CN107383764A - A kind of compound low Heat Conduction Material and preparation method thereof - Google Patents

A kind of compound low Heat Conduction Material and preparation method thereof Download PDF

Info

Publication number
CN107383764A
CN107383764A CN201710655035.2A CN201710655035A CN107383764A CN 107383764 A CN107383764 A CN 107383764A CN 201710655035 A CN201710655035 A CN 201710655035A CN 107383764 A CN107383764 A CN 107383764A
Authority
CN
China
Prior art keywords
added
heat conduction
layer material
low heat
minutes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710655035.2A
Other languages
Chinese (zh)
Inventor
韩建
梁国正
王志龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiaxing Li Xin New Material Co Ltd
Original Assignee
Jiaxing Li Xin New Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiaxing Li Xin New Material Co Ltd filed Critical Jiaxing Li Xin New Material Co Ltd
Priority to CN201710655035.2A priority Critical patent/CN107383764A/en
Publication of CN107383764A publication Critical patent/CN107383764A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/286—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02—Polythioethers; Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2607/00—Walls, panels
    • B32B2607/02—Wall papers, wall coverings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/05—Polymer mixtures characterised by other features containing polymer components which can react with one another
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/08—Polymer mixtures characterised by other features containing additives to improve the compatibility between two polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking

Abstract

The invention provides a kind of compound low Heat Conduction Material and preparation method thereof, cladding material, middle layer material and inner layer material are combined successively to obtain the compound low Heat Conduction Material presoma system, hot pressing obtains compound low Heat Conduction Material；Pass through resin matrix and the selection compatibility of small-molecule substance, with reference to rational preparation technology, the heat-insulation composite material for being molded preparation after preforming again possesses excellent heat resistance, fire resistance, there is good processing characteristics simultaneously, cladding material is provided with graphene, with N, N dimethyl lauryl amine and strontium titanates can improve the corrosion resistance of material together.

Description

A kind of compound low Heat Conduction Material and preparation method thereof
Technical field
The invention belongs to compound low Heat Conduction Material technical field, and in particular to a kind of compound low Heat Conduction Material and its preparation side Method.
Background technology
Compound low Heat Conduction Material has in fields such as metallurgy, non-ferrous metal, machinery, petrochemical industry, electric power to be extremely widely applied. Compound low Heat Conduction Material has the characteristics such as density is small, pliability is high, waterproof, collectable waste heat, random good, no cavity, Negative blast tear can be avoided and come off.Compound low Heat Conduction Material is generally divided into two kinds of inorganic and organic.Organic material advantage It is raw material abundance, low, the easy for construction, technical maturity of product thermal conductivity factor etc., its major defect is that the resistance to heat problem of material is difficult to solve Certainly；And inorganic non-ignitable compound low Heat Conduction Material, because thermal conductivity factor is higher, or low intensity, it can not meet that design uses mostly It is required that.And existing compound low Heat Conduction Material decay resistance deficiency, its application in special is limited, limitation is special in turn The development of kind industry.
The content of the invention
The invention provides a kind of compound low Heat Conduction Material and preparation method thereof, with epoxy combination cyanate, pass through resin The selection compatibility of matrix and small-molecule substance, with reference to rational preparation technology, the heat-insulated composite wood of preparation is molded after preforming again Material possesses excellent heat resistance, fire resistance, while has good processing characteristics.
To achieve the above object of the invention, the present invention adopts the following technical scheme that：
A kind of preparation method of compound low Heat Conduction Material, comprises the following steps：
(1) add graphene oxide into N, in N- dimethyl lauryl amines, 100 DEG C of stirrings added after 1 hour diphenyl phosphine oxide with Strontium titanates, stir 0.5 hour, then add six ammonium chloroiridates, stir 10 minutes, natural cooling, obtain graphene composition metal System；Polyester resin, graphene composition metal system, naphthol novolac resin, maleic anhydride, nanoporous nickel oxide are done Mill is uniformly rear to be added in extruder, and particle is obtained in 195 DEG C of extrusions；Then cladding material is prepared using film-making machine；
(2) by fullerene derivate add cyanate in, 110 DEG C reaction 20 minutes after add diethylbenzene phosphate and four Ethoxysilane, reaction add triglycidyl group cyamelide ester monomer after 30 minutes, add after being stirred 2 hours in 120 DEG C Enter isotridecyl acrylate, uramit, continue stirring 20 minutes, pour into mould natural cooling and obtain middle layer material；
(3) by polystyrene, polyphenylene sulfide, hollow alumina dry grinding mixing after with bicyclopentadiene, organosilicon phenolic aldehyde tree Fat and polyvinyl alcohol are added in extruder, and particle is obtained in 185 DEG C of extrusions；Then internal layer material is prepared using film-making machine Material；
(4) cladding material, middle layer material, inner layer material are sequentially placed into mould, hot pressing obtains compound low Heat Conduction Material.
In above-mentioned technical proposal, graphene oxide, N, N- dimethyl lauryl amine, diphenyl phosphine oxide, strontium titanates, six chloro-iridic acids Ammonium, polyester resin, naphthol novolac resin, maleic anhydride, the mass ratio of nanoporous nickel oxide are 5: 18: 20: 5: 3: 60: 100∶20∶4；Fullerene derivate, cyanate, diethylbenzene phosphate, tetraethoxysilane, triglycidyl group trimerization isocyanide Acid ester monomer, isotridecyl acrylate, the mass ratio of uramit are 0.8: 100: 8: 10: 60: 15: 25；Polystyrene, Polyphenylene sulfide, hollow alumina, bicyclopentadiene, organosilicon phenolic resin, the mass ratio of polyvinyl alcohol are 70: 100: 10: 3: 30∶45。
In above-mentioned technical proposal, the cladding material, middle layer material, the thickness ratio of inner layer material are 30: 100: 15；Step (2) in, the mould by 115 DEG C of preheatings is poured at 105 DEG C；The condition of the hot pressing be 0MPa/140 DEG C/10 minutes+ + 1.5MPa/180 DEG C/15 minutes 0.5MPa/160 DEG C/20 minutes；Pressurize Temperature fall after the completion of hot pressing.
The invention also discloses a kind of preparation method of compound low Heat Conduction Material cladding material, comprise the following steps, will Graphene oxide adds N, and in N- dimethyl lauryl amines, 100 DEG C of stirrings add diphenyl phosphine oxide and strontium titanates, stirring 0.5 after 1 hour Hour, six ammonium chloroiridates are then added, stirs 10 minutes, natural cooling, obtains graphene composition metal system；By terylene tree Added after fat, graphene composition metal system, naphthol novolac resin, maleic anhydride, the dry grinding uniformly of nanoporous nickel oxide In extruder, particle is obtained in 195 DEG C of extrusions；Then compound low Heat Conduction Material cladding material is prepared using film-making machine.
The preparation method of layer material, comprises the following steps in being used the invention also discloses a kind of compound low Heat Conduction Material, will Fullerene derivate is added in cyanate, and 110 DEG C of reactions add diethylbenzene phosphate and tetraethoxysilane after 20 minutes, instead Triglycidyl group cyamelide ester monomer is added after answering 30 minutes, isotridecyl third is added after being stirred 2 hours in 120 DEG C Olefin(e) acid ester, uramit, continue stirring 20 minutes, pour into mould natural cooling and obtain layer material during compound low Heat Conduction Material is used.
The invention also discloses a kind of preparation method of compound low Heat Conduction Material inner layer material, comprise the following steps, will Polystyrene, polyphenylene sulfide, hollow alumina dry grinding mixing after with bicyclopentadiene, organosilicon phenolic resin and polyvinyl alcohol Add in extruder, particle is obtained in 185 DEG C of extrusions；Then compound low Heat Conduction Material internal layer material is prepared using film-making machine Material.
The invention also discloses a kind of preparation method of compound low Heat Conduction Material presoma system, by cladding material, middle level Material and inner layer material combine to obtain the compound low Heat Conduction Material presoma system successively；The cladding material, middle level material The preparation method of material or inner layer material comprises the following steps：
(1) add graphene oxide into N, in N- dimethyl lauryl amines, 100 DEG C of stirrings added after 1 hour diphenyl phosphine oxide with Strontium titanates, stir 0.5 hour, then add six ammonium chloroiridates, stir 10 minutes, natural cooling, obtain graphene composition metal System；Polyester resin, graphene composition metal system, naphthol novolac resin, maleic anhydride, nanoporous nickel oxide are done Mill is uniformly rear to be added in extruder, and particle is obtained in 195 DEG C of extrusions；Then cladding material is prepared using film-making machine；
(2) by fullerene derivate add cyanate in, 110 DEG C reaction 20 minutes after add diethylbenzene phosphate and four Ethoxysilane, reaction add triglycidyl group cyamelide ester monomer after 30 minutes, add after being stirred 2 hours in 120 DEG C Enter isotridecyl acrylate, uramit, continue stirring 20 minutes, pour into mould natural cooling and obtain middle layer material；
(3) by polystyrene, polyphenylene sulfide, hollow alumina dry grinding mixing after with bicyclopentadiene, organosilicon phenolic aldehyde tree Fat and polyvinyl alcohol are added in extruder, and particle is obtained in 185 DEG C of extrusions；Then internal layer material is prepared using film-making machine Material.
The invention also discloses a kind of compound low Heat Conduction Material, and the preparation method of the compound low Heat Conduction Material is including following Step：
(1) add graphene oxide into N, in N- dimethyl lauryl amines, 100 DEG C of stirrings added after 1 hour diphenyl phosphine oxide with Strontium titanates, stir 0.5 hour, then add six ammonium chloroiridates, stir 10 minutes, natural cooling, obtain graphene composition metal System；Polyester resin, graphene composition metal system, naphthol novolac resin, maleic anhydride, nanoporous nickel oxide are done Mill is uniformly rear to be added in extruder, and particle is obtained in 195 DEG C of extrusions；Then cladding material is prepared using film-making machine；
(2) by fullerene derivate add cyanate in, 110 DEG C reaction 20 minutes after add diethylbenzene phosphate and four Ethoxysilane, reaction add triglycidyl group cyamelide ester monomer after 30 minutes, add after being stirred 2 hours in 120 DEG C Enter isotridecyl acrylate, uramit, continue stirring 20 minutes, pour into mould natural cooling and obtain middle layer material；
(3) by polystyrene, polyphenylene sulfide, hollow alumina dry grinding mixing after with bicyclopentadiene, organosilicon phenolic aldehyde tree Fat and polyvinyl alcohol are added in extruder, and particle is obtained in 185 DEG C of extrusions；Then internal layer material is prepared using film-making machine Material；
(4) cladding material, middle layer material, inner layer material are sequentially placed into mould, hot pressing obtains compound low Heat Conduction Material.
In being used the invention also discloses a kind of compound low Heat Conduction Material cladding material, compound low Heat Conduction Material layer material or The compound low Heat Conduction Material inner layer material of person, the compound low Heat Conduction Material is with cladding material, compound low Heat Conduction Material middle level The preparation method of material or compound low Heat Conduction Material inner layer material comprises the following steps：
(1) add graphene oxide into N, in N- dimethyl lauryl amines, 100 DEG C of stirrings added after 1 hour diphenyl phosphine oxide with Strontium titanates, stir 0.5 hour, then add six ammonium chloroiridates, stir 10 minutes, natural cooling, obtain graphene composition metal System；Polyester resin, graphene composition metal system, naphthol novolac resin, maleic anhydride, nanoporous nickel oxide are done Mill is uniformly rear to be added in extruder, and particle is obtained in 195 DEG C of extrusions；Then compound low Heat Conduction Material is prepared using film-making machine Use cladding material；
(2) by fullerene derivate add cyanate in, 110 DEG C reaction 20 minutes after add diethylbenzene phosphate and four Ethoxysilane, reaction add triglycidyl group cyamelide ester monomer after 30 minutes, add after being stirred 2 hours in 120 DEG C Enter isotridecyl acrylate, uramit, continue stirring 20 minutes, pour into mould natural cooling and obtain compound low heat conduction material Layer material during material is used；
(3) by polystyrene, polyphenylene sulfide, hollow alumina dry grinding mixing after with bicyclopentadiene, organosilicon phenolic aldehyde tree Fat and polyvinyl alcohol are added in extruder, and particle is obtained in 185 DEG C of extrusions；Then compound low lead is prepared using film-making machine Hot material inner layer material.
The invention also discloses cladding material, middle layer material or inner layer material answering in compound low Heat Conduction Material is prepared With the preparation method of the cladding material, middle layer material or inner layer material comprises the following steps：
(1) add graphene oxide into N, in N- dimethyl lauryl amines, 100 DEG C of stirrings added after 1 hour diphenyl phosphine oxide with Strontium titanates, stir 0.5 hour, then add six ammonium chloroiridates, stir 10 minutes, natural cooling, obtain graphene composition metal System；Polyester resin, graphene composition metal system, naphthol novolac resin, maleic anhydride, nanoporous nickel oxide are done Mill is uniformly rear to be added in extruder, and particle is obtained in 195 DEG C of extrusions；Then cladding material is prepared using film-making machine；
(2) by fullerene derivate add cyanate in, 110 DEG C reaction 20 minutes after add diethylbenzene phosphate and four Ethoxysilane, reaction add triglycidyl group cyamelide ester monomer after 30 minutes, add after being stirred 2 hours in 120 DEG C Enter isotridecyl acrylate, uramit, continue stirring 20 minutes, pour into mould natural cooling and obtain middle layer material；
(3) by polystyrene, polyphenylene sulfide, hollow alumina dry grinding mixing after with bicyclopentadiene, organosilicon phenolic aldehyde tree Fat and polyvinyl alcohol are added in extruder, and particle is obtained in 185 DEG C of extrusions；Then internal layer material is prepared using film-making machine Material.
Cladding material disclosed by the invention, middle layer material, inner layer material are prepared in the application of compound low Heat Conduction Material；According to Actual installation position restriction outer layer, middle level, internal layer, it is bonded being corrosive the one side of material for inner layer material or contact for wall For cladding material, middle layer material is between cladding material and inner layer material.
In the present invention, cladding material need to have excellent corrosion resistance and it is good process, be heat-resisting, fire resistance, Also need to form stable reactive interfaces transition region with middle layer material simultaneously；The present invention is with polyester resin and naphthol novolac tree Fat is matrix, and rigid structure can ensure heat resistance, and simultaneously added with machine small molecule, one side increases the compatibility of each component, On the other hand the processing characteristics of material is improved, avoids local defect, especially nanometer porous nickel oxide can slightly improve acidproof Alkali ability, and can provide low heat-conducting effect.
Middle layer material needs to have excellent heat resistance, thermal insulation, and good processing, fire resistance, passes through cyanic acid Ester polymerize with epoxy, it is ensured that the hot property of material settling out, especially fullerene derivate PCBM possess reactive ester group Functional group, good reactivity can be both formed with cyanate under limited amount, cause that fullerene is dispersed again, to fire-retardant Favorably；The processing characteristics of cyanic acid ester epoxy resin mixed system is improved by the addition of small molecule, and small molecule can join With cross-linked network, while can also react mutually, for example, diethylbenzene phosphate and tetraethoxysilane can with it is compound enter height Molecular backbone, reach excellent flame retardant effect so as to coordinate beneficial to phosphorus silicon, isotridecyl acrylate can improve polyureas first The dispersion level of aldehyde is uniform beneficial to micro-nano hole is resolved into；Small molecule both can avoid macromolecule local reaction not as diluent , high molecular reaction can be participated in again, such as connection cyanate and epoxy resin, while so as to realize excellent machinability Do not reduce heat resistance.
Inner layer material needs to have excellent elastic and good heat resistance, anti-flammability, while needs and middle layer material Form stable interfacial reaction area；By the addition of organosilicon phenolic resin, the polystyrene of tenacity excellent can be improved with gathering The heat resistance of diphenyl sulfide copolymer, and organosilicon is additionally favorable for the holding of elasticity, and polyvinyl alcohol can improve the phase of several components Hold reactivity, hollow alumina can increase overall heat-insulating capability and raising prepares the effect of through hole, prevent localized crackses, lead to Cross the peptizaiton of bicyclopentadiene and polyvinyl alcohol so that alumina dispersion is uniform.
In the present invention, the cladding material, middle layer material, the thickness ratio and preparation technology of inner layer material, especially in Layer material technique, beneficial to shaping, avoid producing flow field problem.Trilaminate material interacts, and forms stable compound entirety, can To apply in high fever corrosion field.The present invention, which limits hot pressing condition, can cause three kinds of materials progressively to melt, and start in mould certainly Under band pressure, formed and melt interpenetrating for interface, avoid gummosis or trilaminate material excessively to merge again；Subsequently progressively it is crosslinked again Solidification, the solidification level of system was both improved, turn avoid the gummosis of thermoplastic, under small molecule series connection, and catalysis Under agent regulation and control, high polymer step-reaction, the 3-layer composite material of entirety, excellent effect have been finally given.
The present invention is by process choice, and during the course of the reaction, the probability to be contacted with each other between raw material is higher, in mixed process Overreact is avoided to cause hot pressure reaction uneven, faster, cross-linked network production rate is higher for reaction speed during hot pressing；Stirred by regulation Mix, hot pressure reaction temperature and time, extent of reaction when control mixes, method is ingenious in design and reasonable；By adding additive bag Inorganic material, metallic compound etc. are included, adds the compression strength of the compound low Heat Conduction Material of resin matrix, corrosion-resistant intensity, is dropped Low thermal conductivity factor, effect of heat insulation is more preferably.
The low Heat Conduction Material of existing organic composite does not possess antiseptic property or antiseptic property is poor, and this is compound low by preparing What the raw material of Heat Conduction Material determined, cause to be restricted when applying as corrosive substance, service life is short, maintenance cost It is high；The present invention heat-insulation composite material molecule cross-link is compact-sized, compactness is good, while cladding material is provided with graphene, and N, N- dimethyl lauryl amine and strontium titanates can improve the corrosion resistance of material together；Especially the present invention adds a small amount of iridium Compound, one side organo-iridium compounds can form interfacial reaction effect with organic component, improve the compatibility of integral material, separately On the one hand the cross-linked structure of organic matter can be improved, the activity that the third aspect can increase graphene is good corrosion-resistant so as to realize Performance, more important is, the present invention limits the ratio of several additives, avoid to heat-proof quality slacken and hot pressing is anti- The interference answered.
General compound low Heat Conduction Material is all disposed within surface of wall, existing compound low Heat Conduction Material mostly by bonded adhesives with Effect of heat insulation is realized in wall combination, if necessary to corrosion-resistant, then in outer layer brushing corrosion-resistant finishes；Prior art is clearly present more Kind defect, for example construct cumbersome, it is necessary to which multistep process, the impact of performance is poor, although being combined by being bonded, between several layer materials Or Presence of an interface inhomogeneity, especially anti-corrosion layer fall off on compound low Heat Conduction Material surface, aging, gluing or When brushing, solvent contamination can be produced at the scene；In addition, modular architectural is shown up prominently in terms of building, it is by assembling The manufacture of monolithic architecture can be achieved, but this has a problem that, i.e., if still by gluing mode combination wall and again Low Heat Conduction Material is closed, then is unfavorable for modular assembling, because gluing intensity and technique mismatch with modularization, if adopted The mechanical bond matched with modularization, then compound low Heat Conduction Material and wall there may be microgap, small area is perhaps had nothing to do, but It is for whole building building, effect of heat insulation can be influenceed.The method comprises the steps of firstly, preparing the compound low Heat Conduction Material of one, it is divided into three Individual functional layer, adjacent functional bed boundary are interpenetrated, and form stable overall transition zone, and trilaminate material is integrally standardized, and has There is excellent processability, mounting hole and filler plug can be set, it is possible to achieve the technique effect of mechanical erection, and in internal layer bullet Property heat proof material effect under, during mechanical package, can make it that compound low Heat Conduction Material and wall are seamless applying, realize height first Heat-resisting, the compound low Heat Conduction Material of the integrated anti-corrosion of flame retardant type mechanical seamless integration.
Embodiment
A kind of preparation method of compound low Heat Conduction Material of embodiment one, comprises the following steps：
(1) add graphene oxide into N, in N- dimethyl lauryl amines, 100 DEG C of stirrings added after 1 hour diphenyl phosphine oxide with Strontium titanates, stir 0.5 hour, then add six ammonium chloroiridates, stir 10 minutes, natural cooling, obtain graphene composition metal System；Polyester resin, graphene composition metal system, naphthol novolac resin, maleic anhydride, nanoporous nickel oxide are done Mill is uniformly rear to be added in extruder, and particle is obtained in 195 DEG C of extrusions；Then cladding material is prepared using film-making machine；
(2) by fullerene derivate PCBM add cyanate in, 110 DEG C reaction 20 minutes after add diethylbenzene phosphate With tetraethoxysilane, reaction adds triglycidyl group cyamelide ester monomer after 30 minutes, stirred 2 hours in 120 DEG C Isotridecyl acrylate, uramit are added afterwards, continues stirring 20 minutes, pour into what is preheated by 115 DEG C at 105 DEG C Mould, natural cooling obtain middle layer material；
(3) by polystyrene, polyphenylene sulfide, hollow alumina dry grinding mixing after with bicyclopentadiene, organosilicon phenolic aldehyde tree Fat and polyvinyl alcohol are added in extruder, and particle is obtained in 185 DEG C of extrusions；Then internal layer material is prepared using film-making machine Material；
(4) layer material, 1.5mm inner layer materials in 3mm cladding materials, 10mm are sequentially placed into mould, hot pressing is answered Close low Heat Conduction Material, the condition of hot pressing for+0.5MPa/160 DEG C/20 minutes 0MPa/140 DEG C/10 minutes+1.5MPa/180 DEG C/ 15 minutes；Pressurize Temperature fall after the completion of hot pressing.
In the present embodiment, graphene oxide, N, N- dimethyl lauryl amine, diphenyl phosphine oxide, strontium titanates, six ammonium chloroiridates, wash Synthetic fibre resin, naphthol novolac resin, maleic anhydride, the mass ratio of nanoporous nickel oxide are 5: 18: 20: 5: 3: 60: 100: 20∶4；Fullerene derivate, cyanate, diethylbenzene phosphate, tetraethoxysilane, triglycidyl group isocyanuric acid ester Monomer, isotridecyl acrylate, the mass ratio of uramit are 0.8: 100: 8: 10: 60: 15: 25；Polystyrene, polyphenyl Thioether, hollow alumina, bicyclopentadiene, organosilicon phenolic resin, the mass ratio of polyvinyl alcohol are 70: 100: 10: 3: 30: 45。
Comparative example one
Consistent with embodiment one, wherein difference is, strontium titanates and six ammonium chloroiridates are free of in step (1).
Comparative example two
Consistent with embodiment one, wherein difference is, step is added without uramit in (2).
Comparative example three
Consistent with embodiment one, wherein difference is, step is added without fullerene derivate in (2).
Comparative example four
Consistent with embodiment one, wherein difference is, step is added without bicyclopentadiene, polyvinyl alcohol in (3).
The composite property of table 1 characterizes
Tg Td Bending strength Thermal conductivity factor Oxygen index (OI) Hole number
Embodiment one 233℃ 428℃ 173MPa 0.019w/(mK) 38 ＞ 3500
Comparative example one 218℃ 419℃ 162MPa 0.028w/(mK) 37 ＞ 3500
Comparative example two 228℃ 426℃ 168MPa 0.082w/(mK) 35 3450
Comparative example three 208℃ 405℃ 153MPa 0.025w/(mK) 34 3350
Comparative example four 226℃ 421℃ 163MPa 0.060w/(mK) 34 3450
Table 1 is the correlated performance of composite prepared by embodiment and comparative example, it can be clearly seen that, production of the invention Product possess excellent combination property, especially anti-flammability；Simultaneously with 3mol/L sodium hydroxide solutions, 3mol/L sodium chloride solutions and 3mol/L acetum carries out corrosion-resistant test respectively, and the time is 10 days, and embodiment product surface does not change, is kept Original state, has good anticorrosion effect, corrosion phenomenon occurs in the product surface of comparative example one, and color is slightly turned to be yellow, right The product surface of ratio two is unchanged, and the product surface of comparative example three is unchanged, and the product surface of comparative example four is unchanged.Therefore, this hair Bright product can be used for corrosion-resistant heat-insulated special occasions, and can be mass, and scene only assembles, laborsaving, be adapted to industrialization Prepare.

Claims (10)

1. a kind of preparation method of compound low Heat Conduction Material, it is characterised in that comprise the following steps：
(1) N is added graphene oxide into, in N- dimethyl lauryl amines, 100 DEG C of stirrings add diphenyl phosphine oxide and metatitanic acid after 1 hour Strontium, stir 0.5 hour, then add six ammonium chloroiridates, stir 10 minutes, natural cooling, obtain graphene composition metal system； Polyester resin, graphene composition metal system, naphthol novolac resin, maleic anhydride, the dry grinding of nanoporous nickel oxide is equal Added after even in extruder, particle is obtained in 195 DEG C of extrusions：Then cladding material is prepared using film-making machine；
(2) fullerene derivate is added in cyanate, 110 DEG C of reactions add diethylbenzene phosphate and four ethoxies after 20 minutes Base silane, reaction add triglycidyl group cyamelide ester monomer after 30 minutes, are added after being stirred 2 hours in 120 DEG C different Tridecyl acrylate, uramit, continue stirring 20 minutes, pour into mould natural cooling and obtain middle layer material；
(3) by polystyrene, polyphenylene sulfide, hollow alumina dry grinding mixing after with bicyclopentadiene, organosilicon phenolic resin with And polyvinyl alcohol is added in extruder, and particle is obtained in 185 DEG C of extrusions；Then inner layer material is prepared using film-making machine；
(4) cladding material, middle layer material, inner layer material are sequentially placed into mould, hot pressing obtains compound low Heat Conduction Material.
2. preparation method according to claim 1, it is characterised in that graphene oxide, N, N- dimethyl lauryl amine, hexichol Phosphine oxide, strontium titanates, six ammonium chloroiridates, polyester resin, naphthol novolac resin, maleic anhydride, the matter of nanoporous nickel oxide Amount is than being 5: 18: 20: 5: 3: 60: 100: 20: 4；Fullerene derivate, cyanate, diethylbenzene phosphate, tetraethoxy-silicane Alkane, triglycidyl group cyamelide ester monomer, isotridecyl acrylate, the mass ratio of uramit are 0.8: 100: 8∶10∶60∶15∶25；Polystyrene, polyphenylene sulfide, hollow alumina, bicyclopentadiene, organosilicon phenolic resin, polyvinyl alcohol Mass ratio be 70: 100: 10: 3: 30: 45.
3. preparation method according to claim 1, it is characterised in that the cladding material, middle layer material, inner layer material Thickness ratio is 30: 100: 15；In step (2), the mould by 115 DEG C of preheatings is poured at 105 DEG C；The condition of the hot pressing is + 1.5MPa/180 DEG C/15 minutes+0.5MPa/160 DEG C/20 minutes 0MPa/140 DEG C/10 minutes；Pressurize is natural after the completion of hot pressing Cooling.
4. a kind of preparation method of compound low Heat Conduction Material cladding material, it is characterised in that comprise the following steps, stone will be aoxidized Black alkene adds N, and in N- dimethyl lauryl amines, 100 DEG C of stirrings add diphenyl phosphine oxide and strontium titanates after 1 hour, stir 0.5 hour, Then six ammonium chloroiridates are added, stirs 10 minutes, natural cooling, obtains graphene composition metal system；By polyester resin, graphite Extruder is added after alkene composition metal system, naphthol novolac resin, maleic anhydride, the dry grinding uniformly of nanoporous nickel oxide In, obtain particle in 195 DEG C of extrusions；Then compound low Heat Conduction Material cladding material is prepared using film-making machine.
The preparation method of layer material during 5. a kind of compound low Heat Conduction Material is used, it is characterised in that comprise the following steps, by fullerene Derivative is added in cyanate, and 110 DEG C of reactions add diethylbenzene phosphate and tetraethoxysilane after 20 minutes, react 30 points Triglycidyl group cyamelide ester monomer is added after clock, isotridecyl acrylic acid is added after being stirred 2 hours in 120 DEG C Ester, uramit, continue stirring 20 minutes, pour into mould natural cooling and obtain layer material during compound low Heat Conduction Material is used.
6. a kind of preparation method of compound low Heat Conduction Material inner layer material, it is characterised in that comprise the following steps, by polyphenyl second Add and squeeze with bicyclopentadiene, organosilicon phenolic resin and polyvinyl alcohol after alkene, polyphenylene sulfide, hollow alumina dry grinding mixing Go out in machine, particle is obtained in 185 DEG C of extrusions；Then compound low Heat Conduction Material inner layer material is prepared using film-making machine.
A kind of 7. preparation method of compound low Heat Conduction Material presoma system, it is characterised in that by cladding material, middle layer material with And inner layer material combines to obtain the compound low Heat Conduction Material presoma system successively；The cladding material, middle layer material or The preparation method of inner layer material comprises the following steps：
(1) N is added graphene oxide into, in N- dimethyl lauryl amines, 100 DEG C of stirrings add diphenyl phosphine oxide and metatitanic acid after 1 hour Strontium, stir 0.5 hour, then add six ammonium chloroiridates, stir 10 minutes, natural cooling, obtain graphene composition metal system； Polyester resin, graphene composition metal system, naphthol novolac resin, maleic anhydride, the dry grinding of nanoporous nickel oxide is equal Added after even in extruder, particle is obtained in 195 DEG C of extrusions；Then cladding material is prepared using film-making machine；
(2) fullerene derivate is added in cyanate, 110 DEG C of reactions add diethylbenzene phosphate and four ethoxies after 20 minutes Base silane, reaction add triglycidyl group cyamelide ester monomer after 30 minutes, are added after being stirred 2 hours in 120 DEG C different Tridecyl acrylate, uramit, continue stirring 20 minutes, pour into mould natural cooling and obtain middle layer material；
(3) by polystyrene, polyphenylene sulfide, hollow alumina dry grinding mixing after with bicyclopentadiene, organosilicon phenolic resin with And polyvinyl alcohol is added in extruder, and particle is obtained in 185 DEG C of extrusions；Then inner layer material is prepared using film-making machine.
8. a kind of compound low Heat Conduction Material, it is characterised in that the preparation method of the compound low Heat Conduction Material comprises the following steps：
(1) N is added graphene oxide into, in N- dimethyl lauryl amines, 100 DEG C of stirrings add diphenyl phosphine oxide and metatitanic acid after 1 hour Strontium, stir 0.5 hour, then add six ammonium chloroiridates, stir 10 minutes, natural cooling, obtain graphene composition metal system； Polyester resin, graphene composition metal system, naphthol novolac resin, maleic anhydride, the dry grinding of nanoporous nickel oxide is equal Added after even in extruder, particle is obtained in 195 DEG C of extrusions；Then cladding material is prepared using film-making machine；
(2) fullerene derivate is added in cyanate, 110 DEG C of reactions add diethylbenzene phosphate and four ethoxies after 20 minutes Base silane, reaction add triglycidyl group cyamelide ester monomer after 30 minutes, are added after being stirred 2 hours in 120 DEG C different Tridecyl acrylate, uramit, continue stirring 20 minutes, pour into mould natural cooling and obtain middle layer material；
(3) by polystyrene, polyphenylene sulfide, hollow alumina dry grinding mixing after with bicyclopentadiene, organosilicon phenolic resin with And polyvinyl alcohol is added in extruder, and particle is obtained in 185 DEG C of extrusions；Then inner layer material is prepared using film-making machine；
(4) cladding material, middle layer material, inner layer material are sequentially placed into mould, hot pressing obtains compound low Heat Conduction Material.
Layer material or compound low Heat Conduction Material during 9. a kind of compound low Heat Conduction Material cladding material, compound low Heat Conduction Material are used With inner layer material, it is characterised in that during the compound low Heat Conduction Material cladding material, compound low Heat Conduction Material are used layer material or The preparation method of the compound low Heat Conduction Material inner layer material of person comprises the following steps：
(1) N is added graphene oxide into, in N- dimethyl lauryl amines, 100 DEG C of stirrings add diphenyl phosphine oxide and metatitanic acid after 1 hour Strontium, stir 0.5 hour, then add six ammonium chloroiridates, stir 10 minutes, natural cooling, obtain graphene composition metal system； Polyester resin, graphene composition metal system, naphthol novolac resin, maleic anhydride, the dry grinding of nanoporous nickel oxide is equal Added after even in extruder, particle is obtained in 195 DEG C of extrusions；Then it is outer compound low Heat Conduction Material use to be prepared using film-making machine Layer material；
(2) fullerene derivate is added in cyanate, 110 DEG C of reactions add diethylbenzene phosphate and four ethoxies after 20 minutes Base silane, reaction add triglycidyl group cyamelide ester monomer after 30 minutes, are added after being stirred 2 hours in 120 DEG C different Tridecyl acrylate, uramit, continue stirring 20 minutes, pour into mould natural cooling and obtain compound low Heat Conduction Material use Middle layer material；
(3) by polystyrene, polyphenylene sulfide, hollow alumina dry grinding mixing after with bicyclopentadiene, organosilicon phenolic resin with And polyvinyl alcohol is added in extruder, and particle is obtained in 185 DEG C of extrusions；Then compound low heat conduction material is prepared using film-making machine Material inner layer material.
10. the application of cladding material, middle layer material or inner layer material in compound low Heat Conduction Material is prepared, it is characterised in that The preparation method of the cladding material, middle layer material or inner layer material comprises the following steps：
(1) N is added graphene oxide into, in N- dimethyl lauryl amines, 100 DEG C of stirrings add diphenyl phosphine oxide and metatitanic acid after 1 hour Strontium, stir 0.5 hour, then add six ammonium chloroiridates, stir 10 minutes, natural cooling, obtain graphene composition metal system； Polyester resin, graphene composition metal system, naphthol novolac resin, maleic anhydride, the dry grinding of nanoporous nickel oxide is equal Added after even in extruder, particle is obtained in 195 DEG C of extrusions；Then cladding material is prepared using film-making machine；
(2) fullerene derivate is added in cyanate, 110 DEG C of reactions add diethylbenzene phosphate and four ethoxies after 20 minutes Base silane, reaction add triglycidyl group cyamelide ester monomer after 30 minutes, are added after being stirred 2 hours in 120 DEG C different Tridecyl acrylate, uramit, continue stirring 20 minutes, pour into mould natural cooling and obtain middle layer material；
(3) by polystyrene, polyphenylene sulfide, hollow alumina dry grinding mixing after with bicyclopentadiene, organosilicon phenolic resin with And polyvinyl alcohol is added in extruder, and particle is obtained in 185 DEG C of extrusions；Then inner layer material is prepared using film-making machine.
CN201710655035.2A 2017-07-28 2017-07-28 A kind of compound low Heat Conduction Material and preparation method thereof Pending CN107383764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710655035.2A CN107383764A (en) 2017-07-28 2017-07-28 A kind of compound low Heat Conduction Material and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710655035.2A CN107383764A (en) 2017-07-28 2017-07-28 A kind of compound low Heat Conduction Material and preparation method thereof

Publications (1)

Publication Number Publication Date
CN107383764A true CN107383764A (en) 2017-11-24

Family

ID=60343249

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710655035.2A Pending CN107383764A (en) 2017-07-28 2017-07-28 A kind of compound low Heat Conduction Material and preparation method thereof

Country Status (1)

Country Link
CN (1) CN107383764A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108912695A (en) * 2018-05-17 2018-11-30 合肥羿振电力设备有限公司 A kind of novel high dielectric property electronic material and preparation method thereof
CN109385202A (en) * 2018-10-31 2019-02-26 江苏立新材料科技有限公司 A kind of preparation method of anti-friction bearing slurry
CN109385203A (en) * 2018-10-31 2019-02-26 江苏立新材料科技有限公司 A kind of flame-proof abrasion-resistant bearing material
CN109401592A (en) * 2018-10-31 2019-03-01 江苏立新材料科技有限公司 A kind of preparation method of abrasion-resistant bearing materials
CN109401606A (en) * 2018-10-31 2019-03-01 江苏立新材料科技有限公司 Flame-retardant slurry is preparing the application in flame-proof abrasion-resistant bearing material
CN109456679A (en) * 2018-10-31 2019-03-12 江苏立新材料科技有限公司 A kind of anti-friction bearing slurry
CN109467927A (en) * 2018-10-31 2019-03-15 江苏立新材料科技有限公司 A kind of flame-proof abrasion-resistant bearing slurry
CN109467926A (en) * 2018-10-31 2019-03-15 江苏立新材料科技有限公司 Wear-resisting slurry is preparing the application in abrasion-resistant bearing materials
CN109504148A (en) * 2018-10-31 2019-03-22 江苏立新材料科技有限公司 A kind of abrasion-resistant bearing materials
CN109504149A (en) * 2018-10-31 2019-03-22 江苏立新材料科技有限公司 A kind of preparation method of flame-proof abrasion-resistant bearing slurry
CN109536033A (en) * 2018-10-31 2019-03-29 江苏立新材料科技有限公司 A kind of preparation method of flame-proof abrasion-resistant bearing material
CN111468083A (en) * 2020-04-18 2020-07-31 中山市君泽科技有限公司 Graphene sewage purification material and preparation method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104629361A (en) * 2015-02-09 2015-05-20 中国工程物理研究院化工材料研究所 High-temperature-resistant foamed plastic composition and preparation method thereof
CN105172270A (en) * 2014-05-27 2015-12-23 广东生益科技股份有限公司 Thermosetting resin sandwich preimpregnation body and preparation method thereof, and copper-clad plate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105172270A (en) * 2014-05-27 2015-12-23 广东生益科技股份有限公司 Thermosetting resin sandwich preimpregnation body and preparation method thereof, and copper-clad plate
CN104629361A (en) * 2015-02-09 2015-05-20 中国工程物理研究院化工材料研究所 High-temperature-resistant foamed plastic composition and preparation method thereof

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
李晓林: "《橡塑并用》", 30 April 1998, 化学工业出版社 *
肖长发: "《化学纤维概论》", 30 June 2015, 中国纺织出版社 *

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108912695A (en) * 2018-05-17 2018-11-30 合肥羿振电力设备有限公司 A kind of novel high dielectric property electronic material and preparation method thereof
CN109385202A (en) * 2018-10-31 2019-02-26 江苏立新材料科技有限公司 A kind of preparation method of anti-friction bearing slurry
CN109385203A (en) * 2018-10-31 2019-02-26 江苏立新材料科技有限公司 A kind of flame-proof abrasion-resistant bearing material
CN109401592A (en) * 2018-10-31 2019-03-01 江苏立新材料科技有限公司 A kind of preparation method of abrasion-resistant bearing materials
CN109401606A (en) * 2018-10-31 2019-03-01 江苏立新材料科技有限公司 Flame-retardant slurry is preparing the application in flame-proof abrasion-resistant bearing material
CN109456679A (en) * 2018-10-31 2019-03-12 江苏立新材料科技有限公司 A kind of anti-friction bearing slurry
CN109467927A (en) * 2018-10-31 2019-03-15 江苏立新材料科技有限公司 A kind of flame-proof abrasion-resistant bearing slurry
CN109467926A (en) * 2018-10-31 2019-03-15 江苏立新材料科技有限公司 Wear-resisting slurry is preparing the application in abrasion-resistant bearing materials
CN109504148A (en) * 2018-10-31 2019-03-22 江苏立新材料科技有限公司 A kind of abrasion-resistant bearing materials
CN109504149A (en) * 2018-10-31 2019-03-22 江苏立新材料科技有限公司 A kind of preparation method of flame-proof abrasion-resistant bearing slurry
CN109536033A (en) * 2018-10-31 2019-03-29 江苏立新材料科技有限公司 A kind of preparation method of flame-proof abrasion-resistant bearing material
CN111468083A (en) * 2020-04-18 2020-07-31 中山市君泽科技有限公司 Graphene sewage purification material and preparation method thereof

Similar Documents

Publication Publication Date Title
CN107383764A (en) A kind of compound low Heat Conduction Material and preparation method thereof
CN107337897A (en) A kind of heat-barrier material and preparation method thereof
JP7045462B2 (en) Polyamide composite material with high strength and easy electroplating and its manufacturing method
CN102977670B (en) Cashew phenolic aldehyde amide epoxy hardener for four-season-general type anticorrosive paint and preparation method of cashew phenolic aldehyde amide epoxy hardener
CN101205129B (en) Dual-component bisphenol A epoxide-resin puddle for construction joint filling and preparation thereof
CN101717514A (en) Modified phenolic resin, foamed material thereof and method for preparing same
CN103571059A (en) Polypropylene composite material as well as preparation method and use thereof
CN105837797A (en) A water-based epoxy resin curing agent
CN104845403A (en) High-strength anti-wear high polymer material and preparation method thereof
CN104403345A (en) High-strength abrasion-proof high-molecular material and preparation method thereof
CN101880376A (en) Ageing-resistant epoxy resin curing agent
CN105647097A (en) Flame-retardant resin
CN112143070A (en) Pipe reinforcing master batch and preparation method thereof
CN107353646A (en) A kind of heat insulation composite and preparation method thereof
CN107498967A (en) A kind of easy processing heat-preserving complex material and preparation method thereof
CN105440388A (en) Heat-preservation heat-insulation rubber plate and preparation method thereof
CN101580613B (en) Master batch used for preparing high heat-resisting polypropylene plastic as well as preparation method and application thereof
CN108276768A (en) A kind of preparation method of light graphite alkene nylon composite materials
CN109233710B (en) Insulating material with high glass transition temperature and high-temperature cohesiveness and preparation method thereof
CN107446256B (en) Toughened polystyrene filling master batch and preparation method thereof
CN114621715A (en) High strength epoxy material
CN110776747A (en) Heat-insulating waterproof material and preparation method thereof
CN115819887B (en) Barrier flame-retardant polyolefin plastic packaging material and preparation method thereof
CN105925240A (en) Novel halogen-free flame-retardant silicone sealant
CN113024997A (en) Heat insulation material capable of being hot-pressed and formed and preparation process thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20171124

RJ01 Rejection of invention patent application after publication