CN107336270A - A kind of chopping disk for diode plastic packaging product - Google Patents
A kind of chopping disk for diode plastic packaging product Download PDFInfo
- Publication number
- CN107336270A CN107336270A CN201710791905.9A CN201710791905A CN107336270A CN 107336270 A CN107336270 A CN 107336270A CN 201710791905 A CN201710791905 A CN 201710791905A CN 107336270 A CN107336270 A CN 107336270A
- Authority
- CN
- China
- Prior art keywords
- chopping disk
- plastic packaging
- packaging product
- disk body
- diode plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
- B26D2001/002—Materials or surface treatments therefor, e.g. composite materials
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The present invention provides a kind of chopping disk for diode plastic packaging product, including chopping disk body, the chopping disk body is formed by ceramic making, some stomatas are provided through between the upper and lower surface of the chopping disk body, the bore dia of each stomata is arranged to 30 60um, and the stomatal frequency set between the upper and lower surface of the chopping disk body is 40 100PPI.Beneficial effects of the present invention are：By the material and structure that change chopping disk, the UV films for making the diode plastic packaging product bottom of well cutting are not in rough situation, ensure to be measured exactly in the test of diode plastic packaging product back segment process, so as to ensure the quality of product by ensuring the accuracy of measurement, the hidden danger of quality of product is eliminated to greatest extent, and the otch of diode plastic packaging product is smooth, no micelle, collodion silk produce.
Description
Technical field
The present invention relates to diode technical field of processing equipment, more particularly to a kind of cutting for diode plastic packaging product
Disk.
Background technology
In cutting link for diode plastic packaging product, prior art is that product is placed on into stainless steel cut disk is enterprising
Row cutting, the structure of the stainless steel cut disk is as shown in Figure 1：16 chimeric are provided with stainless steel cut on cutting workbench
Disk 13, it is provided with the concentric ring-shaped vacuum pipeline 15 gradually outwards expanded, position in proper order in the upper surface of stainless steel cut disk 13
Extended vertically through at the axle center of the ring-shaped vacuum pipeline 15 and be provided with stomata 11, the stomata 11 is occurred by adapter and vacuum
Device connects, and the upper surface of the stainless steel cut disk 13 is additionally provided with some through axle center and across ring-shaped vacuum pipeline 15
Straight line vacuum pipe 14.
The defects of prior art is present be：Firstth, it is placed on not when diode plastic packaging product justifying on UV films will be fitted in
After on rust steel chopping disk, vacuum generator starts and starts to vacuumize, and is close to UV films and the upper surface of stainless steel cut disk, cuts
Structure is cut to diode plastic packaging product, and after completing to cut, the UV films of every diode plastic packaging product bottom can go out
The now lines as stainless steel cut disk upper surface, this lines cause the lower surface of UV films uneven, are moulded in diode
When sealing the test of product back segment process, often cause fixed mechanism to suck diode plastic packaging product because of these lines and enter
Row test, has a strong impact on the test accuracy of product, and very big hidden danger is left for the quality of product.
Secondth, due to being provided with ring-shaped vacuum pipeline and straight line vacuum pipe in the upper surface of stainless steel cut disk, make not
The upper surface of rust steel chopping disk forms a male and fomale(M＆F), causes when cutting, and cutting knife is easily because touch different concavo-convex positions
And cut partially, the diode plastic packaging product otch out-of-flatness cut out, micelle, collodion silk generation are often accompanied by, directly affects product
Quality.
The content of the invention
Based on this, it is an object of the invention to provide a kind of chopping disk for diode plastic packaging product, is cut by changing
The material and structure of disk are cut, the UV films for making the diode plastic packaging product bottom of well cutting are not in rough situation, really
Guarantor can be measured exactly in the test of diode plastic packaging product back segment process, so as to by ensure measurement accuracy come
Ensure the quality of product, eliminate the hidden danger of quality of product to greatest extent, and the otch of diode plastic packaging product is smooth, no glue
Grain, collodion silk produce.
The present invention provides a kind of chopping disk for diode plastic packaging product, including chopping disk body, the chopping disk sheet
Body is formed by ceramic making, and some stomatas, Mei Gesuo are provided through between the upper and lower surface of the chopping disk body
The bore dia for stating stomata is arranged to 30-60um, the stomatal frequency set between the upper and lower surface of the chopping disk body
For 40-100PPI.
Preferably, the stomatal frequency set between the upper and lower surface of the chopping disk body is 70PPI.
Preferably, the bore dia of each stomata is arranged to 45um.
Preferably, the thickness of the chopping disk body is arranged to 2.5mm.
Preferably, the stomata is set by the way of horizontal array.
Preferably, the stomata is set by the way of annular array.
Beneficial effects of the present invention are：
1st, the chopping disk body is formed by ceramic making, through setting between the upper and lower surface of the chopping disk body
There are some stomatas, the bore dia of each stomata is arranged to 30-60um, stomatal frequency 40-100PPI, and such stomata is straight
Footpath is not realized for stainless steel cut disk of the prior art in production technology, in the present invention, because ceramic making
Stomata is set fine on the chopping disk body formed, the upper surface of chopping disk body is not formed obvious male and fomale(M＆F), thus
After being cut to diode plastic packaging product, the UV films of diode plastic packaging product bottom are more smooth, without lines, so that will not
The test of back segment process is influenceed, ensures that the degree of accuracy of test；
2nd, it is thin more than stomata on the chopping disk body formed due to ceramic making, make chopping disk body upper surface will not be formed it is bright
Aobvious male and fomale(M＆F), when cutting knife is cut, inclined situation will not be cut, makes otch smooth, no micelle, collodion silk produce, it is ensured that
Diode plastic packaging product cuts quality.
Brief description of the drawings
Fig. 1 is the structure chart of stainless steel cut disk in the prior art.
Fig. 2 is the structural representation of the present invention.
Fig. 3 is zoomed-in view at the A in Fig. 2.
Fig. 4 is the partial schematic diagram that stomata is set by the way of annular array in embodiment 2.
Reference is：Chopping disk body 10, stomata 11, stainless steel cut disk 13, straight line vacuum pipe 14, ring-shaped vacuum
16 on pipeline 15, workbench.
Embodiment
For the feature of the present invention, technological means and the specific purposes reached, function can be further appreciated that, with reference to
Accompanying drawing is described in further detail with embodiment to the present invention.
Embodiment 1：
Refer to shown in Fig. 2-3：A kind of chopping disk for diode plastic packaging product, including chopping disk body 10, the cutting
Disk body 10 is formed by ceramic making, and the thickness of the chopping disk body 10 is arranged to 2.5mm.The chopping disk body 10 it is upper
Some stomatas 11 are provided through between surface and lower surface, the bore dia of each stomata 11 is arranged to 30-60um, described
The density of stomata 11 set between the upper and lower surface of chopping disk body 10 is 40-100PPI.It is described in present embodiment
The stomatal frequency set between the upper and lower surface of chopping disk body 10 is 70PPI, the bore dia of each stomata 11
It is arranged to 45um.The stomata 11 is set by the way of horizontal array.
During practical operation, the chopping disk body 10 is entrenched in 16 on cutting workbench, and the adapter is cut through described
Cut 16 on workbench, the diode plastic packaging product justifying being fitted on UV films is placed on chopping disk body 10, vacuum occurs
Device starts and starts to vacuumize, and UV films are fitted in the upper surface of the chopping disk body 10, and cutting knife starts to diode plastic packaging product
Cut one by one.
In the present invention, the bore dia of stomata 11 is arranged to 30-60um, such hole diameter for it is of the prior art not
Rust steel chopping disk does not realize that the present invention is because stomata is set on the chopping disk body that ceramic making forms in production technology
Put fine, the upper surface of chopping disk body is not formed obvious male and fomale(M＆F), thus cut to diode plastic packaging product
Afterwards, the UV films of diode plastic packaging product bottom are more smooth, without lines, so as to not interfere with the test of back segment process, so as to
It ensure that the degree of accuracy of test.
It is more than stomata and thin on the chopping disk body that is formed due to ceramic making in the present invention, make the upper table of chopping disk body
Face will not form obvious male and fomale(M＆F), when cutting knife is cut, will not cut inclined situation, make otch smooth, no micelle, glue
Silk produces, it is ensured that diode plastic packaging product cuts quality.
Embodiment 2：
Refer to shown in Fig. 4：The main distinction of the embodiment 1 and the embodiment 2 is that the stomata 11 uses ring
The mode of shape array is set.
Above-described embodiment is only that the basic principles, principal features and advantages of the present invention have been shown and described.The skill of the industry
For art personnel it should be appreciated that the present invention is not limited to the above embodiments, described in above-described embodiment and specification is explanation
The principle of the present invention, without departing from the spirit and scope of the present invention, various changes and modifications of the present invention are possible, these
Changes and improvements all fall within the protetion scope of the claimed invention.
Claims (6)
1. a kind of chopping disk for diode plastic packaging product, including chopping disk body (10), it is characterised in that：The chopping disk
Body (10) is formed by ceramic making, the chopping disk body (10) if upper and lower surface between be provided through dry gas
Hole (11), the bore dia of each stomata (11) are arranged to 30-60um, the upper surface of the chopping disk body (10) and following table
Stomata (11) density set between face is 40-100PPI.
A kind of 2. chopping disk for diode plastic packaging product according to claim 1, it is characterised in that：The chopping disk
The stomatal frequency set between the upper and lower surface of body (10) is 70PPI.
A kind of 3. chopping disk for diode plastic packaging product according to claim 1, it is characterised in that：Each gas
The bore dia in hole (11) is arranged to 45um.
A kind of 4. chopping disk for diode plastic packaging product according to claim 1, it is characterised in that：The chopping disk
The thickness of body (10) is arranged to 2.5mm.
A kind of 5. chopping disk for diode plastic packaging product according to claim 1, it is characterised in that：The stomata
(11) set by the way of horizontal array.
A kind of 6. chopping disk for diode plastic packaging product according to claim 1, it is characterised in that：The stomata
(11) set by the way of annular array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710791905.9A CN107336270B (en) | 2017-09-05 | 2017-09-05 | Cutting disc for diode plastic package product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710791905.9A CN107336270B (en) | 2017-09-05 | 2017-09-05 | Cutting disc for diode plastic package product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107336270A true CN107336270A (en) | 2017-11-10 |
| CN107336270B CN107336270B (en) | 2023-09-01 |
Family
ID=60215794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710791905.9A Active CN107336270B (en) | 2017-09-05 | 2017-09-05 | Cutting disc for diode plastic package product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107336270B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2659892A1 (en) * | 1990-03-20 | 1991-09-27 | Snecma | Cutting disc of the abrasive grinding wheel type |
| CN201404113Y (en) * | 2009-05-27 | 2010-02-17 | 周利 | Ceramic coffee bean grinding cutter head |
| CN101695808A (en) * | 2009-10-27 | 2010-04-21 | 重庆泰蒙科技有限公司 | Preparation method of high-performance pored ceramic blade |
| CN102248543A (en) * | 2011-04-27 | 2011-11-23 | 苏州工业园区天势科技有限公司 | Automatic absorbing type label cutter |
| CN107116703A (en) * | 2017-06-02 | 2017-09-01 | 四川利丰航空科技有限公司 | A kind of glass plate cuts special tooling platform |
| CN207120258U (en) * | 2017-09-05 | 2018-03-20 | 东莞市佳骏电子科技有限公司 | A kind of chopping disk for diode plastic packaging product |
-
2017
- 2017-09-05 CN CN201710791905.9A patent/CN107336270B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2659892A1 (en) * | 1990-03-20 | 1991-09-27 | Snecma | Cutting disc of the abrasive grinding wheel type |
| CN201404113Y (en) * | 2009-05-27 | 2010-02-17 | 周利 | Ceramic coffee bean grinding cutter head |
| CN101695808A (en) * | 2009-10-27 | 2010-04-21 | 重庆泰蒙科技有限公司 | Preparation method of high-performance pored ceramic blade |
| CN102248543A (en) * | 2011-04-27 | 2011-11-23 | 苏州工业园区天势科技有限公司 | Automatic absorbing type label cutter |
| CN107116703A (en) * | 2017-06-02 | 2017-09-01 | 四川利丰航空科技有限公司 | A kind of glass plate cuts special tooling platform |
| CN207120258U (en) * | 2017-09-05 | 2018-03-20 | 东莞市佳骏电子科技有限公司 | A kind of chopping disk for diode plastic packaging product |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107336270B (en) | 2023-09-01 |
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