CN107371351A - Video card backboard and its video card - Google Patents
Video card backboard and its video card Download PDFInfo
- Publication number
- CN107371351A CN107371351A CN201710703170.XA CN201710703170A CN107371351A CN 107371351 A CN107371351 A CN 107371351A CN 201710703170 A CN201710703170 A CN 201710703170A CN 107371351 A CN107371351 A CN 107371351A
- Authority
- CN
- China
- Prior art keywords
- video card
- backboard
- heat
- pcb board
- conducting substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of video card backboard, including：Backboard support and heat-conducting substrate; the heat-conducting substrate is arranged at the back side of video card by backboard support, and the backboard support is connected with the pcb board of the video card, a kind of the video card backboard and its video card; backboard support can provide protection for the pcb board of video card, prevent pcb board stress deformation；Ad-hoc location on the backboard support sets hollow-out parts to be used to avoid the component on pcb board；The heat-conducting substrate is arranged at the top of backboard support, plays a part of decorative appearance, additionally it is possible to further passes through the effects such as Heat Pipes radiating.
Description
Technical field
The present invention relates to backplane technology field, specially a kind of video card backboard and its video card.
Background technology
As scientific technological advance is advanced by leaps and bounds, various new technologies, new invention emerge in an endless stream, and are applied rapidly and serviced
In society, expanding economy is greatly facilitated, in a kind of current video card backboard, has been substantially one piece of metallic plate and has added rivet structure
Into, the component on pcb board for protecting video card, pcb board is supported, it is not deformed by external force, also auxiliary heat dissipation
Deng；But because the demand such as various outward appearances, radiating and intensity, need to be related to various hollow outs and bumps etc. on a kind of video card backboard and make
Type, this allows for a kind of video card backboard and is easily deformed, and influences the function of its support and protection video card pcb board.
The content of the invention
It is an object of the invention to provide a kind of video card backboard and its video card, is asked with solve to propose in above-mentioned background technology
Topic.
To achieve the above object, the present invention provides following technical scheme：
A kind of video card backboard, including：Backboard support and heat-conducting substrate, the heat-conducting substrate are arranged at aobvious by backboard support
The back side of card, the backboard support are connected with the pcb board of the video card.
Preferably, the heat-conducting substrate is arranged at the side of the backboard support away from the pcb board.
Preferably, it is provided with hollow out part on the backboard support.
Preferably, the hollow out part is respectively arranged at the chip near-end filtration module of the pcb board and chip distal end is filtered
The top of ripple module.
Preferably, the inside of the heat-conducting substrate is provided with storage tank, and the inside of the storage tank is provided with heat pipe, the heat pipe
For the roundabout coil-like structure of S-shaped.
Preferably, the backboard support is linked together with the pcb board by screw or snap features.
Preferably, one end of the backboard support is provided with bending component, the bending component respectively with the pcb board and
The bottom plate of video card is connected.
Preferably, the heat pipe is made of copper, and the heat-conducting substrate is made of aluminum.
The present invention also provides：A kind of video card, the video card include the video card back of the body as described in claim to any one
Plate.
Compared with prior art, the beneficial effects of the invention are as follows：A kind of video card backboard and its video card, backboard support can be
The pcb board of video card provides protection, prevents pcb board stress deformation；Ad-hoc location on the backboard support sets hollow-out parts to be used for
Avoid the component on pcb board；The heat-conducting substrate is arranged at the top of backboard support, plays a part of decorative appearance, moreover it is possible to
It is enough further to pass through the effects such as Heat Pipes radiating.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention.
In figure：1 backboard support, 2 heat-conducting substrates, 21 storage tanks, 22 heat pipes, 3 hollow out parts, 4 bending components, 5 video cards.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Referring to Fig. 1, the present invention provides a kind of technical scheme：
A kind of video card backboard, including：Backboard support 1 and heat-conducting substrate 2, the heat-conducting substrate 2 are set by backboard support 1
In the back side of video card 5, the backboard support 1 is connected with the pcb board of the video card 5.
Specifically, the heat-conducting substrate 2 is arranged at the side of the backboard support 1 away from the pcb board.
Specifically, it is provided with hollow out part 3 on the backboard support 1.
Specifically, the hollow out part 3 is respectively arranged at the chip near-end filtration module of the pcb board and chip distal end is filtered
The top of ripple module；So design the reason for be, the chip near-end filtration module and chip distal end filtration module of the pcb board
Wave filter or electric capacity etc. would generally be used to filter component, there is certain height, therefore, it is necessary to the pcb board chip
Need to set hollow out part 3 above near-end filtration module and chip distal end filtration module.
Specifically, the inside of the heat-conducting substrate 2 is provided with storage tank 21, the inside of the storage tank 21 is provided with heat pipe 22,
The heat pipe 22 is the roundabout coil-like structure of S-shaped, increase and the heating surface area of heat-conducting substrate 2, improves the radiating effect of video card backboard 1
Fruit.
Specifically, the backboard support is linked together with the pcb board by screw or snap features.
Specifically, one end of the backboard support 1 is provided with bending component 4, the bending component 4 respectively with the PCB
Plate is connected with the bottom plate of video card 5；In this way, the bending component 4 that is forced through of pcb board is enabled to be transferred to video card 5
On bottom plate, reduce the stress of the pcb board, further protect the pcb board.
Specifically, the heat pipe 22 is made of copper, the heat-conducting substrate 2 is made of aluminum.
The heat-conducting substrate 2 is made up of Heat Conduction Material such as aluminium, and its is generally rectangular shaped.Heat-conducting substrate 2 is close at a long side certainly
On be stamped and formed out the storage tank 21 of an accommodating heat pipe 22 downwards, the parallel long side of heat-conducting substrate 2 of the storage tank 21 runs through two
End, and the upper table of heat-conducting substrate 2 be recessed downwards and in its lower surface projection.
The present invention also provides：A kind of video card, the video card include video card backboard as described above.
Similarly, it will be appreciated that in order to simplify the disclosure and help to understand one or more of each inventive aspect,
Above in the description to the exemplary embodiment of the present invention, each feature of the invention is grouped together into single implementation sometimes
In example, figure or descriptions thereof.However, the method for the disclosure should be construed to reflect following intention：I.e. required guarantor
The application claims of shield are than the feature more features that is expressly recited in each claim.More precisely, as following
As claims reflect, inventive aspect is all features less than single embodiment disclosed above.Therefore, abide by
Thus the claims for following embodiment are expressly incorporated in the embodiment, wherein each claim is in itself
Separate embodiments as the present invention.
As used in this, unless specifically stated so, come using ordinal number " first ", " second ", " the 3rd " etc.
Description plain objects are merely representative of the different instances for being related to similar object, and are not intended to imply that the object being so described must
Must have the time it is upper, spatially, in terms of sequence or given order in any other manner
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of changes, modification can be carried out to these embodiments, replace without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (9)
- A kind of 1. video card backboard, it is characterised in that including：Backboard support (1) and heat-conducting substrate (2), the heat-conducting substrate (2) are logical The back side that backboard support (1) is arranged at video card (5) is crossed, the backboard support (1) is connected with the pcb board of the video card (5).
- A kind of 2. video card backboard according to claim 1, it is characterised in that：The heat-conducting substrate (2) is arranged at the back of the body Side of the board mount (1) away from the pcb board.
- A kind of 3. video card backboard according to claim 1, it is characterised in that：Hollow out is provided with the backboard support (1) Part (3).
- A kind of 4. video card backboard according to claim 3, it is characterised in that：The hollow out part (3) is respectively arranged at institute State the chip near-end filtration module of pcb board and the top of chip distal end filtration module.
- A kind of 5. video card backboard according to claim 1, it is characterised in that：The inside of the heat-conducting substrate (2), which is provided with, to hold Groove (21) is put, the inside of the storage tank (21) is provided with heat pipe (22), and the heat pipe (22) is the roundabout coil-like structure of S-shaped.
- A kind of 6. video card backboard according to claim 1, it is characterised in that：The backboard support passes through with the pcb board Screw or snap features link together.
- A kind of 7. video card backboard according to claim 1, it is characterised in that：One end of the backboard support (1) is provided with Bending component (4), bottom plate of the bending component (4) respectively with the pcb board and video card (5) are connected.
- A kind of 8. video card backboard according to claim 5, it is characterised in that：The heat pipe (22) is made of copper, described to lead Hot substrate (2) is made of aluminum.
- 9. a kind of video card, it is characterised in that the video card includes the video card backboard as described in claim 1 to 8 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710703170.XA CN107371351A (en) | 2017-08-16 | 2017-08-16 | Video card backboard and its video card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710703170.XA CN107371351A (en) | 2017-08-16 | 2017-08-16 | Video card backboard and its video card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107371351A true CN107371351A (en) | 2017-11-21 |
Family
ID=60309015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710703170.XA Withdrawn CN107371351A (en) | 2017-08-16 | 2017-08-16 | Video card backboard and its video card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107371351A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111434199A (en) * | 2017-12-07 | 2020-07-17 | 西门子交通有限公司 | Fanless cooling system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050122686A1 (en) * | 2003-12-05 | 2005-06-09 | Nec Corporation | Electronic card unit and method for removing heat from a heat-generating component on a printed circuit board |
| CN103149995A (en) * | 2013-03-15 | 2013-06-12 | 宗鸿电子科技（昆山）有限公司 | Heat-dissipation device for graphics card |
| CN205750689U (en) * | 2016-05-18 | 2016-11-30 | 深圳市七彩虹科技发展有限公司 | A kind of video card backboard and video card thereof |
| CN106455430A (en) * | 2016-09-30 | 2017-02-22 | 广东顺德三扬科技股份有限公司 | Heat dissipation apparatus and manufacturing method therefor |
-
2017
- 2017-08-16 CN CN201710703170.XA patent/CN107371351A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050122686A1 (en) * | 2003-12-05 | 2005-06-09 | Nec Corporation | Electronic card unit and method for removing heat from a heat-generating component on a printed circuit board |
| CN103149995A (en) * | 2013-03-15 | 2013-06-12 | 宗鸿电子科技（昆山）有限公司 | Heat-dissipation device for graphics card |
| CN205750689U (en) * | 2016-05-18 | 2016-11-30 | 深圳市七彩虹科技发展有限公司 | A kind of video card backboard and video card thereof |
| CN106455430A (en) * | 2016-09-30 | 2017-02-22 | 广东顺德三扬科技股份有限公司 | Heat dissipation apparatus and manufacturing method therefor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111434199A (en) * | 2017-12-07 | 2020-07-17 | 西门子交通有限公司 | Fanless cooling system |
| US11678463B2 (en) | 2017-12-07 | 2023-06-13 | Siemens Mobility GmbH | Fanless cooling system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20171121 |