CN107343352A - Have the flexible circuit connection framework and its preparation method of display interface - Google Patents

Have the flexible circuit connection framework and its preparation method of display interface Download PDF

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Publication number
CN107343352A
CN107343352A CN201610285577.0A CN201610285577A CN107343352A CN 107343352 A CN107343352 A CN 107343352A CN 201610285577 A CN201610285577 A CN 201610285577A CN 107343352 A CN107343352 A CN 107343352A
Authority
CN
China
Prior art keywords
conducting layer
flexible substrate
metal conducting
liquid crystal
display part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610285577.0A
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Chinese (zh)
Inventor
许国诚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHEESHIN TECHNOLOGY Co Ltd
Original Assignee
CHEESHIN TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHEESHIN TECHNOLOGY Co Ltd filed Critical CHEESHIN TECHNOLOGY Co Ltd
Priority to CN201610285577.0A priority Critical patent/CN107343352A/en
Publication of CN107343352A publication Critical patent/CN107343352A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention discloses a kind of flexible circuit connection framework for having display interface and its preparation method, first to sequentially form a transparency conducting layer and a metal conducting layer on a transparent flexible substrate, then the metal conducting layer and the transparency conducting layer are etched, to form an one patterned circuit connecting section and an one patterned metal conducting layer, a liquid crystal layer is re-formed on the transparency conducting layer, and a calculation process element and a power supply delivery member are electrically connected with the one patterned metal conducting layer, thereby, the one patterned metal conducting layer is formed directly on the transparency conducting layer, and then the problem of preventing contact to be broken.

Description

Have the flexible circuit connection framework and its preparation method of display interface
Technical field
The present invention is is related to a kind of flexible circuit board, espespecially a kind of flexible circuit connection framework for having display interface With its preparation method.
Background technology
Flexible circuit board (Flexible Printed Circuit, FPC) be also known as flexible printed circuit board, Flex circuit application, soft board etc., it does line arrangement with mode of printing on flexible substrate, and to conduct The transmission medium of electronic product signal, and there is in light weight, thickness of thin, softness, flexible, and It is widely used on the products such as mobile phone, notebook computer, PDA, digital camera, LCDs.
" the Flexible printed circuit board of its application such as U.S. Patent No. US8283567 And touch screen panel apparatus having the same ", it includes a transparent base Plate, multiple sensing electrodes, a front side surface gasket unit, a non-sensing electrode, a rear side surface pad list Member and a bendable printed circuit board (PCB), the transparency carrier include a first surface and one relative to this first The second surface on surface, those sensing electrodes are arranged at the first surface, and the front side surface gasket unit is to connect Those sensing electrodes are connected to, the non-sensing electrode is arranged at the second surface, and the rear side surface gasket unit connects The non-sensing electrode is connected to, the bendable printed circuit board (PCB) includes one and is connected to the front side surface gasket unit The first gasket unit, and second gasket unit for being connected to the rear side surface gasket unit.
Although flexible circuit board is by the significantly application of electronic correlation industry, however, when itself and other electronics member When part connects, such as display panel, contact panel, drive circuit board, due to its flexible architectural characteristic, Incomplete situation is easily often broken or be electrically connected with junction, and element is not transported normally Make, therefore, how to prevent the contact of junction to be broken, the target made great efforts by related dealer.
The content of the invention
The main object of the present invention, it is that solving the contact that flexible circuit board is connected with other elements is easily broken off Or it is electrically connected with incomplete problem.
For the above-mentioned purpose, the present invention provides a kind of flexible circuit connection framework for having display interface, includes One transparent flexible substrate, a transparency conducting layer, a liquid crystal layer, an one patterned metal conducting layer, at a computing Reason element and a power supply delivery member, the transparency conducting layer are arranged at the side of the transparent flexible substrate, and wrap Containing a display part and one adjacent to the display part one patterned circuit connecting section, the liquid crystal layer is arranged at this Side of the transparency conducting layer away from the transparent flexible substrate simultaneously corresponds to the display part, the one patterned metallic conduction Layer is arranged at side of the transparency conducting layer away from the transparent flexible substrate and shape corresponds to one patterned electricity Road connecting portion, the calculation process element are electrically connected with the one patterned metal conducting layer, and the power supply delivery member is with being somebody's turn to do One patterned metal conducting layer is electrically connected with.
For the above-mentioned purpose, the present invention more provides a kind of making for the flexible circuit connection framework for having display interface Method, include following steps:
S1:A transparency conducting layer and a metal conducting layer are sequentially formed on a transparent flexible substrate, this is saturating Bright conductive layer include a display part and one adjacent to the display part circuit connecting section;
S2:The metal conducting layer being pointed on the display part is etched to expose the display part, and to this Circuit connecting section and the metal conducting layer in the circuit connecting section are etched, and connect the circuit Portion forms an one patterned circuit connecting section and an one patterned metal conducting layer respectively with the metal conducting layer;With And
S3:A liquid crystal layer is formed on the display part, and by a calculation process element and a power supply delivery member It is electrically connected at the one patterned metal conducting layer;
In summary, it is formed directly into by by the transparency conducting layer in the transparent flexible substrate, and the figure Sample metal conducting layer is formed directly on the transparency conducting layer, makes the adhesive force between itself stronger, And the generation of contact is not had, accordingly it is possible to prevent of the invention when bending, the one patterned metal conducting layer Or the electrically conducting transparent fault rupture and the problem of element is not used.
Brief description of the drawings
Figure 1A, it is the schematic top plan view of a preferred embodiment of the present invention.
Figure 1B, it is Figure 1A of the present invention A-A diagrammatic cross-sections.
Fig. 2, it is the function block schematic diagram of a preferred embodiment of the present invention.
Fig. 3, it is the schematic flow sheet of a preferred embodiment of the present invention.
Fig. 4 A to 4D, it is the Making programme structural representation of a preferred embodiment of the present invention.
Fig. 5, it is first application schematic diagram of a preferred embodiment of the present invention.
Fig. 6, it is second application schematic diagram of a preferred embodiment of the present invention.
Embodiment
It is related to detailed description of the invention and technology contents, now just coordinates schema to be described as follows:
Refer to shown in Figure 1A, Figure 1B and Fig. 2, the present invention connects for a kind of flexible circuit for having display interface Framework is connect, includes a transparent flexible substrate 10, a transparency conducting layer 20, a liquid crystal layer 30, a pattern Change metal conducting layer 41, a calculation process element 60 and a power supply delivery member 70, the transparent flexible substrate 10 material can be polyimides (Polyimide, abbreviation PI), PET (Polyethylene terephthalate, abbreviation PET), makrolon (Polycarbonate, referred to as PC), Triafol T (Triacetyl cellulose, abbreviation TAC), cyclic olefine copolymer (Cyclic Olefin Copolymer, abbreviation COC, Cyclic Olefin Polymer, abbreviation COP), poly- naphthalene two Formic acid glycol ester (Polyethylene naphthalate, abbreviation PEN), glass or its combination, and be somebody's turn to do Transparency conducting layer 20 is arranged at the side of the transparent flexible substrate 10, and include a display part 21 and One adjacent to the display part 21 one patterned circuit connecting section 23, its material can be tin indium oxide, oxidation The metal oxides such as zinc, fluorinated tin oxide, aluminium zinc oxide, zinc gallium oxide and combinations thereof.
The liquid crystal layer 30 is arranged at the side of the transparency conducting layer 20 away from the transparent flexible substrate 10 and right Should be in the display part 21, it is saturating away from this that the one patterned metal conducting layer 41 is arranged at the transparency conducting layer 20 The side of bright flexible substrate 10 and shape correspond to the one patterned circuit connecting section 23, and its material can be copper Deng conducting metal, the calculation process element 60 is electrically connected at the one patterned metal conducting layer 41, and the electricity Source delivery member 70 is then electrically connected with the one patterned metal conducting layer 41 to provide required electric power.Thereby, The transparency conducting layer 20 is directly formed in being led in the transparent flexible substrate 10 with directly forming the one patterned metal Electric layer 41 is on the transparency conducting layer 20, when can not produce contact, and then prevent terminating in bending, the figure The problem of sample metal conducting layer 41 or the transparency conducting layer 20 are broken and make element not use.
In the present embodiment, the liquid crystal layer 30 has multiple liquid crystal 31, and those liquid crystal 31 respectively have one White displays portion 311 of black display portion 312 and one, and when actual assembled, more can be in the liquid crystal layer 30 An electrode layer (not shown) is set away from the transparent flexible substrate 10, uses and is produced with the transparency conducting layer 20 Corresponding electric field, those liquid crystal 31 are made to be overturn in correspondence position, when operated, power supply supply Part 70 provides the electric power, is operated the calculation process element 60, and then transmits a signal, and this is transparent Conductive layer 20 produces corresponding electric field after receiving the signal with the electrode layer, and then makes those liquid crystal 31 Overturn in correspondence position, and the numeral for corresponding to the signal or symbol etc. can be showed.
Continuous collocation is refering to shown in Fig. 3 and Fig. 4 A to Fig. 4 D, being the Making programme of the present embodiment, in this wherein, The material of each element at this as it was previously stated, do not repeat separately then.The making step of the present embodiment is as follows:
S1:As shown in Figure 4 A and 4 B shown in FIG., a transparency conducting layer 20 is formed in a transparent flexible substrate 10 On, a metal conducting layer 40 is then re-formed on the transparency conducting layer 20, the transparency conducting layer 20 include a display part 21 and one adjacent to the display part 21 circuit connecting section 22, need to especially say Bright, the metal conducting layer 40 can be copper, and the transparency conducting layer 20 is tin indium oxide, and in this implementation It is that directly copper is formed on tin indium oxide in example, that is, and without the setting of any padded coaming, Directly the metal conducting layer 40 is formed on the transparency conducting layer 20.
S2:As shown in Figure 4 C, the metal conducting layer 40 being first pointed on the display part 21 is etched Expose the display part 21, then, then to the circuit connecting section 22 and positioned at the circuit connecting section 22 On the metal conducting layer 40 be etched, the circuit connecting section 22 is distinguished with the metal conducting layer 40 An one patterned circuit connecting section 23 and an one patterned metal conducting layer 41 are formed, and the one patterned circuit connects Socket part 23 is corresponding with the shape of the one patterned metal conducting layer 41, through the one patterned metal conducting layer 41 increase circuits extend to electric conductivity when outside display part 21, avoid the material because circuit connecting section 22 Matter for electrically conducting transparent material influence electrical conductivity resistance value it is excessive the problem of.
S3:As shown in Figure 4 D, a liquid crystal layer 30 is formed on the display part 21, and the liquid crystal layer 30 has Multiple liquid crystal 31, and those liquid crystal 31 respectively have a black display portion 312 and a white displays portion 311, And a calculation process element 60 and a power supply delivery member 70 (being shown in Figure 1A) are electrically connected at the one patterned Metal conducting layer 41.
Continuous collocation, for the Application Example of the present invention, is connected in above-mentioned steps refering to shown in Fig. 5 and Fig. 6 After S3, following steps have been further included:
S4:A guard member 91 is formed in the side of the transparent flexible substrate 10 away from the transparency conducting layer 20, And a display window 93 of the guard member 91 is set to correspond to the display part 21.And during actual assembled, also may be used Additionally to set another guard member (not shown) in the position of the relative guard member 91, will the present invention set It is placed between the guard member 91 and another guard member, and can further protects the present invention.
In addition, as shown in fig. 6, the guard member 91 can more include one to house the transparent flexible base The groove 92 of plate 10, thus, it is possible to reduce the thickness of this application embodiment.
And if the liquid crystal layer 30 is arranged at away from should be in order to protect the part of the side of the transparent flexible substrate 10 Also to be transparent, the display window 93 can also be arranged in another guard member and correspond to the display part 21, present invention could apply to the fields such as Electronic Paper, credit card.Specifically, applied to credit On card and when when being swiped the card on network, the liquid crystal layer 30 can show a sets of numbers, except general defeated Enter outside password, holder must input the number on relevant apparatus, and can just swipe the card success, improve brush The security of card.
In summary, due to the invention has the characteristics that:
First, by the transparency conducting layer and the one patterned metal conducting layer is directly formed, avoid in display member Electrical contact is produced between part and flexible circuit board and then anti-when terminating in bending, the one patterned metal conducting layer or The electrically conducting transparent fault rupture and the problem of element is not used, and can be applied to the neck such as Electronic Paper, credit card Domain.
2nd, by the setting of the guard member, the present invention can be further protected, such as prevents aqueous vapor from corroding Etc., improve and use the upper life-span.
3rd, by the setting of the groove, the transparent flexible substrate can be accommodated, to reduce thickness.

Claims (9)

1. a kind of flexible circuit connection framework for having display interface, it is characterised in that include:
One transparent flexible substrate;
One is arranged at the transparency conducting layer of the side of the transparent flexible substrate, includes a display part and a phase Adjacent to the one patterned circuit connecting section of the display part;
One is arranged at side of the transparency conducting layer away from the transparent flexible substrate and corresponding to the display part Liquid crystal layer;
One is arranged at side of the transparency conducting layer away from the transparent flexible substrate and shape corresponds to the pattern Change the one patterned metal conducting layer of circuit connecting section;
One is electrically connected with the calculation process element of the one patterned metal conducting layer;And
The one power supply delivery member being electrically connected with the one patterned metal conducting layer.
2. the flexible circuit connection framework of tool display interface according to claim 1, its feature exist In the material of the transparent flexible substrate is selected from by polyimides, PET, poly- carbon The group that acid esters, Triafol T, cyclic olefine copolymer, PEN and glass are formed Group, the material of the transparency conducting layer is selected from by tin indium oxide, zinc oxide, fluorinated tin oxide, aluminium zinc The group that oxide, zinc gallium oxide and combinations thereof are formed, the material of the one patterned metal conducting layer is copper.
3. the flexible circuit connection framework of tool display interface according to claim 1, its feature exist In, also include a guard member for being arranged at side of the transparent flexible substrate away from the transparency conducting layer, should Guard member has a display window for corresponding to the display part.
4. the flexible circuit connection framework of tool display interface according to claim 3, its feature exist In the guard member has one to house the first groove of the transparent flexible substrate.
5. the flexible circuit connection framework of tool display interface according to claim 1, its feature exist In the liquid crystal layer has multiple liquid crystal, and those liquid crystal respectively have a black display portion and a white displays portion.
A kind of 6. preparation method for the flexible circuit connection framework for having display interface, it is characterised in that bag Contain following steps:
S1:A transparency conducting layer and a metal conducting layer are sequentially formed on a transparent flexible substrate, this is saturating Bright conductive layer include a display part and one adjacent to the display part circuit connecting section;
S2:The metal conducting layer being pointed on the display part is etched to expose the display part, and to this Circuit connecting section and the metal conducting layer in the circuit connecting section are etched, and connect the circuit Portion forms an one patterned circuit connecting section and an one patterned metal conducting layer respectively with the metal conducting layer;With And
S3:A liquid crystal layer is formed on the display part, and by a calculation process element and a power supply delivery member It is electrically connected at the one patterned metal conducting layer.
7. the making side of the flexible circuit connection framework of tool display interface according to claim 6 Method, it is characterised in that after step S3, also include following steps:
S4:A guard member is formed in side of the transparent flexible substrate away from the transparency conducting layer, and makes the guarantor One display window of guard corresponds to the display part.
8. the making side of the flexible circuit connection framework of tool display interface according to claim 6 Method, it is characterised in that in step S3, the liquid crystal layer has multiple liquid crystal, and those liquid crystal respectively have one Black display portion and a white displays portion.
9. the making side of the flexible circuit connection framework of tool display interface according to claim 6 Method, it is characterised in that in step S1, the material of the transparent flexible substrate be selected from by polyimides, PET, makrolon, Triafol T, cyclic olefine copolymer, poly- naphthalenedicarboxylic acid The group that glycol ester and glass are formed, the material of the transparency conducting layer is selected from by tin indium oxide, oxygen Change the group that zinc, fluorinated tin oxide, aluminium zinc oxide, zinc gallium oxide and combinations thereof are formed, the gold The material for belonging to conductive layer is copper.
CN201610285577.0A 2016-05-03 2016-05-03 Have the flexible circuit connection framework and its preparation method of display interface Pending CN107343352A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610285577.0A CN107343352A (en) 2016-05-03 2016-05-03 Have the flexible circuit connection framework and its preparation method of display interface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610285577.0A CN107343352A (en) 2016-05-03 2016-05-03 Have the flexible circuit connection framework and its preparation method of display interface

Publications (1)

Publication Number Publication Date
CN107343352A true CN107343352A (en) 2017-11-10

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1282106A (en) * 1999-07-22 2001-01-31 株式会社半导体能源研究所 Contact structure and semiconductor device
CN1309320A (en) * 2000-02-18 2001-08-22 精工爱普生株式会社 Base board for display device and its mfg. method, liquid crystal device and electronic apparatus
CN1328268A (en) * 2000-05-25 2001-12-26 精工爱普生株式会社 Liquid crystal apparatus, its making method and electronic apparatus
CN101370955A (en) * 2006-01-19 2009-02-18 出光兴产株式会社 Laminated structure, electrode for circuit using the same, and method for manufacturing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1282106A (en) * 1999-07-22 2001-01-31 株式会社半导体能源研究所 Contact structure and semiconductor device
CN1309320A (en) * 2000-02-18 2001-08-22 精工爱普生株式会社 Base board for display device and its mfg. method, liquid crystal device and electronic apparatus
CN1328268A (en) * 2000-05-25 2001-12-26 精工爱普生株式会社 Liquid crystal apparatus, its making method and electronic apparatus
CN101370955A (en) * 2006-01-19 2009-02-18 出光兴产株式会社 Laminated structure, electrode for circuit using the same, and method for manufacturing the same

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Application publication date: 20171110