat conductive filler of surface treatment agent process.
With chelating agent solution process heat conductive filler, the transition metal to the free metal ion, particularly some multivalence on the filler particles surface that thermal conductive adhesive stability is harmful to or heavy metal ion can be removed.Sequestrant is disodium ethylene diamine tetraacetate, trisodium, tetra-na salt etc. normally.The concentration that described chelating agent solution is suitable for is 0.01% ~ 0.5%, and the heating suitable when carrying out chelation treatment can make sequestration rate faster.
Silane coupling agent is generally made up of two portions: a part is close inorganic group, can with inorganic filler or strongthener effect; Another part is close organic group, can with synthetic resins effect.The general formula of described silane coupling agent is RSiX
3, in formula, R represents the groups such as amino, sulfydryl, vinyl, epoxy group(ing), cyano group and methacryloxy, and these groups and different matrix resins all have stronger response capacity, and X represents the alkoxyl group that can be hydrolyzed, as methoxyl group, oxyethyl group etc.Silane coupling agent consumption is generally 0.5 ~ 5% of heat conductive filler, preferably commercially available KH550, this several model of KH560, KH570, KH792, DL602, DL171.Be dissolved in non-aqueous solvent during use, then heat conductive filler is processed.Described non-aqueous solvent is generally lower alcohol, ether, ketone, ester etc., as ethanol, Virahol, acetone, ethyl acetate etc.Heat conductive filler through coupling agent treatment can improve base dispersity, the conjugation between reinforcing filler and resin.
In addition, in anaerobic type heat-conducting glue of the present invention, non-reacted resin and rubber can also be added if desired, suspension agent, dispersion agent, softening agent, tinting material, the auxiliary agents such as mask agent.How many these materials are determined according to the performance requriements of thermal conductive adhesive the need of adding or adding.
The preparation method of above-mentioned anaerobic type thermal conductive adhesive, is made up of following steps:
(1) process of heat conductive filler, select the wherein one in following two kinds of methods:
Method one, sequestrant is made into the aqueous solution, then drops into heat conductive filler and stir, abundant chelating, then filter with whizzer and dry; By silane coupling agent and non-aqueous solvent wiring solution-forming, add the heat conductive filler through chelating, stir to filter with whizzer after the specified time dry, dry, pulverize for subsequent use;
Method two, sequestrant is added non-aqueous solvent wiring solution-forming, drops into heat conductive filler and stir abundant chelating, then add silane coupling agent, filter with whizzer after stirring the specified time dry, dry, pulverize for subsequent use;
(2) preparation of thermal conductive adhesive: by each for other in the binding agent of anaerobically curable except organo-peroxide component mutual mixed dissolution according to a conventional method, then the heat conductive filler that step (1) processed is added, stir through power mixer high speed dispersion, vacuumize removing bubble, finally add organo-peroxide under lower than 40 DEG C of conditions and mix.
Can according to practical condition in actual production, the preparation temperature of set-up procedure (1) and step (2), in the method one of step (1), chelating process can be heated to 60 ~ 70 DEG C to accelerate sequestration rate; In the method two of step (1), chelating process can be heated to 50 ~ 60 DEG C to accelerate sequestration rate; In step (2), dissolution process can be heated to 50 ~ 70 DEG C to help to dissolve.
The present invention has following beneficial effect:
The heat conductive filler that thermal conductive adhesive of the present invention uses, after surface treatment, makes that prepared heat conduction is gluing has higher package stability and viscosity stability.Good in storage at normal temperature viscosity stability, heat conductivility is excellent.
Thermal conductive adhesive of the present invention both can have been made single component heat-conducting glue and use, and catalyzing primer also can be coordinated to use.Do about to need several minutes to tens minute set time when single component heat-conducting glue uses, do not need other heating, very convenient.Needing the larger occasion of fast setting or bonding gap that catalyzing primer can be coordinated to use in addition, the agent of this end is conventional anaerobic glue promotor, and its composition is known technology, the normally solution of organic copper salt solution or aldehyde-amine condensate.During use at bonding plane while impose on catalyzing primer, the other side imposes on anaerobic type heat-conducting glue, compresses laminating for both sides with certain pressure, the soonest can one minute inner position primary solidification.Accurate weighing is not needed or not to be pre-mixed yet, handled easily.
Embodiment
Below in conjunction with embodiment, the present invention will be described in detail, and embodiment is only the preferred embodiment of the present invention, is not limitation of the invention.Without departing from the spirit and substance of the case in the present invention, the amendment do the inventive method, step or condition or replacement, all belong to scope of the present invention.
Embodiment 1
Heat conductive filler treatment process one: be dissolved in 100 parts of pure water by 0.2 part of (mass fraction, lower same) EDTA-2Na, add 100 parts of aluminum oxide, be heated to 60 DEG C and stir the specified times, centrifuging dries.Separately getting 2 parts of KH570 adds in 80 parts of dehydrated alcohols, and stirring and dissolving, adds the heat conductive filler crossed through chelation treatment, stirring reaction certain hour.Centrifuging dries, and filter residue is pulverized after drying, and can obtain the heat conductive filler processed.
Embodiment 2
Heat conductive filler treatment process two: be dissolved in 80 parts of dehydrated alcohols by 0.1 part of EDTA-4Na, adds 100 parts of silicon powders, is heated to 50 DEG C and stirs the specified time.Add 2 parts of KH560 stirring reaction specified times again, centrifuging dries, and filter residue is pulverized after drying, and obtains the heat conductive filler processed.
Embodiment 3
Prepare thermal conductive adhesive: by TEGDMA 92.95 parts, 2 parts, vinylformic acid, Resorcinol 0.05 part, pyrodin 1 part, saccharin 1 part, mixes to dissolving, can be heated to 60 ~ 70 DEG C if desired to help to dissolve; Add surface treated silicon powder (described in embodiment 2) 100 parts again, aerosil 3 parts, stir through power mixer high speed dispersion, vacuumize removing bubble; Finally at lower than 40 DEG C, add isopropyl benzene hydroperoxide 3 parts, mix, obtain experimental group 1.
Embodiment 4
Prepare thermal conductive adhesive: by TEGDMA 63.3 parts, methacrylic acid 2 parts, urethane methacrylate prepolymer 30 parts, Resorcinol 0.05 part, pyrodin 0.5 part, tri-n-butylamine 0.5 part, 0.1 part, xitix, sodium ascorbate 0.05 part, saccharin 1 part, mix to dissolving, be heated to 65 DEG C to help to dissolve; Add 200 parts, the aluminum oxide (described in embodiment 1) processed again, aerosil 2 parts, stir through power mixer high speed dispersion, vacuumize to remove bubble; Finally at lower than 40 DEG C, add tertbutyl peroxide 2.5 parts, mix, obtain experimental group 2.
Embodiment 5
Prepare thermal conductive adhesive: by Rocryl 410 73.9 parts, methacrylic acid 2 parts, epoxy acrylic ester prepolymer 20 parts, Resorcinol 0.05 part, pyrodin 0.2 part, tri-n-butylamine 0.7 part, 0.1 part, xitix, 0.05 part, saccharin sodium, saccharin 0.5 part, mix to dissolving, be heated to 60 DEG C to help to dissolve; Add 500 parts, the aluminum oxide (described in embodiment 1) processed again, aerosil 3 parts, stir through power mixer high speed dispersion, vacuumize to remove bubble; Finally at lower than 40 DEG C, add tertbutyl peroxide 2.5 parts, mix, obtain experimental group 3.
Comparative example 1:
By TEGDMA 92.95 parts, 2 parts, vinylformic acid, Resorcinol 0.05 part, pyrodin 0.5 part, tri-n-butylamine 0.5 part, saccharin 1 part, mixes to dissolving, is heated to 65 DEG C to help to dissolve; Add untreated silicon powder 200 parts again, aerosil 2 parts, stir through power mixer high speed dispersion, vacuumize to remove bubble; Finally at lower than 40 DEG C, add isopropyl benzene hydroperoxide 3 parts, mix, obtain control group.
Performance test:
1, storage stability test: add 35g the above embodiments and comparative example heat-conducting glue sample in the Low Density Polyethylene bottle of 100ml, under being placed in 80 DEG C of environment, there is retrogradation or solidify the required time in record colloid, rule of thumb, can store more than 1 year under keeping within 4 hours, being equivalent to room temperature under anaerobic glue 80 DEG C of environment, test-results is remembered in table 1.
2, curability test:
The primary solidification time
Get 45# carbon steel and make test piece (100 × 25 × 2mm), by above-described embodiment and comparative sample, intersected with each other carry out bonding, overlap joint area about 15 × 25mm, and loading 100g counterweight is fixed thereon, at room temperature 25 DEG C, the mensuration intersection test piece irremovable time is setting time, and result is remembered in table 1.
3, tensile shear strength test:
Test with the test piece of 45# carbon steel according to standard GB/T7124-2008, impose on catalyzing primer 7649 at bonding plane, the other side imposes on above-mentioned experimental group and each composition of control group, carries out bonding, and test after 24 hours, test-results is as table 1.
Table 1
Compared with control group, heat conductive filler can improve package stability and the viscosity stability of heat-conducting glue after treatment greatly.After storing one week, control group colloid have cured, has no value for use, and experimental group still has good operability.
Claims (13)
1. an anaerobic type thermal conductive adhesive, is characterized in that, comprises the component of following parts by weight:
The binding agent of (a) anaerobically curable 100 parts;
(b) heat conductive filler 100 ~ 500 parts.
2. anaerobic type thermal conductive adhesive according to claim 1, is characterized in that, the binding agent of described anaerobically curable is made up of the component of following parts by weight:
A kind of to several monomers containing vinyl and/or oligopolymer 65 ~ 95 parts;
Organo-peroxide 0.1 ~ 10 part;
Promotor 0.05 ~ 5 part;
Organic acid 0.1 ~ 10 part;
Stopper 0.005 ~ 0.5 part;
Secondary accelerator 0.01 ~ 5 part.
3. anaerobic type thermal conductive adhesive according to claim 2, is characterized in that, comprises at least one containing the monomer of vinyl and at least one oligopolymer containing vinyl;
The described monomer containing vinyl is at least one in mono acrylic ester, diacrylate, many acrylate, monomethacrylates, dimethacrylate, many methacrylic esters;
The described oligopolymer containing vinyl is at least one in epoxy acrylate, urethane acrylate, polyester acrylate, polyether acrylate.
4. anaerobic type thermal conductive adhesive according to claim 2, is characterized in that, described organic cross compound be contain one or more peroxy-O-O-compound.
5. anaerobic type thermal conductive adhesive according to claim 2, is characterized in that, described promotor is at least one in organic hydrazides, tertiary amine.
6. anaerobic type thermal conductive adhesive according to claim 2, is characterized in that, described organic acid is at least one in organic carboxyl acid, chlorinated carboxylic acid, sulfonic compound.
7. anaerobic type thermal conductive adhesive according to claim 2, is characterized in that, the described stopper at least one that to be described stopper be in phenols, quinones.
8. anaerobic type thermal conductive adhesive according to claim 2, is characterized in that, described secondary accelerator is at least one in saccharin, saccharin salt, xitix, ascorbate salt.
9. anaerobic type thermal conductive adhesive according to claim 1, is characterized in that, described heat conductive filler is carry out the heat conductive filler after surface treatment through surface treatment agent.
10. anaerobic type thermal conductive adhesive according to claim 11, is characterized in that, described heat conductive filler is at least one in aluminum oxide, magnesium oxide, zinc oxide, aluminium nitride, boron nitride, silicon carbide, silicon-dioxide, aluminium hydroxide, magnesium hydroxide.
11. anaerobic type thermal conductive adhesives according to claim 11, is characterized in that, described surface treatment agent is sequestrant and silane coupling agent.
The preparation method of anaerobic type thermal conductive adhesive described in 12. 1 kinds of claims 1, is characterized in that, be made up of following steps:
(1) process of heat conductive filler, select the wherein one in following two kinds of methods:
Method one, sequestrant is made into the aqueous solution, then drops into heat conductive filler and stir, abundant chelating, then filter with whizzer and dry; By silane coupling agent and non-aqueous solvent wiring solution-forming, add the heat conductive filler through chelating, stir to filter with whizzer after the specified time dry, dry, pulverize for subsequent use;
Method two, sequestrant is added non-aqueous solvent wiring solution-forming, drops into heat conductive filler and stir abundant chelating, then add silane coupling agent, filter with whizzer after stirring the specified time dry, dry, pulverize for subsequent use;
(2) preparation of thermal conductive adhesive: by each for other in the binding agent of anaerobically curable except organo-peroxide component mutual mixed dissolution according to a conventional method, then the heat conductive filler that step (1) processed is added, stir through power mixer high speed dispersion, vacuumize removing bubble, finally add organo-peroxide under lower than 40 DEG C of conditions and mix.
The preparation method of 13. anaerobic type thermal conductive adhesives according to claim 14, it is characterized in that: according to practical condition, the preparation temperature of set-up procedure (1) and step (2), in the method one of step (1), chelating process can be heated to 60 ~ 70 DEG C to accelerate sequestration rate; In the method two of step (1), chelating process can be heated to 50 ~ 60 DEG C to accelerate sequestration rate; In step (2), dissolution process can be heated to 50 ~ 70 DEG C to help to dissolve.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107722842A (en) * | 2017-11-07 | 2018-02-23 | 广东三和控股有限公司 | A kind of quick-drying, high stability anaerobic adhesive and preparation method thereof |
| CN108384506A (en) * | 2018-03-02 | 2018-08-10 | 南宁珀源能源材料有限公司 | Add the preparation method of the One-component adhesive of the stabilization of silica flour |
| CN111019587A (en) * | 2019-12-17 | 2020-04-17 | 格丽泰新材料科技（苏州）有限公司 | Two-component polyurethane adhesive for bonding power battery and preparation method thereof |
| CN111073523A (en) * | 2019-12-19 | 2020-04-28 | Tcl华星光电技术有限公司 | Frame glue and preparation method of display panel |
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| US4855002A (en) * | 1983-01-18 | 1989-08-08 | Loctite Corporation | Process of bonding surfaces employing/anaerobic aluminum filled compositions |
| CN101328395A (en) * | 2008-07-31 | 2008-12-24 | 广东恒大新材料科技有限公司 | Anaerobic oxygen rubber composition |
| CN101735734A (en) * | 2008-11-04 | 2010-06-16 | 广东恒大新材料科技有限公司 | Anaerobic adhesive initiator composite and anaerobic adhesive containing initiator |
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| US4855002A (en) * | 1983-01-18 | 1989-08-08 | Loctite Corporation | Process of bonding surfaces employing/anaerobic aluminum filled compositions |
| CN101328395A (en) * | 2008-07-31 | 2008-12-24 | 广东恒大新材料科技有限公司 | Anaerobic oxygen rubber composition |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107722842A (en) * | 2017-11-07 | 2018-02-23 | 广东三和控股有限公司 | A kind of quick-drying, high stability anaerobic adhesive and preparation method thereof |
| CN108384506A (en) * | 2018-03-02 | 2018-08-10 | 南宁珀源能源材料有限公司 | Add the preparation method of the One-component adhesive of the stabilization of silica flour |
| CN111019587A (en) * | 2019-12-17 | 2020-04-17 | 格丽泰新材料科技（苏州）有限公司 | Two-component polyurethane adhesive for bonding power battery and preparation method thereof |
| CN111019587B (en) * | 2019-12-17 | 2022-04-12 | 格丽泰新材料科技（苏州）有限公司 | Two-component polyurethane adhesive for bonding power battery and preparation method thereof |
| CN111073523A (en) * | 2019-12-19 | 2020-04-28 | Tcl华星光电技术有限公司 | Frame glue and preparation method of display panel |
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