CN107350978A - A kind of green fixed abrasive polished silicon wafer and preparation method thereof - Google Patents
A kind of green fixed abrasive polished silicon wafer and preparation method thereof Download PDFInfo
- Publication number
- CN107350978A CN107350978A CN201710615468.5A CN201710615468A CN107350978A CN 107350978 A CN107350978 A CN 107350978A CN 201710615468 A CN201710615468 A CN 201710615468A CN 107350978 A CN107350978 A CN 107350978A
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- Prior art keywords
- fixed abrasive
- silicon wafer
- polished silicon
- coat
- starch
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/001—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as supporting member
- B24D3/002—Flexible supporting members, e.g. paper, woven, plastic materials
- B24D3/004—Flexible supporting members, e.g. paper, woven, plastic materials with special coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention relates to a kind of green fixed abrasive polished silicon wafer, it is characterised in that：It is made up of basic unit and coat, the basic unit is PET film, and the component and its percentage by weight of the coat are：20~50wt% of fixed abrasive；25~40wt% of starch；25~40wt% of polyketone resin.The preparation method of green fixed abrasive polished silicon wafer of the present invention is：(1) weigh；(2) prepared by coating liquid；(3) coat coats；(4) solidify.The fixed abrasive polished silicon wafer of the present invention, the binding agent of starch and polyketone resin as green non-pollution, single starch polish can dissolve under aqueous conditions as the coat of binding agent, and coat is also easy to produce crack performance in solidification, starch can improve the uniformity of coat particle after being mixed with polyketone resin, improve quality of forming film, and film forming speed greatly improves, and improves operating efficiency, technological parameter is controllable, it is environment friendly and pollution-free, simple operation, polishing effect can be ensured.
Description
Technical field
The invention belongs to Precision Machining field, is related to fixed abrasive polished silicon wafer, and more particularly to a kind of green fixed abrasive is thrown
Mating plate and preparation method thereof.
Background technology
At present, various microelectronic substrate materials (such as Si, SiC, the substrate of glass material), fixed abrasive dielectric film and micro-
The Ultra-precision Turning of electronic component needs to be processed by shot blasting to ensure to use its precision, and handles generally using free mill
Expect polishing fluid.But free abrasive polishing fluid produces waste liquid after use, waste liquid can cause problem of environmental pollution, it is necessary to carry out
Post-processing, and polishing fluid is applied to the polishing of large area electric elements.
For the less microelectronic component of process face, such as the polishing of fiber connector, using polishing fluid not only
Pollution problem be present, and polishing fluid easily wastes, polishing effect is bad.
Fixed abrasive polished silicon wafer is the instrument for being easiest to realize the Ultraprecise polished processing of small area, and existing fixed abrasive is thrown
Mating plate is mainly made up of polished silicon wafer basic unit and the fixed abrasive being fixed in basic unit, the coating uniformity of the fixed abrasive in basic unit
Directly affect the polishing effect of polished silicon wafer, it is therefore desirable to add binding agent to improve the fixed abrasive coating uniformity, in peace
The angle that loopful is protected, the selection of binding agent are also required to green, and preparing a kind of green fixed abrasive polished silicon wafer is highly desirable.
By the retrieval to patent document, publication text same or analogous with present patent application is not found
Offer.
The content of the invention
It is viscous using nanoscale fixed abrasive and green it is an object of the invention to overcome the deficiencies of the prior art and provide one kind
The fixed abrasive polished silicon wafer of agent is tied, polyketone resin can reduce the water solubility of starch, strengthen its viscosity；Starch can alleviate polyketone
Hardening of the resin in water, two-way interaction can strengthen fixed abrasive adhesive property, ensure its coating in basic unit
The uniformity, ensure suface processing quality, improve operating efficiency, and green pollution-free.
Controllable the present invention also aims to provide a kind of technological parameter, simple operation can ensure the green of polishing effect
Fixed abrasive polishes piece preparation method.
The present invention solves its technical problem and is achieved through the following technical solutions：
A kind of green fixed abrasive polished silicon wafer, it is characterised in that：It is made up of basic unit and coat, the basic unit is PET
Film,
The component and its percentage by weight of the coat be：
20~50wt% of fixed abrasive
25~40wt% of starch
25~40wt% of polyketone resin.
Moreover, the thickness of the PET film is 60~80um.
Moreover, the thickness of the coat is 60~200um.
Moreover, the fixed abrasive is silica, aluminum oxide, cerium oxide or polycrystalline diamond.
Moreover, the fixed abrasive particle diameter is 0.1nm~100um.
Moreover, the starch is the cornstarch or glutinous rice starch in GB/T20887-2009 cereal starch.
A kind of preparation method of green fixed abrasive polished silicon wafer, it is characterised in that：The step of preparation method is：
(1) weigh：Fixed abrasive, starch, polyketone resin are weighed according to the percentage by weight；
(2) prepared by coating liquid：Load weighted polyketone resin, fixed abrasive and starch are added to the test tube for filling absolute ethyl alcohol
In, then uniformly mixed using ultrasonic oscillator so that polyketone resin, fixed abrasive and starch are dispersed in anhydrous
In ethanol, coating liquid is made；
(3) coat coats：Tile described PET film on glass plate, the coating liquid that will be prepared using coated rod
Repeatedly it is coated uniformly in PET film, forms the coat that thickness is 60~200um；
(4) solidify：Under room temperature environment after its solidification, polished silicon wafer is formed.
The advantages of the present invention are：
1st, fixed abrasive polished silicon wafer of the invention, is made up of basic unit and coat, polyketone resin and shallow lake is used in coat
Powder is as fixed abrasive binding agent, and starch is soluble in water, and simple use is had any problem, and polyketone resin chance water easily hardens, also not
It can directly use, therefore the water solubility of starch can be reduced using polyketone resin, strengthen its viscosity；Starch can alleviate polyketone tree
Hardening of the fat in water, two-way interaction can improve fixed abrasive tack and hold viscosity, make it in basic unit's PET film
Coating is uniform, ensures polishing effect, and coat material environment friendly is pollution-free.
2nd, fixed abrasive polished silicon wafer of the invention, fixed abrasive particle diameter is 0.1nm~100um, can make nano-particle
It is not easy to be absorbed in the polished silicon wafer basic unit of viscoelastic material, while ensureing good surface smoothness, gives full play to elaboration.
3rd, fixed abrasive polished silicon wafer of the invention, the binding agent of starch and polyketone resin as green non-pollution, jointly
Effect can strengthen fixed abrasive adhesive property and mechanicalness, ensure its coating uniformity in basic unit, ensure that surface adds
Working medium amount, operating efficiency is improved, and technological parameter is controllable, environment friendly and pollution-free, simple operation can ensure polishing effect.
Brief description of the drawings
Fig. 1 (a) is that coat coats number as polished silicon wafer once；
Fig. 1 (b) is that coat coating number is multiple polished silicon wafer；
Fig. 2 (a) is the fiber connector surface not being processed by shot blasting；
Fig. 2 (b) is the fiber connector surface after polishing；
Fig. 3 (a) is the polished silicon wafer that fixed abrasive percentage by weight is 20wt%；
Fig. 3 (b) is the polished silicon wafer that fixed abrasive percentage by weight is 40wt%.
Embodiment
Below by specific embodiment, the invention will be further described, and following examples are descriptive, is not limit
Qualitatively, it is impossible to which protection scope of the present invention is limited with this.
Embodiment one
A kind of green fixed abrasive polished silicon wafer, its innovation are：It is made up of basic unit and coat, basic unit PET
Film, the thickness of PET film is 60um, and the thickness of coat is 60um,
The component and its percentage by weight of coat be：
Silica 2g
Cornstarch 4g
Polyketone resin 4g.
The particle diameter of silica is 0.1nm.
A kind of preparation method of green fixed abrasive polished silicon wafer, its innovation are：The step of preparation method is：
(1) weigh：Weigh 2g silica；4g cornstarch；4g polyketone resins, and measure 4g absolute ethyl alcohol；
(2) prepared by coating liquid：Load weighted polyketone resin, silica and starch are added to the test tube for filling absolute ethyl alcohol
In, then uniformly mixed using ultrasonic oscillator so that polyketone resin, silica and starch are dispersed in anhydrous second
In alcohol, coating liquid is made；
(3) coat coats：Tile PET film on glass plate, using coated rod that the coating liquid prepared is repeatedly equal
Even coating on a pet film, forms the coat that thickness is 60um；
(4) solidify：Under room temperature environment after its solidification, polished silicon wafer is formed.
Embodiment two
A kind of green fixed abrasive polished silicon wafer, its innovation are：It is made up of basic unit and coat, basic unit PET
Film, the thickness of PET film is 70um, and the thickness of coat is 150um,
The component and its percentage by weight of coat be：
Aluminum oxide 4g
Cornstarch 3g
Polyketone resin 3g.
The particle diameter of silica is 1um.
A kind of preparation method of green fixed abrasive polished silicon wafer, its innovation are：The step of preparation method is：
(1) weigh：Weigh 4g aluminum oxide；3g cornstarch；3g polyketone resins, and measure 3g absolute ethyl alcohols；
(2) prepared by coating liquid：Load weighted polyketone resin, aluminum oxide and starch are added to the test tube for filling absolute ethyl alcohol
In, then uniformly mixed using ultrasonic oscillator so that polyketone resin, aluminum oxide and starch are dispersed in anhydrous second
In alcohol, coating liquid is made；
(3) coat coats：Tile PET film on glass plate, using coated rod that the coating liquid prepared is repeatedly equal
Even coating on a pet film, forms the coat that thickness is 150um；
(4) solidify：Under room temperature environment after its solidification, polished silicon wafer is formed.
Embodiment three
A kind of green fixed abrasive polished silicon wafer, its innovation are：It is made up of basic unit and coat, basic unit PET
Film, the thickness of the PET film is 80um, and the thickness of coat is 200um,
The component and its percentage by weight of coat be：
Cerium oxide 5g
Glutinous rice starch 2.5g
Polyketone resin 2.5g.
The particle diameter of cerium oxide is 100um.
A kind of preparation method of green fixed abrasive polished silicon wafer, its innovation are：The step of preparation method is：
(1) weigh：Weigh 5g cerium oxide；2.5g glutinous rice starch；2.5g polyketone resins, 2.5g absolute ethyl alcohols are measured,；
(2) prepared by coating liquid：Load weighted polyketone resin, cerium oxide and starch are added to the test tube for filling absolute ethyl alcohol
In, then uniformly mixed using ultrasonic oscillator so that cerium oxide, starch and polyketone resin are dispersed in anhydrous second
In alcohol, coating liquid is made；
(3) coat coats：Tile PET film on glass plate, using coated rod that the coating liquid prepared is repeatedly equal
Even coating on a pet film, forms the coat that thickness is 200um；
(4) solidify：Under room temperature environment after its solidification, polished silicon wafer is formed.
The microexamination analysis of fixed abrasive polished silicon wafer
In order to study fixed abrasive coating distributed effect in the polished silicon wafer after solidification, had using Shanghai Pu Dan optical instruments
The MM-BC type light microscopes of limit company are observed, and microscope view is as shown in figure 1, wherein：Fig. 1 (a) applies for coat
Number is covered for polished silicon wafer once, and Fig. 1 (b) is that coat coating number is multiple, reaches certain thickness polished silicon wafer.Can be with by figure
Find out, obvious uniform using fixed abrasive distribution in the polished silicon wafer of green binding agent, abrasive material distribution is smooth and is distributed on basic unit PET
On film, and coating number is more, and the uniformity of abrasive material is better, the addition of starch so that the adhesive property of polyketone resin is changed
Property lifting, in abrasive material coating procedure is carried, abrasive material is evenly distributed, flowing it is smooth, be not in abrasive material accumulate or be gathered into
The phenomenon of group, obtained polished silicon wafer are more satisfactory.
The polishing effect microscopic analysis of the joints of optical fibre
The polished silicon wafer prepared is placed on rubber cushion, fiber connector card is manually polished under pure water environment, is led to
Cross the surface of the FV-410P types optical fiber scope observation fiber connector of Westover companies production, optical fiber scope observation knot
Fruit is as shown in Fig. 2 wherein：Fig. 2 (a) is the fiber connector surface not being processed by shot blasting, and Fig. 2 (b) is after polishing
Fiber connector surface.As seen from the figure, the cut on the fiber connector surface after polished polishing is removed, surface light
Cunning is smooth, ensures its service precision.
The polished silicon wafer comparative analysis of different fixed abrasive contents
Percentage by weight of the fixed abrasive in polished silicon wafer basic unit is 20~50wt%, if Fig. 3 is different weight percentage
Fixed abrasive polished silicon wafer, Fig. 3 (a) are the polished silicon wafer that fixed abrasive percentage by weight is 20wt%, and Fig. 3 (b) is fixed abrasive
Percentage by weight is 40wt% polished silicon wafer.As seen from the figure, polished silicon wafer surface is uniform in Fig. 3 (a) (b) and caking property is good, is throwing
Abrasive material is difficult for drop-off in photoreduction process, and polishing grinding is smooth.
Although disclosing embodiments of the invention and accompanying drawing for the purpose of illustration, those skilled in the art can manage
Solution：Do not departing from the present invention and spirit and scope of the appended claims in, it is various replace, change and modifications all be it is possible,
Therefore, the scope of the present invention is not limited to embodiment and accompanying drawing disclosure of that.
Claims (7)
- A kind of 1. green fixed abrasive polished silicon wafer, it is characterised in that：It is made up of basic unit and coat, the basic unit is PET film,The component and its percentage by weight of the coat be：20~50wt% of fixed abrasive25~40wt% of starch25~40wt% of polyketone resin.
- 2. green fixed abrasive polished silicon wafer according to claim 1, it is characterised in that：The thickness of the PET film be 60~ 80um。
- 3. green fixed abrasive polished silicon wafer according to claim 1, it is characterised in that：The thickness of the coat be 60~ 200um。
- 4. green fixed abrasive polished silicon wafer according to claim 1, it is characterised in that：The fixed abrasive be silica, Aluminum oxide, cerium oxide or polycrystalline diamond.
- 5. green fixed abrasive polished silicon wafer according to claim 1, it is characterised in that：The fixed abrasive particle diameter is 0.1nm~100um.
- 6. green fixed abrasive polished silicon wafer according to claim 1, it is characterised in that：The starch is GB/T20887- Cornstarch or glutinous rice starch in 2009 cereal starch.
- 7. the preparation method of green fixed abrasive polished silicon wafer according to any one in claim 1~6, it is characterised in that： The step of preparation method is：(1) weigh：Fixed abrasive, starch, polyketone resin are weighed according to the percentage by weight；(2) prepared by coating liquid：Load weighted polyketone resin, fixed abrasive and starch are added in the test tube for filling absolute ethyl alcohol, Then uniformly mixed using ultrasonic oscillator so that polyketone resin, fixed abrasive and starch are dispersed in anhydrous second In alcohol, coating liquid is made；(3) coat coats：Tile described PET film on glass plate, using coated rod that the coating liquid prepared is multiple It is coated uniformly in PET film, forms the coat that thickness is 60~200um；(4) solidify：Under room temperature environment after its solidification, polished silicon wafer is formed.
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| CN201710615468.5A CN107350978A (en) | 2017-07-26 | 2017-07-26 | A kind of green fixed abrasive polished silicon wafer and preparation method thereof |
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| CN201710615468.5A CN107350978A (en) | 2017-07-26 | 2017-07-26 | A kind of green fixed abrasive polished silicon wafer and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109648487A (en) * | 2019-01-04 | 2019-04-19 | 合肥工业大学 | A kind of monocrystalline silicon carbide green, efficient polishing abrasive tool and its method for polishing monocrystalline silicon carbide |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1830627A (en) * | 2005-03-08 | 2006-09-13 | 罗门哈斯电子材料Cmp控股股份有限公司 | Water-based polishing pads and methods of manufacture |
| CN1868675A (en) * | 2005-05-27 | 2006-11-29 | 三芳化学工业股份有限公司 | Ultrafine fiber polishing sheet and its manufacturing method |
| CN101525522A (en) * | 2008-02-22 | 2009-09-09 | 罗门哈斯电子材料Cmp控股股份有限公司 | An oligosaprobic polishing composition |
| CN104128896A (en) * | 2014-07-23 | 2014-11-05 | 上虞市自远磨具有限公司 | Nanometer silicon dioxide thin film base polished section and preparation method thereof |
| CN105102188A (en) * | 2013-03-12 | 2015-11-25 | 国立大学法人九州大学 | Polishing pad and polishing method |
| CN105792990A (en) * | 2013-12-06 | 2016-07-20 | 圣戈班磨料磨具有限公司 | Coated abrasive article including a non-woven material |
| US20160339559A1 (en) * | 2015-05-20 | 2016-11-24 | FNS Tech. Co., Ltd. | Polishing pad and preparing method thereof |
-
2017
- 2017-07-26 CN CN201710615468.5A patent/CN107350978A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1830627A (en) * | 2005-03-08 | 2006-09-13 | 罗门哈斯电子材料Cmp控股股份有限公司 | Water-based polishing pads and methods of manufacture |
| CN1868675A (en) * | 2005-05-27 | 2006-11-29 | 三芳化学工业股份有限公司 | Ultrafine fiber polishing sheet and its manufacturing method |
| CN101525522A (en) * | 2008-02-22 | 2009-09-09 | 罗门哈斯电子材料Cmp控股股份有限公司 | An oligosaprobic polishing composition |
| CN105102188A (en) * | 2013-03-12 | 2015-11-25 | 国立大学法人九州大学 | Polishing pad and polishing method |
| CN105792990A (en) * | 2013-12-06 | 2016-07-20 | 圣戈班磨料磨具有限公司 | Coated abrasive article including a non-woven material |
| CN104128896A (en) * | 2014-07-23 | 2014-11-05 | 上虞市自远磨具有限公司 | Nanometer silicon dioxide thin film base polished section and preparation method thereof |
| US20160339559A1 (en) * | 2015-05-20 | 2016-11-24 | FNS Tech. Co., Ltd. | Polishing pad and preparing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109648487A (en) * | 2019-01-04 | 2019-04-19 | 合肥工业大学 | A kind of monocrystalline silicon carbide green, efficient polishing abrasive tool and its method for polishing monocrystalline silicon carbide |
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Application publication date: 20171117 |
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