CN107359130B - Full-automatic hot briquetting device of power module - Google Patents
Full-automatic hot briquetting device of power module Download PDFInfo
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- CN107359130B CN107359130B CN201710550106.2A CN201710550106A CN107359130B CN 107359130 B CN107359130 B CN 107359130B CN 201710550106 A CN201710550106 A CN 201710550106A CN 107359130 B CN107359130 B CN 107359130B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
- H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
- H01L2224/7592—Load or pressure adjusting means, e.g. sensors
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Abstract
The invention belongs to the technical field of power electronic device packaging, and discloses a full-automatic hot-press forming device for a power module. The invention can provide different sintering pressure and sintering temperature, can accurately control the sintering pressure and the height of the bonding layer through closed loop feedback, realizes various changes of sintering time, sintering pressure and bonding layer thickness, provides help for researching related problems of hot press molding of the power module, and has important pushing effect on the development of high and new technology industries such as semiconductors, micro-electromechanical systems and the like.
Description
Technical Field
The invention belongs to the technical field of power electronic device packaging, and particularly relates to a device for a power module hot press molding process.
Background
The rapid development of the electronics packaging industry has made the electronics industry highly dependent on power electronics. The power module is a module which is prepared by encapsulating power electronic devices according to certain functional combination. At present, the power module mainly faces the following two problems in practical application:
on the one hand, in the fields of automobiles, ships, aviation, deep well drilling and the like, the power module is required to work in a severe environment with the temperature higher than 200 ℃. However, the conventional technology for connecting power electronic devices mainly uses alloy solder or conductive adhesive to bond a semiconductor chip on a heat sink or uses aluminum wires or gold wires to bond another semiconductor chip, and the bonding temperature achieved by these technologies is about 150 ℃ at the highest, so that the requirements of the wide-bandgap device under the high-temperature operation environment cannot be met; on the other hand, heat dissipation has become one of the bottlenecks in achieving commercialization of power electronics. At present, the heat dissipation of the power electronic device is mainly studied from the directions of a packaging structure, a substrate material, an adhesive material, a heat sink structure and the like. Therefore, the thermal resistance of the bonding interface between the chip and the substrate becomes a key for reducing the whole thermal resistance.
One solution to these problems is to use nano silver solder paste as an adhesive material. The nano silver solder paste is used as a novel green packaging material, has the characteristics of high melting point (961 ℃) and low sintering temperature (less than 300 ℃) and excellent electricity and heat, and the like, and therefore has wide application prospect in high-temperature power electronic device packaging. However, the existing technology of nano silver soldering paste has the problems of low connection strength, macroscopic porosity, large technological complexity and the like in the field of large-area chip bonding, and further research is needed, so that a hot press forming device with more flexible control mode and more various functions is needed.
Disclosure of Invention
The invention aims to provide a full-automatic hot-press forming device for a power module, which can realize different sintering pressures and sintering temperatures, can accurately control the sintering pressure and the height of an adhesive layer through closed-loop feedback and realize various changes of the sintering time, the sintering pressure and the thickness of the adhesive layer.
In order to solve the technical problems, the invention is realized by the following technical scheme:
the full-automatic hot-press forming device of the power module is characterized by comprising an upper layer working area, a lower layer accessory and a control area; a hot pressing actuating system, a hot pressing guiding system and a heating assembly are arranged in the upper working area; a water cooling system and a control system are arranged in the lower accessory and the control area;
the hot pressing system comprises an upper supporting plate and a lower supporting plate which are parallel to each other, and the upper supporting plate and the lower supporting plate are connected by four supporting studs; an upper cooling plate is fixed on the lower end face of the upper supporting plate, and an upper presser is fixed on the lower end face of the upper cooling plate; the upper cooling plate is connected with the lower cooling plate through a guide mechanism consisting of a guide post support, a guide post and a guide sleeve, a lower presser is fixed on the upper end surface of the lower cooling plate, and a working area for placing a power component is arranged between the lower presser and the upper presser; the lower supporting plate is fixedly provided with an electric cylinder, and the electric cylinder is connected with a round head force application part through a force sensor and is used for applying force to the lower cooling plate and the lower presser; the electric cylinder is also provided with a rotary encoder;
the hot-pressing guiding system comprises guide post supports symmetrically fixed on two sides of the lower end face of the upper cooling plate, a guide post is fixedly connected to the lower part of each guide post support, the lower end of each guide post sequentially penetrates through the guide sleeve and the lower cooling plate, the two guide sleeves are respectively fixed on two sides of the upper end face of the lower cooling plate, a spring sleeved on the guide post is arranged between the guide post support and the guide sleeve, and a linear ball sleeve is arranged between the guide sleeve and the guide post; the round head force application part is arranged in the force application part fixing seat, the force application part fixing seat is of a hollow structure, the upper end face of the force application part fixing seat is fixedly connected with the lower end face of the lower cooling plate, and the top end of the round head force application part is contacted with the lower end face of the lower cooling plate;
the heating component comprises the upper presser and the lower presser, wherein the upper presser and the lower presser are composed of a pressing plate, a ceramic heat insulation plate and a pressing head supporting plate; the pressing plate is internally provided with a plurality of heating rods, the pressing plate is in contact with the ceramic heat insulation plate and is pressed and fixed by the pressure head supporting plate, and the ceramic heat insulation plate is fixed on the upper cooling plate or the lower cooling plate;
the water cooling system comprises an upper cooling plate, a lower cooling plate and a cooling water tank, wherein cooling water is pumped out of the cooling water tank to enter the upper cooling plate and the lower cooling plate, circulation pipelines are processed in the upper cooling plate and the lower cooling plate, and the cooling water taking away heat after circulation flows back to the cooling water tank;
the control system comprises a control circuit board, an upper pressure device temperature control meter, a lower pressure device temperature control meter and a switching power supply, wherein the control circuit board is connected with a computer with matched software;
the control circuit board is in signal connection with the electric cylinder and the rotary encoder and is used for controlling the displacement of the pressing device so as to control the height of the bonding layer; the control circuit board controls the electric cylinder to operate, the electric cylinder drives the round head force application piece to drive the pressing device to displace, meanwhile, the rotary encoder collects the motor rotation angle of the electric cylinder and transmits the motor rotation angle to the control circuit board, and the control circuit board converts the motor rotation angle into displacement of the pressing device and transmits the displacement to the computer;
the control circuit board is in signal connection with the electric cylinder and the force sensor and is used for controlling sintering pressure; the computer transmits the load value input by the software to the control circuit board, the control circuit board converts the load value into a load signal and transmits the load signal to the electric cylinder, and the load applied by the electric cylinder to the round head force application part is collected by the force sensor and converted into the load signal to be fed back to the control circuit board;
the upper pressure device temperature control meter and the lower pressure device temperature control meter are used for controlling the opening and closing of the heating rod and controlling the sintering temperature; the heating rod is connected with the switch power supply through a solid relay; the upper pressure device temperature control meter and the lower pressure device temperature control meter respectively take actual temperatures acquired by temperature sensors arranged on the surfaces of the upper pressure device and the lower pressure device as feedback variables, and the heating rod is controlled to heat or stop heating through the solid relay.
Preferably, the upper-layer accessory, the lower-layer accessory, the control area, the power supply, the USB interface and five switch buttons are respectively provided with a power-on button, a heating button, a water-cooling button, a rising button and a falling button, wherein the rising button and the falling button are respectively connected with the control circuit board through signals; the computer is connected with the control circuit board through a USB interface.
Preferably, the middle part of the top surface of the round head force application piece is a spherical crown body, and the top end of the spherical crown body is always in point contact with the lower end surface of the lower cooling plate.
Preferably, four short support legs are arranged at four corners of the contact surface of the ceramic heat insulation plate and the upper cooling plate or the lower cooling plate.
Preferably, the cooling water tank is arranged in the lower-layer accessory and the control area, and comprises a submersible pump and a connecting water pipe; and a water level gauge and a water temperature gauge are arranged on the side face of the cooling water tank.
Preferably, the heating rod is connected with the switch power supply through a solid-state relay; when the upper pressure device temperature control meter and the lower pressure device temperature control meter detect that the actual temperature is lower than the set temperature, the solid relay controls the heating rod to heat; when the upper pressure device temperature control meter and the lower pressure device temperature control meter detect that the actual temperature reaches the set temperature, the solid state relay controls the heating rod to stop heating.
Preferably, the switch power supply supplies power to the electric cylinder, the upper pressure device temperature control meter, the lower pressure device temperature control meter, the control circuit board, the heating rod and the cooling water tank.
The beneficial effects of the invention are as follows:
compared with the prior art, the invention can realize different sintering pressures and sintering temperatures, and simultaneously can accurately control the sintering pressure and the bonding layer height through closed loop feedback, thereby realizing full-automatic control of the sintering time, the sintering pressure and the bonding layer thickness. For example, the heat preservation is carried out for 2 hours at 300 ℃ and 50MPa, then the temperature is automatically changed to 20MPa for 1 hour, then the pressure is reduced at a constant speed of 5MPa/s until the pressure is zero, the process is often used in scientific research and actual production, and the traditional power module hot-press forming device is difficult to realize because of single function.
The hot pressing actuating system and the hot pressing guiding system realize low-friction axial loading, ensure the parallelism of the upper and lower pressers and enable the force measurement to be more accurate; the point contact design of the round head force application piece overcomes the errors caused by processing and installation; four support studs are connected with the upper support plate and the lower support plate, and the hot pressing actuating system and the hot pressing guiding system are arranged between the upper support plate and the lower support plate, so that the overall rigidity is high, and the large load loading can be realized.
The temperature of the upper pressing device and the temperature of the lower pressing device can be controlled respectively, so that synchronous heating or hot pressing functions of different temperatures can be realized, and technological means are enriched; the heat insulation and water cooling system ensures that the temperature of the heating components (the upper pressing device and the lower pressing device) is constant, heat sink effect is prevented from being generated, and other parts of the equipment are protected.
And fourthly, the integrated level of the invention is high, the equipment is structurally divided into an upper part and a lower part, the hot pressing actuating system, the hot pressing guiding system, the heating component, the water cooling system and the control system are reasonably arranged, the size of the equipment is effectively reduced, and the space utilization rate is improved.
The invention can be popularized in series, and the hot press molding of the power modules with different specifications can be realized by changing the sizes of the components and the like, and the invention can also be used as one of important equipment for hot press sintering processing of the power modules.
Drawings
Fig. 1 is a schematic view of the appearance structure of a full-automatic hot press molding device for a power module according to the present invention;
FIG. 2 is a schematic diagram of a thermal compression actuation system in the apparatus of the present invention;
FIG. 3 is a schematic view of the hot press guiding system in the apparatus of the present invention;
FIG. 4 is a schematic view of the heating assembly of the apparatus of the present invention;
FIG. 5 is a schematic diagram of a water cooling system in the apparatus of the present invention;
FIG. 6 is a schematic diagram of the control system of the apparatus of the present invention;
fig. 7 is a schematic structural diagram of a power module in which a dummy chip and a dummy substrate are connected in an embodiment.
In the above figures: 1. support studs, 2, left side sheet metal, 3, front side sheet metal, 4, door handle, 5, front panel, 6, upper press temperature control gauge, 7, lower press temperature control gauge, 8, upper support plate, 9, rear side sheet metal, 10, right side sheet metal, 11, switch button, 12, side panel, 13, power supply and USB interface, 14, upper cooling plate, 15, upper press, 16, lower press, 17, lower cooling plate, 18, round head force element, 19, guide pillar support, 20, spring, 21, guide sleeve, 22, guide pillar, 23, force sensor, 24, lower support plate, 25, electric cylinder, 26 force element fixing seat, 27, pressure plate, 28, heating rod, 29, short support leg, 30, water inlet, 31, pressure head support plate, 32, ceramic heat insulation plate, 33, lower cooling plate, 34, water outlet, 35, water tank water inlet, 36, water tank water outlet, 37, control circuit board, 38, water tank return, 39, water level gauge, 40, table, 41, cooling water tank, 42, 43, power supply, 45, simulated chip, 45, nanometer water outlet, and simulated chip 46.
Detailed Description
For a further understanding of the nature, features, and effects of the present invention, the following examples are set forth to illustrate, and are to be considered in connection with the accompanying drawings:
as shown in fig. 1, the embodiment provides a full-automatic hot press forming device for a power module, and its outer structure is divided into an upper working area, a lower accessory and a control area. The periphery metal plate of the upper working area is surrounded by a left metal plate 2, a front metal plate 3, a rear metal plate 9 and a right metal plate 10, and a door handle 4 is arranged on the front metal plate 3; the appearance of the lower accessory and the control area is composed of a front panel 5, a rear panel and two side panels 12, wherein an upper-pressure device temperature control meter 6, a lower-pressure device temperature control meter 7 and five switch buttons 11 are arranged on the front panel 5, and the five switch buttons 11 comprise a power-on button, a heating button, a water-cooling button, a rising button and a falling button; a power supply and a USB interface 13 are fixed below the side panel 12.
A hot pressing actuating system, a hot pressing guiding system and a heating assembly are arranged in the upper working area; the lower layer accessories and the control area are internally provided with a water cooling system, a control system and other accessories.
As shown in fig. 2, the hot pressing system includes an upper support plate 8 and a lower support plate 24 parallel to each other, the upper support plate 8 and the lower support plate 24 being connected at four corners by four support studs 1, the position of the upper support plate 8 being adjustable by the support studs 1 while leveling the upper support plate 8. An upper cooling plate 14 is fixed on the lower end surface of the upper supporting plate 8, and an upper presser 15 is fixed on the lower end surface of the upper cooling plate 14; the upper cooling plate 14 is connected with a lower cooling plate 17 through a guide mechanism consisting of a guide post support 19, a guide post 22 and a guide sleeve 21, and the upper end surface of the lower cooling plate 17 is fixed with a lower presser 16; between the presser 16 and the upper presser 15 is a working area for placing power components. The lower support plate 24 is fixedly provided with an electric cylinder 25, an output shaft of the electric cylinder 25 is connected with the lower end of a force sensor 23, and the upper end of the force sensor 23 is connected with the lower end of the round head force application member 18. The tail end of the electric cylinder 25 is also provided with a rotary encoder which is used for collecting the motor rotation angle of the electric cylinder 25 and transmitting the motor rotation angle to the control circuit board 37 in real time, and the control circuit board 37 can convert the motor rotation angle into the moving distance of the presser 16 and transmit the moving distance to a computer, so that the purpose of controlling the height of the bonding layer is achieved.
As shown in fig. 3, the hot pressing guiding system comprises guide post supports 19 symmetrically fixed on two sides of the lower end surface of the upper cooling plate 14, a guide post 22 is fixedly connected to the lower portion of each guide post support 19, the lower ends of the guide posts 22 sequentially penetrate through holes of the guide sleeves 21 and the lower cooling plate 17, and the two guide sleeves 21 are respectively fixed on two sides of the upper end surface of the lower cooling plate 17. A spring 20 sleeved on a guide post 22 is arranged between the guide post support 19 and the guide sleeve 21, and plays a role in assisting the separation of the guide mechanism. A linear ball sleeve is mounted between the guide sleeve 21 and the guide post 22 in order to reduce friction so that the value of the force sensor 23, after subtracting the weight of the accessory, is closer to the pressure exerted on the power assembly sample. The middle part of the top surface of the round head force application part 18 is a spherical crown body, and the round head force application part 18 is arranged in the force application part fixing seat 26; the force application member fixing seat 26 is of a hollow structure, and the upper end surface of the force application member fixing seat is fixedly connected with the lower end surface of the lower cooling plate 17, so that the top end of the spherical crown body of the round head force application member 18 is contacted with the lower end surface of the lower cooling plate 17. During installation, the round head force application part 18 is sleeved into the force application part fixing seat 26 from top to bottom, then the upper end face of the force application part fixing seat 26 is connected with the lower cooling plate 17, the top end of the spherical crown body of the round head force application part 18 is always in point contact with the lower end face of the lower cooling plate 17 after connection, and the contact end face has smaller roughness, so that the friction force in the horizontal direction can be ignored, the parallelism error between the lower end face of the upper presser 15 and the upper end face of the lower presser 16 caused by machining and assembly errors can be effectively avoided, and the guide mechanism consisting of the guide pillar support 19, the guide pillar 22, the guide sleeve 21 and the spring 20 is used, so that the electric cylinder 25 can always keep horizontal when driving the lower presser 16 to move upwards.
The heating assembly includes an upper presser 15 and a lower presser 16, and the internal structures of the upper presser 15 and the lower presser 16 are identical and symmetrically arranged, and only the lower presser 16 will be specifically described with reference to fig. 4. The presser 16 mainly comprises a pressing plate 27, a ceramic heat insulation plate 32 and a pressing head support plate 31; the pressing plate 27 is made of die steel, a plurality of heating rods 28 are arranged in the pressing plate, and the heating value of the heating rods 28 is controlled by a temperature control meter 7 of a pressing device and an accessory circuit system; the lower end face of the pressing plate 27 is contacted with the ceramic heat insulation plate 31, the side of the pressing plate 27 and the side of the ceramic heat insulation plate 31 are embedded in the inner side of the pressing head supporting plate 31, and the pressing head supporting plate 31 presses and fixes the pressing plate 27 and the ceramic heat insulation plate 31 from the side face. The lower end surface of the ceramic insulating plate 32 is fixed to the lower cooling plate 17, and four short legs 28 are installed at four corners of the lower end surface thereof to reduce downward heat diffusion, thereby serving to insulate and protect the lower force sensor 23.
As shown in fig. 5, the water cooling system includes an upper cooling plate 14, a lower cooling plate 17, and a cooling water tank 41, and the cooling water tank 41 is provided in the lower-layer accessories and control area, and includes a submersible pump, a connecting water pipe, and the like. The side surface of the cooling water tank 41 is provided with a water level gauge 39 and a water temperature gauge 40, the water level gauge 39 is used for monitoring the water level in the cooling water tank 41, and when the water level is too low, the cooling liquid is manually injected through the water tank water return port 38; the water temperature meter 40 is used for observing that the water temperature is not too high during long-time hot pressing operation so as not to influence the cooling effect, and a cooling liquid heat dissipation box can be additionally arranged if necessary. The water path circulation mode is that the cooling water in the cooling water tank 41 is pumped out from the water tank water outlet 37 and enters the upper cooling plate 14 and the lower cooling plate 17; circulation pipelines are processed in the upper cooling plate 14 and the lower cooling plate 17, cooling water enters from the water inlets 30 and flows out from the water outlets 34 of the upper cooling plate 14 and the lower cooling plate 17, and heat is taken away; and finally flows back to the cooling water tank 41 through the water tank water filling port 36. The "water cooling" button is connected to the cooling water tank 41, and "controls the submersible pump to be turned on or off, thereby controlling the operation state of the water cooling system.
As shown in fig. 6, the control system mainly includes a switching power supply 43, an upper-voltage device temperature control meter 6, a lower-voltage device temperature control meter 7, and a control circuit board 37. The power-on button is connected with the switch power supply 43, controls the switch power supply 43 to be turned on or off, and the switch power supply 43 provides direct current required by the electric cylinder 25, the upper pressure device temperature control meter 6, the lower pressure device temperature control meter 7, the control circuit board 37, the heating rod 2 and the cooling water tank 41. The heating button is a power supply switch of the upper pressure device temperature control meter 6 and the lower pressure device temperature control meter 7. The control circuit board 37 is installed on the inner side of the side panel 12, and can be a CARE Test Studio Software type multifunctional control board manufactured by Kaier measurement and control test System (Tianjin) limited company, and is connected with a computer by a USB wire, and the computer software is CARE Test Studio Software software matched with the computer.
The control circuit board 37 is respectively connected with the electric cylinder 25, the rotary encoder, the 'up' button and the 'down' button in a signal manner and is used for controlling the displacement of the presser 16 in the sintering process so as to control the height of the bonding layer; the up button and the down button transmit up or down signals to the electric cylinder 25 through the control circuit board 37, the electric cylinder 25 drives the round head force application part 18 to drive the cooling plate 17 and the pressing device 16 to displace, meanwhile, the rotary encoder collects the motor rotation angle of the electric cylinder 25 and transmits the motor rotation angle to the control circuit board 37, the control circuit board 37 converts the motor rotation angle into the moving distance of the pressing device 16 and transmits the moving distance to the computer, and the computer outputs the up or down moving distance to control the height of the bonding layer.
The control circuit board 37 is respectively connected with the electric cylinder 25 and the force sensor 23 in a signal manner and is used for controlling the sintering pressure in the sintering process; the computer transmits the load value input by the software to the control circuit board 37, the control circuit board 37 transmits the load signal to the electric cylinder 25, the load pressure value applied by the electric cylinder 25 to the round head force application member 18 is transmitted to the control circuit board 37 through the force sensor 23, and the control circuit board 37 feeds back the detected load pressure value to the computer to form closed loop control.
The upper presser temperature control meter 6 and the lower presser temperature control meter 7 are respectively connected with the solid state relay 42 of the upper presser 15 and the lower presser 16 in a signal manner so as to control the opening and closing of the heating rod 28, thereby controlling the sintering temperature in the sintering process. The positive pole of the heating rod 28 is connected with the positive pole of the switch power supply 43, the negative pole of the heating rod 28 is connected with the negative pole of the switch power supply 43 through the solid state relay 42, and the solid state relay 42 plays a role in controlling the switch of the heating rod 28. Pressing the heating button, the upper press temperature control meter 6 and the lower press temperature control meter 7 are electrified, the upper press temperature control meter 6 and the lower press temperature control meter 7 respectively take temperature sensors arranged on the surfaces of the upper press 15 and the lower press 16 as feedback variables, and the temperature control is realized by controlling the on-off of the solid relay 41. When the upper-voltage temperature control meter 6 and the lower-voltage temperature control meter 7 detect that the actual temperature is lower than the set temperature, the upper-voltage temperature control meter 6 and the lower-voltage temperature control meter 7 output voltage signals, and the solid relay 42 is controlled to be in an on state, so that the negative electrode of the heating rod 28 is communicated with the negative electrode of the switching power supply 43, and the heating rod 28 is heated; when the upper and lower temperature control tables 6 and 7 detect that the actual temperature reaches the set temperature, the upper and lower temperature control tables 6 and 7 output voltage signals to control the solid relay 42 to be closed, so that the negative electrode of the heating rod 28 is disconnected from the negative electrode of the switching power supply 43, and the heating rod 28 stops heating. The set temperature can be directly input into the upper-pressure temperature control table 6 and the lower-pressure temperature control table 7, or the set temperature of software can be transmitted to the upper-pressure temperature control table 6 and the lower-pressure temperature control table 7 through the control circuit board 37 by a computer. The temperature of the upper presser temperature control table 6 and the temperature of the lower presser temperature control table 7 can be respectively set so as to realize synchronous heating or hot pressing functions of different temperatures.
In the embodiment of the invention, a nano silver soldering paste is used as an adhesive to realize high-temperature sintering connection of the simulation chip 45 and the simulation substrate 44, so as to study the bonding performance of the nano silver soldering paste under different sintering processes. The embodiment can realize heat preservation for 2 hours at 300 ℃ and 50MPa through a full-automatic hot-press forming device of a power module, then automatically changes to heat preservation for 1 hour at 20MPa, and then reduces the pressure at a constant speed of 5MPa/s until the pressure is zero.
In this embodiment, a silver-plated copper plate of 5mm×5mm×1.5mm is used as the dummy chip 45 and a silver-plated copper plate of 22mm×15mm×1.5mm is used as the dummy substrate 44. A 90 μm thick stainless steel plug with a square through hole of 5mm×5mm was fixed on the dummy substrate 44 using an adhesive tape, nano silver solder paste was preliminarily printed on the upper end surface of the dummy substrate 44 using a doctor blade, and after preliminary solidification, the stainless steel plug was removed, and at this time, the initial thickness of the nano silver solder paste coating 46 was considered to be 90 μm. The simulated substrate 44 with the scraped nano silver solder paste coating 46 is placed on a heating table for heating, and after the completion, a silver-plated copper plate with the thickness of 5mm multiplied by 1.5mm is placed on the nano silver solder paste coating 46 as a simulated chip 45, so as to prepare an initial sample before sintering.
The switching power supply 43 of the full-automatic hot-press forming device of the power module is turned on, the working space between the lower press 16 and the upper press 15 is adjusted by using an up button or a down button, and an initial sample is placed on the upper surface of the lower press 16 by using tweezers to simulate the substrate 44; setting the target temperature of the upper pressure head temperature control table 6 and the lower pressure head temperature control table 7 to be 300 ℃, simultaneously pressing a water cooling button, and starting circulation of cooling water; waiting for the two upper pressure head temperature control tables 6 and the lower pressure head temperature control table 7 to display that when the current temperature is 300 ℃, pressing a 'rising' button to reduce the working space between the lower pressure device 16 and the upper pressure device 15, so that the distance between the upper pressure device 16 and the upper surface of the analog chip 45 is 1-3mm; setting a test scheme in CARE Test Studio Software software, adopting a multi-step loading functional module, setting a load target to 1250N (50 MPa), delaying for 2 hours, automatically adjusting the load target to 400N (20 MPa) and delaying for 1 hour, then uniformly reducing the load at a speed of 125N/s (5 MPa/s) until the pressure is zero, and automatically ending the test. The "drop" button was pressed and the sample was removed with forceps. At the moment, the sintering work is completed, then the heating function is closed by pressing the heating button, the water cooling function is closed by pressing the water cooling button after the equipment is cooled, and finally the equipment is closed by pressing the starting button.
In summary, the device for the hot press molding process of the power module can provide different sintering pressures and sintering temperatures, can accurately control the sintering pressure and the bonding layer height through closed loop feedback, realizes various changes of the sintering time, the sintering pressure and the bonding layer thickness, and provides assistance for researching related problems of hot press molding of the nano silver solder paste. Meanwhile, the invention has important effect on the research of other power module hot-press molding processes, and is one of the important equipment for the hot-press sintering processing of the power module.
Although the preferred embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, which are merely illustrative, not restrictive, and many changes may be made by those having ordinary skill in the art without departing from the spirit of the present invention and the scope of the appended claims, which are to be construed as falling within the scope of the present invention.
Claims (7)
1. The full-automatic hot-press forming device of the power module is characterized by comprising an upper layer working area, a lower layer accessory and a control area; a hot pressing actuating system, a hot pressing guiding system and a heating assembly are arranged in the upper working area; a water cooling system and a control system are arranged in the lower accessory and the control area;
the hot pressing system comprises an upper supporting plate and a lower supporting plate which are parallel to each other, and the upper supporting plate is connected with the lower supporting plate through four supporting studs; an upper cooling plate is fixed on the lower end face of the upper supporting plate, and an upper presser is fixed on the lower end face of the upper cooling plate; the upper cooling plate is connected with the lower cooling plate through a guide mechanism consisting of a guide post support, a guide post and a guide sleeve, a lower presser is fixed on the upper end surface of the lower cooling plate, and a working area for placing a power component is arranged between the lower presser and the upper presser; the lower supporting plate is fixedly provided with an electric cylinder, and the electric cylinder is connected with a round head force application part through a force sensor and is used for applying force to the lower cooling plate and the lower presser; the electric cylinder is also provided with a rotary encoder;
the hot-pressing guiding system comprises guide post supports symmetrically fixed on two sides of the lower end face of the upper cooling plate, a guide post is fixedly connected to the lower part of each guide post support, the lower end of each guide post sequentially penetrates through the guide sleeve and the lower cooling plate, the two guide sleeves are respectively fixed on two sides of the upper end face of the lower cooling plate, a spring sleeved on the guide post is arranged between the guide post support and the guide sleeve, and a linear ball sleeve is arranged between the guide sleeve and the guide post; the round head force application part is arranged in the force application part fixing seat, the force application part fixing seat is of a hollow structure, the upper end face of the force application part fixing seat is fixedly connected with the lower end face of the lower cooling plate, and the top end of the round head force application part is contacted with the lower end face of the lower cooling plate;
the heating component comprises the upper presser and the lower presser, wherein the upper presser and the lower presser are composed of a pressing plate, a ceramic heat insulation plate and a pressing head supporting plate; the pressing plate is internally provided with a plurality of heating rods, the pressing plate is in contact with the ceramic heat insulation plate and is pressed and fixed by the pressure head supporting plate, and the ceramic heat insulation plate is fixed on the upper cooling plate or the lower cooling plate;
the water cooling system comprises an upper cooling plate, a lower cooling plate and a cooling water tank, wherein cooling water is pumped out of the cooling water tank to enter the upper cooling plate and the lower cooling plate, circulation pipelines are processed in the upper cooling plate and the lower cooling plate, and the cooling water taking away heat after circulation flows back to the cooling water tank;
the control system comprises a control circuit board, an upper pressure device temperature control meter, a lower pressure device temperature control meter and a switching power supply, wherein the control circuit board is connected with a computer with matched software;
the control circuit board is in signal connection with the electric cylinder and the rotary encoder and is used for controlling the displacement of the pressing device so as to control the height of the bonding layer; the control circuit board controls the electric cylinder to operate, the electric cylinder drives the round head force application piece to drive the pressing device to displace, meanwhile, the rotary encoder collects the motor rotation angle of the electric cylinder and transmits the motor rotation angle to the control circuit board, and the control circuit board converts the motor rotation angle into displacement of the pressing device and transmits the displacement to the computer;
the control circuit board is in signal connection with the electric cylinder and the force sensor and is used for controlling sintering pressure; the computer transmits the load value input by the software to the control circuit board, the control circuit board converts the load value into a load signal and transmits the load signal to the electric cylinder, and the load applied by the electric cylinder to the round head force application part is collected by the force sensor and converted into the load signal to be fed back to the control circuit board;
the upper pressure device temperature control meter and the lower pressure device temperature control meter are used for controlling the opening and closing of the heating rod and controlling the sintering temperature; the heating rod is connected with the switch power supply through a solid relay; the upper pressure device temperature control meter and the lower pressure device temperature control meter respectively take actual temperatures acquired by temperature sensors arranged on the surfaces of the upper pressure device and the lower pressure device as feedback variables, and the heating rod is controlled to heat or stop heating through the solid relay.
2. The full-automatic hot press forming device of the power module according to claim 1, wherein the upper-layer accessory and the control area are externally provided with the upper-layer temperature control meter, the lower-layer temperature control meter, a power supply, a USB interface and five switch buttons, wherein the five switch buttons are respectively a power-on button, a heating button, a water-cooling button, an ascending button and a descending button, and the ascending button and the descending button are respectively connected with the control circuit board through signals; the computer is connected with the control circuit board through a USB interface.
3. The full-automatic hot press molding device of the power module according to claim 1, wherein the middle part of the top surface of the round head force application piece is a spherical crown body, and the top end of the spherical crown body is always in point contact with the lower end surface of the lower cooling plate.
4. The full-automatic hot press molding device for the power module according to claim 1, wherein four short supporting legs are arranged at four corners of the contact surface of the ceramic heat insulation plate and the upper cooling plate or the lower cooling plate.
5. The full-automatic hot press molding device of the power module according to claim 1, wherein the cooling water tank is arranged in the lower accessory and the control area and internally comprises a submersible pump and a connecting water pipe; and a water level gauge and a water temperature gauge are arranged on the side face of the cooling water tank.
6. The full-automatic hot press forming device of a power module according to claim 1, wherein when the upper and lower pressure device temperature control meters detect that the actual temperature is lower than a set temperature, the heating rod is controlled to heat by the solid state relay; when the upper pressure device temperature control meter and the lower pressure device temperature control meter detect that the actual temperature reaches the set temperature, the solid state relay controls the heating rod to stop heating.
7. The full-automatic hot press forming device of a power module according to claim 1, wherein the switching power supply supplies power to the electric cylinder, the upper pressure device temperature control meter, the lower pressure device temperature control meter, the control circuit board, the heating rod and the cooling water tank.
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| CN109121326A (en) * | 2018-08-22 | 2019-01-01 | 唐兴云 | One kind pressing fixed device and its application method for circuit board |
| US11253898B2 (en) * | 2018-10-18 | 2022-02-22 | The Boeing Company | Hot-forming presses and methods of hot-forming workpieces |
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