CN107396540A - A kind of PCB bellmouths preparation method - Google Patents

A kind of PCB bellmouths preparation method Download PDF

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Publication number
CN107396540A
CN107396540A CN201710736716.1A CN201710736716A CN107396540A CN 107396540 A CN107396540 A CN 107396540A CN 201710736716 A CN201710736716 A CN 201710736716A CN 107396540 A CN107396540 A CN 107396540A
Authority
CN
China
Prior art keywords
bellmouth
aluminium flake
preparation
pcb
bellmouths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710736716.1A
Other languages
Chinese (zh)
Inventor
曾海强
陈志新
王孔祥
罗新权
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aoshikang Technology Co Ltd
Original Assignee
Aoshikang Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aoshikang Technology Co Ltd filed Critical Aoshikang Technology Co Ltd
Priority to CN201710736716.1A priority Critical patent/CN107396540A/en
Publication of CN107396540A publication Critical patent/CN107396540A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827Tapered, e.g. tapered hole, via or groove

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Drilling And Boring (AREA)

Abstract

A kind of PCB bellmouths preparation method, comprises the following steps:(1) tapered bur nozzle is selected according to bellmouth size;(2) according to customer requirement bellmouth aperture aperture, calculate lower drilling depth and result < b=a/tg (r/2) > is write into taper hole drilling formula;(3) routinely drill flow sequential analysis:A installation chock plates, b kind pins, c upper padding plates, the upper plates to be drilled of d, e lid aluminium flake rubberizing paper, f open machine part " mushroom head " and push down aluminium flake, and lid cold punching plate pastes jail to g with gummed paper again;(4) confirm that aluminium flake and board table top are conductings with universal meter, and ensure that it is " mushroom head " to be uniquely coupled between aluminium flake and board table top at conducting;(5) drill.The present invention calculates lower drilling depth and inputs formula, being then automatically performed bellmouth by board makes, and efficiency high, can produce accurately bellmouth according to tapered bur nozzle angle.

Description

A kind of PCB bellmouths preparation method
Technical field
The invention belongs to pcb board production technical field, and in particular to a kind of PCB bellmouths preparation method.
Background technology
In PCB application installations, it is often necessary to which the lead screw for using " cap " is fixed, and bellmouth can prevent spiral shell Silk cap protrudes pcb board, and can preferably play fixation.Past is typically larger because of bellmouth tolerance, and preparation method is all relative " coarse ".Main shaft is highly usually adjusted to consistent first, then makes the consistent (note of plate plate face flatness to be drilled:As plate face is uneven, Taper hole depth also can be different), then calculate lower drilling depth and make bellmouth, need full inspection after completing.As customer requirement is got over Come tighter, such a method is substantially outdated.
The content of the invention
The technical problem to be solved by the invention is to provide a kind of PCB bellmouths preparation method, according to tapered bur nozzle angle Degree, calculates lower drilling depth and inputs formula, and being then automatically performed bellmouth by board makes, and efficiency high, can produce precisely Bellmouth.
The technical solution adopted for the present invention to solve the technical problems is:A kind of PCB bellmouths preparation method, including it is following Step:
(1) tapered bur nozzle is selected according to bellmouth size;
(2) according to customer requirement bellmouth aperture aperture, calculate lower drilling depth and write result < b=a/tg (r/2) > Taper hole drilling formula;A is bellmouth aperture radius, and for b to bore drilling depth under nozzle, r/2 is half drill point angle angle;
(3) routinely drill flow sequential analysis:A., it is upper to be drilled that chock plate → b. kinds pin → c. upper padding plates → d. is installed Plate → e. lid aluminium flake rubberizings paper → f. opens machine part " mushroom head " and pushes down aluminium flake → g. lid cold punching plate gummed paper patch jails again;
(4) confirm that aluminium flake and board table top are conductings with universal meter, and ensure uniquely to join between aluminium flake and board table top It is " mushroom head " to tie at conducting;
(5) drill.
Further, in step (1), bore that nozzle size is bigger 0.2-0.5mm than institute hole diameter is advisable, preferably 0.3-0.4mm.
The present invention has advantages below:
Preparation method of the present invention is using conventional controllable deep drilling board, and board need not specially be adjusted by boring bellmouth, to main shaft height Degree, plate face flatness routine, no particular/special requirement, can save manpower/material resources, reduce cost, improve efficiency.
Preparation method of the present invention automatically controls lower drilling depth by board, and board bores down set depth again after receiving signal, So main shaft is highly inconsistent and plate face flatness it is inconsistent on bellmouth precision substantially without influence.
The bellmouth qualitative reliability that preparation method of the present invention drills out is high, need only routinely detect frequency, is not necessary to complete All bellmouths are examined, can largely save manpower/material resources, reduce cost, improve efficiency.
Brief description of the drawings
Fig. 1 is that drilling depth (b) calculates schematic diagram under the embodiment of the present invention;
Fig. 2 is bellmouth schematic diagram of the embodiment of the present invention.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described.
Embodiment
A kind of PCB bellmouths preparation method, comprises the following steps:
(1) tapered bur nozzle is selected according to bellmouth size, it is bigger 0.4mm than institute hole diameter;
(2) according to customer requirement bellmouth aperture aperture, calculate lower drilling depth and write result < b=a/tg (r/2) > Taper hole drilling formula;A is bellmouth aperture radius, and for b to bore drilling depth under nozzle, r/2 is half drill point angle angle;
(3) routinely drill flow sequential analysis:A., it is upper to be drilled that chock plate → b. kinds pin → c. upper padding plates → d. is installed Plate → e. lid aluminium flake rubberizings paper → f. opens machine part " mushroom head " and pushes down aluminium flake → g. lid cold punching plate gummed paper patch jails again;
(4) confirm that aluminium flake and board table top are conductings with universal meter, and ensure uniquely to join between aluminium flake and board table top It is " mushroom head " to tie at conducting;
(5) drill.
In the present embodiment, taper pore radius is a, and it is b to bore drilling depth under nozzle, as shown in figure 1, wherein, r/2 is half Drill point angle angle, b=a/tg (r/2).
Preparation method of the present invention is using conventional controllable deep drilling board, and board need not specially be adjusted by boring bellmouth, to main shaft height Degree, plate face flatness routine, no particular/special requirement, can save manpower/material resources, reduce cost, improve efficiency.
Preparation method of the present invention automatically controls lower drilling depth by board, and board bores down set depth again after receiving signal, So main shaft is highly inconsistent and plate face flatness it is inconsistent on bellmouth precision substantially without influence.
The bellmouth qualitative reliability that preparation method of the present invention drills out is high, need only routinely detect frequency, is not necessary to complete All bellmouths are examined, can largely save manpower/material resources, reduce cost, improve efficiency.

Claims (3)

1. a kind of PCB bellmouths preparation method, it is characterised in that comprise the following steps:
(1) tapered bur nozzle is selected according to bellmouth size;
(2) according to customer requirement bellmouth aperture aperture, calculate lower drilling depth and result < b=a/tg (r/2) > is write into taper Hole drilling formula;A is bellmouth aperture radius, and for b to bore drilling depth under nozzle, r/2 is half drill point angle angle;
(3) routinely drill flow sequential analysis:A. install chock plate → b. kinds pin → upper plates to be drilled of c. upper padding plates → d. → E. lid aluminium flake rubberizing paper → f. opens machine part " mushroom head " and pushes down aluminium flake → g. lid cold punching plate gummed paper patch jails again;
(4) confirm that aluminium flake and board table top are conductings with universal meter, and ensure uniquely to be coupled between aluminium flake and board table top and lead Logical place is " mushroom head ";
(5) drill.
2. PCB bellmouths preparation method according to claim 1, it is characterised in that in step (1), bore nozzle size and compare institute The big 0.2-0.5mm of hole diameter.
3. PCB bellmouths preparation method according to claim 2, it is characterised in that in step (1), bore nozzle size and compare institute The big 0.3-0.4mm of hole diameter.
CN201710736716.1A 2017-08-24 2017-08-24 A kind of PCB bellmouths preparation method Pending CN107396540A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710736716.1A CN107396540A (en) 2017-08-24 2017-08-24 A kind of PCB bellmouths preparation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710736716.1A CN107396540A (en) 2017-08-24 2017-08-24 A kind of PCB bellmouths preparation method

Publications (1)

Publication Number Publication Date
CN107396540A true CN107396540A (en) 2017-11-24

Family

ID=60346711

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710736716.1A Pending CN107396540A (en) 2017-08-24 2017-08-24 A kind of PCB bellmouths preparation method

Country Status (1)

Country Link
CN (1) CN107396540A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020006983A1 (en) * 2018-07-03 2020-01-09 惠州市金百泽电路科技有限公司 Built-in nut stepped hole pcb rapid machining method
CN110785014A (en) * 2019-10-31 2020-02-11 珠海精毅电路有限公司 Circuit board manufacturing process
CN112996254A (en) * 2021-03-03 2021-06-18 苏州维嘉科技股份有限公司 Circuit board blind hole processing method, circuit board processing gong machine and computer equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101537505A (en) * 2008-12-30 2009-09-23 南京依利安达电子有限公司 Small-aperture high-density drilling method of printed circuit board
CN203509145U (en) * 2013-09-23 2014-04-02 深圳诚和电子实业有限公司 Drill bit for drilling countersunk head screw hole in HDI plate
CN104640354A (en) * 2013-11-11 2015-05-20 珠海方正科技多层电路板有限公司 Printed circuit board and back-bore forming method thereof
CN104625181A (en) * 2014-12-31 2015-05-20 广州兴森快捷电路科技有限公司 PCB milling device and PCB milling method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101537505A (en) * 2008-12-30 2009-09-23 南京依利安达电子有限公司 Small-aperture high-density drilling method of printed circuit board
CN203509145U (en) * 2013-09-23 2014-04-02 深圳诚和电子实业有限公司 Drill bit for drilling countersunk head screw hole in HDI plate
CN104640354A (en) * 2013-11-11 2015-05-20 珠海方正科技多层电路板有限公司 Printed circuit board and back-bore forming method thereof
CN104625181A (en) * 2014-12-31 2015-05-20 广州兴森快捷电路科技有限公司 PCB milling device and PCB milling method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020006983A1 (en) * 2018-07-03 2020-01-09 惠州市金百泽电路科技有限公司 Built-in nut stepped hole pcb rapid machining method
CN110785014A (en) * 2019-10-31 2020-02-11 珠海精毅电路有限公司 Circuit board manufacturing process
CN112996254A (en) * 2021-03-03 2021-06-18 苏州维嘉科技股份有限公司 Circuit board blind hole processing method, circuit board processing gong machine and computer equipment
CN112996254B (en) * 2021-03-03 2022-06-21 苏州维嘉科技股份有限公司 Circuit board blind hole processing method, circuit board processing gong machine and computer equipment

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Application publication date: 20171124