CN107396219B - The sound conduction component of terminal device and its microphone, leading note part - Google Patents
The sound conduction component of terminal device and its microphone, leading note part Download PDFInfo
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- CN107396219B CN107396219B CN201710673216.8A CN201710673216A CN107396219B CN 107396219 B CN107396219 B CN 107396219B CN 201710673216 A CN201710673216 A CN 201710673216A CN 107396219 B CN107396219 B CN 107396219B
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- leading note
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
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- Acoustics & Sound (AREA)
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Abstract
This application provides the sound conduction component of a kind of terminal device and its microphone, leading note part, which includes the different leading note brackets and buffer body of material hardness, and the hardness of leading note bracket material is greater than the hardness of buffer body material；Buffer body includes buffer main portion and an at least holding section, buffer main portion structure annular in shape, an at least holding section and buffer main portion integral structure, and it is extended to the cyclic structure of buffer main portion outside, end face is equipped with and is surrounded on the accommodation groove of sound inlet and the engaging slot being correspondingly arranged with holding section on end face, buffer main portion is embedded in accommodation groove, holding section snap fit corresponding with engaging slot, realizes being connected together for leading note bracket and buffer body.The leading note part is convenient for the integrally-built assembling of leading note part by the clamping structure of setting leading note bracket and buffer body.
Description
Technical field
The present invention relates to the technical fields of terminal device microphone voice conducting structure, are specifically related to a kind of terminal device
And its sound conduction component, the leading note part of microphone.
Background technique
With the development of electronic equipment, the electronic equipments such as mobile phone are had become in people's work and life indispensable one
Part.The electronic equipments such as mobile phone all include generally microphone, and the setting relationship between microphone and mobile phone shell is usually：Mike
Microphone aperture setting in the direct face mobile phone shell of wind is either by turning sound structure for the microphone on microphone and mobile phone shell
Hole indirect communication.
Summary of the invention
On the one hand the embodiment of the present application provides a kind of leading note part of microphone, the leading note part includes that material hardness is different
Leading note bracket and buffer body, the hardness of the leading note bracket material is greater than the hardness of the buffer body material；Wherein, described
One side end face of leading note bracket is equipped with sound inlet, and top surface is equipped with sound outlet hole, and bottom surface is oppositely arranged with the top surface, on the bottom surface
Equipped with leading note slot, the sound inlet is connected to the sound outlet hole by the leading note slot；The buffer body includes buffer main portion
And an at least holding section, the buffer main portion structure annular in shape, an at least holding section and the buffer main portion one
Body structure, and be extended to the cyclic structure of buffer main portion outside, the end face is equipped with and is surrounded on the end face
The accommodation groove of upper sound inlet and the engaging slot being correspondingly arranged with the holding section, the buffer main portion are embedded at the accommodating
In slot, holding section snap fit corresponding with the engaging slot realizes that leading note bracket engaging with the buffer body connects
It connects.
On the other hand the embodiment of the present application also provides a kind of sound conduction component of microphone, the conducting subassembly includes wheat
Leading note part described in any one of gram wind, sealed bolster plate and above-described embodiment；The sealed bolster plate is covered on the leading note part
Bottom surface, with the leading note slot formed leading note channel, the side of the microphone is connect with circuit board, on the other side another
Sound inlet is arranged in side, and the sound inlet of the microphone corresponds to the sound outlet hole of the leading note part, and then connect the microphone can
It receives and enters from the sound inlet of the leading note part, and pass through the sound of the leading note channel transfer.
The embodiment of the present application provides a kind of sound conduction component of microphone again, and conducting subassembly includes microphone, gasket
Leading note part described in any one of plate and above-described embodiment；The sealed bolster plate is covered on the bottom surface of the leading note part, with
The leading note slot forms leading note channel, and the microphone is fixed on circuit board, and the circuit board goes out in the correspondence leading note part
Sound hole position is equipped with through-hole, and the microphone and the leading note part are located at the two sides of the circuit board, and the microphone into
Sound hole corresponds to the through-hole of the circuit board, and then can receive the microphone and enter from the sound inlet of the leading note part, and
The sound transmitted by the leading note channel and the through-hole.
Further, the embodiment of the present application provides a kind of terminal device, and the terminal device includes front housing, rear shell, circuit
Microphone voice conducting subassembly described in any one of plate and above-described embodiment；The sealed bolster plate abuts the front housing, institute
It states rear shell to abut with the end face of the leading note bracket, the rear shell is equipped with into sound channel, the sound inlet pair of the leading note bracket
Into sound channel described in Ying Yu, the buffer body of the leading note part is located between the rear shell and the leading note bracket, to described
Sealing and buffering connection between leading note bracket and the rear shell.
Sound conduction component, the leading note part of terminal device and its microphone provided by the embodiments of the present application are led by design
The structure type that the hard plastic leading note bracket and soft rubber buffer body two parts of sound part combine, on the one hand can guarantee leading note
On the other hand part can also improve the integral strength of leading note part, improve sound with the sealing and buffering connection of terminal device
The quality of conduction；In addition, being convenient for the integrally-built assembling of leading note part by the clamping structure of setting leading note bracket and buffer body.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is the overall structure diagram of one embodiment of the application microphone leading note part；
Fig. 2 is the side view of leading note part in Fig. 1 embodiment；
Fig. 3 be in Fig. 1 embodiment leading note part along the A-A cross-sectional view of dotted line position；
Fig. 4 is the bottom view of leading note part in Fig. 1 embodiment；
Fig. 5 is the structure dismantling schematic diagram of leading note part in Fig. 1 embodiment；
Fig. 6 is the schematic structural cross-sectional view of another embodiment of the application microphone leading note part；
Fig. 7 is the overall structure diagram of the another embodiment of the application microphone leading note part；
Fig. 8 is the structure dismantling schematic diagram of leading note part in Fig. 7 embodiment；
Fig. 9 is the schematic structural cross-sectional view of one embodiment of sound conduction component of the application microphone；
Figure 10 is the structural blast schematic diagram of sound conduction component in Fig. 9 embodiment；
Figure 11 is the structure dismantling schematic diagram of the application leading note part another embodiment；
Figure 12 is the overall structure diagram of the application leading note bracket a further embodiment；
Figure 13 is the schematic structural cross-sectional view of the another embodiment of the application leading note part；
Figure 14 is the schematic structural cross-sectional view of another embodiment of sound conduction component of the application microphone；
Figure 15 is the partial structurtes schematic cross-sectional view of one embodiment of the application terminal device；
Figure 16 is the partial structurtes schematic cross-sectional view of another embodiment of the application terminal device.
Specific embodiment
With reference to the accompanying drawings and examples, the present invention is described in further detail.It refers in particular to
Out, following embodiment is merely to illustrate the present invention, but is not defined to the scope of the present invention.Likewise,
Following embodiment is only section Example of the invention and not all embodiments, those of ordinary skill in the art are not making wound
All other embodiment obtained under the premise of the property made labour, shall fall within the protection scope of the present invention.
Term " first ", " second ", " third " in the present invention are used for description purposes only, and should not be understood as instruction or dark
Show relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " second ", " are defined as a result,
Three " feature can explicitly or implicitly include at least one of the features.In description of the invention, the meaning of " plurality " is extremely
It is two few, such as two, three etc., unless otherwise specifically defined.The directional instruction of institute is (all in the embodiment of the present invention
Such as up, down, left, right, before and after ...) it is only used for explaining in the phase under a certain particular pose (as shown in the picture) between each component
To positional relationship, motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes therewith
Become.In addition, term " includes " and " having " and their any deformations, it is intended that cover and non-exclusive include.Such as comprising
The process, method, system, product or equipment of a series of steps or units are not limited to listed step or unit, and
It is optionally further comprising the step of not listing or unit, or optionally further comprising for these process, methods, product or equipment
Intrinsic other step or units.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
Containing at least one embodiment of the present invention.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
Microphone on terminal device be typically all pass through sound conduction part to be connected to external, rather than microphone into
Through-hole setting in the direct corresponding housing of sound hole.Because on the one hand leading note part needs to have the function of sound conduction, it is also necessary to protect
With the connection of pooling feature between card and terminal device shell, therefore conducting piece in the prior art is generally whole soft rubber
The shortcomings that structural member made of glue, this kind of structure, is to be made due to its entirety of soft material, inside need be equipped with lead
The channel of sound, it is well known that soft material can be deformed when being squeezed, to will lead to leading note channel deformation, and then make sound
There are distortion phenomenons in communication process；In addition, the conducting piece of soft material holds in sound-delivery channel very much in injection molding process
Burr is easily formed, and then noise can be brought, influences the conductive mass of sound.In view of the above technical problems, the application will provide as
Under solution.
In addition, it is necessary to explanation, the terminal device in the application may include mobile phone, tablet computer, laptop,
Wearable device etc. has the electronic equipment of microphone.
It is the overall structure diagram of one embodiment of the application microphone leading note part also referring to Fig. 1 and Fig. 2, Fig. 1, figure
2 be the side view of leading note part in Fig. 1 embodiment, and in the embodiment, leading note part 100 includes the different leading note bracket of material hardness
110 and buffer body 120, the hardness of 110 material of leading note bracket is greater than the hardness of 120 material of buffer body.Wherein, leading note bracket
110 specific material can be the hard plastics such as ABS, POM, PS, PMMA, PC, PET, PBT, PPO, PP, PE, PA, PVC.And delay
Rushing body 120 can then be made of the soft material such as rubber, foam.Those skilled in the art can under above-mentioned guiding theory according at
The actual demand of this grade is voluntarily chosen, and is not specifically limited herein.
Specifically, the leading note bracket 110 includes top surface 111, end face 112, bottom surface 113 and side 114.Bottom surface 113
It is oppositely arranged with top surface 111.The top surface 111 further comprises the first plane 1111, the second plane 1112 and is set to first flat
Joint face 1113 between face 1111 and the second plane 1112, joint face 1113 can be for inclined curved surfaces or perpendicular to described
First plane 1111 and the second plane 1112 are faced directly.
The top margin of end face 112 and bottom edge are connect with the second plane 1112 and bottom surface 113 respectively, optionally, in this implementation
In example, included angle B between 112 end faces and bottom surface 113 is acute angle so that leading note part 100 can preferably with terminal device shell
Between installation cooperation, specific fit structure form will be described in detail in the embodiment below, certainly, in other embodiments
In, included angle B may be right angle or obtuse angle.
Side 114 connects top surface 111, end face 112 and bottom surface 113, so with top surface 111, end face 112 and bottom surface
113 are collectively formed the complete appearance profile of leading note bracket 110.
In the present embodiment, optionally, the distance between the second plane 1112 and bottom surface 113 H1 are greater than the first plane 1111
The distance between bottom surface 113 H2, to form difference in height in the first plane 1111 and 1112 position of the second plane.On end face 112
Equipped with sound inlet 115, the first plane 1111 is equipped with sound outlet hole 116.
It is that along the A-A cross-sectional view of dotted line position, Fig. 4 is leading note part in Fig. 1 embodiment also referring to Fig. 3 and Fig. 4, Fig. 3
The bottom view of leading note part in Fig. 1 embodiment, bottom surface 113 are equipped with leading note slot 117, sound inlet 115 and sound outlet hole 116 by leading
Sound slot 117 is connected to.It is flat that microphone (not showing in figure, specific structure please refers to the detailed description in subsequent embodiment) is installed on first
On face 1111, and it is correspondingly arranged with the sound outlet hole 116 in the first plane 1111.
Referring to Fig. 5, Fig. 5 is the structure dismantling schematic diagram of leading note part in Fig. 1 embodiment, in the present embodiment, leading note branch
The end face 112 of frame 110 is equipped with the first accommodation groove 1121 around sound inlet 115, and the appearance profile of buffer body 120 and first are held
It sets slot 1121 to be adapted, and is embedded in the first accommodation groove 1121, guarantee that the ring week of sound inlet 115 is all embedded and hold first
The buffer body 120 set in slot 1121 surrounds.
Optionally, which is embedded in the first accommodation groove 1121 by way of integrated injection molding, and buffer body
120 lateral surface is higher by 1121 end face of the first accommodation groove (please referring to Fig. 3), i.e. 120 part of buffer body is embedded at the first accommodation groove
In 1121, it is to be understood that if the lateral surface of buffer body 120 is not higher by the end face of the first accommodation groove 1121, i.e. buffer body
120 are disposed entirely within the structure type in the first accommodation groove 1121, then cannot achieve buffer body 120 in leading note bracket 110 and end
The purpose of sealing and buffering connection between end equipment shell.
In addition, positioning cams can also be arranged on the side 114 of the leading note bracket 110 please continue to refer to Fig. 1 and Fig. 4
(1141,1142), for the positioning action of leading note part 100 during the installation process.
Leading note part provided in this embodiment, by the hard plastic leading note bracket and soft rubber buffer body that design leading note part
On the one hand the structure type that two parts integrated injection molding combines can guarantee that leading note part can connect with the sealing of terminal device and buffering
(soft buffer body) is connect, the integral strength (hard leading note bracket) of leading note part on the other hand can also be improved, improves sound conduction
Quality.
Referring to Fig. 6, Fig. 6 is the schematic structural cross-sectional view of another embodiment of the application microphone leading note part, it is real with upper one
It applies unlike example, the accommodation groove of accommodation groove or setting compared with shallow structure can be not provided in the present embodiment on leading note bracket 110
(for a upper embodiment), buffer body 120 is sticked on the end face of leading note bracket 110 112, likewise, buffer body 120
Sound inlet 115 on end face 112 is arranged.
Leading note part structure in the embodiment, will delay made of leading note bracket made of hard material and soft material
It rushes body to bond together, makes leading note part in the case where meeting sealing, buffering connection and integral strength, overall structure is more
Simply, the either assembling cost of the process costs of the single component of leading note bracket, buffer body or leading note bracket and buffer body
It is all lower.
Referring to Figure 7 together and Fig. 8, Fig. 7 be the another embodiment of the application microphone leading note part overall structure diagram,
Fig. 8 is the structure dismantling schematic diagram of leading note part in Fig. 7 embodiment, and in the embodiment, buffer body 120 includes buffer main portion 121
And reinforcement part 122,121 structures annular in shape of main body are buffered, reinforcement part 122 is structure as a whole with buffer main portion 121, and to
It is extended on the outside of the cyclic structure of buffer main portion 121.
The end face 112 of leading note bracket 110 is equipped with the first accommodation groove 1121, the second plane 1112 enterprising one of top surface 111
Step is equipped with the second accommodation groove 11121 being connected to the first accommodation groove 1121, and buffer main portion 121 is embedded at the first accommodation groove 1121
Interior, reinforcement part 122 is embedded in the second accommodation groove 11121.
Optionally, it again may be by the shape of integrated injection molding between the buffer body 120 and leading note bracket 110 in the embodiment
Formula connects, and a nanometer salient point (not shown) can be set respectively in the first accommodation groove 1121 and the second accommodation groove 11121, to strengthen
It is connected between leading note bracket 110 and reinforcement part 122, the effect of the reinforcement part 122 is in buffer body 120 and leading note bracket 110 1
Reinforce the coupling force between buffer body 120 and leading note bracket 110 in body injection moulding process.
Leading note part provided in this embodiment, the mode that buffer body again may be by integrated injection molding with leading note bracket connect
Connect, by setting reinforcement part on buffer body, can be improved coupling force between buffer body and leading note bracket, strengthen buffer body with
It is connected between leading note bracket.
It is the structure section view of one embodiment of sound conduction component of the application microphone also referring to Fig. 9 and Figure 10, Fig. 9
Schematic diagram, Figure 10 are the structural blast schematic diagrames of sound conduction component in Fig. 9 embodiment.The conducting subassembly includes but is not limited to lead
Sound part 100, microphone 200 and sealed bolster plate 300.Wherein, the structure of the leading note part 100 can be appointing in above-described embodiment
It anticipates one kind, a kind of structure of leading note part 100 is only illustrated in the diagram of the present embodiment.
Specifically, sealed bolster plate 300 is covered on the bottom surface 113 of leading note part 100, with leading note on leading note part bottom surface 113
Slot 117 forms leading note channel, and the sound inlet of microphone 200 corresponds to the sound outlet hole 116 of leading note part, and then makes microphone 200 can
It receives and enters from the sound inlet 115 of leading note part (specially leading note bracket 110), and pass through the sound of leading note channel transfer.
Optionally, in the present embodiment, microphone 200 can be fixed on circuit board 400, and circuit board 400 is led in correspondence
116 position of sound part sound outlet hole is equipped with through-hole 410, and microphone 200 and the first plane 1111 of leading note part leading note bracket 110 are located at electricity
The two sides of road plate 400 are in the present embodiment diagram：Microphone 200 is located at the top of circuit board 400, microphone 200 and circuit
On the one hand the setting relationship of plate 400 plays the role of microphone 200 and is electrically connected with circuit board 400, on the other hand also act as to wheat
The effect that gram wind 200 is fixed.
The sound inlet of microphone 200 corresponds to the through-hole 410 of circuit board 400.Optionally, circuit board 400 and leading note bracket
Gasket 500 is folded between 110 the first plane 1111, gasket 500 plays circuit board 400 and leading note bracket 110 first
Connection and sealing function between plane 1111.
Due to 1111 position of the first plane of leading note bracket 110 (in Fig. 2 H2 thinner compared to the position of the second plane 1112
Less than H1), therefore microphone 200 and circuit board 400 are connect with 1111 position of the first plane of leading note bracket 110, can be with
Reduce the installation thickness bottom of conducting subassembly entirety, and then is conducive to the thin design of terminal device.
Wherein, sound is in the transmission path of the conducting subassembly：Enter from the sound inlet 115 on leading note bracket 110, then
Via the leading note channel that leading note slot 117 on sealed bolster plate 300 and leading note part bottom surface 113 is collectively formed, then from leading note bracket 110
Sound outlet hole 116 spread out of, and the sound inlet by being passed to microphone 200 after the through-hole 410 on circuit board 400.
Microphone voice conducting subassembly provided in this embodiment, leading note part is by hard plastic leading note bracket and soft rubber
The structure type that buffer body two parts integrated injection molding combines, on the one hand can guarantee leading note part can with the sealing of terminal device and
Buffering connection (soft buffer body), on the other hand can also improve the integral strength (hard leading note bracket) of leading note part, raising sound
The quality of sound conduction；In addition, leading note channel is collectively formed using leading note slot on sealed bolster plate and leading note part bottom surface, sound is made to exist
Transmission, ensure that the continuity and accuracy of sound conduction in controlled range.
Please refer to Figure 11, Figure 11 is the structure dismantling schematic diagram of the application leading note part another embodiment, in the embodiment
Leading note part 100 includes the different leading note bracket 110 and buffer body 120 of material hardness, likewise, 110 material of leading note bracket
Hardness is greater than the hardness of 120 material of buffer body.
Wherein, a side end face 112 of leading note bracket 110 is equipped with sound inlet 115, and top surface 111 is equipped with sound outlet hole 116, equally
, sound outlet hole 116 is arranged in the first plane 1111 of top surface 111, about leading note bracket 110 detailed construction feature and lead
The technical characteristics such as the material of sound bracket 110 and buffer body 120, please refer to the associated description of above-described embodiment, details are not described herein again.
By the difference of emphasis description and previous embodiment in the present embodiment.
Bottom surface 113 is oppositely arranged with top surface 111, and bottom surface 113 is equipped with leading note slot and (does not show in figure, specific structure can join
Read the structure in Fig. 3, Fig. 5 embodiment), sound inlet 115 is connected to sound outlet hole 116 by leading note slot.
The buffer body 120 includes buffer main portion 121 and an at least holding section 122, and buffer main portion 121 is annularly tied
Structure, at least a holding section 122 and 121 integral structure of buffer main portion, and extend to the cyclic structure of buffer main portion 121 outside
Setting.End face 112 is equipped with the accommodation groove 1121 for being surrounded on sound inlet 115 on end face and is correspondingly arranged with holding section 122
Engaging slot 1122, buffer main portion 121 are embedded in accommodation groove 1121, and the then engaging corresponding with engaging slot 1122 of holding section 122
Cooperation, realization leading note bracket 110 are connected together with buffer body 120.
The specific structure of the holding section 122 can be the shape to match therewith in setting barb shape, with engaging slot 1122
Snap fit；In addition, the size of engaging slot 1122 may be arranged as the appearance profile undersized than holding section 122, so that
Holding section 122 can be installed in engaging slot 1122 in the form of interference fit.Leading note bracket 110 and buffering in the present embodiment
Body 120 can be separately formed structural member, be then combined together by holding section 122 and the installation of engaging slot 1122, with shape
At the leading note part 100 of complete structure.
Optionally, buffer body 120 includes at least two holding sections 122, and at least two holding sections 122 are uniformly distributed in buffering
In the ring week of main part 121, further, in the diagram of the present embodiment, the quantity of holding section 122 is four, uniformly and two-by-two
The opposite ring week for being set to buffer main portion 121.
Further, in this embodiment leading note bracket 110 the first plane 1111 on location structure can also be set
600, location structure 600 is for positioning microphone.Optionally, in the present embodiment diagram, location structure 600 is multiple
Positioning column 610, positioning column 610 can be realized by clamping the outside (not showing specific fixed structure form in figure) of microphone casing body
It can also be by between microphone casing body to the positioning or positioning column 610 of the microphone being installed in the first plane 1111
It is realized using screw (not showing specific fixed structure form in figure) connection and the microphone being installed in the first plane 1111 is determined
Position.
Leading note part provided in this embodiment is realized by the cooperation of snap-in structure between leading note bracket and buffer body and is connected
It connects, the structure of the leading note part is simple, and assembly is easy.
Figure 12 is please referred to, Figure 12 is the overall structure diagram of the application leading note bracket a further embodiment, compared to aforementioned
Unlike embodiment, the location structure being arranged on top surface in the present embodiment is locating slot 620, the shape of locating slot 620 with
The appearance profile of microphone is adapted, and is connected to the sound outlet hole of leading note bracket 110 116, so that microphone can at least partly be set
It is placed in locating slot 620, and makes the sound inlet of microphone corresponding to the sound outlet hole 116 of the leading note bracket 110.In the embodiment
Positioning slot structure also have the function of being fixedly connected in addition to the positioning function to microphone, specific structure please refers to subsequent
The associated description of conducting subassembly embodiment.
Further it should be noted that the connection of buffer body (not shown) and leading note bracket 110 in the present embodiment
Form can be clamping or integrated injection molding, referring specifically to the associated description of previous embodiment.
The leading note part structure that the embodiment provides realizes the positioning to microphone by setting locating slot, makes positioning more
Accurately, while also there is good fixed function to microphone.
Please refer to Figure 13, Figure 13 is the schematic structural cross-sectional view of the another embodiment of the application leading note part, in the embodiment, is led
Sound part 100 includes the different leading note bracket 110 and buffer body 120 of material hardness, and the hardness of 110 material of leading note bracket is greater than slow
Rush the hardness of 120 material of body.Phase in above-described embodiment is please referred to about leading note bracket 110 and the specific material of buffer body 120
The description of pass.It also repeats no more herein.
The leading note bracket 110 equally includes top surface, end face 112, bottom surface 113 and side 114.Bottom surface 113 and top surface 111
It is oppositely arranged.The top surface further comprise the first plane 1111, the second plane 1112 and be set to the first plane 1111 and second
Joint face 1113 between plane 1112, joint face 1113 can be for inclined curved surfaces or perpendicular to first plane 1111
With facing directly for the second plane 1112.
The top margin of end face 112 and bottom edge are connect with the second plane 1112 and bottom surface 113 respectively, optionally, in this implementation
In example, optionally, the angle (not indicating in figure) between 112 end faces and bottom surface 113 is similarly acute angle, so that leading note part 100 can
With the installation cooperation preferably between terminal device shell, specific fit structure form will carry out in the embodiment below
It is described in detail, certainly, in other embodiments, the angle between 112 end faces and bottom surface 113 may be right angle or obtuse angle.
Side 114 connects top surface 111, end face 112 and bottom surface 113, so with top surface 111, end face 112 and bottom surface
113 are collectively formed the complete appearance profile of leading note bracket 110.End face 112 is equipped with sound inlet 115, sets in the first plane 1111
There is sound outlet hole 116.Unlike previous embodiment, in the embodiment, by being set between sound inlet 115 and sound outlet hole 116
Leading note channel 118 inside leading note bracket 110 connects, that is, forms the leading note channel 118 of complete structure, and is no longer semi-open knot
The leading note slot and the complete leading note channel design of sealed bolster plate fit form of structure.The structure type in this kind of leading note channel can make sound
It is propagated in leading note bracket 110 completely, and then can preferably guarantee the quality of sound transmission.
Optionally, in the present embodiment, locating slot 620, locating slot are additionally provided in the first plane 1111 of leading note bracket 110
620 shape and the appearance profile of microphone are adapted, and are connected to the sound outlet hole of leading note bracket 110 116, so that microphone can
It is at least partially arranged in locating slot 620, and makes the sound inlet of microphone corresponding to the sound outlet hole 116 of leading note bracket 110.
Likewise, the type of attachment of buffer body 120 and leading note bracket 110 in the present embodiment can be clamping or one
Injection molding etc., referring specifically to the associated description of previous embodiment, is also no longer described in detail herein.
The leading note part structure that embodiment provides is located at the leading note channel of leading note internal stent by being arranged, sound can be made complete
It is propagated in leading note bracket entirely, and then can preferably guarantee the quality of sound transmission.
Figure 14 is please referred to, Figure 14 is the structure section view signal of another embodiment of sound conduction component of the application microphone
Figure, which includes but is not limited to leading note part 100 and microphone 200.Wherein, the structure of the leading note part 100 can be
Any one in above-described embodiment only illustrates a kind of structure of leading note part 100 in the diagram of the present embodiment.
Unlike Fig. 9 embodiment, leading note channel 118 is located at the inside of leading note bracket 110 in the embodiment, therefore not
It needs that sealed bolster plate structure is arranged again.Optionally, in the present embodiment, the side of microphone 200 can be fixed on circuit board 400
On, sound inlet 210 is arranged in the other side of microphone 200, i.e., the microphone 200 in the present embodiment is set to circuit board 400 and leading note
Between bracket 110.
The sound inlet 210 of microphone 200 corresponds to the sound outlet hole 116 of leading note part, and then can receive microphone 200 from leading
The sound inlet 115 of sound part (specially leading note bracket 110) enters, and the sound transmitted by leading note channel 118.
In addition, locating slot (not indicating in figure), locating slot are additionally provided in the present embodiment in the first plane of leading note bracket
Shape and the appearance profile of microphone 200 be adapted, and be connected to the sound outlet hole of leading note bracket 110 116, so that microphone
200 can be at least partially arranged in locating slot, and make the sound inlet 210 of microphone 200 corresponding to the sound outlet hole of leading note bracket 110
116。
In the present embodiment, sound is in the transmission path of conducting subassembly：Enter from the sound inlet 115 on leading note bracket 110,
Then through the leading note channel 118 inside leading note bracket 110, then from the outflow of sound outlet hole 116 on leading note bracket 110, later directly
The sound inlet 210 of incoming microphone 200.
Microphone voice conducting subassembly provided in this embodiment, leading note part is by hard plastic leading note bracket and soft rubber
The structure type that buffer body two parts integrated injection molding combines, on the one hand can guarantee leading note part can with the sealing of terminal device and
Buffering connection (soft buffer body), on the other hand can also improve the integral strength (hard leading note bracket) of leading note part, raising sound
The quality of sound conduction；In addition, being located at the leading note channel of leading note internal stent by setting, the entirety of conducting subassembly both can simplify
Structure can also be such that sound propagates in leading note bracket completely, and then can preferably guarantee the quality of sound transmission.
Further, Figure 15 is please referred to, Figure 15 is the partial structurtes schematic cross-sectional view of one embodiment of the application terminal device,
Terminal device in the application may include the electricity that mobile phone, tablet computer, laptop, wearable device etc. have microphone
Sub- equipment.
The terminal device may include described in any one of front housing 700, rear shell 800, circuit board 400 and above-described embodiment
Microphone voice conducting subassembly.The present embodiment diagram is schematically illustrated by taking conducting subassembly in Fig. 9 as an example.
In this terminal device embodiment, the bottom surface of sealed bolster plate 300 abuts front housing 700, the top surface of sealed bolster plate 300 with lead
The leading note slot 117 of sound bracket 110 cooperatively forms leading note channel；Rear shell 800 is abutted from side with the end face 112 of leading note bracket 110.
Rear shell 800 is equipped with into sound channel 810, and the sound inlet 115 of leading note bracket 110 corresponds into sound channel 810.The buffering of leading note part
Body 120 is located between rear shell 800 and the end face 112 of leading note bracket 110, to close between leading note bracket 110 and rear shell 800
Envelope and buffering connection.Figure label 900 can be display screen.
About the detail technical features of front housing 700 and rear shell 800, and will not be described here in detail, and the specific structure of conducting subassembly
Feature then please refers to the associated description of above-described embodiment.
In addition, please referring to Figure 16, Figure 16 is the partial structurtes schematic cross-sectional view of another embodiment of the application terminal device, should
In embodiment, the bottom surface 113 of leading note bracket 110 abuts front housing 700, and rear shell 800 is abutted with the end face 112 of leading note bracket 110, after
It is again provided on shell 800 into sound channel 810, the sound inlet 115 of leading note bracket 110 corresponds into sound channel 810, and leading note part delays
It rushes body 120 to be located between rear shell 800 and leading note bracket 110, to the sealing between leading note bracket 110 and rear shell 800 and delay
Punching connection.The thing different from a upper embodiment, is no longer arranged sealed bolster plate in the embodiment, but the bottom surface of leading note bracket 110
113 directly abut front housing 700.
And for the structure type of conducting subassembly and front housing, rear shell cooperation in Figure 14, it is corresponding with above-described embodiment similar
It is identical, it is no longer described in detail one by one herein.
Terminal device provided by the embodiments of the present application, leading note part is by hard plastic leading note bracket and soft rubber buffer body
Two parts integrated injection molding combine structure type, on the one hand can guarantee leading note part can between rear shell sealing and buffering connect
(soft buffer body) is connect, the integral strength (hard leading note bracket) of leading note part on the other hand can also be improved, improves sound conduction
Quality.
The foregoing is merely section Examples of the invention, are not intended to limit protection scope of the present invention, all utilizations
Equivalent device made by description of the invention and accompanying drawing content or equivalent process transformation are applied directly or indirectly in other correlations
Technical field, be included within the scope of the present invention.
Claims (10)
1. a kind of leading note part of microphone, which is characterized in that the leading note part include the different leading note bracket of material hardness and
Buffer body, the hardness of the leading note bracket material are greater than the hardness of the buffer body material；Wherein, the side of the leading note bracket
End face is equipped with sound inlet, and top surface is equipped with sound outlet hole, and bottom surface is oppositely arranged with the top surface, and the bottom surface is equipped with leading note slot, institute
It states sound inlet and is connected to the sound outlet hole by the leading note slot；The buffer body includes buffer main portion and at least one engaging
Portion, the buffer main portion structure annular in shape, an at least holding section and the buffer main portion integral structure, and to described
It is extended on the outside of the cyclic structure of buffer main portion, the end face is equipped with the accommodation groove for being surrounded on sound inlet on the end face
And the engaging slot being correspondingly arranged with the holding section, the buffer main portion are embedded in the accommodation groove, the holding section
Snap fit corresponding with the engaging slot realizes being connected together for the leading note bracket and the buffer body.
2. leading note part according to claim 1, which is characterized in that the buffer body includes at least two holding sections, described
At least two holding sections are uniformly distributed in the ring week of the buffer main portion.
3. leading note part according to claim 1, which is characterized in that the top surface of the leading note bracket further comprises first flat
Face, the second plane and the joint face between first plane and the second plane, second plane and the bottom surface
The distance between be greater than the distance between first plane and the bottom surface, the top margin of the leading note bracket end face and bottom edge are divided
It is not connect with second plane and the bottom surface, the sound outlet hole is set in first plane.
4. leading note part according to claim 3, which is characterized in that the angle between the end face and bottom surface of the leading note bracket
For acute angle.
5. leading note part according to claim 3, which is characterized in that it is additionally provided with location structure in first plane, it is described
Location structure is for positioning microphone.
6. leading note part according to claim 5, which is characterized in that the location structure is multiple positioning columns, the positioning
Column is realized by the outside of clamping microphone casing body to the positioning of the microphone or by utilizing between microphone casing body
The positioning to the microphone is realized in screw connection.
7. a kind of sound conduction component of microphone, which is characterized in that the conducting subassembly include microphone, sealed bolster plate and
Leading note part described in any one of claims 1-6；The sealed bolster plate is covered on the bottom surface of the leading note part, with the leading note
Slot forms leading note channel, and the side of the microphone is connect with circuit board, and sound inlet, the wheat is arranged in the other side on the other side
The sound inlet of gram wind corresponds to the sound outlet hole of the leading note part, and then can receive the microphone from the leading note part into sound
Hole enters, and passes through the sound of the leading note channel transfer.
8. a kind of sound conduction component of microphone, which is characterized in that the conducting subassembly include microphone, sealed bolster plate and
The described in any item leading note parts of claim 1-4；The sealed bolster plate is covered on the bottom surface of the leading note part, with the leading note
Slot forms leading note channel, and the microphone is fixed on circuit board, and the circuit board is in the correspondence leading note part sound outlet hole position
Equipped with through-hole, the microphone is located at the two sides of the circuit board with the leading note part, and the sound inlet of the microphone is corresponding
In the through-hole of the circuit board, and then it can receive the microphone and enter from the sound inlet of the leading note part, and by described
The sound of leading note channel and through-hole transmission.
9. conducting subassembly according to claim 8, which is characterized in that be folded between the circuit board and the leading note part
Gasket.
10. a kind of terminal device, which is characterized in that the terminal device includes front housing, rear shell, circuit board and claim 7-
The sound conduction component of 9 described in any item microphones；The sealed bolster plate abuts the front housing, the rear shell and the leading note
The end face of bracket abuts, and the rear shell is equipped with into sound channel, the sound inlet of the leading note bracket correspond to it is described into sound channel,
The buffer body of the leading note part is located between the rear shell and the leading note bracket, to the leading note bracket and the rear shell
Between sealing and buffering connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710673216.8A CN107396219B (en) | 2017-08-08 | 2017-08-08 | The sound conduction component of terminal device and its microphone, leading note part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710673216.8A CN107396219B (en) | 2017-08-08 | 2017-08-08 | The sound conduction component of terminal device and its microphone, leading note part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107396219A CN107396219A (en) | 2017-11-24 |
| CN107396219B true CN107396219B (en) | 2018-11-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710673216.8A Active CN107396219B (en) | 2017-08-08 | 2017-08-08 | The sound conduction component of terminal device and its microphone, leading note part |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108616785B (en) * | 2018-06-15 | 2019-12-06 | Oppo广东移动通信有限公司 | shell and electronic equipment |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200976624Y (en) * | 2006-10-20 | 2007-11-14 | 比亚迪精密制造有限公司 | Mobile telephone microphone tone cavity device and mobile phone having the same |
| CN201869330U (en) * | 2010-11-11 | 2011-06-15 | 三星电子株式会社 | Portable terminal and fixation structure of microphone rubber sleeve of portable terminal |
| CN205123958U (en) * | 2015-11-02 | 2016-03-30 | 维沃移动通信有限公司 | Microphone sound cavity configuration and earphone |
| CN205987258U (en) * | 2016-09-07 | 2017-02-22 | 上海展扬通信技术有限公司 | Microphone seal structure and terminal equipment |
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| Publication number | Publication date |
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| CN107396219A (en) | 2017-11-24 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: Guangdong Opel Mobile Communications Co., Ltd. |