CN107336270B - Cutting disc for diode plastic package product - Google Patents
Cutting disc for diode plastic package product Download PDFInfo
- Publication number
- CN107336270B CN107336270B CN201710791905.9A CN201710791905A CN107336270B CN 107336270 B CN107336270 B CN 107336270B CN 201710791905 A CN201710791905 A CN 201710791905A CN 107336270 B CN107336270 B CN 107336270B
- Authority
- CN
- China
- Prior art keywords
- cutting disc
- disc body
- plastic package
- diode plastic
- diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
- B26D2001/002—Materials or surface treatments therefor, e.g. composite materials
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention provides a cutting disc for diode plastic package products, which comprises a cutting disc body, wherein the cutting disc body is made of ceramic, a plurality of air holes are formed between the upper surface and the lower surface of the cutting disc body in a penetrating way, the diameter of each air hole is set to be 30-60 mu m, and the density of the air holes arranged between the upper surface and the lower surface of the cutting disc body is 40-100PPI. The beneficial effects of the invention are as follows: through changing the material and the structure of cutting dish, the condition that the unevenness can not appear in the UV membrane that makes the diode plastic package product bottom that cuts, can be accurately measured when guaranteeing the test of diode plastic package product back end process to guarantee the quality of product through guaranteeing measuring accuracy, furthest eliminates the quality hidden danger of product, and the incision of diode plastic package product is level, no micelle, gum silk produce.
Description
Technical Field
The invention relates to the technical field of diode processing equipment, in particular to a cutting disc for diode plastic package products.
Background
In the cutting link of diode plastic package product, the prior art is to place the product on the stainless steel cutting dish and cut, the structure of stainless steel cutting dish is as shown in fig. 1: the stainless steel cutting disc 13 is arranged on the cutting working platform in a jogged mode, a coaxial annular vacuum pipeline 15 which is gradually and outwards expanded is sequentially arranged on the upper surface of the stainless steel cutting disc 13, an air hole 11 is vertically arranged at the axis of the annular vacuum pipeline 15 in a penetrating mode, the air hole 11 is connected with the vacuum generator through a connecting pipe, and a plurality of straight-line vacuum pipelines 14 which penetrate through the axis and transversely span the annular vacuum pipeline 15 are further arranged on the upper surface of the stainless steel cutting disc 13.
The prior art has the following defects: firstly, when placing the laminating on the UV membrane diode plastic package product whole edition on stainless steel cutting dish after, vacuum generator starts the evacuation, make the upper surface of UV membrane and stainless steel cutting dish hug closely, cutting structure cuts the diode plastic package product, after accomplishing the cutting, the line the same with stainless steel cutting dish upper surface can all appear to the UV membrane of every diode plastic package product bottom, this kind of line leads to the lower surface roughness of UV membrane, when the test of diode plastic package product back end process, often lead to fixed establishment can not suck tight diode plastic package product because of these lines tests, seriously influence the test accuracy of product, leave very big hidden danger for the quality of product.
Secondly, because the upper surface of stainless steel cutting disc is provided with annular vacuum pipeline and sharp vacuum pipeline, make the upper surface of stainless steel cutting disc constitute a unsmooth face, lead to when cutting, the cutter is easy because touch different unsmooth positions and cut off the side, and diode plastic package product incision that cuts out is uneven, often accompanies micelle, gum silk production, directly influences the quality of product.
Disclosure of Invention
Based on the above, the invention aims to provide a cutting disc for a diode plastic package product, which can ensure that an uneven condition of a UV film at the bottom of the cut diode plastic package product can not occur by changing the material and the structure of the cutting disc, and can be accurately measured during the test of the post-stage process of the diode plastic package product, thereby ensuring the quality of the product by ensuring the accuracy of measurement, furthest eliminating the hidden danger of the quality of the product, ensuring that the cut of the diode plastic package product is smooth and no colloidal particles or glue wires are generated.
The invention provides a cutting disc for diode plastic package products, which comprises a cutting disc body, wherein the cutting disc body is made of ceramic, a plurality of air holes are formed between the upper surface and the lower surface of the cutting disc body in a penetrating way, the diameter of each air hole is set to be 30-60 mu m, and the density of the air holes arranged between the upper surface and the lower surface of the cutting disc body is 40-100PPI.
Preferably, the air hole density arranged between the upper surface and the lower surface of the cutting disc body is 70PPI.
Preferably, the pore diameter of each of the pores is set to 45um.
Preferably, the thickness of the cutting disc body is set to be 2.5mm.
Preferably, the air holes are arranged in a transverse array mode.
Preferably, the air holes are arranged in a ring-shaped array.
The beneficial effects of the invention are as follows:
1. the cutting disc body is made of ceramic, a plurality of air holes are formed between the upper surface and the lower surface of the cutting disc body in a penetrating way, the hole diameter of each air hole is set to be 30-60 mu m, the air hole density is 40-100PPI, the diameter of each air hole cannot be realized in the production process of a stainless steel cutting disc in the prior art, and the air holes on the cutting disc body made of ceramic are fine, so that the upper surface of the cutting disc body does not form obvious concave-convex surfaces, after a diode plastic package product is cut, a UV film at the bottom of the diode plastic package product is flat and has no lines, so that the testing of a later process is not influenced, and the testing accuracy is ensured;
2. as the air holes on the cutting disc body made of ceramic are more and thinner, the upper surface of the cutting disc body cannot form obvious concave-convex surfaces, and the cutter cannot generate the condition of cutting deviation when cutting, so that the incision is smooth, no colloidal particles and glue wires are generated, and the cutting quality of diode plastic package products is ensured.
Drawings
Fig. 1 is a structural view of a prior art stainless steel cutting disc.
Fig. 2 is a schematic structural view of the present invention.
Fig. 3 is an enlarged view at a in fig. 2.
Fig. 4 is a partial schematic view showing the arrangement of the air holes in the annular array in embodiment 2.
The reference numerals are: the cutting disc comprises a cutting disc body 10, air holes 11, a stainless steel cutting disc 13, a linear vacuum pipeline 14, an annular vacuum pipeline 15 and a working platform upper part 16.
Detailed Description
The invention will be further described in detail with reference to the drawings and the detailed description below, in order to further understand the features and technical means of the invention and the specific objects and functions achieved.
Embodiment 1:
please refer to fig. 2-3: the cutting disc for the diode plastic package product comprises a cutting disc body 10, wherein the cutting disc body 10 is made of ceramic, and the thickness of the cutting disc body 10 is set to be 2.5mm. A plurality of air holes 11 are formed between the upper surface and the lower surface of the cutting disc body 10 in a penetrating manner, the diameter of each air hole 11 is set to be 30-60um, and the density of the air holes 11 formed between the upper surface and the lower surface of the cutting disc body 10 is 40-100PPI. In this embodiment, the density of pores between the upper surface and the lower surface of the cutting disc body 10 is 70PPI, and the pore diameter of each pore 11 is 45um. The air holes 11 are arranged in a transverse array.
During actual operation, the cutting disc body 10 is embedded on the cutting working platform 16, the connecting pipe penetrates through the cutting working platform 16, diode plastic package products attached to the UV film are placed on the cutting disc body 10 in a whole mode, the vacuum generator is started to start vacuumizing, the UV film is attached to the upper surface of the cutting disc body 10, and the cutters start to cut the diode plastic package products one by one.
In the invention, the pore diameter of the pore 11 is set to be 30-60um, and the pore diameter cannot be realized in the production process of the stainless steel cutting disc in the prior art.
In the invention, as the air holes on the cutting disc body made of ceramic are more and thinner, the upper surface of the cutting disc body can not form obvious concave-convex surfaces, and the situation of cutting deflection can not occur when a cutter cuts, so that the cut is smooth, no colloidal particles or glue wires are generated, and the cutting quality of diode plastic package products is ensured.
Embodiment 2:
please refer to fig. 4: the main difference between embodiment 1 and embodiment 2 is that the air holes 11 are arranged in an annular array.
The foregoing embodiments are merely illustrative of the principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims.
Claims (6)
1. Cutting disc for diode plastic package products, comprising a cutting disc body (10), characterized in that: the cutting disc body (10) is made of ceramic, a plurality of air holes (11) are formed between the upper surface and the lower surface of the cutting disc body (10) in a penetrating mode, the hole diameter of each air hole (11) is set to be 30-60um, and the density of the air holes (11) arranged between the upper surface and the lower surface of the cutting disc body (10) is 40-100PPI; because the air holes on the cutting disc body made of ceramic are arranged finely, the upper surface of the cutting disc body does not form obvious concave-convex surfaces, and after the diode plastic package product is cut, the UV film at the bottom of the diode plastic package product is smoother and has no lines.
2. A cutting disc for diode plastic packaged products as claimed in claim 1, wherein: the air hole density arranged between the upper surface and the lower surface of the cutting disc body (10) is 70PPI.
3. A cutting disc for diode plastic packaged products as claimed in claim 1, wherein: the pore diameter of each pore (11) is set to 45um.
4. A cutting disc for diode plastic packaged products as claimed in claim 1, wherein: the thickness of the cutting disc body (10) is set to be 2.5mm.
5. A cutting disc for diode plastic packaged products as claimed in claim 1, wherein: the air holes (11) are arranged in a transverse array mode.
6. A cutting disc for diode plastic packaged products as claimed in claim 1, wherein: the air holes (11) are arranged in an annular array mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710791905.9A CN107336270B (en) | 2017-09-05 | 2017-09-05 | Cutting disc for diode plastic package product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710791905.9A CN107336270B (en) | 2017-09-05 | 2017-09-05 | Cutting disc for diode plastic package product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107336270A CN107336270A (en) | 2017-11-10 |
| CN107336270B true CN107336270B (en) | 2023-09-01 |
Family
ID=60215794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710791905.9A Active CN107336270B (en) | 2017-09-05 | 2017-09-05 | Cutting disc for diode plastic package product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107336270B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2659892A1 (en) * | 1990-03-20 | 1991-09-27 | Snecma | Cutting disc of the abrasive grinding wheel type |
| CN201404113Y (en) * | 2009-05-27 | 2010-02-17 | 周利 | Ceramic coffee bean grinding cutter head |
| CN101695808A (en) * | 2009-10-27 | 2010-04-21 | 重庆泰蒙科技有限公司 | Preparation method of high-performance pored ceramic blade |
| CN102248543A (en) * | 2011-04-27 | 2011-11-23 | 苏州工业园区天势科技有限公司 | Automatic absorbing type label cutter |
| CN107116703A (en) * | 2017-06-02 | 2017-09-01 | 四川利丰航空科技有限公司 | A kind of glass plate cuts special tooling platform |
| CN207120258U (en) * | 2017-09-05 | 2018-03-20 | 东莞市佳骏电子科技有限公司 | A kind of chopping disk for diode plastic packaging product |
-
2017
- 2017-09-05 CN CN201710791905.9A patent/CN107336270B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2659892A1 (en) * | 1990-03-20 | 1991-09-27 | Snecma | Cutting disc of the abrasive grinding wheel type |
| CN201404113Y (en) * | 2009-05-27 | 2010-02-17 | 周利 | Ceramic coffee bean grinding cutter head |
| CN101695808A (en) * | 2009-10-27 | 2010-04-21 | 重庆泰蒙科技有限公司 | Preparation method of high-performance pored ceramic blade |
| CN102248543A (en) * | 2011-04-27 | 2011-11-23 | 苏州工业园区天势科技有限公司 | Automatic absorbing type label cutter |
| CN107116703A (en) * | 2017-06-02 | 2017-09-01 | 四川利丰航空科技有限公司 | A kind of glass plate cuts special tooling platform |
| CN207120258U (en) * | 2017-09-05 | 2018-03-20 | 东莞市佳骏电子科技有限公司 | A kind of chopping disk for diode plastic packaging product |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107336270A (en) | 2017-11-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103230880B (en) | Rapid nondestructive detection apparatus of vacuum degrees of containers, and detection method thereof | |
| CN107336270B (en) | Cutting disc for diode plastic package product | |
| CN204008572U (en) | A kind of compound substance step bar | |
| WO2010128432A3 (en) | Non-destructive signal propagation system and method to determine substrate integrity | |
| WO2016097164A3 (en) | Accurately calculating acoustic time-of-flight | |
| CN202229736U (en) | System for detecting diameter of cutter steel wire | |
| EP2778673A3 (en) | Ultrasonic inspection method for diffusion bonded articles | |
| MX2019008279A (en) | An in-line, contactless and non-destructive method & system for detecting defects in a moving cardboard structure. | |
| CN207120258U (en) | A kind of chopping disk for diode plastic packaging product | |
| CN108007316A (en) | A kind of cone mouth overall dimensions go-no go gauge cubing and its detection method | |
| CN204249496U (en) | A kind of high accuracy adhesive tape slicer | |
| JP6286437B2 (en) | Leak test device for mounting on a flexible wall of a member under test | |
| US9915580B2 (en) | Pulp chamber leak test | |
| CN211783233U (en) | Brake caliper support pin hole depth gauge | |
| CN207662314U (en) | A kind of cone mouth overall dimensions go-no go gauge cubing | |
| CN203148623U (en) | Container vacuum degree rapid nondestructive test device used for production line | |
| CN203928967U (en) | A kind of altimeter gauge head | |
| CN110873640B (en) | Electrostatic chuck performance detection device and detection method | |
| CN101750004B (en) | Measuring tool | |
| CN211281737U (en) | Convenient tool for sealing and inspecting food and medicine composite packaging bags | |
| CN203929481U (en) | A kind of dish leaf flattening device for leaf vegetables optical detection | |
| CN205262387U (en) | Wheel hub flange face indent detection device | |
| CN204996856U (en) | Checking machine of punching press seal of a government organization in old china depth constructs | |
| CN202956361U (en) | Pipeline surface fault detection device | |
| CN216731978U (en) | Slicing device for quality detection of preserved eggs |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |